Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 251 nach 572
| Foto | Bezeichnung | Hersteller | Beschreibung |
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SA616BS,115 | NXP USA Inc. |
 Description: IC MIXER FM IF SYSTEM LV 20HVQFN |
Produkt ist nicht verfügbar |
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OM13071UL | NXP USA Inc. |
Description: LPCXPRESSO LPC82X EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC82x Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 21-28 Tag (e) |
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| SSL8516DB1195,598 | NXP USA Inc. |
Description: BOARD DEMO SSL8516T 75W LED DVR |
Produkt ist nicht verfügbar |
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SSL8516T/1Y | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO |
Produkt ist nicht verfügbar |
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SSL8516T/1Y | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO |
Produkt ist nicht verfügbar |
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LPC822M101JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 33HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Discontinued at Digi-Key Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC824M201JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Discontinued at Digi-Key Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK24FN256VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 121XFBGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1024ASE7MLA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
auf Bestellung 3 Stücke: Lieferzeit 21-28 Tag (e) |
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LS1024A-RDB | NXP USA Inc. |
Description: LS1024A EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-K24F120M | NXP USA Inc. |
Description: TOWER SYSTEM K24 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K24 Platform: Tower System |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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TWR-LS1021A | NXP USA Inc. |
Description: TOWER SYSTEM LS1021A EVAL BRD |
Produkt ist nicht verfügbar |
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KEA128LEDLIGHTRD | NXP USA Inc. |
Description: BOARD REF DESIGN KEA128 Packaging: Box Features: SPI digital interface Utilized IC / Part: KEA128, MC10XS3425 Supplied Contents: Board(s) Outputs and Type: 4, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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MPC5604EKIT | NXP USA Inc. |
Description: KIT DEV VOE WITH MPC5604E Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: MPC5604E Supplied Contents: Board(s) Primary Attributes: Video Over Ethernet Embedded: Yes, MCU, 32-Bit |
auf Bestellung 6 Stücke: Lieferzeit 21-28 Tag (e) |
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SCP2201VMU | NXP USA Inc. |
Description: IC MPU ARM926EJ-S 236MAPBGA Packaging: Tray Package / Case: 236-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 236-MAPBGA (9x9) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SCP2207VMU | NXP USA Inc. |
Description: IC MPU ARM926EJ-S 236MAPBGA |
auf Bestellung 36 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL17Z256VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL17Z256VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 18x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1200 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL17Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 4784 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL17Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA |
Produkt ist nicht verfügbar |
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MKL27Z256VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Part Status: Active Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL27Z256VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 780 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL27Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 102 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL27Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 153 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL33Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
auf Bestellung 83 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL33Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 640 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL43Z256VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 2240 Stücke: Lieferzeit 21-28 Tag (e) |
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MKL43Z256VMP4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDM-KL43Z | NXP USA Inc. |
Description: FREEDOM KL17/KL27/KL33/KL43 |
Produkt ist nicht verfügbar |
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TWR-KL43Z48M | NXP USA Inc. |
Description: TOWER SYSTEM KL17/KL27/KL33/KL43 Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KL17, KL27, KL33, KL43 Platform: Tower System |
auf Bestellung 6 Stücke: Lieferzeit 21-28 Tag (e) |
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MK24FN1M0VDC12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121XFBGA Packaging: Cut Tape (CT) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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CBTL06GP213EEJ | NXP USA Inc. |
Description: IC MUX 6CH DISPLAY PORT 50TFBGA Packaging: Cut Tape (CT) Features: Bi-Directional, HDMI Package / Case: 50-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Applications: DisplayPort, PCIe, Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 9.5GHz Supplier Device Package: 50-TFBGA (5x5) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 6 |
auf Bestellung 2350 Stücke: Lieferzeit 21-28 Tag (e) |
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FXTH870502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH870902DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FXTH870911DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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PTN3355BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 9888 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN3460IBS/F1MP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 273 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN36221AHXHP | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
auf Bestellung 33 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN36221AHXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN |
Produkt ist nicht verfügbar |
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PTN3460IBS/F1MP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: LVDS Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
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PTN36221AHXHP | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 0.5ns Number of Channels: 1 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Applications: USB 3.0 Current - Supply: 57mA Supplier Device Package: 12-X2QFN (1.6x1.6) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PTN36221AHXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 1CH 12X2QFN |
Produkt ist nicht verfügbar |
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PCAL6408ABSHP | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-HVQFN (3x3) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 60000 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN3355BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 8000 Stücke: Lieferzeit 21-28 Tag (e) |
