Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35544) > Seite 254 nach 593

Wählen Sie Seite:   [  << Vorherige Seite ]  1 59 118 177 236 249 250 251 252 253 254 255 256 257 258 259 295 354 413 472 531 590 593  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
SA616BS,115 SA616BS,115 NXP USA Inc. SA616.pdf Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM13071UL OM13071UL NXP USA Inc. OM13071%20Product%20Brief.pdf Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+40.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516DB1195,598 NXP USA Inc. SSL8516T.pdf Description: BOARD DEMO SSL8516T 75W LED DVR
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516T/1Y SSL8516T/1Y NXP USA Inc. SSL8516T.pdf Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516T/1Y SSL8516T/1Y NXP USA Inc. SSL8516T.pdf Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC822M101JHI33E LPC822M101JHI33E NXP USA Inc. LPC82x%20Draft.pdf Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC824M201JHI33E LPC824M201JHI33E NXP USA Inc. LPC82X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK24FN256VDC12 MK24FN256VDC12 NXP USA Inc. MK24FN256VDC12.pdf Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1024ASE7MLA LS1024ASE7MLA NXP USA Inc. Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+134.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1024A-RDB LS1024A-RDB NXP USA Inc. LS1024AFS.pdf Description: LS1024A EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TWR-K24F120M TWR-K24F120M NXP USA Inc. Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+295.10 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TWR-LS1021A TWR-LS1021A NXP USA Inc. TWRLS1021AFS.pdf Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KEA128LEDLIGHTRD KEA128LEDLIGHTRD NXP USA Inc. www.nxp.com Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC5604EKIT MPC5604EKIT NXP USA Inc. MPC5604E.pdf Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+1042.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SCP2201VMU SCP2201VMU NXP USA Inc. SCP220x.pdf Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SCP2207VMU SCP2207VMU NXP USA Inc. SCP220x.pdf Description: IC MPU ARM926EJ-S 236MAPBGA
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VFM4 MKL17Z256VFM4 NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 9679 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.33 EUR
10+6.16 EUR
25+6.06 EUR
100+5.95 EUR
490+5.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VFT4 MKL17Z256VFT4 NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1091 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.38 EUR
10+6.30 EUR
25+6.19 EUR
100+6.09 EUR
260+5.79 EUR
520+5.66 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VLH4 MKL17Z256VLH4 NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1439 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.99 EUR
10+5.46 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VMP4 MKL17Z256VMP4 NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1280 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.89 EUR
10+6.84 EUR
25+6.33 EUR
100+5.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VFM4 MKL27Z256VFM4 NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 2320 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.63 EUR
10+8.95 EUR
25+8.29 EUR
80+7.65 EUR
230+7.23 EUR
490+7.00 EUR
980+6.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VFT4 MKL27Z256VFT4 NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.13 EUR
10+11.09 EUR
80+9.18 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VLH4 MKL27Z256VLH4 NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.68 EUR
10+10.16 EUR
25+8.99 EUR
160+7.34 EUR
320+6.91 EUR
480+6.69 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VMP4 MKL27Z256VMP4 NXP USA Inc. KL27P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.40 EUR
10+11.31 EUR
80+9.36 EUR
1280+8.16 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL33Z256VLH4 MKL33Z256VLH4 NXP USA Inc. KL33P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKL33Z256VMP4 MKL33Z256VMP4 NXP USA Inc. KL33P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.61 EUR
10+6.65 EUR
25+6.58 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL43Z256VLH4 MKL43Z256VLH4 NXP USA Inc. KL43P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 2236 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.20 EUR
10+7.20 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL43Z256VMP4 MKL43Z256VMP4 NXP USA Inc. KL43P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-KL43Z FRDM-KL43Z NXP USA Inc. FRDMKL43ZUG.pdf Description: FREEDOM KL17/KL27/KL33/KL43
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TWR-KL43Z48M TWR-KL43Z48M NXP USA Inc. TWRKL43ZUG.pdf Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+276.30 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MK24FN1M0VDC12R MK24FN1M0VDC12R NXP USA Inc. K24P144M120SF5.pdf Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
CBTL06GP213EEJ CBTL06GP213EEJ NXP USA Inc. CBTL06GP213.pdf Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 4690 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.61 EUR
10+2.67 EUR
25+2.44 EUR
100+2.18 EUR
250+2.06 EUR
500+1.99 EUR
1000+1.93 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870502DT1 FXTH870502DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870902DT1 FXTH870902DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870911DT1 FXTH870911DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3355BSMP PTN3355BSMP NXP USA Inc. PTN3355.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3460IBS/F1MP PTN3460IBS/F1MP NXP USA Inc. PTN3460I.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6545 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.86 EUR
10+6.89 EUR
25+6.61 EUR
100+6.34 EUR
250+6.07 EUR
500+5.90 EUR
1000+5.77 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXHP PTN36221AHXHP NXP USA Inc. PTN36221A.pdf Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXZ PTN36221AHXZ NXP USA Inc. PTN36221A.pdf Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3460IBS/F1MP PTN3460IBS/F1MP NXP USA Inc. PTN3460I.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+5.59 EUR
Mindestbestellmenge: 2000
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXHP PTN36221AHXHP NXP USA Inc. PTN36221A.pdf Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXZ PTN36221AHXZ NXP USA Inc. PTN36221A.pdf Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PCAL6408ABSHP PCAL6408ABSHP NXP USA Inc. PCAL6408A.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+0.96 EUR
12000+0.94 EUR
Mindestbestellmenge: 6000
Im Einkaufswagen  Stück im Wert von  UAH
PTN3355BSMP PTN3355BSMP NXP USA Inc. PTN3355.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3363BSMP PTN3363BSMP NXP USA Inc. PTN3363.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74CBTLVD3245DS,118 74CBTLVD3245DS,118 NXP USA Inc. 74CBTLVD3245_Rev_Mar2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC812M101JTB16X LPC812M101JTB16X NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16XSON
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-XSON (3.2x2.5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 7990 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.41 EUR
10+2.11 EUR
25+2.00 EUR
100+1.89 EUR
250+1.88 EUR
500+1.86 EUR
1000+1.76 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
1N4448,143 1N4448,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Cut Tape (CT)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BFR540,235 BFR540,235 NXP USA Inc. BFR540_Rev6.pdf Description: RF TRANS NPN 15V 9GHZ SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KTY84/130,153 KTY84/130,153 NXP USA Inc. KTY84_SER.pdf Description: SENSOR PTC 603OHM DO34
Packaging: Cut Tape (CT)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34VR500V1ES MC34VR500V1ES NXP USA Inc. MC34VR500.pdf Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.13 EUR
10+15.82 EUR
25+14.74 EUR
100+13.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC34VR500V2ES MC34VR500V2ES NXP USA Inc. MC34VR500.pdf Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK02FN128VFM10 MK02FN128VFM10 NXP USA Inc. K02P64M100SFA.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 4936 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.09 EUR
10+5.35 EUR
25+5.24 EUR
100+4.88 EUR
490+4.69 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MK02FN64VFM10 MK02FN64VFM10 NXP USA Inc. K02P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2535 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.05 EUR
10+3.62 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870912DT1 FXTH870912DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870511DT1 FXTH870511DT1 NXP USA Inc. FXTH870xD.pdf Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH8709226T1 FXTH8709226T1 NXP USA Inc. FXTH870x6_Family_Rev1.3.pdf Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870502DT1 FXTH870502DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1927 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.77 EUR
5+9.43 EUR
10+8.96 EUR
25+8.41 EUR
50+8.04 EUR
100+7.72 EUR
500+7.08 EUR
1000+6.85 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870911DT1 FXTH870911DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870902DT1 FXTH870902DT1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 1861 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.37 EUR
5+9.34 EUR
10+8.95 EUR
25+8.49 EUR
50+8.18 EUR
100+7.89 EUR
500+7.32 EUR
1000+7.10 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SA616BS,115 SA616.pdf
SA616BS,115
Hersteller: NXP USA Inc.
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM13071UL OM13071%20Product%20Brief.pdf
OM13071UL
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+40.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516DB1195,598 SSL8516T.pdf
Hersteller: NXP USA Inc.
Description: BOARD DEMO SSL8516T 75W LED DVR
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516T/1Y SSL8516T.pdf
SSL8516T/1Y
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SSL8516T/1Y SSL8516T.pdf
SSL8516T/1Y
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC822M101JHI33E LPC82x%20Draft.pdf
LPC822M101JHI33E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC824M201JHI33E LPC82X.pdf
LPC824M201JHI33E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK24FN256VDC12 MK24FN256VDC12.pdf
MK24FN256VDC12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1024ASE7MLA
LS1024ASE7MLA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+134.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1024A-RDB LS1024AFS.pdf
LS1024A-RDB
Hersteller: NXP USA Inc.
Description: LS1024A EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TWR-K24F120M
TWR-K24F120M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+295.10 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TWR-LS1021A TWRLS1021AFS.pdf
TWR-LS1021A
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KEA128LEDLIGHTRD www.nxp.com
KEA128LEDLIGHTRD
Hersteller: NXP USA Inc.
Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC5604EKIT MPC5604E.pdf
MPC5604EKIT
Hersteller: NXP USA Inc.
Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1042.68 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SCP2201VMU SCP220x.pdf
SCP2201VMU
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SCP2207VMU SCP220x.pdf
SCP2207VMU
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VFM4 KL17P64M48SF6.pdf
MKL17Z256VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 9679 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.33 EUR
10+6.16 EUR
25+6.06 EUR
100+5.95 EUR
490+5.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VFT4 KL17P64M48SF6.pdf
MKL17Z256VFT4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1091 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.38 EUR
10+6.30 EUR
25+6.19 EUR
100+6.09 EUR
260+5.79 EUR
520+5.66 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VLH4 KL17P64M48SF6.pdf
MKL17Z256VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.99 EUR
10+5.46 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL17Z256VMP4 KL17P64M48SF6.pdf
MKL17Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.89 EUR
10+6.84 EUR
25+6.33 EUR
100+5.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VFM4 KL27P64M48SF6.pdf
MKL27Z256VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 2320 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.63 EUR
10+8.95 EUR
25+8.29 EUR
80+7.65 EUR
230+7.23 EUR
490+7.00 EUR
980+6.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VFT4 KL27P64M48SF6.pdf
MKL27Z256VFT4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.13 EUR
10+11.09 EUR
80+9.18 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VLH4 KL27P64M48SF6.pdf
MKL27Z256VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.68 EUR
10+10.16 EUR
25+8.99 EUR
160+7.34 EUR
320+6.91 EUR
480+6.69 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL27Z256VMP4 KL27P64M48SF6.pdf
MKL27Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.40 EUR
10+11.31 EUR
80+9.36 EUR
1280+8.16 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKL33Z256VLH4 KL33P64M48SF6.pdf
MKL33Z256VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKL33Z256VMP4 KL33P64M48SF6.pdf
MKL33Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.61 EUR
10+6.65 EUR
25+6.58 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL43Z256VLH4 KL43P64M48SF6.pdf
MKL43Z256VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 2236 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.20 EUR
10+7.20 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MKL43Z256VMP4 KL43P64M48SF6.pdf
MKL43Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-KL43Z FRDMKL43ZUG.pdf
FRDM-KL43Z
Hersteller: NXP USA Inc.
Description: FREEDOM KL17/KL27/KL33/KL43
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TWR-KL43Z48M TWRKL43ZUG.pdf
TWR-KL43Z48M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+276.30 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MK24FN1M0VDC12R K24P144M120SF5.pdf
MK24FN1M0VDC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
CBTL06GP213EEJ CBTL06GP213.pdf
CBTL06GP213EEJ
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 4690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.61 EUR
10+2.67 EUR
25+2.44 EUR
100+2.18 EUR
250+2.06 EUR
500+1.99 EUR
1000+1.93 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870502DT1
FXTH870502DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870902DT1
FXTH870902DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870911DT1
FXTH870911DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3355BSMP PTN3355.pdf
PTN3355BSMP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3460IBS/F1MP PTN3460I.pdf
PTN3460IBS/F1MP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6545 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.86 EUR
10+6.89 EUR
25+6.61 EUR
100+6.34 EUR
250+6.07 EUR
500+5.90 EUR
1000+5.77 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXHP PTN36221A.pdf
PTN36221AHXHP
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXZ PTN36221A.pdf
PTN36221AHXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3460IBS/F1MP PTN3460I.pdf
PTN3460IBS/F1MP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+5.59 EUR
Mindestbestellmenge: 2000
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXHP PTN36221A.pdf
PTN36221AHXHP
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN36221AHXZ PTN36221A.pdf
PTN36221AHXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PCAL6408ABSHP PCAL6408A.pdf
PCAL6408ABSHP
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+0.96 EUR
12000+0.94 EUR
Mindestbestellmenge: 6000
Im Einkaufswagen  Stück im Wert von  UAH
PTN3355BSMP PTN3355.pdf
PTN3355BSMP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTN3363BSMP PTN3363.pdf
PTN3363BSMP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74CBTLVD3245DS,118 74CBTLVD3245_Rev_Mar2017.pdf
74CBTLVD3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC812M101JTB16X LPC81XM.pdf
LPC812M101JTB16X
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16XSON
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-XSON (3.2x2.5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 7990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.41 EUR
10+2.11 EUR
25+2.00 EUR
100+1.89 EUR
250+1.88 EUR
500+1.86 EUR
1000+1.76 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
1N4448,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4448,143
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Cut Tape (CT)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BFR540,235 BFR540_Rev6.pdf
BFR540,235
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
KTY84/130,153 KTY84_SER.pdf
KTY84/130,153
Hersteller: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Cut Tape (CT)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34VR500V1ES MC34VR500.pdf
MC34VR500V1ES
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.13 EUR
10+15.82 EUR
25+14.74 EUR
100+13.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC34VR500V2ES MC34VR500.pdf
MC34VR500V2ES
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK02FN128VFM10 K02P64M100SFA.pdf
MK02FN128VFM10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 4936 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.09 EUR
10+5.35 EUR
25+5.24 EUR
100+4.88 EUR
490+4.69 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MK02FN64VFM10 K02P64M100SFA.pdf
MK02FN64VFM10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2535 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.05 EUR
10+3.62 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870912DT1
FXTH870912DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870511DT1 FXTH870xD.pdf
FXTH870511DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH8709226T1 FXTH870x6_Family_Rev1.3.pdf
FXTH8709226T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870502DT1
FXTH870502DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1927 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.77 EUR
5+9.43 EUR
10+8.96 EUR
25+8.41 EUR
50+8.04 EUR
100+7.72 EUR
500+7.08 EUR
1000+6.85 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870911DT1
FXTH870911DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FXTH870902DT1
FXTH870902DT1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 1861 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.37 EUR
5+9.34 EUR
10+8.95 EUR
25+8.49 EUR
50+8.18 EUR
100+7.89 EUR
500+7.32 EUR
1000+7.10 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 59 118 177 236 249 250 251 252 253 254 255 256 257 258 259 295 354 413 472 531 590 593  [ Nächste Seite >> ]