MPC5553MZQ132 NXP Semiconductors
| Anzahl | Preis |
|---|---|
| 1+ | 114.07 EUR |
| 10+ | 94.49 EUR |
| 25+ | 90.6 EUR |
| 100+ | 84.23 EUR |
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Technische Details MPC5553MZQ132 NXP Semiconductors
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA, DigiKey Programmable: Not Verified, Number of I/O: 220, Supplier Device Package: 324-PBGA (23x23), Peripherals: DMA, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI, Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V, Core Size: 32-Bit Single-Core, Data Converters: A/D 40x12b, Core Processor: e200z6, Program Memory Type: FLASH, Oscillator Type: External, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 64K x 8, Program Memory Size: 1.5MB (1.5M x 8), Speed: 132MHz, Mounting Type: Surface Mount, Package / Case: 324-BBGA, Packaging: Tray.
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| Foto | Bezeichnung | Hersteller | Beschreibung |
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MPC5553MZQ132 | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 1.5MB FLASH 324PBGADigiKey Programmable: Not Verified Number of I/O: 220 Supplier Device Package: 324-PBGA (23x23) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 132MHz Mounting Type: Surface Mount Package / Case: 324-BBGA Packaging: Tray |
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