LPC18S10FET100E NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 2+ | 15.84 EUR |
| 10+ | 12.34 EUR |
| 25+ | 11.47 EUR |
| 80+ | 10.64 EUR |
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Technische Details LPC18S10FET100E NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA, DigiKey Programmable: Not Verified, Number of I/O: 49, Part Status: Active, Supplier Device Package: 100-TFBGA (9x9), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT, Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit Single-Core, Data Converters: A/D 4x10b; D/A 1x10b, Core Processor: ARM® Cortex®-M3, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 136K x 8, Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 100-TFBGA, Packaging: Tray.
Weitere Produktangebote LPC18S10FET100E
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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LPC18S10FET100E | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU ARM Cortex M3 |
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