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MC34978ES MC34978ES NXP USA Inc. MC33978,%20MC34978.pdf Description: IC INTERFACE SPECIALIZED 32QFN
Produkt ist nicht verfügbar
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OM13081UL OM13081UL NXP USA Inc. LPC82X.pdf Description: LPC824 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC824
Part Status: Active
Produkt ist nicht verfügbar
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S9S12ZVL32F0MLC S9S12ZVL32F0MLC NXP USA Inc. S12ZVLFS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
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S9S12ZVL32F0MLF S9S12ZVL32F0MLF NXP USA Inc. S12ZVLFS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12ZVLS3F0MFM S9S12ZVLS3F0MFM NXP USA Inc. S12ZVLFS.pdf Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
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2+10.94 EUR
10+8.38 EUR
25+7.74 EUR
100+7.02 EUR
490+6.49 EUR
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TRK-S12ZVL TRK-S12ZVL NXP USA Inc. Description: S12ZVL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVL
Platform: StarterTRAK
Part Status: Active
Produkt ist nicht verfügbar
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PCF8883US/7EA/1Y PCF8883US/7EA/1Y NXP USA Inc. PCF8883.pdf Description: IC PROXIMITY SWITCH UNCASED
auf Bestellung 1283 Stücke:
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MWCT1012CFM MWCT1012CFM NXP USA Inc. Description: IC TRANSMITTER 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 1436 Stücke:
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2+13.57 EUR
10+12.26 EUR
25+11.7 EUR
80+10.15 EUR
230+9.7 EUR
490+8.84 EUR
980+7.7 EUR
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MWCT1111CLH MWCT1111CLH NXP USA Inc. MWCT1xyz%20Reference%20Manual.pdf Description: IC TRANSMITTER 40KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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NTB0104UK,012 NTB0104UK,012 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-UFBGA/WLCSP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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SSL5021BDB1205UL SSL5021BDB1205UL NXP USA Inc. SSL5021BTS.pdf Description: EVAL BOARD FOR SSL5021BTS
Packaging: Bulk
Voltage - Output: 40V ~ 60V
Voltage - Input: 85 ~ 140 VAC
Contents: Board(s)
Current - Output / Channel: 93mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
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SSL5021BDB1206UL SSL5021BDB1206UL NXP USA Inc. SSL5021BTS.pdf Description: DEMO BD SSL5021 LED DVR 230V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 60V
Voltage - Input: 150 ~ 265 VAC
Current - Output / Channel: 93mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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SSL5021BDB1267UL SSL5021BDB1267UL NXP USA Inc. Description: DEMO BD SSL5021 LED DVR 230V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 88V
Voltage - Input: 170 ~ 265 VAC
Current - Output / Channel: 71mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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SSL5021BDB1268UL SSL5021BDB1268UL NXP USA Inc. Description: DEMO BD SSL5021 LED DVR 120V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 65V
Voltage - Input: 96 ~ 138 VAC
Current - Output / Channel: 85mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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SSL5031BDB1207UL SSL5031BDB1207UL NXP USA Inc. Description: EVAL BOARD FOR SSL5031BTS
Packaging: Bulk
Voltage - Output: 40V
Voltage - Input: 120VAC
Contents: Board(s)
Current - Output / Channel: 205mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
Produkt ist nicht verfügbar
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SSL5031BDB1208UL SSL5031BDB1208UL NXP USA Inc. Description: DEMO BD SSL5031 LED DVR 230V 9W
Packaging: Bulk
Voltage - Output: 80V
Voltage - Input: 230VAC
Current - Output / Channel: 105mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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SSL5031BDB1209UL SSL5031BDB1209UL NXP USA Inc. Description: DEMO BD SSL5031 LED DVR 18W
Packaging: Bulk
Voltage - Output: 50V ~ 65V
Voltage - Input: 100 ~ 264 VAC
Current - Output / Channel: 297mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL5031CDB1210UL SSL5031CDB1210UL NXP USA Inc. SSL5031CDB1210_UM.pdf Description: DEMO BD SSL5031 LED DVR 18W
Packaging: Bulk
Voltage - Output: 35V ~ 60V
Voltage - Input: 90 ~ 265 VAC
Current - Output / Channel: 300mA
Utilized IC / Part: SSL5031CTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
Produkt ist nicht verfügbar
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SSL5021BTS/1X SSL5021BTS/1X NXP USA Inc. SSL5021BTS.pdf Description: IC LED DRIVER RGLTR 2A SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Regulator
