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MMPF0100F3AEP MMPF0100F3AEP NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F3ANESR2 MMPF0100F3ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100F4AEP MMPF0100F4AEP NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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2+13.71 EUR
10+10.67 EUR
25+9.9 EUR
100+9.07 EUR
260+8.65 EUR
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MMPF0100F4AEPR2 MMPF0100F4AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MMPF0100F4ANES MMPF0100F4ANES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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MMPF0100F4ANESR2 MMPF0100F4ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MMPF0100NPANES MMPF0100NPANES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
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10+11.77 EUR
25+10.94 EUR
100+10.02 EUR
260+9.57 EUR
520+9.31 EUR
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MMPF0100NPANESR2 MMPF0100NPANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MMRF1011HR5 MMRF1011HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 330W
Frequency: 1.4GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1011HSR5 MMRF1011HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MMRF1012NR1 MMRF1012NR1 NXP USA Inc. MMRF1012NR1.pdf Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 30 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 23.9dB
Power - Output: 10W
Frequency: 220MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1013HR5 MMRF1013HR5 NXP USA Inc. Description: RF MOSFET LDMOS 30V NI1230
Current - Test: 100 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 13.3dB
Power - Output: 320W
Configuration: Dual
Frequency: 2.9GHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
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MMRF1013HSR5 MMRF1013HSR5 NXP USA Inc. Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 13.3dB
Power - Output: 320W
Configuration: Dual
Frequency: 2.9GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Produkt ist nicht verfügbar
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MMRF1014NT1 MMRF1014NT1 NXP USA Inc. MMRF1014N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
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MMRF1015GNR1 MMRF1015GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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MMRF1015NR1 MMRF1015NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 68 V
Part Status: Last Time Buy
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 10W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1016HR5 MMRF1016HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1017NR3 MMRF1017NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 20dB
Power - Output: 80W
Frequency: 960MHz
Mounting Type: Surface Mount
Current - Test: 1.4 A
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1018NBR1 MMRF1018NBR1 NXP USA Inc. Description: FET RF 120V 860MHZ
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: TO-272BB
Packaging: Tape & Reel (TR)
Technology: LDMOS
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-272 WB-4
Gain: 22dB
Produkt ist nicht verfügbar
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MMRF1018NR1 MMRF1018NR1 NXP USA Inc. Description: FET RF 120V 860MHZ
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1019NR4 MMRF1019NR4 NXP USA Inc. Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1308HR5 MMRF1308HR5 NXP USA Inc. www.nxp.com Description: FET RF 2CH 133V 230MHZ NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1308HSR5 MMRF1308HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1310HR5 MMRF1310HR5 NXP USA Inc. MMRF1310H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1310HSR5 MMRF1310HSR5 NXP USA Inc. www.nxp.com Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1315NR1 MMRF1315NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MMRF1316NR1 MMRF1316NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1318NR1 MMRF1318NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 900 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 300W
Frequency: 450MHz
Mounting Type: Surface Mount
Package / Case: TO-270-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF2005NR1 MMRF2005NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-16
Current - Test: 106 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16
Technology: LDMOS
Gain: 35.9dB
Power - Output: 3.2W
Frequency: 940MHz
Mounting Type: Chassis Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF2006NT1 MMRF2006NT1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.17GHZ 24QFN
Supplier Device Package: 24-PQFN (8x8)
Test Frequency: 1.8GHz ~ 2.17GHz
P1dB: 43dBm
Current - Supply: 230mA
Gain: 36dB
Voltage - Supply: 26V ~ 32V
RF Type: W-CDMA
Frequency: 1.8GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMRF2007NR1 NXP USA Inc. High_Power_GaN%2CLDMOS.pdf Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 35W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 60 mA
Produkt ist nicht verfügbar
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MRFE6VP6300GSR5 MRFE6VP6300GSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Voltage - Rated: 50 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 25dB
Power - Output: 300W
Frequency: 600MHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWPR1516CALR NXP USA Inc. WPR1516.pdf Description: IC RECEIVER 16KB FLASH 32QFN
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P1010NXN5DFB P1010NXN5DFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
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P1010NXN5FFB P1010NXN5FFB NXP USA Inc. QP1010FS.pdf Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
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RAPPID-560XSSW NXP USA Inc. Description: DEV TOOL MPC560XS
Produkt ist nicht verfügbar
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RAPPID-563XMSW NXP USA Inc. Description: DEV TOOL MPC563XM
Produkt ist nicht verfügbar
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S912XEG128W1MAA S912XEG128W1MAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
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S912XEP100BMAG S912XEP100BMAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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S912XEQ384F1MAG S912XEQ384F1MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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S912XET256BMAA S912XET256BMAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 420 Stücke
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S912XET256BMAAR S912XET256BMAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XET256BMAL S912XET256BMAL NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BMALR S912XET256BMALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W0MAA S912XET256W0MAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Produkt ist nicht verfügbar
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S912XET256W1MAA S912XET256W1MAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 137 Stücke:
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1+27.33 EUR
10+21.72 EUR
24+20.37 EUR
80+18.98 EUR
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S912XET256W1MAG S912XET256W1MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
auf Bestellung 300 Stücke:
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1+25.01 EUR
10+19.11 EUR
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S912XET256W1MAL S912XET256W1MAL NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZ128ACLH S9KEAZ128ACLH NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1549 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.66 EUR
10+6.62 EUR
25+6.11 EUR
100+5.55 EUR
250+5.28 EUR
800+5.03 EUR
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S9KEAZ128ACLK S9KEAZ128ACLK NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
auf Bestellung 445 Stücke:
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S9KEAZ128AVLH S9KEAZ128AVLH NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
auf Bestellung 1430 Stücke:
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3+7.34 EUR
10+5.61 EUR
25+5.18 EUR
100+4.71 EUR
250+4.48 EUR
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S9KEAZ64ACLH S9KEAZ64ACLH NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
auf Bestellung 780 Stücke:
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S9KEAZ64AMLH S9KEAZ64AMLH NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZ64AVLH S9KEAZ64AVLH NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
auf Bestellung 290 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.81 EUR
10+5.95 EUR
25+5.48 EUR
80+5.03 EUR
230+4.74 EUR
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S9KEAZN16AMLC S9KEAZN16AMLC NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
auf Bestellung 1250 Stücke:
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6+3.29 EUR
10+2.33 EUR
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S9KEAZN32ACLC S9KEAZN32ACLC NXP USA Inc. KINETISEAMCUFS.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
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S9KEAZN32ACLH S9KEAZN32ACLH NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN32AMLC S9KEAZN32AMLC NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 477 Stücke:
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4+4.91 EUR
10+3.68 EUR
25+3.37 EUR
100+3.03 EUR
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S9KEAZN32AMLH S9KEAZN32AMLH NXP USA Inc. www.nxp.com Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN64ACLC S9KEAZN64ACLC NXP USA Inc. QP1010FS.pdf Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2158 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.26 EUR
10+3.95 EUR
25+3.63 EUR
100+3.27 EUR
250+3.1 EUR
500+2.99 EUR
1250+2.88 EUR
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MMPF0100F3AEP MMPF0100.pdf
MMPF0100F3AEP
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MMPF0100F3ANESR2 MMPF0100.pdf
MMPF0100F3ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MMPF0100F4AEP MMPF0100.pdf
MMPF0100F4AEP
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.71 EUR
10+10.67 EUR
25+9.9 EUR
100+9.07 EUR
260+8.65 EUR
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MMPF0100F4AEPR2 MMPF0100.pdf
MMPF0100F4AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMPF0100F4ANES MMPF0100.pdf
MMPF0100F4ANES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MMPF0100F4ANESR2 MMPF0100.pdf
MMPF0100F4ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMPF0100NPANES MMPF0100.pdf
MMPF0100NPANES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 758 Stücke:
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AnzahlPreis
2+15.1 EUR
10+11.77 EUR
25+10.94 EUR
100+10.02 EUR
260+9.57 EUR
520+9.31 EUR
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MMPF0100NPANESR2 MMPF0100.pdf
MMPF0100NPANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1011HR5
MMRF1011HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 150 mA
Voltage - Test: 50 V
Voltage - Rated: 100 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 330W
Frequency: 1.4GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1011HSR5
MMRF1011HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MMRF1012NR1 MMRF1012NR1.pdf
MMRF1012NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 30 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 23.9dB
Power - Output: 10W
Frequency: 220MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1013HR5
MMRF1013HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI1230
Current - Test: 100 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 13.3dB
Power - Output: 320W
Configuration: Dual
Frequency: 2.9GHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
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MMRF1013HSR5
MMRF1013HSR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Current - Test: 100 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 13.3dB
Power - Output: 320W
Configuration: Dual
Frequency: 2.9GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Produkt ist nicht verfügbar
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MMRF1014NT1 MMRF1014N.pdf
MMRF1014NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
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MMRF1015GNR1
MMRF1015GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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MMRF1015NR1
MMRF1015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 68 V
Part Status: Last Time Buy
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 10W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1016HR5
MMRF1016HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 2.6 A
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 125W
Configuration: Dual
Frequency: 225MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1017NR3
MMRF1017NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 20dB
Power - Output: 80W
Frequency: 960MHz
Mounting Type: Surface Mount
Current - Test: 1.4 A
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1018NBR1
MMRF1018NBR1
Hersteller: NXP USA Inc.
Description: FET RF 120V 860MHZ
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: TO-272BB
Packaging: Tape & Reel (TR)
Technology: LDMOS
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-272 WB-4
Gain: 22dB
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MMRF1018NR1
MMRF1018NR1
Hersteller: NXP USA Inc.
