Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34428) > Seite 166 nach 574
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| PCF2113AU/10/F4,00 | NXP USA Inc. |
 Description: IC DRVR CTRLR MATRIX DIE |
Produkt ist nicht verfügbar |
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| PCF2123U/10AA/1,00 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR SPI DIE Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Interface: SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.6V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: Die Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PCF8564ACX9/B/1,02 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C DIE Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1V ~ 5.5V Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: Die Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SE95U,025 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C DIE Features: Output Switch, Programmable Limit, Shutdown Mode Packaging: Bulk Package / Case: Die Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 13 b Supplier Device Package: Die Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PCF8564ACX9/1,005 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C DIE Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1V ~ 5.5V Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: Die Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF5272VM66R2J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
Produkt ist nicht verfügbar |
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PCA8576CH/Q900/1,1 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64LQFP |
Produkt ist nicht verfügbar |
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P1021-MDS-PB | NXP USA Inc. |
Description: P1021 EVAL BRD |
Produkt ist nicht verfügbar |
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P1013PSE2HFA | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA |
Produkt ist nicht verfügbar |
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P1013PSE2LFA | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA |
Produkt ist nicht verfügbar |
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P1013PSN2LFA | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA |
Produkt ist nicht verfügbar |
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TWR-S08MM128 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08MM EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08MM Platform: Tower System |
Produkt ist nicht verfügbar |
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TWR-56F8257 | NXP USA Inc. |
Description: TOWER SYSTEM MC56F8257 EVAL BRD Packaging: Box Mounting Type: Fixed Type: DSP Contents: Board(s), Cable(s) Core Processor: 56800E Board Type: Evaluation Platform Utilized IC / Part: MC56F8257 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-SER2 | NXP USA Inc. |
Description: TOWER SYSTEM INTERFACE BOARD Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Interface Board |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-WIFI-RS2101 | NXP USA Inc. |
Description: TOWER SYSTEM EVAL 802.11N Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Interface Board, WIFI Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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MED-EKG | NXP USA Inc. |
Description: TOWER SYSTEM ELECTROCARDIOGRAM Packaging: Box Interface: JTAG Voltage - Supply: 3.3V Sensor Type: Medical, Electrocardiogram (EKG/ECG) Utilized IC / Part: MC56F8257 Supplied Contents: Board(s) Embedded: Yes, DSC Part Status: Active |
Produkt ist nicht verfügbar |
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IAR-KSK-IMX25 | NXP USA Inc. |
Description: IAR KICKSTART I.MX25 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), LCD, Power Supply, J-Link Lite Programmer Core Processor: ARM9 Board Type: Evaluation Platform Utilized IC / Part: i.MX25 Platform: IAR KickStart Operating System: Linux, Windows Embedded CE Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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MMA8451QT | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Packaging: Tube Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g) Part Status: Obsolete |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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MMA8452QT | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Packaging: Tube Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA8453QT | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Packaging: Tube Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g) |
Produkt ist nicht verfügbar |
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TWR-MCF51JE | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JE EVAL BRD |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-MCF51JE-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JE EVAL BRD |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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M52277EVB | NXP USA Inc. |
 Description: MCF52277 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K40X256 | NXP USA Inc. |
Description: TOWER SYSTEM K40 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K60N512 | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K40X256-KIT | NXP USA Inc. |
Description: TOWER SYSTEM K40 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K60N512-KIT | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-MCF51MM | NXP USA Inc. |