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PTN3363BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: HDMI Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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74CBTLVD3245DS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOP Packaging: Cut Tape (CT) Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LPC812M101JTB16X | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 16XSON Packaging: Cut Tape (CT) Package / Case: 16-XFDFN Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-XSON (3.2x2.5) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 21-28 Tag (e) |
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1N4448,143 | NXP USA Inc. |
Description: DIODE GEN PURP 100V 200MA DO35 |
Produkt ist nicht verfügbar |
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BFR540,235 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz Supplier Device Package: SOT-23 (TO-236AB) |
Produkt ist nicht verfügbar |
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KTY84/130,153 | NXP USA Inc. |
Description: THERMISTOR PTC 603 OHM DO34 Packaging: Cut Tape (CT) Package / Case: DO-204AG, DO-34, Axial Mounting Type: Through Hole Operating Temperature: -40°C ~ 300°C Supplier Device Package: DO-34 Part Status: Obsolete Resistance @ 25°C: 603 Ohms |
Produkt ist nicht verfügbar |
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MC34VR500V1ES | NXP USA Inc. |
Description: IC REG 9OUT BUCK/LDO 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) |
auf Bestellung 174 Stücke: Lieferzeit 21-28 Tag (e) |
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MC34VR500V2ES | NXP USA Inc. |
Description: IC REG 9OUT BUCK/LDO 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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MK02FN128VFM10 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1950 Stücke: Lieferzeit 21-28 Tag (e) |
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MK02FN64VFM10 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1350 Stücke: Lieferzeit 21-28 Tag (e) |
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FXTH870912DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH870511DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH8709226T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH870502DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
auf Bestellung 1927 Stücke: Lieferzeit 21-28 Tag (e) |
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FXTH870911DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
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FXTH870902DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) Part Status: Obsolete |
auf Bestellung 1811 Stücke: Lieferzeit 21-28 Tag (e) |
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| SA616BS,115 |
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Hersteller: NXP USA Inc.
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Description: IC MIXER FM IF SYSTEM LV 20HVQFN
Produkt ist nicht verfügbar
| OM13071UL |
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Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC82X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC82x
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 59.31 EUR |
| SSL8516DB1195,598 |
|
Hersteller: NXP USA Inc.
Description: BOARD DEMO SSL8516T 75W LED DVR
Description: BOARD DEMO SSL8516T 75W LED DVR
Produkt ist nicht verfügbar
| SSL8516T/1Y |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
| SSL8516T/1Y |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Description: IC LED DRIVER OFFL SWITCHER 16SO
Produkt ist nicht verfügbar
| LPC822M101JHI33E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 33HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC824M201JHI33E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Discontinued at Digi-Key
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK24FN256VDC12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LS1024ASE7MLA |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
auf Bestellung 3 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 188.79 EUR |
| TWR-K24F120M |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
Description: TOWER SYSTEM K24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K24
Platform: Tower System
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 453.47 EUR |
| TWR-LS1021A |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM LS1021A EVAL BRD
Description: TOWER SYSTEM LS1021A EVAL BRD
Produkt ist nicht verfügbar
| KEA128LEDLIGHTRD |
|
Hersteller: NXP USA Inc.
Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Description: BOARD REF DESIGN KEA128
Packaging: Box
Features: SPI digital interface
Utilized IC / Part: KEA128, MC10XS3425
Supplied Contents: Board(s)
Outputs and Type: 4, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| MPC5604EKIT |
|
Hersteller: NXP USA Inc.
Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
Description: KIT DEV VOE WITH MPC5604E
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: MPC5604E
Supplied Contents: Board(s)
Primary Attributes: Video Over Ethernet
Embedded: Yes, MCU, 32-Bit
auf Bestellung 6 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1540.32 EUR |
| SCP2201VMU |
|
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Description: IC MPU ARM926EJ-S 236MAPBGA
Packaging: Tray
Package / Case: 236-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 236-MAPBGA (9x9)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography
Part Status: Obsolete
Produkt ist nicht verfügbar
| SCP2207VMU |
|
Hersteller: NXP USA Inc.
Description: IC MPU ARM926EJ-S 236MAPBGA
Description: IC MPU ARM926EJ-S 236MAPBGA
auf Bestellung 36 Stücke:
Lieferzeit 21-28 Tag (e)| MKL17Z256VFM4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL17Z256VFT4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1200 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 18.33 EUR |
| 10+ | 14.39 EUR |
| 80+ | 11.91 EUR |
| 1040+ | 10.39 EUR |
| MKL17Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 4784 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 18.72 EUR |
| 10+ | 14.71 EUR |
| 160+ | 12.18 EUR |
| 960+ | 10.62 EUR |
| MKL17Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Produkt ist nicht verfügbar
| MKL27Z256VFM4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL27Z256VFT4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 780 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 20.88 EUR |
| 10+ | 16.39 EUR |
| 80+ | 13.57 EUR |
| MKL27Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 102 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 20.75 EUR |
| 10+ | 16.3 EUR |
| MKL27Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 153 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 21.06 EUR |
| 10+ | 16.54 EUR |
| 80+ | 13.69 EUR |
| MKL33Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
auf Bestellung 83 Stücke:
Lieferzeit 21-28 Tag (e)| MKL33Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 21.37 EUR |
| 10+ | 16.78 EUR |
| 80+ | 13.9 EUR |
| MKL43Z256VLH4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 2240 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 22.78 EUR |
| 10+ | 17.91 EUR |
| 160+ | 14.82 EUR |
| 960+ | 12.93 EUR |
| MKL43Z256VMP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| FRDM-KL43Z |
|
Hersteller: NXP USA Inc.