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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SSL5021BTS/1X SSL5021BTS/1X NXP USA Inc. SSL5021BTS.pdf Description: IC LED DRIVER RGLTR 2A SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Regulator
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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SSL5031BTS/1X SSL5031BTS/1X NXP USA Inc. Description: IC LED DRIVER OFFL SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL5031CTS/1X SSL5031CTS/1X NXP USA Inc. SSL5031CTS.pdf Description: IC LED DRIVER OFFL SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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MKV31F512VLH12 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
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2+15.27 EUR
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160+9.77 EUR
320+9.46 EUR
640+9.21 EUR
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MKV31F256VLH12 MKV31F256VLH12 NXP USA Inc. KV31P100M120SF8.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 614 Stücke:
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3+8.96 EUR
10+6.89 EUR
25+6.75 EUR
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MKV30F128VLH10 MKV30F128VLH10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
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3+7.14 EUR
10+6.18 EUR
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MKV30F128VFM10 MKV30F128VFM10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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4+6.95 EUR
10+5.2 EUR
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MKV31F512VLL12 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 2757 Stücke:
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2+16.21 EUR
10+12.57 EUR
24+11.7 EUR
90+10.73 EUR
270+10.16 EUR
450+9.95 EUR
990+9.67 EUR
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MKV31F256VLL12 MKV31F256VLL12 NXP USA Inc. KV31P100M120SF8.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
auf Bestellung 357 Stücke:
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2+14.91 EUR
10+11.53 EUR
24+10.72 EUR
90+9.82 EUR
270+9.28 EUR
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MKV31F128VLL10 MKV31F128VLL10 NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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3+8.92 EUR
10+5.56 EUR
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MKV31F128VLH10 NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 381 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.14 EUR
10+8.53 EUR
25+7.88 EUR
160+6.97 EUR
320+6.74 EUR
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TWR-KV31F120M TWR-KV31F120M NXP USA Inc. TWR-KV31F120M.pdf Description: TOWER SYSTEM KV3X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: KV3x
Platform: Tower System
Part Status: Active
auf Bestellung 2 Stücke:
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1+328.8 EUR
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MKV30F64VLH10 MKV30F64VLH10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKV30F64VFM10 MKV30F64VFM10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1856 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.19 EUR
10+6.21 EUR
25+5.71 EUR
100+5.18 EUR
490+4.76 EUR
980+4.63 EUR
1470+4.57 EUR
Mindestbestellmenge: 3 Stücke
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MC34CM0902WEF MC34CM0902WEF NXP USA Inc. CM0902.pdf Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
 Mindestbestellmenge: 55 Stücke
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OM13080UL OM13080UL NXP USA Inc. OM13080%20Product%20Brief.pdf Description: LPCXPRESSO LPC1125 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1125
Platform: LPCXpresso™
Part Status: Active
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NX5P2190UKZ NX5P2190UKZ NXP USA Inc. NX5P2190.pdf Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.36x1.36)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HT2DC20S20/F/RSP HT2DC20S20/F/RSP NXP USA Inc. HT2X_SDS.pdf Description: RFID TAG R/W 125KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.469" L x 0.232" W (11.90mm x 5.90mm)
Style: Encapsulated
Frequency: 125kHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 256b (User)
Part Status: Active
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FRDM-STBC-AGM01 FRDM-STBC-AGM01 NXP USA Inc. FXOS8700CQ.pdf Description: FREEDOM BOARD FXAS21002/FXOS8700
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXAS21002, FXOS8700
Supplied Contents: Board(s)
Part Status: Active