Description: TOWER SYSTEM MCF51MM EVAL BRD |
Produkt ist nicht verfügbar |
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I74F86D,602 | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
Produkt ist nicht verfügbar |
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I74F00D,602 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
Produkt ist nicht verfügbar |
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MRFE6VP6300HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFE6VP61K25HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFE6VP6300HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFE6VP61K25HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
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PK60N256VLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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PK60N256VLL100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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LPC1111FHN33/102,5 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1111FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1112FHN33/102,5 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1112FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1113FBD48/302,1 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1113FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1113FHN33/302,5 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1114FBD48/302,1 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Discontinued at Digi-Key Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1114FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1114FHN33/302:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Discontinued at Digi-Key Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1323XNSK-BDM | NXP USA Inc. |
Description: 1323X_NETWORK_BDM Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| 1323XNSK-SFTW | NXP USA Inc. |
Description: 1323X_NETWORK_PLUS Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Part Status: Active |
Produkt ist nicht verfügbar |
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| D3172MMA7361LC | NXP USA Inc. |
Description: BOARD XYZ-AXIS DIGITAL ACCEL D Packaging: Box Sensitivity: 800, 206 mV/g Interface: Analog Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7361LC Supplied Contents: Board(s) Sensing Range: ±1.5g, 6g |
Produkt ist nicht verfügbar |
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| DEMO9S08SC4 | NXP USA Inc. |
Description: MC9S08SC4 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SC4 Part Status: Active |
Produkt ist nicht verfügbar |
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| DEMOFLEXISJMSD | NXP USA Inc. |
Description: CARD READER M9S08JM60 Packaging: Box Function: SD/MMC Type: Memory Utilized IC / Part: MC9S08JM60 Supplied Contents: Board(s) Primary Attributes: SPI to SD/MMC Memory Card Interface Embedded: Yes, MCU, 8-Bit Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DSPB56725CAF | NXP USA Inc. |
Description: IC DSP 24BIT 80LQFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Interface: Host Interface, I²C, SAI, SPI Type: Audio Processor Operating Temperature: -40°C ~ 85°C (TA) Non-Volatile Memory: External On-Chip RAM: 112kB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 200MHz Supplier Device Package: 80-LQFP (14x14) Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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| JMBADGE2008-B | NXP USA Inc. |
Description: MCF51JM128 EVAL BRD |
Produkt ist nicht verfügbar |
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| KIT3376MMA7331LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 308mV/g, 83.6mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7331LC Supplied Contents: Board(s) Sensing Range: ±4g, 9g Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| KIT3376MMA7341LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 440, 117.8 mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7341LC Supplied Contents: Board(s) Sensing Range: ±3g, 9g Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| KIT3376MMA7361LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 800, 206 mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7361LC Supplied Contents: Board(s) Sensing Range: ±1.5g, 6g Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| KIT3376MMA7368LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 800mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7368LC Supplied Contents: Board(s) Sensing Range: ±1.5g Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| KIT33905D5EKEVBE | NXP USA Inc. |
Description: KIT EVALUATION FOR MC33905 Packaging: Box Function: CANbus and LINbus Type: Interface Utilized IC / Part: MC33905 Supplied Contents: Board(s), Cable(s) |
Produkt ist nicht verfügbar |
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| KITSTBLITE2EVM | NXP USA Inc. |
Description: SENSOR TOOLBX MB Packaging: Box Sensor Type: Accelerometer, Capacitive Touch, Pressure Utilized IC / Part: Sensor Toolbox Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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KMC8113TMP3600V | NXP USA Inc. |
Description: IC DSP 300/400MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, TDM, UART Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 300MHz Supplier Device Package: 431-FCPBGA (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
| PCF2113AU/10/F4,00 |
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Hersteller: NXP USA Inc.
