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MC08XSF421EK MC08XSF421EK NXP USA Inc. MC12XSFD4.pdf Description: IC SWITCH HIGH SIDE 32SOIC
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MC10XS6200EK MC10XS6200EK NXP USA Inc. MCyyXS6yyy%28B%29EK.pdf Description: IC PWR SWITCH HIGH SIDE 32HSOP
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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MC10XS6225EK MC10XS6225EK NXP USA Inc. MCyyXS6yyy%28B%29EK.pdf Description: IC PWR SWITCH HIGH SIDE 32HSOP
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Part Status: Obsolete
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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MC10XS6325EK MC10XS6325EK NXP USA Inc. MCyyXS6yyy(B)EK.pdf Description: IC PWR SWITCH HIGH SIDE 32HSOP
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 3
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
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MC10XSD200BFK MC10XSD200BFK NXP USA Inc. Description: IC PWR SWITCH HIGH SIDE 23PQFN
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MC16XSD200BFK MC16XSD200BFK NXP USA Inc. Description: IC PWR SWITCH HIGH SIDE 23PQFN
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MC25XS6300EK MC25XS6300EK NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH HIGH SIDE 32HSOP
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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MCIMX535DVV2C2 MCIMX535DVV2C2 NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.2GHZ 529FBGA
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MK21FX512AVMC12 MK21FX512AVMC12 NXP USA Inc. K21P144M120SF5V2.pdf Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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100+19.64 EUR
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MK22FN1M0AVLH12 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK22FN1M0AVLK12 MK22FN1M0AVLK12 NXP USA Inc. K22P80M120SF5V2.pdf Description: IC MCU 32BIT 1MB FLASH 80FQFP
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
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MK22FN1M0AVLL12 MK22FN1M0AVLL12 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
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MK22FN1M0AVLQ12 MK22FN1M0AVLQ12 NXP USA Inc. K22P64M120SF5V2.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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MK22FN1M0AVMC12 MK22FN1M0AVMC12 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 38x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN512VMP12 MK22FN512VMP12 NXP USA Inc. K22FPB_Rev.5_Mar3%2C2014_PB.pdf Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK22FX512AVLH12 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MK22FX512AVLK12 MK22FX512AVLK12 NXP USA Inc. K22P80M120SF5V2.pdf Description: IC MCU 32BIT 512KB FLASH 80FQFP
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
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MK22FX512AVLL12 MK22FX512AVLL12 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
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MK22FX512AVLQ12 MK22FX512AVLQ12 NXP USA Inc. K22P144M120SF5V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
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MK22FX512AVMC12 MK22FX512AVMC12 NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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MK22FX512AVMD12 MK22FX512AVMD12 NXP USA Inc. K22P144M120SF5V2.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
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MKE02Z16VFM4 MKE02Z16VFM4 NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
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MKE02Z32VFM4 MKE02Z32VFM4 NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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MKE02Z64VFM4 MKE02Z64VFM4 NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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A2I25D012GNR1 A2I25D012GNR1 NXP USA Inc. Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
Produkt ist nicht verfügbar
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A2I25D012NR1 A2I25D012NR1 NXP USA Inc. Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
Produkt ist nicht verfügbar
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A2T07D160W04SR3 A2T07D160W04SR3 NXP USA Inc. Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
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A2T07H310-24SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 880MHz
Configuration: Dual
Power - Output: 47W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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A2T18H100-25SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
Produkt ist nicht verfügbar
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A2T21H100-25SR3 NXP USA Inc. A2T21H100-25S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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AFT05MS004NT1 AFT05MS004NT1 NXP USA Inc. AFT05MS004N.pdf Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
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AFT09S200W02GNR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT09S200W02NR3 AFT09S200W02NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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AFT09S200W02SR3 NXP USA Inc. Description: RF MOSFET LDMOS 4W PLD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT21S240-12SR3 NXP USA Inc. AFT21S240-12S.pdf Description: FET RF 65V 2.17GHZ NI780S-2
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AFT26P100-4WGSR3 NXP USA Inc. Description: RF MOSFET 2.6GHZ 100W NI780S-6
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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B4420NXE7QQMD NXP USA Inc. QIQQB4420FS.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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B4860NXE7QUMD B4860NXE7QUMD NXP USA Inc. B4860FS.pdf Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
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FXLN8362QR1 FXLN8362QR1 NXP USA Inc. FXLN83xxQ.pdf Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
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FXTH8705026T1 FXTH8705026T1 NXP USA Inc. Description: IC SENSOR MULTICHIP Z-AXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH8705116T1 FXTH8705116T1 NXP USA Inc. Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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FXTH8709026T1 NXP USA Inc. Description: IC SENSOR MULTICHIP Z-AXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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FXTH8709116T1 NXP USA Inc. Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXTH8709126T1 FXTH8709126T1 NXP USA Inc. Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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KKL15Z128CAD4R NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 35WLCSP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 100 Stücke
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LS101MASE7DFA NXP USA Inc. Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS101MASE7EHA NXP USA Inc. Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS101MASN7DFA NXP USA Inc. Description: IC PROCESSOR DUAL CORE
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LS101MAXE7DFA NXP USA Inc. Description: IC PROCESSOR DUAL CORE
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LS1024ASE7JLA LS1024ASE7JLA NXP USA Inc. LS1024AFS.pdf Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LS1024ASN7ELA LS1024ASN7ELA NXP USA Inc. LS1024AFS.pdf Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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LS1024ASN7JLA LS1024ASN7JLA NXP USA Inc. Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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LS102MASN7BFA NXP USA Inc. Description: IC PROCESSOR DUAL CORE
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MC08XS6421EKR2 MC08XS6421EKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC10XS6325EKR2 MC10XS6325EKR2 NXP USA Inc. MCyyXS6yyy(B)EK.pdf Description: IC PWR SWITCH HIGH SIDE 32HSOP
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MC10XSD200BFKR2 MC10XSD200BFKR2 NXP USA Inc. Description: IC PWR SWITCH HIGH SIDE 23PQFN
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MC16XSD200BFKR2 MC16XSD200BFKR2 NXP USA Inc. Description: IC PWR SWITCH HIGH SIDE 23PQFN
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MC33901WEFR2 MC33901WEFR2 NXP USA Inc. 33901_34901.pdf Description: IC TRANSCEIVER 1/1 8SOIC
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 Mindestbestellmenge: 2500 Stücke
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MC33907LAE MC33907LAE NXP USA Inc. MC33907-MC33908D2.pdf Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 278 Stücke:
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100+15.55 EUR
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MC33908LAE MC33908LAE NXP USA Inc. MC33907-MC33908D2.pdf Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
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MC08XSF421EK MC12XSFD4.pdf
MC08XSF421EK
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Produkt ist nicht verfügbar
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MC10XS6200EK MCyyXS6yyy%28B%29EK.pdf
MC10XS6200EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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MC10XS6225EK MCyyXS6yyy%28B%29EK.pdf
MC10XS6225EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Part Status: Obsolete
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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MC10XS6325EK MCyyXS6yyy(B)EK.pdf
MC10XS6325EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 3
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
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MC10XSD200BFK
MC10XSD200BFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
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MC16XSD200BFK
MC16XSD200BFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
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MC25XS6300EK MC12XS6D2.pdf
MC25XS6300EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Current - Output (Max): 3.8A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
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2+15.27 EUR
10+11.79 EUR
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MCIMX535DVV2C2 IMX53CEC.pdf
MCIMX535DVV2C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MK21FX512AVMC12 K21P144M120SF5V2.pdf
MK21FX512AVMC12
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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1+28.77 EUR
10+22.79 EUR
25+21.29 EUR
100+19.64 EUR
348+18.61 EUR
696+18.18 EUR
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MK22FN1M0AVLH12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1052 Stücke:
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1+28.44 EUR
10+22.5 EUR
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MK22FN1M0AVLK12 K22P80M120SF5V2.pdf
MK22FN1M0AVLK12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
auf Bestellung 480 Stücke:
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MK22FN1M0AVLL12
MK22FN1M0AVLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
DigiKey Programmable: Not Verified
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
auf Bestellung 161 Stücke:
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MK22FN1M0AVLQ12 K22P64M120SF5V2.pdf
MK22FN1M0AVLQ12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 835 Stücke:
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1+31.58 EUR
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540+20.23 EUR
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MK22FN1M0AVMC12
MK22FN1M0AVMC12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Number of I/O: 64
Part Status: Active
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 38x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN512VMP12 K22FPB_Rev.5_Mar3%2C2014_PB.pdf
MK22FN512VMP12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 649 Stücke:
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2+20.48 EUR
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MK22FX512AVLH12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
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MK22FX512AVLK12 K22P80M120SF5V2.pdf
MK22FX512AVLK12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 27x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
auf Bestellung 288 Stücke:
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1+21.36 EUR
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MK22FX512AVLL12
MK22FX512AVLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 720 Stücke:
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MK22FX512AVLQ12 K22P144M120SF5V2.pdf
MK22FX512AVLQ12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
auf Bestellung 331 Stücke:
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MK22FX512AVMC12
MK22FX512AVMC12
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1740 Stücke
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MK22FX512AVMD12 K22P144M120SF5V2.pdf
MK22FX512AVMD12
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 178 Stücke:
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1+30.42 EUR
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MKE02Z16VFM4 MKE02P64M40SF0.pdf
MKE02Z16VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
auf Bestellung 16808 Stücke:
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5+4.19 EUR
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MKE02Z32VFM4 MKE02P64M40SF0.pdf
MKE02Z32VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1950 Stücke:
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5+4.71 EUR
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MKE02Z64VFM4 MKE02P64M40SF0.pdf
MKE02Z64VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 753 Stücke:
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3+8.23 EUR
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A2I25D012GNR1
A2I25D012GNR1
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
Produkt ist nicht verfügbar
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A2I25D012NR1
A2I25D012NR1
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
Produkt ist nicht verfügbar
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A2T07D160W04SR3
A2T07D160W04SR3
Hersteller: NXP USA Inc.
Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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A2T07H310-24SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 880MHz
Configuration: Dual
Power - Output: 47W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
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A2T18H100-25SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
Produkt ist nicht verfügbar
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A2T21H100-25SR3 A2T21H100-25S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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AFT05MS004NT1 AFT05MS004N.pdf
AFT05MS004NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 3900 Stücke:
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1000+4 EUR
2000+3.9 EUR
3000+3.86 EUR
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AFT09S200W02GNR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT09S200W02NR3
AFT09S200W02NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT09S200W02SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 4W PLD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT21S240-12SR3 AFT21S240-12S.pdf
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI780S-2
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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AFT26P100-4WGSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET 2.6GHZ 100W NI780S-6
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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B4420NXE7QQMD QIQQB4420FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
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B4860NXE7QUMD B4860FS.pdf
B4860NXE7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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FXLN8362QR1 FXLN83xxQ.pdf
FXLN8362QR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Produkt ist nicht verfügbar
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FXTH8705026T1
FXTH8705026T1
Hersteller: NXP USA Inc.
Description: IC SENSOR MULTICHIP Z-AXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH8705116T1
FXTH8705116T1
Hersteller: NXP USA Inc.
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FXTH8709026T1
Hersteller: NXP USA Inc.
Description: IC SENSOR MULTICHIP Z-AXIS 24QFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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FXTH8709116T1
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXTH8709126T1
FXTH8709126T1
Hersteller: NXP USA Inc.
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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KKL15Z128CAD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 35WLCSP
Produkt ist nicht verfügbar
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LS101MASE7DFA
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS101MASE7EHA
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS101MASN7DFA
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS101MAXE7DFA
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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LS1024ASE7JLA LS1024AFS.pdf
LS1024ASE7JLA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LS1024ASN7ELA LS1024AFS.pdf
LS1024ASN7ELA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+108.6 EUR
10+89.48 EUR
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LS1024ASN7JLA
LS1024ASN7JLA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+127.57 EUR
10+104.21 EUR
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LS102MASN7BFA
Hersteller: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Produkt ist nicht verfügbar
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MC08XS6421EKR2
MC08XS6421EKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC10XS6325EKR2 MCyyXS6yyy(B)EK.pdf
MC10XS6325EKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Produkt ist nicht verfügbar
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MC10XSD200BFKR2
MC10XSD200BFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
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MC16XSD200BFKR2
MC16XSD200BFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
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MC33901WEFR2 33901_34901.pdf
MC33901WEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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MC33907LAE MC33907-MC33908D2.pdf
MC33907LAE
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+23.15 EUR
10+18.17 EUR
25+16.92 EUR
100+15.55 EUR
250+14.91 EUR
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MC33908LAE MC33907-MC33908D2.pdf
MC33908LAE
Hersteller: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 6
Voltage - Input: -1V ~ 40V
Operating Temperature: -40°C ~ 125°C
Applications: Power Supply, Automotive Applications
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.81 EUR
10+17.93 EUR
25+16.71 EUR
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