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MCIMX6X1AVO08AB MCIMX6X1AVO08AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MCIMX6X2AVN08AB MCIMX6X2AVN08AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MCIMX6X3CVN08AB MCIMX6X3CVN08AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MCIMX6X4AVM08AB MCIMX6X4AVM08AB NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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MCIMX6X4CVM08AB MCIMX6X4CVM08AB NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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MCIMX6SX-SDB MCIMX6SX-SDB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: SABRE I.MX 6SOLOX EVAL BRD
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LPC18S10FET100E LPC18S10FET100E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LPC18S30FET256E LPC18S30FET256E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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LPC18S37JET100E LPC18S37JET100E NXP USA Inc. LPC18S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC18S50FET180E LPC18S50FET180E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
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LPC18S50FET256,551 LPC18S50FET256,551 NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC18S57JET256E LPC18S57JET256E NXP USA Inc. LPC18S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC43S37JET100E LPC43S37JET100E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC43S50FET180E LPC43S50FET180E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
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LPC43S57JET256E LPC43S57JET256E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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LPC1124JBD48/303QL LPC1124JBD48/303QL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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LPC1125JBD48/303QL LPC1125JBD48/303QL NXP USA Inc. LPC112X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
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MM912KS812AMAF MM912KS812AMAF NXP USA Inc. MM912_S812.pdf Description: IC MCU 16BIT HCS12 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (256kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 12K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
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MC08XS6421EK MC08XS6421EK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Tray
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OM5569/NT312D,699 OM5569/NT312D,699 NXP USA Inc. NT3H1101_NT3H1201_DS.pdf Description: DEMO BOARD NTAG I2C
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NT3H1101
Packaging: Box
Produkt ist nicht verfügbar
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OM13073,598 OM13073,598 NXP USA Inc. OM13073_PB.pdf Description: LPCXPRESSO LPC43S37 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+, Cortex®-M4F
Utilized IC / Part: LPC43S37
Platform: LPCXpresso™
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OM13082UL OM13082UL NXP USA Inc. OM13082_PB.pdf Description: SHIELD BOARD LPC GEN PURPOSE
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MC34978ES MC33978,%20MC34978.pdf
MC34978ES
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32QFN
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OM13081UL LPC82X.pdf
OM13081UL
Hersteller: NXP USA Inc.
Description: LPC824 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC824
Part Status: Active
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S9S12ZVL32F0MLC S12ZVLFS.pdf
S9S12ZVL32F0MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
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S9S12ZVL32F0MLF S12ZVLFS.pdf
S9S12ZVL32F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12ZVLS3F0MFM S12ZVLFS.pdf
S9S12ZVLS3F0MFM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
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2+10.94 EUR
10+8.38 EUR
25+7.74 EUR
100+7.02 EUR
490+6.49 EUR
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TRK-S12ZVL
TRK-S12ZVL
Hersteller: NXP USA Inc.
Description: S12ZVL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVL
Platform: StarterTRAK
Part Status: Active
Produkt ist nicht verfügbar
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PCF8883US/7EA/1Y PCF8883.pdf
PCF8883US/7EA/1Y
Hersteller: NXP USA Inc.
Description: IC PROXIMITY SWITCH UNCASED
auf Bestellung 1283 Stücke:
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MWCT1012CFM
MWCT1012CFM
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 1436 Stücke:
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2+13.57 EUR
10+12.26 EUR
25+11.7 EUR
80+10.15 EUR
230+9.7 EUR
490+8.84 EUR
980+7.7 EUR
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MWCT1111CLH MWCT1xyz%20Reference%20Manual.pdf
MWCT1111CLH
Hersteller: NXP USA Inc.