Description: IC DRVR CTRLR MATRIX DIE
Description: IC DRVR CTRLR MATRIX DIE
Produkt ist nicht verfügbar
| PCF2123U/10AA/1,00 |
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Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR SPI DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR SPI DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCF8564ACX9/B/1,02 |
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Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SE95U,025 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C DIE
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Bulk
Package / Case: Die
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 13 b
Supplier Device Package: Die
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C DIE
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Bulk
Package / Case: Die
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 13 b
Supplier Device Package: Die
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
| PCF8564ACX9/1,005 |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF5272VM66R2J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Produkt ist nicht verfügbar
| PCA8576CH/Q900/1,1 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64LQFP
Description: IC DRVR 7 SEGMENT 64LQFP
Produkt ist nicht verfügbar
| P1013PSE2HFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Produkt ist nicht verfügbar
| P1013PSE2LFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Produkt ist nicht verfügbar
| P1013PSN2LFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Produkt ist nicht verfügbar
| TWR-S08MM128 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08MM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08MM
Platform: Tower System
Description: TOWER SYSTEM MC9S08MM EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08MM
Platform: Tower System
Produkt ist nicht verfügbar
| TWR-56F8257 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC56F8257 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800E
Board Type: Evaluation Platform
Utilized IC / Part: MC56F8257
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC56F8257 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Core Processor: 56800E
Board Type: Evaluation Platform
Utilized IC / Part: MC56F8257
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
| TWR-SER2 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM INTERFACE BOARD
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Description: TOWER SYSTEM INTERFACE BOARD
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 213.7 EUR |
| TWR-WIFI-RS2101 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM EVAL 802.11N
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board, WIFI
Part Status: Not For New Designs
Description: TOWER SYSTEM EVAL 802.11N
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board, WIFI
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| MED-EKG |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM ELECTROCARDIOGRAM
Packaging: Box
Interface: JTAG
Voltage - Supply: 3.3V
Sensor Type: Medical, Electrocardiogram (EKG/ECG)
Utilized IC / Part: MC56F8257
Supplied Contents: Board(s)
Embedded: Yes, DSC
Part Status: Active
Description: TOWER SYSTEM ELECTROCARDIOGRAM
Packaging: Box
Interface: JTAG
Voltage - Supply: 3.3V
Sensor Type: Medical, Electrocardiogram (EKG/ECG)
Utilized IC / Part: MC56F8257
Supplied Contents: Board(s)
Embedded: Yes, DSC
Part Status: Active
Produkt ist nicht verfügbar
| IAR-KSK-IMX25 |
|
Hersteller: NXP USA Inc.
Description: IAR KICKSTART I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, J-Link Lite Programmer
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX25
Platform: IAR KickStart
Operating System: Linux, Windows Embedded CE
Part Status: Not For New Designs
Description: IAR KICKSTART I.MX25 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, J-Link Lite Programmer
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX25
Platform: IAR KickStart
Operating System: Linux, Windows Embedded CE
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| MMA8451QT |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tube
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Packaging: Tube
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Part Status: Obsolete
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2450+ | 2.46 EUR |
| MMA8452QT |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tube
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tube
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Produkt ist nicht verfügbar
| MMA8453QT |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tube
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g)
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tube
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g)
Produkt ist nicht verfügbar
| TWR-MCF51JE |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JE EVAL BRD
Description: TOWER SYSTEM MCF51JE EVAL BRD
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 154.65 EUR |
| TWR-MCF51JE-KIT |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JE EVAL BRD
Description: TOWER SYSTEM MCF51JE EVAL BRD
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 266.71 EUR |
| TWR-K40X256 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Description: TOWER SYSTEM K40 EVAL BRD
Produkt ist nicht verfügbar
| TWR-K60N512 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
| TWR-K40X256-KIT |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Description: TOWER SYSTEM K40 EVAL BRD
Produkt ist nicht verfügbar
| TWR-K60N512-KIT |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
| TWR-MCF51MM |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51MM EVAL BRD
Description: TOWER SYSTEM MCF51MM EVAL BRD
Produkt ist nicht verfügbar
| I74F86D,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Produkt ist nicht verfügbar
| I74F00D,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Produkt ist nicht verfügbar
| MRFE6VP6300HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| MRFE6VP61K25HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 50+ | 333.19 EUR |
| MRFE6VP6300HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 223.77 EUR |
| 10+ | 213.18 EUR |
| 25+ | 208.65 EUR |
| MRFE6VP61K25HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 355.75 EUR |
| 10+ | 340.71 EUR |
| 25+ | 333.19 EUR |
| PK60N256VLQ100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
| PK60N256VLL100 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
| LPC1111FHN33/102,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1111FHN33/202,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1112FHN33/102,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1112FHN33/202,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1113FBD48/302,1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1113FHN33/202,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1113FHN33/302,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1114FBD48/302,1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1114FHN33/202,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.06 EUR |
| 10+ | 5.5 EUR |
| LPC1114FHN33/302:5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1323XNSK-BDM |
|
Hersteller: NXP USA Inc.