Description: FET RF 120V 860MHZ
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 120 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1019NR4
MMRF1019NR4
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1308HR5 www.nxp.com
MMRF1308HR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1308HSR5
MMRF1308HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF1310HR5 MMRF1310H.pdf
MMRF1310HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MMRF1310HSR5 www.nxp.com
MMRF1310HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1315NR1
MMRF1315NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MMRF1316NR1
MMRF1316NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1318NR1
MMRF1318NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 900 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 300W
Frequency: 450MHz
Mounting Type: Surface Mount
Package / Case: TO-270-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF2005NR1
MMRF2005NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-16
Current - Test: 106 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: TO-270 WBL-16
Technology: LDMOS
Gain: 35.9dB
Power - Output: 3.2W
Frequency: 940MHz
Mounting Type: Chassis Mount
Package / Case: TO-270-16 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMRF2006NT1
MMRF2006NT1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.17GHZ 24QFN
Supplier Device Package: 24-PQFN (8x8)
Test Frequency: 1.8GHz ~ 2.17GHz
P1dB: 43dBm
Current - Supply: 230mA
Gain: 36dB
Voltage - Supply: 26V ~ 32V
RF Type: W-CDMA
Frequency: 1.8GHz ~ 2.17GHz
Mounting Type: Surface Mount
Package / Case: 24-PowerQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMRF2007NR1 High_Power_GaN%2CLDMOS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-16
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 35W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 60 mA
Produkt ist nicht verfügbar
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MRFE6VP6300GSR5
MRFE6VP6300GSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Voltage - Rated: 50 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 25dB
Power - Output: 300W
Frequency: 600MHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWPR1516CALR WPR1516.pdf
Hersteller: NXP USA Inc.
Description: IC RECEIVER 16KB FLASH 32QFN
Produkt ist nicht verfügbar
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P1010NXN5DFB QP1010FS.pdf
P1010NXN5DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Produkt ist nicht verfügbar
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P1010NXN5FFB QP1010FS.pdf
P1010NXN5FFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA
Produkt ist nicht verfügbar
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RAPPID-560XSSW
Hersteller: NXP USA Inc.
Description: DEV TOOL MPC560XS
Produkt ist nicht verfügbar
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RAPPID-563XMSW
Hersteller: NXP USA Inc.
Description: DEV TOOL MPC563XM
Produkt ist nicht verfügbar
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S912XEG128W1MAA MC9S12XEP100RMV1.pdf
S912XEG128W1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
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AnzahlPreis
1+26.79 EUR
10+21.22 EUR
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S912XEP100BMAG MC9S12XEP100RMV1.pdf
S912XEP100BMAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384F1MAG MC9S12XEP100RMV1.pdf
S912XEQ384F1MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BMAA MC9S12XEP100RMV1.pdf
S912XET256BMAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XET256BMAAR MC9S12XEP100RMV1.pdf
S912XET256BMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XET256BMAL
S912XET256BMAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BMALR
S912XET256BMALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W0MAA MC9S12XEP100RMV1.pdf
S912XET256W0MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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S912XET256W1MAA MC9S12XEP100RMV1.pdf
S912XET256W1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+27.33 EUR
10+21.72 EUR
24+20.37 EUR
80+18.98 EUR
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S912XET256W1MAG MC9S12XEP100RMV1.pdf
S912XET256W1MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+25.01 EUR
10+19.11 EUR
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S912XET256W1MAL MC9S12XEP100RMV1.pdf
S912XET256W1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZ128ACLH S9KEA128P80M48SF0.pdf
S9KEAZ128ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1549 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.66 EUR
10+6.62 EUR
25+6.11 EUR
100+5.55 EUR
250+5.28 EUR
800+5.03 EUR
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S9KEAZ128ACLK S9KEA128P80M48SF0.pdf
S9KEAZ128ACLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
auf Bestellung 445 Stücke:
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S9KEAZ128AVLH S9KEA128P80M48SF0.pdf
S9KEAZ128AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
auf Bestellung 1430 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.34 EUR
10+5.61 EUR
25+5.18 EUR
100+4.71 EUR
250+4.48 EUR
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S9KEAZ64ACLH S9KEA128P80M48SF0.pdf
S9KEAZ64ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
auf Bestellung 780 Stücke:
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S9KEAZ64AMLH S9KEA128P80M48SF0.pdf
S9KEAZ64AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZ64AVLH S9KEA128P80M48SF0.pdf
S9KEAZ64AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
auf Bestellung 290 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.81 EUR
10+5.95 EUR
25+5.48 EUR
80+5.03 EUR
230+4.74 EUR
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S9KEAZN16AMLC S9KEA64P64M20SF0.pdf
S9KEAZN16AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+3.29 EUR
10+2.33 EUR
Mindestbestellmenge: 6 Stücke
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S9KEAZN32ACLC KINETISEAMCUFS.pdf
S9KEAZN32ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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S9KEAZN32ACLH S9KEA8P44M48SF0.pdf
S9KEAZN32ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN32AMLC S9KEA8P44M48SF0.pdf
S9KEAZN32AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 477 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.91 EUR
10+3.68 EUR
25+3.37 EUR
100+3.03 EUR
250+2.87 EUR
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S9KEAZN32AMLH www.nxp.com
S9KEAZN32AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9KEAZN64ACLC QP1010FS.pdf
S9KEAZN64ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2158 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.26 EUR
10+3.95 EUR
25+3.63 EUR
100+3.27 EUR
250+3.1 EUR
500+2.99 EUR
1250+2.88 EUR
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