Description: IC TRANSMITTER 40KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 81 Stücke:
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2+11.38 EUR
10+8.7 EUR
25+8.03 EUR
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NTB0104UK,012 NTB0104.pdf
NTB0104UK,012
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-UFBGA/WLCSP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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SSL5021BDB1205UL SSL5021BTS.pdf
SSL5021BDB1205UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SSL5021BTS
Packaging: Bulk
Voltage - Output: 40V ~ 60V
Voltage - Input: 85 ~ 140 VAC
Contents: Board(s)
Current - Output / Channel: 93mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
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1+185.38 EUR
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SSL5021BDB1206UL SSL5021BTS.pdf
SSL5021BDB1206UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5021 LED DVR 230V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 60V
Voltage - Input: 150 ~ 265 VAC
Current - Output / Channel: 93mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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1+194.61 EUR
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SSL5021BDB1267UL
SSL5021BDB1267UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5021 LED DVR 230V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 88V
Voltage - Input: 170 ~ 265 VAC
Current - Output / Channel: 71mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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1+194.61 EUR
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SSL5021BDB1268UL
SSL5021BDB1268UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5021 LED DVR 120V 6W
Packaging: Bulk
Voltage - Output: 40V ~ 65V
Voltage - Input: 96 ~ 138 VAC
Current - Output / Channel: 85mA
Utilized IC / Part: SSL5021BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
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1+194.61 EUR
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SSL5031BDB1207UL
SSL5031BDB1207UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SSL5031BTS
Packaging: Bulk
Voltage - Output: 40V
Voltage - Input: 120VAC
Contents: Board(s)
Current - Output / Channel: 205mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
Produkt ist nicht verfügbar
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SSL5031BDB1208UL
SSL5031BDB1208UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5031 LED DVR 230V 9W
Packaging: Bulk
Voltage - Output: 80V
Voltage - Input: 230VAC
Current - Output / Channel: 105mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
auf Bestellung 1 Stücke:
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1+194.61 EUR
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SSL5031BDB1209UL
SSL5031BDB1209UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5031 LED DVR 18W
Packaging: Bulk
Voltage - Output: 50V ~ 65V
Voltage - Input: 100 ~ 264 VAC
Current - Output / Channel: 297mA
Utilized IC / Part: SSL5031BTS
Supplied Contents: Board(s)
Outputs and Type: 1, Non-Isolated
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL5031CDB1210UL SSL5031CDB1210_UM.pdf
SSL5031CDB1210UL
Hersteller: NXP USA Inc.
Description: DEMO BD SSL5031 LED DVR 18W
Packaging: Bulk
Voltage - Output: 35V ~ 60V
Voltage - Input: 90 ~ 265 VAC
Current - Output / Channel: 300mA
Utilized IC / Part: SSL5031CTS
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Obsolete
Produkt ist nicht verfügbar
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SSL5021BTS/1X SSL5021BTS.pdf
SSL5021BTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 2A SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Regulator
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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SSL5021BTS/1X SSL5021BTS.pdf
SSL5021BTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 2A SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: DC DC Regulator
Operating Temperature: -40°C ~ 160°C (TJ)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Produkt ist nicht verfügbar
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SSL5031BTS/1X
SSL5031BTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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SSL5031CTS/1X SSL5031CTS.pdf
SSL5031CTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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MKV31F512VLH12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 874 Stücke:
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2+15.27 EUR
10+11.82 EUR
25+10.96 EUR
160+9.77 EUR
320+9.46 EUR
640+9.21 EUR
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MKV31F256VLH12 KV31P100M120SF8.pdf
MKV31F256VLH12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 614 Stücke:
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3+8.96 EUR
10+6.89 EUR
25+6.75 EUR
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MKV30F128VLH10 KV30P64M100SFA.pdf
MKV30F128VLH10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
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3+7.14 EUR
10+6.18 EUR
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MKV30F128VFM10 KV30P64M100SFA.pdf
MKV30F128VFM10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2769 Stücke:
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4+6.95 EUR
10+5.2 EUR
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MKV31F512VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 2757 Stücke:
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2+16.21 EUR
10+12.57 EUR
24+11.7 EUR
90+10.73 EUR
270+10.16 EUR
450+9.95 EUR
990+9.67 EUR
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MKV31F256VLL12 KV31P100M120SF8.pdf
MKV31F256VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
auf Bestellung 357 Stücke:
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2+14.91 EUR
10+11.53 EUR
24+10.72 EUR
90+9.82 EUR
270+9.28 EUR
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MKV31F128VLL10
MKV31F128VLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
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3+8.92 EUR
10+5.56 EUR
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MKV31F128VLH10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 381 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.14 EUR
10+8.53 EUR
25+7.88 EUR
160+6.97 EUR