Description: FREEDOM KL17/KL27/KL33/KL43
Description: FREEDOM KL17/KL27/KL33/KL43
Produkt ist nicht verfügbar
| TWR-KL43Z48M |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
Description: TOWER SYSTEM KL17/KL27/KL33/KL43
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27, KL33, KL43
Platform: Tower System
auf Bestellung 6 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 440.31 EUR |
| MK24FN1M0VDC12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| CBTL06GP213EEJ |
|
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
Description: IC MUX 6CH DISPLAY PORT 50TFBGA
Packaging: Cut Tape (CT)
Features: Bi-Directional, HDMI
Package / Case: 50-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: DisplayPort, PCIe, Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 9.5GHz
Supplier Device Package: 50-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 6
auf Bestellung 2350 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 6.21 EUR |
| 10+ | 5.6 EUR |
| 25+ | 5.28 EUR |
| 100+ | 4.5 EUR |
| 250+ | 4.22 EUR |
| 500+ | 3.7 EUR |
| 1000+ | 3.06 EUR |
| FXTH870502DT1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH870902DT1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Produkt ist nicht verfügbar
| FXTH870911DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| PTN3355BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 9888 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 7.62 EUR |
| 10+ | 6.85 EUR |
| 25+ | 6.47 EUR |
| 100+ | 5.61 EUR |
| 250+ | 5.32 EUR |
| 500+ | 4.78 EUR |
| 1000+ | 4.03 EUR |
| PTN3460IBS/F1MP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 273 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 17.29 EUR |
| 10+ | 15.54 EUR |
| 25+ | 14.69 EUR |
| 100+ | 12.73 EUR |
| 250+ | 12.08 EUR |
| PTN36221AHXHP |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
auf Bestellung 33 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 3.15 EUR |
| 10+ | 2.8 EUR |
| 25+ | 2.66 EUR |
| PTN36221AHXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Produkt ist nicht verfügbar
| PTN3460IBS/F1MP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
| PTN36221AHXHP |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 0.5ns
Number of Channels: 1
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Applications: USB 3.0
Current - Supply: 57mA
Supplier Device Package: 12-X2QFN (1.6x1.6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PTN36221AHXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Description: IC REDRIVER USB 3.0 1CH 12X2QFN
Produkt ist nicht verfügbar
| PCAL6408ABSHP |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 60000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.46 EUR |
| 12000+ | 1.41 EUR |
| PTN3355BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 8000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 3.83 EUR |
| PTN3363BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
| 74CBTLVD3245DS,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
| LPC812M101JTB16X |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16XSON
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-XSON (3.2x2.5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16XSON
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-XSON (3.2x2.5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 6.32 EUR |
| 10+ | 4.93 EUR |
| 100+ | 3.97 EUR |
| 500+ | 3.75 EUR |
| 1000+ | 3.1 EUR |
| 1N4448,143 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 100V 200MA DO35
Description: DIODE GEN PURP 100V 200MA DO35
Produkt ist nicht verfügbar
| BFR540,235 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Description: RF TRANS NPN 15V 9GHZ TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
| KTY84/130,153 |
|
Hersteller: NXP USA Inc.
Description: THERMISTOR PTC 603 OHM DO34
Packaging: Cut Tape (CT)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
Description: THERMISTOR PTC 603 OHM DO34
Packaging: Cut Tape (CT)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Part Status: Obsolete
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
| MC34VR500V1ES |
|
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 174 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 30.37 EUR |
| 10+ | 27.92 EUR |
| 25+ | 26.76 EUR |
| 80+ | 23.58 EUR |
| MC34VR500V2ES |
|
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| MK02FN128VFM10 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1950 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.51 EUR |
| 10+ | 12.91 EUR |
| 80+ | 10.58 EUR |
| 490+ | 10.35 EUR |
| 980+ | 8.73 EUR |
| MK02FN64VFM10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1350 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 12.66 EUR |
| 10+ | 9.88 EUR |
| 80+ | 8.09 EUR |
| 490+ | 7.92 EUR |
| 980+ | 6.68 EUR |
| FXTH870912DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH870511DT1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH8709226T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH870502DT1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
auf Bestellung 1927 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 18.12 EUR |
| 10+ | 14.51 EUR |
| 25+ | 13.42 EUR |
| 100+ | 11.61 EUR |
| 500+ | 10.88 EUR |
| 1000+ | 10.16 EUR |
| FXTH870911DT1 |
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
| FXTH870902DT1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
auf Bestellung 1811 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 18.36 EUR |
| 10+ | 14.7 EUR |
| 25+ | 13.59 EUR |
| 100+ | 11.76 EUR |
| 500+ | 11.02 EUR |
| 1000+ | 10.29 EUR |