Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35706) > Seite 124 nach 596
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MC9S08SH8MSC | NXP USA Inc. |
 Description: IC MCU 8BIT 8KB FLASH 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08SH8MTG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 2852 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH8MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 17 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12XD64MAA | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12XDG128CAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12XDG128CAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12XEP100CAG | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
auf Bestellung 600 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12XEP100CAL | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
auf Bestellung 448 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12XEP100MAG | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
auf Bestellung 234 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12XEP100MAL | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S12XEP768CAL | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S12XHZ512CAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 117 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51QE128CLH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 382 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51QE128CLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 708 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51QE32LH | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 594 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51QE64CLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 3275 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52110CAE80 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Last Time Buy Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF52236AF50 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 659 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52236CAF50 | NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 56 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF5253CVM140 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 140MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V Connectivity: CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 225-MAPBGA (13x13) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF53281CVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 94 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF53721CVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA |
Produkt ist nicht verfügbar |
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MCF54450VM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
auf Bestellung 1197 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54451CVM180 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA |
Produkt ist nicht verfügbar |
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MCF54451VM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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mcf54452cvr200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCF54452VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54453CVR200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Part Status: Obsolete Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54453VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54454VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCF54455VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCHC908QY2CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX27ADSE | NXP USA Inc. |
Description: I.MX27 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), LCD, Power Supply, Accessories Core Processor: ARM9 Utilized IC / Part: i.MX27 |
Produkt ist nicht verfügbar |
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MCIMX27LVOP4AR2 | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tape & Reel (TR) Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Part Status: Not For New Designs Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX27VOP4A | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tray Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
auf Bestellung 652 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX27VOP4AR2 | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tape & Reel (TR) Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory |
Produkt ist nicht verfügbar |
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| MCIMX31ADSE/C | NXP USA Inc. |
Description: I.MX31 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM11 Utilized IC / Part: i.MX31 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MCIMX31VKN5C | NXP USA Inc. |
Description: IC MPU I.MX31 532MHZ 457MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33793AEF | NXP USA Inc. |
Description: IC DSI SLAVE SENSOR 16-SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC Part Status: Active Current - Supply: 250 mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33793AEFR2 | NXP USA Inc. |
Description: IC DSI SLAVE SENSOR 16-SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 250 mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33879EK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33879EKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33880EW | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side or Low Side Rds On (Typ): 550mOhm Voltage - Load: 5.5V ~ 24.5V Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Current - Output (Max): 800mA Ratio - Input:Output: 1:8 Supplier Device Package: 32-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33880EWR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side or Low Side Rds On (Typ): 550mOhm Voltage - Load: 5.5V ~ 24.5V Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Current - Output (Max): 800mA Ratio - Input:Output: 1:8 Supplier Device Package: 32-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33897DEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33897DEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33897TEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Active |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33972AEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33972AEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33972AEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33975EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Supplier Device Package: 32-SOIC-EP Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33975EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Supplier Device Package: 32-SOIC-EP Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33991EG | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 40mA Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 4.5V ~ 5.5V Voltage - Load: 6.5V ~ 26V Supplier Device Package: 24-SOIC Motor Type - Stepper: Bipolar Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33991EGR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 40mA Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 4.5V ~ 5.5V Voltage - Load: 6.5V ~ 26V Supplier Device Package: 24-SOIC Motor Type - Stepper: Bipolar Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33993EW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCZ33993EWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MFR4300FRDC | NXP USA Inc. |
Description: FRDC FLEXRAY DAUGHTER CARD Packaging: Bulk For Use With/Related Products: HCS12XEVB Accessory Type: Daughter Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MFR4310FRDC | NXP USA Inc. |
Description: FRDC FLEXRAY DAUGHTER CARD Packaging: Bulk For Use With/Related Products: EVB9S12XDP512 Accessory Type: Daughter Board Utilized IC / Part: EVB9S12XDP512 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MMA7330LR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-12G ANALOG 14LGA Packaging: Tape & Reel (TR) Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 12g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA7360LR1 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Packaging: Tape & Reel (TR) Features: Selectable Scale, Sleep Mode Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MC9S08SH8MSC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08SH8MTG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 2852 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.42 EUR |
| 10+ | 4.89 EUR |
| 96+ | 4.1 EUR |
| 192+ | 3.94 EUR |
| 288+ | 3.87 EUR |
| MC9S08SH8MTJ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XD64MAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XDG128CAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XDG128CAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XEP100CAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 50.11 EUR |
| 10+ | 40.63 EUR |
| 25+ | 38.27 EUR |
| 100+ | 35.67 EUR |
| 300+ | 34.22 EUR |
| MC9S12XEP100CAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 53.24 EUR |
| 10+ | 43.17 EUR |
| 25+ | 40.65 EUR |
| 100+ | 37.88 EUR |
| 300+ | 36.33 EUR |
| MC9S12XEP100MAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 234 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 60.84 EUR |
| 10+ | 49.46 EUR |
| 25+ | 46.62 EUR |
| 80+ | 43.93 EUR |
| MC9S12XEP100MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 58.41 EUR |
| 10+ | 44.17 EUR |
| 25+ | 40.52 EUR |
| 80+ | 37.02 EUR |
| 300+ | 35.84 EUR |
| MC9S12XEP768CAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12XHZ512CAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51QE128CLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 382 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 19.41 EUR |
| 10+ | 15.27 EUR |
| 25+ | 14.23 EUR |
| 100+ | 13.1 EUR |
| 250+ | 12.55 EUR |
| MCF51QE128CLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 708 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.03 EUR |
| 10+ | 15.78 EUR |
| 25+ | 14.72 EUR |
| 100+ | 13.55 EUR |
| 450+ | 12.7 EUR |
| MCF51QE32LH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 594 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.8 EUR |
| 10+ | 10.74 EUR |
| 25+ | 9.97 EUR |
| 100+ | 9.13 EUR |
| 250+ | 8.73 EUR |
| MCF51QE64CLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 3275 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.94 EUR |
| 10+ | 16.45 EUR |
| 80+ | 13.62 EUR |
| MCF52110CAE80 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF52236AF50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 32.01 EUR |
| 10+ | 25.69 EUR |
| 25+ | 24.11 EUR |
| 80+ | 23.99 EUR |
| MCF52236CAF50 | |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF5253CVM140 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF53281CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF53721CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54450VM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 1197 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 44.3 EUR |
| 10+ | 35.77 EUR |
| 25+ | 33.64 EUR |
| 100+ | 31.3 EUR |
| 450+ | 29.61 EUR |
| MCF54451CVM180 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54451VM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| mcf54452cvr200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54452VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54453CVR200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54453VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54454VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54455VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCHC908QY2CDWER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27ADSE |
|
Hersteller: NXP USA Inc.
Description: I.MX27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, Accessories
Core Processor: ARM9
Utilized IC / Part: i.MX27
Description: I.MX27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, Accessories
Core Processor: ARM9
Utilized IC / Part: i.MX27
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27LVOP4AR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Part Status: Not For New Designs
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27VOP4A | |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
auf Bestellung 652 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 53.22 EUR |
| 10+ | 43.39 EUR |
| 25+ | 41.72 EUR |
| MCIMX27VOP4AR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX31ADSE/C |
Hersteller: NXP USA Inc.
Description: I.MX31 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM11
Utilized IC / Part: i.MX31
Description: I.MX31 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM11
Utilized IC / Part: i.MX31
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX31VKN5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457MAPBGA
Description: IC MPU I.MX31 532MHZ 457MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33793AEF |
|
Hersteller: NXP USA Inc.
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Part Status: Active
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Part Status: Active
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33793AEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33879EK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33879EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33880EW |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33880EWR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33897DEF |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33897DEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33897TEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2500+ | 2.6 EUR |
| MCZ33972AEK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33972AEW |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33972AEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33975EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33975EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
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| MCZ33991EG |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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| MCZ33991EGR2 |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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| MCZ33993EW |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MCZ33993EWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MFR4300FRDC |
Hersteller: NXP USA Inc.
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: HCS12XEVB
Accessory Type: Daughter Board
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: HCS12XEVB
Accessory Type: Daughter Board
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| MFR4310FRDC |
Hersteller: NXP USA Inc.
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: EVB9S12XDP512
Accessory Type: Daughter Board
Utilized IC / Part: EVB9S12XDP512
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: EVB9S12XDP512
Accessory Type: Daughter Board
Utilized IC / Part: EVB9S12XDP512
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| MMA7330LR1 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-12G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 12g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Description: ACCELEROMETER 4-12G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 12g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
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| MMA7360LR1 |
|
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Features: Selectable Scale, Sleep Mode
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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