320+6.74 EUR
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TWR-KV31F120M TWR-KV31F120M.pdf
TWR-KV31F120M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KV3X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: KV3x
Platform: Tower System
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+328.8 EUR
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MKV30F64VLH10 KV30P64M100SFA.pdf
MKV30F64VLH10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKV30F64VFM10 KV30P64M100SFA.pdf
MKV30F64VFM10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1856 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.19 EUR
10+6.21 EUR
25+5.71 EUR
100+5.18 EUR
490+4.76 EUR
980+4.63 EUR
1470+4.57 EUR
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MC34CM0902WEF CM0902.pdf
MC34CM0902WEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13080UL OM13080%20Product%20Brief.pdf
OM13080UL
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC1125 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1125
Platform: LPCXpresso™
Part Status: Active
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NX5P2190UKZ NX5P2190.pdf
NX5P2190UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.36x1.36)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HT2DC20S20/F/RSP HT2X_SDS.pdf
HT2DC20S20/F/RSP
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 125KHZ ENCAP
Packaging: Bulk
Size / Dimension: 0.469" L x 0.232" W (11.90mm x 5.90mm)
Style: Encapsulated
Frequency: 125kHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 256b (User)
Part Status: Active
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3+9.89 EUR
10+7.53 EUR
25+6.94 EUR
100+6.3 EUR
250+5.99 EUR
500+5.8 EUR
1000+5.64 EUR
2500+5.47 EUR
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FRDM-STBC-AGM01 FXOS8700CQ.pdf
FRDM-STBC-AGM01
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD FXAS21002/FXOS8700
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: FXAS21002, FXOS8700
Supplied Contents: Board(s)
Part Status: Active
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MCIMX6X1AVO08AB DWF13_AMF_CON_T0060.pdf
MCIMX6X1AVO08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6X2AVN08AB DWF13_AMF_CON_T0060.pdf
MCIMX6X2AVN08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6X3CVN08AB DWF13_AMF_CON_T0060.pdf
MCIMX6X3CVN08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
auf Bestellung 28 Stücke:
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1+76.03 EUR
10+61.92 EUR
25+58.38 EUR
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MCIMX6X4AVM08AB IMX6SXIEC.pdf
MCIMX6X4AVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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1+94.38 EUR
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MCIMX6X4CVM08AB IMX6SXIEC.pdf
MCIMX6X4CVM08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 529MAPBGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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1+83.84 EUR
10+68.7 EUR
84+61.84 EUR
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MCIMX6SX-SDB DWF13_AMF_CON_T0060.pdf
MCIMX6SX-SDB
Hersteller: NXP USA Inc.
Description: SABRE I.MX 6SOLOX EVAL BRD
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1+1124.03 EUR
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LPC18S10FET100E LPC18S50_30_10.pdf
LPC18S10FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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2+18.85 EUR
10+14.68 EUR
25+13.65 EUR
80+12.66 EUR
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LPC18S30FET256E LPC18S50_30_10.pdf
LPC18S30FET256E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC18S37JET100E LPC18S5X_S3X.pdf
LPC18S37JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC18S50FET180E LPC18S50_30_10.pdf
LPC18S50FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC18S50FET256,551 LPC18S50_30_10.pdf
LPC18S50FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC18S57JET256E LPC18S5X_S3X.pdf
LPC18S57JET256E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC43S37JET100E LPC43S5X_S3X.pdf
LPC43S37JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC43S50FET180E LPC43S50_30_20.pdf
LPC43S50FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
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1+23.51 EUR
10+18.62 EUR
25+17.7 EUR
189+15.49 EUR
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LPC43S57JET256E LPC43S5X_S3X.pdf
LPC43S57JET256E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
auf Bestellung 921 Stücke:
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1+36.08 EUR
10+25.92 EUR
90+23.76 EUR
180+23.2 EUR
270+22.65 EUR
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LPC1124JBD48/303QL LPC1102_1104.pdf
LPC1124JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 68 Stücke:
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AnzahlPrivatkunde
3+9.95 EUR
10+7.59 EUR
25+7 EUR
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LPC1125JBD48/303QL LPC112X.pdf
LPC1125JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MM912KS812AMAF MM912_S812.pdf
MM912KS812AMAF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT HCS12 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (256kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 12K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 83 Stücke:
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AnzahlPrivatkunde
2+18.05 EUR
10+14.08 EUR
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MC08XS6421EK
MC08XS6421EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Tray
Produkt ist nicht verfügbar
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OM5569/NT312D,699 NT3H1101_NT3H1201_DS.pdf
OM5569/NT312D,699
Hersteller: NXP USA Inc.
Description: DEMO BOARD NTAG I2C
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NT3H1101
Packaging: Box
Produkt ist nicht verfügbar
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OM13073,598 OM13073_PB.pdf
OM13073,598
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC43S37 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+, Cortex®-M4F
Utilized IC / Part: LPC43S37
Platform: LPCXpresso™
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OM13082UL OM13082_PB.pdf
OM13082UL
Hersteller: NXP USA Inc.
Description: SHIELD BOARD LPC GEN PURPOSE
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
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