Description: 1323X_NETWORK_BDM
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Description: 1323X_NETWORK_BDM
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1092.12 EUR |
| 1323XNSK-SFTW |
|
Hersteller: NXP USA Inc.
Description: 1323X_NETWORK_PLUS
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Description: 1323X_NETWORK_PLUS
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Produkt ist nicht verfügbar
| D3172MMA7361LC |
Hersteller: NXP USA Inc.
Description: BOARD XYZ-AXIS DIGITAL ACCEL D
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Description: BOARD XYZ-AXIS DIGITAL ACCEL D
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Produkt ist nicht verfügbar
| DEMO9S08SC4 |
Hersteller: NXP USA Inc.
Description: MC9S08SC4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SC4
Part Status: Active
Description: MC9S08SC4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SC4
Part Status: Active
Produkt ist nicht verfügbar
| DEMOFLEXISJMSD |
Hersteller: NXP USA Inc.
Description: CARD READER M9S08JM60
Packaging: Box
Function: SD/MMC
Type: Memory
Utilized IC / Part: MC9S08JM60
Supplied Contents: Board(s)
Primary Attributes: SPI to SD/MMC Memory Card Interface
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Description: CARD READER M9S08JM60
Packaging: Box
Function: SD/MMC
Type: Memory
Utilized IC / Part: MC9S08JM60
Supplied Contents: Board(s)
Primary Attributes: SPI to SD/MMC Memory Card Interface
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
| DSPB56725CAF |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80LQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: -40°C ~ 85°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 112kB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 200MHz
Supplier Device Package: 80-LQFP (14x14)
Part Status: Not For New Designs
Description: IC DSP 24BIT 80LQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: -40°C ~ 85°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 112kB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 200MHz
Supplier Device Package: 80-LQFP (14x14)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
| KIT3376MMA7331LC |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 308mV/g, 83.6mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7331LC
Supplied Contents: Board(s)
Sensing Range: ±4g, 9g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 308mV/g, 83.6mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7331LC
Supplied Contents: Board(s)
Sensing Range: ±4g, 9g
Part Status: Obsolete
Produkt ist nicht verfügbar
| KIT3376MMA7341LC |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 440, 117.8 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7341LC
Supplied Contents: Board(s)
Sensing Range: ±3g, 9g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 440, 117.8 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7341LC
Supplied Contents: Board(s)
Sensing Range: ±3g, 9g
Part Status: Obsolete
Produkt ist nicht verfügbar
| KIT3376MMA7361LC |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Part Status: Obsolete
Produkt ist nicht verfügbar
| KIT3376MMA7368LC |
Hersteller: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7368LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7368LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g
Part Status: Obsolete
Produkt ist nicht verfügbar
| KIT33905D5EKEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVALUATION FOR MC33905
Packaging: Box
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33905
Supplied Contents: Board(s), Cable(s)
Description: KIT EVALUATION FOR MC33905
Packaging: Box
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33905
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
| KITSTBLITE2EVM |
|
Hersteller: NXP USA Inc.
Description: SENSOR TOOLBX MB
Packaging: Box
Sensor Type: Accelerometer, Capacitive Touch, Pressure
Utilized IC / Part: Sensor Toolbox
Supplied Contents: Board(s)
Description: SENSOR TOOLBX MB
Packaging: Box
Sensor Type: Accelerometer, Capacitive Touch, Pressure
Utilized IC / Part: Sensor Toolbox
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| KMC8113TMP3600V |
|
Hersteller: NXP USA Inc.
Description: IC DSP 300/400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Description: IC DSP 300/400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar