Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35406) > Seite 253 nach 591
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NVT4556BUKZ | NXP USA Inc. |
 Description: IC INTERFACE SPECIALIZED 12WLCSPPackaging: Tape & Reel (TR) Package / Case: 12-XFBGA Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 1.55V ~ 3.6V Applications: SIM Card Supplier Device Package: 12-WLCSP (1.20x1.60) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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OM13512UL | NXP USA Inc. |
Description: DEMO BOARD PCF2123 SPI RTC Packaging: Box Function: Real Time Clock (RTC) Type: Timing Utilized IC / Part: PCF2123 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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OM13515UL | NXP USA Inc. |
Description: EVALUATION BOARD PCX85063A Packaging: Box Function: Real Time Clock (RTC) Type: Timing Contents: Board(s) Utilized IC / Part: PCF85063A Supplied Contents: Board(s) Secondary Attributes: I2C Interface(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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TRK-KEA128 | NXP USA Inc. |
Description: STARTERTRAK KEA128 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: KEA128 Platform: StarterTRAK Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TRK-KEA64 | NXP USA Inc. |
Description: STARTERTRAK KEA64 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KEA64 Platform: StarterTRAK Part Status: Active |
Produkt ist nicht verfügbar |
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TRK-KEA8 | NXP USA Inc. |
Description: STARTERTRAK KEA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KEA8 Platform: StarterTRAK Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13530UL | NXP USA Inc. |
Description: BOARD DEMO RF/IF SA614AHR Packaging: Box For Use With/Related Products: SA614A Frequency: 45MHz Type: Receiver Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| OM13533UL | NXP USA Inc. |
Description: BOARD DEMO RF/IF SA636BS Packaging: Box For Use With/Related Products: SA636 Frequency: 240MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OM13535UL | NXP USA Inc. |
Description: BOARD DEMO SA602AD/SA604AD Packaging: Box For Use With/Related Products: SA602A, SA604A Frequency: 45MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OM13534UL | NXP USA Inc. |
Description: BOARD DEMO SA605DK Packaging: Box For Use With/Related Products: SA605 Frequency: 45MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OM13531UL | NXP USA Inc. |
Description: BOARD DEMO SA6X6DK RF IF Packaging: Box For Use With/Related Products: SA6x6 Frequency: 45MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OM13532UL | NXP USA Inc. |
Description: BOARD DEMO SA6X6BS RF IF Packaging: Box For Use With/Related Products: SA616 Frequency: 45MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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OM13312,598 | NXP USA Inc. |
Description: BOARD DEMO SA636DK Packaging: Box For Use With/Related Products: SA636 Frequency: 110.59MHz Type: Receiver Supplied Contents: Board(s) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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SA615D/01,118 | NXP USA Inc. |
Description: IC MIXER 500MHZ UP CONVRT 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 500MHz RF Type: Cellular, ASK, FSK, UHF, VHF Voltage - Supply: 4.5V ~ 8V Gain: 13dB Current - Supply: 7.4mA Secondary Attributes: With Amplifier Noise Figure: 5dB Number of Mixers: 3 Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 2290 Stücke: Lieferzeit 10-14 Tag (e) |
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SA606D/01,118 | NXP USA Inc. |
Description: IC MIXER 150MHZ UP CONVRT 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 150MHz RF Type: Cellular, ASK, FSK, VHF Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 4.2mA Secondary Attributes: Up Converter Noise Figure: 6.2dB Number of Mixers: 2 Supplier Device Package: 20-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SA616BS,115 | NXP USA Inc. |
Description: IC MIXER FM IF SYSTEM LV 20HVQFN Packaging: Cut Tape (CT) Package / Case: 20-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 150MHz RF Type: General Purpose Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 3.5mA Secondary Attributes: With Amplifier Noise Figure: 6.8dB Number of Mixers: 2 Supplier Device Package: 20-HVQFN (4x4) |
Produkt ist nicht verfügbar |
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OM13071UL | NXP USA Inc. |
Description: LPCXPRESSO LPC82X EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC82x Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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| SSL8516DB1195,598 | NXP USA Inc. |
Description: BOARD DEMO SSL8516T 75W LED DVR |
Produkt ist nicht verfügbar |
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SSL8516T/1Y | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO |
Produkt ist nicht verfügbar |
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SSL8516T/1Y | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO |
Produkt ist nicht verfügbar |
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LPC822M101JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 33HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Discontinued at Digi-Key Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC824M201JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Discontinued at Digi-Key Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK24FN256VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 121XFBGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1024ASE7MLA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1024A-RDB | NXP USA Inc. |
Description: LS1024A EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K24F120M | NXP USA Inc. |
Description: TOWER SYSTEM K24 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K24 Platform: Tower System |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-LS1021A | NXP USA Inc. |
Description: TOWER SYSTEM LS1021A EVAL BRD |
Produkt ist nicht verfügbar |
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KEA128LEDLIGHTRD | NXP USA Inc. |
Description: BOARD REF DESIGN KEA128 Packaging: Box Features: SPI digital interface Utilized IC / Part: KEA128, MC10XS3425 Supplied Contents: Board(s) Outputs and Type: 4, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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MPC5604EKIT | NXP USA Inc. |
Description: KIT DEV VOE WITH MPC5604E Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: MPC5604E Supplied Contents: Board(s) Primary Attributes: Video Over Ethernet Embedded: Yes, MCU, 32-Bit |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SCP2201VMU | NXP USA Inc. |
Description: IC MPU ARM926EJ-S 236MAPBGA Packaging: Tray Package / Case: 236-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 236-MAPBGA (9x9) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SCP2207VMU | NXP USA Inc. |
Description: IC MPU ARM926EJ-S 236MAPBGA |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL17Z256VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 9717 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL17Z256VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 18x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1100 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL17Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 4378 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL17Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1280 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL27Z256VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Part Status: Active Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL27Z256VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 780 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL27Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 699 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL27Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 3199 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL33Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
auf Bestellung 83 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL33Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 640 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL43Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 2240 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL43Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDM-KL43Z | NXP USA Inc. |
Description: FREEDOM KL17/KL27/KL33/KL43 |
Produkt ist nicht verfügbar |
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TWR-KL43Z48M | NXP USA Inc. |
Description: TOWER SYSTEM KL17/KL27/KL33/KL43 Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KL17, KL27, KL33, KL43 Platform: Tower System |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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MK24FN1M0VDC12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121XFBGA Packaging: Cut Tape (CT) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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CBTL06GP213EEJ | NXP USA Inc. |
Description: IC MUX 6CH DISPLAY PORT 50TFBGA Packaging: Cut Tape (CT) Features: Bi-Directional, HDMI Package / Case: 50-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Applications: DisplayPort, PCIe, Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 9.5GHz Supplier Device Package: 50-TFBGA (5x5) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 6 |
auf Bestellung 5150 Stücke: Lieferzeit 10-14 Tag (e) |
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FXTH870502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH870902DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FXTH870911DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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PTN3355BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
Produkt ist nicht verfügbar |
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PTN3460IBS/F1MP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 6944 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN36221AHXHP | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PTN36221AHXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PTN3460IBS/F1MP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN36221AHXHP | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PTN36221AHXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PCAL6408ABSHP | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-HVQFN (3x3) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 48000 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3355BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
Produkt ist nicht verfügbar |
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PTN3363BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: HDMI Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
| NVT4556BUKZ |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 1.55V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 1.55V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM13512UL |
|
Hersteller: NXP USA Inc.
Description: DEMO BOARD PCF2123 SPI RTC
Packaging: Box
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123
Supplied Contents: Board(s)
Part Status: Active
Description: DEMO BOARD PCF2123 SPI RTC
Packaging: Box
Function: Real Time Clock (RTC)
Type: Timing
Utilized IC / Part: PCF2123
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| OM13515UL |
|
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD PCX85063A
Packaging: Box
Function: Real Time Clock (RTC)
Type: Timing
Contents: Board(s)
Utilized IC / Part: PCF85063A
Supplied Contents: Board(s)
Secondary Attributes: I2C Interface(s)
Part Status: Last Time Buy
Description: EVALUATION BOARD PCX85063A
Packaging: Box
Function: Real Time Clock (RTC)
Type: Timing
Contents: Board(s)
Utilized IC / Part: PCF85063A
Supplied Contents: Board(s)
Secondary Attributes: I2C Interface(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| TRK-KEA128 |
|
Hersteller: NXP USA Inc.
Description: STARTERTRAK KEA128 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KEA128
Platform: StarterTRAK
Part Status: Active
Description: STARTERTRAK KEA128 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KEA128
Platform: StarterTRAK
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 199.21 EUR |
| TRK-KEA64 |
|
Hersteller: NXP USA Inc.
Description: STARTERTRAK KEA64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA64
Platform: StarterTRAK
Part Status: Active
Description: STARTERTRAK KEA64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA64
Platform: StarterTRAK
Part Status: Active
Produkt ist nicht verfügbar
| TRK-KEA8 |
Hersteller: NXP USA Inc.
Description: STARTERTRAK KEA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA8
Platform: StarterTRAK
Part Status: Active
Description: STARTERTRAK KEA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA8
Platform: StarterTRAK
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 259.93 EUR |
| OM13530UL |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO RF/IF SA614AHR
Packaging: Box
For Use With/Related Products: SA614A
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Description: BOARD DEMO RF/IF SA614AHR
Packaging: Box
For Use With/Related Products: SA614A
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| OM13533UL |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO RF/IF SA636BS
Packaging: Box
For Use With/Related Products: SA636
Frequency: 240MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO RF/IF SA636BS
Packaging: Box
For Use With/Related Products: SA636
Frequency: 240MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OM13535UL |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO SA602AD/SA604AD
Packaging: Box
For Use With/Related Products: SA602A, SA604A
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO SA602AD/SA604AD
Packaging: Box
For Use With/Related Products: SA602A, SA604A
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OM13534UL |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO SA605DK
Packaging: Box
For Use With/Related Products: SA605
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO SA605DK
Packaging: Box
For Use With/Related Products: SA605
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OM13531UL |
Hersteller: NXP USA Inc.
Description: BOARD DEMO SA6X6DK RF IF
Packaging: Box
For Use With/Related Products: SA6x6
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO SA6X6DK RF IF
Packaging: Box
For Use With/Related Products: SA6x6
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OM13532UL |
Hersteller: NXP USA Inc.
Description: BOARD DEMO SA6X6BS RF IF
Packaging: Box
For Use With/Related Products: SA616
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO SA6X6BS RF IF
Packaging: Box
For Use With/Related Products: SA616
Frequency: 45MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| OM13312,598 |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO SA636DK
Packaging: Box
For Use With/Related Products: SA636
Frequency: 110.59MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Description: BOARD DEMO SA636DK
Packaging: Box
For Use With/Related Products: SA636
Frequency: 110.59MHz
Type: Receiver
Supplied Contents: Board(s)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
| SA615D/01,118 |
|
Hersteller: NXP USA Inc.
Description: IC MIXER 500MHZ UP CONVRT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 500MHz
RF Type: Cellular, ASK, FSK, UHF, VHF
Voltage - Supply: 4.5V ~ 8V
Gain: 13dB
Current - Supply: 7.4mA
Secondary Attributes: With Amplifier
Noise Figure: 5dB
Number of Mixers: 3
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC MIXER 500MHZ UP CONVRT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 500MHz
RF Type: Cellular, ASK, FSK, UHF, VHF
Voltage - Supply: 4.5V ~ 8V
Gain: 13dB
Current - Supply: 7.4mA
Secondary Attributes: With Amplifier
Noise Figure: 5dB
Number of Mixers: 3
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 2290 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.8 EUR |
| 10+ | 11.57 EUR |
| 25+ | 11.03 EUR |
| 100+ | 9.58 EUR |
| 250+ | 9.15 EUR |
| 500+ | 8.34 EUR |
| 1000+ | 7.26 EUR |
| SA606D/01,118 |
|
Hersteller: NXP USA Inc.
Description: IC MIXER 150MHZ UP CONVRT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 4.2mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC MIXER 150MHZ UP CONVRT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular, ASK, FSK, VHF
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 4.2mA
Secondary Attributes: Up Converter
Noise Figure: 6.2dB
Number of Mixers: 2
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA616BS,115 |
|
Hersteller: NXP USA Inc.
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: With Amplifier
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-HVQFN (4x4)
Produkt ist nicht verfügbar
| OM13071UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 40.15 EUR |
| SSL8516DB1195,598 |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO SSL8516T 75W LED DVR
Description: BOARD DEMO SSL8516T 75W LED DVR
Produkt ist nicht verfügbar
| SSL8516T/1Y |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
| SSL8516T/1Y |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
| LPC822M101JHI33E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC824M201JHI33E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK24FN256VDC12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LS1024ASE7MLA |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 127.32 EUR |
| TWR-K24F120M |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 276.3 EUR |
| TWR-LS1021A |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM LS1021A EVAL BRD
Description: TOWER SYSTEM LS1021A EVAL BRD
Produkt ist nicht verfügbar
| KEA128LEDLIGHTRD |
|
Hersteller: NXP USA Inc.
Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| MPC5604EKIT |
|
Hersteller: NXP USA Inc.
Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1042.68 EUR |
| SCP2201VMU |
|
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Produkt ist nicht verfügbar
| SCP2207VMU |
|
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
Description: IC MPU ARM926EJ-S 236MAPBGA
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)| MKL17Z256VFM4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 9717 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.9 EUR |
| 10+ | 8.85 EUR |
| 25+ | 7.8 EUR |
| 80+ | 6.79 EUR |
| 230+ | 6.11 EUR |
| 490+ | 5.73 EUR |
| 980+ | 5.44 EUR |
| 2450+ | 5.21 EUR |
| MKL17Z256VFT4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.36 EUR |
| 10+ | 9.18 EUR |
| 25+ | 8.11 EUR |
| 80+ | 7.07 EUR |
| 260+ | 6.29 EUR |
| 520+ | 5.94 EUR |
| 1040+ | 5.65 EUR |
| MKL17Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 4378 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.56 EUR |
| 10+ | 6.57 EUR |
| 25+ | 5.8 EUR |
| 160+ | 5.57 EUR |
| MKL17Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1280 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.87 EUR |
| 10+ | 9.55 EUR |
| 25+ | 8.44 EUR |
| 80+ | 7.37 EUR |
| 230+ | 6.64 EUR |
| 640+ | 6.11 EUR |
| 1280+ | 5.83 EUR |
| MKL27Z256VFM4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL27Z256VFT4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.13 EUR |
| 10+ | 11.09 EUR |
| 80+ | 9.18 EUR |
| MKL27Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.68 EUR |
| 10+ | 10.16 EUR |
| 25+ | 8.99 EUR |
| 160+ | 7.34 EUR |
| 320+ | 6.91 EUR |
| 480+ | 6.69 EUR |
| MKL27Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.4 EUR |
| 10+ | 11.31 EUR |
| 80+ | 9.36 EUR |
| 1280+ | 8.16 EUR |
| MKL33Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)| MKL33Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.17 EUR |
| 10+ | 7.99 EUR |
| 80+ | 6.61 EUR |
| MKL43Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 2240 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.42 EUR |
| 10+ | 12.12 EUR |
| 160+ | 10.03 EUR |
| 960+ | 8.75 EUR |
| MKL43Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| FRDM-KL43Z |
|
Hersteller: NXP USA Inc.
Description: FREEDOM KL17/KL27/KL33/KL43
Description: FREEDOM KL17/KL27/KL33/KL43
Produkt ist nicht verfügbar
| TWR-KL43Z48M |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 298.06 EUR |
| MK24FN1M0VDC12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| CBTL06GP213EEJ |
|
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 5150 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.1 EUR |
| 10+ | 3.69 EUR |
| 25+ | 3.48 EUR |
| 100+ | 2.96 EUR |
| 250+ | 2.78 EUR |
| 500+ | 2.43 EUR |
| 1000+ | 2.02 EUR |
| FXTH870502DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH870902DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Description: SENSOR TIRE PRESSURE RF
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
| FXTH870911DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| PTN3355BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
| PTN3460IBS/F1MP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6944 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.51 EUR |
| 10+ | 9.45 EUR |
| 25+ | 8.93 EUR |
| 100+ | 7.74 EUR |
| 250+ | 7.34 EUR |
| 500+ | 6.59 EUR |
| 1000+ | 5.56 EUR |
| PTN36221AHXHP |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PTN36221AHXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PTN3460IBS/F1MP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 5.28 EUR |
| PTN36221AHXHP |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PTN36221AHXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PCAL6408ABSHP |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 0.96 EUR |
| 12000+ | 0.93 EUR |
| PTN3355BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
| PTN3363BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar