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MMRF1009HR5 MMRF1009HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Last Time Buy
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MMRF1014NT1 MMRF1014NT1 NXP USA Inc. MMRF1014N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
auf Bestellung 1047 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.01 EUR
10+30.3 EUR
25+28.38 EUR
100+26.26 EUR
250+25.25 EUR
500+24.87 EUR
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MMRF1015NR1 MMRF1015NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-2
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 68 V
Part Status: Last Time Buy
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 10W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Cut Tape (CT)
auf Bestellung 355 Stücke:
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1+41.7 EUR
10+33.4 EUR
25+31.33 EUR
100+29.06 EUR
250+27.98 EUR
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MMRF1304NR1 MMRF1304NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 25.4dB
Power - Output: 25W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MMRF1305HR5 MMRF1305HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Configuration: Dual
Frequency: 512MHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
auf Bestellung 65 Stücke:
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1+209.67 EUR
10+175.82 EUR
25+167.37 EUR
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MMRF1308HR5 MMRF1308HR5 NXP USA Inc. www.nxp.com Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Produkt ist nicht verfügbar
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MMRF1310HR5 MMRF1310HR5 NXP USA Inc. MMRF1310H.pdf Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.5dB
Power - Output: 300W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
auf Bestellung 6 Stücke:
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1+280.13 EUR
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MMRF1316NR1 MMRF1316NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MKL33Z64VLH4 MKL33Z64VLH4 NXP USA Inc. KL33P80M48SF3.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 800 Stücke
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MKL33Z64VLK4 MKL33Z64VLK4 NXP USA Inc. KL33P80M48SF3.pdf Description: IC MCU 32BIT 64KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tube
Produkt ist nicht verfügbar
 Mindestbestellmenge: 480 Stücke
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MKL17Z64VDA4 MKL17Z64VDA4 NXP USA Inc. KL17P64M48SF2.pdf Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.2 EUR
10+7 EUR
25+6.45 EUR
100+5.84 EUR
490+5.39 EUR
Mindestbestellmenge: 3 Stücke
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MKL17Z64VLH4 MKL17Z64VLH4 NXP USA Inc. KL17P64M48SF2.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 798 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.32 EUR
10+6.3 EUR
25+5.8 EUR
160+5.11 EUR
320+4.93 EUR
640+4.77 EUR
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MKL27Z64VDA4 MKL27Z64VDA4 NXP USA Inc. KL27P64M48SF2.pdf Description: IC MCU 32BIT 64KB FLASH 36XFBGA
DigiKey Programmable: Not Verified
Number of I/O: 30
Supplier Device Package: 36-XFBGA (3.5x3.5)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 36-XFBGA
Packaging: Tray
auf Bestellung 467 Stücke:
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2+12.21 EUR
10+9.38 EUR
25+8.68 EUR
100+7.89 EUR
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MKL27Z64VLH4 MKL27Z64VLH4 NXP USA Inc. KL27P64M48SF2.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
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3+9.81 EUR
10+7.47 EUR
25+6.89 EUR
Mindestbestellmenge: 3 Stücke
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LPC54102J512UK49Z LPC54102J512UK49Z NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 512KB FLASH 49WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
8000+8.82 EUR
Mindestbestellmenge: 8000 Stücke
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LPC54102J512UK49Z LPC54102J512UK49Z NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 512KB FLASH 49WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 11435 Stücke:
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3+8.98 EUR
10+8.82 EUR
Mindestbestellmenge: 3 Stücke
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MC32PF3000A0EP MC32PF3000A0EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 495 Stücke:
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2+10.86 EUR
10+8.4 EUR
25+8.33 EUR
Mindestbestellmenge: 2 Stücke
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MC32PF3000A1EP MC32PF3000A1EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.2 EUR
10+10.97 EUR
25+10.16 EUR
100+9.27 EUR
260+8.83 EUR
520+8.58 EUR
Mindestbestellmenge: 2 Stücke
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MC34PF3000A0EP MC34PF3000A0EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1377 Stücke:
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2+12.86 EUR
10+9.97 EUR
25+9.25 EUR
100+8.46 EUR
260+8.19 EUR
Mindestbestellmenge: 2 Stücke
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MC34PF3000A1EP MC34PF3000A1EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
auf Bestellung 215 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.24 EUR
10+11.79 EUR
25+10.92 EUR
100+9.98 EUR
Mindestbestellmenge: 2 Stücke
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MC34PF3000A2EP MC34PF3000A2EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.92 EUR
10+10.02 EUR
25+9.29 EUR
100+8.75 EUR
Mindestbestellmenge: 2 Stücke
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MC34PF3000A3EP MC34PF3000A3EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.49 EUR
10+11.2 EUR
25+10.39 EUR
100+9.59 EUR
Mindestbestellmenge: 2 Stücke
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KITPF3000FRDMEVM KITPF3000FRDMEVM NXP USA Inc. PF3000.pdf Description: EVALUATION KIT PF3000 PMIC
Outputs and Type: 12, Non-Isolated
Main Purpose: DC/DC, Step Up or Down with LDO
Supplied Contents: Board(s)
Utilized IC / Part: PF3000
Board Type: Fully Populated
Regulator Topology: Boost, Buck
Current - Output: 1.75A, 1.5A, 1.25A, 1A, 600mA, 350mA, 350mA, 250mA, 100mA, 100mA, 100mA, 1mA
Voltage - Input: 2.8V ~ 5.5V
Packaging: Box
Produkt ist nicht verfügbar
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KITPF3000FRDMPGM KITPF3000FRDMPGM NXP USA Inc. PF3000%20Overview.pdf Description: EVAL KIT PROGRAM BOARD PF3000
Produkt ist nicht verfügbar
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OM11029,598 OM11029,598 NXP USA Inc. Description: LPC3152 EVAL BRD
Utilized IC / Part: LPC3152
Board Type: Evaluation Platform
Core Processor: ARM9
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Obsolete
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+392.05 EUR
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OM11034,598 NXP USA Inc. Description: IAR KICKSTART LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Platform: IAR KickStart
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM11036,598 OM11036,598 NXP USA Inc. Description: LPC1758 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: LPC1758
Core Processor: ARM® Cortex®-M3
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM11037,598 OM11037,598 NXP USA Inc. LPC3141_43.pdf Description: LPC3141 EVAL BRD
Part Status: Not For New Designs
Utilized IC / Part: LPC3141
Board Type: Evaluation Platform
Core Processor: ARM9
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+538.97 EUR
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OM11040,598 OM11040,598 NXP USA Inc. Description: IAR KICKSTART LPC1343 EVAL BRD
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1343
Core Processor: ARM® Cortex®-M3
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 8 Stücke:
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1+314.37 EUR
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OM11045,598 OM11045,598 NXP USA Inc. Description: LPC3250 EVAL BRD
Utilized IC / Part: LPC3250
Core Processor: ARM9
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 4 Stücke:
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1+646.86 EUR
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OM11084,598 OM11084,598 NXP USA Inc. Description: LPC1769 EVAL BRD
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: LPC1769
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar
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OM11085,598 OM11085,598 NXP USA Inc. Description: IAR KICKSTART LPC1114 EVAL BRD
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1114
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM11086,598 OM11086,598 NXP USA Inc. Description: LPC1114 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: LPC1114
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13003,598 OM13003,598 NXP USA Inc. Description: IAR KICKSTART LPC11C14 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11C14
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 3 Stücke:
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1+268.63 EUR
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OM13004,598 OM13004,598 NXP USA Inc. Description: LPC11C14 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
OM13011,598 OM13011,598 NXP USA Inc. Description: LPC1227 EVAL BRD
Utilized IC / Part: LPC1227
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13018,598 OM13018,598 NXP USA Inc. Description: LPC11U14 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC11U14
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13019,598 NXP USA Inc. Description: EA 7" WVGA LCD DISPLAY KIT
Part Status: Obsolete
Accessory Type: LCD Display
For Use With/Related Products: LPC1788
Packaging: Box
auf Bestellung 4 Stücke:
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OM13025,598 OM13025,598 NXP USA Inc. Description: IAR KICKSTART LPC11A14 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11A14
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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OM13033,598 OM13033,598 NXP USA Inc. Description: BLUEBOARD LPC11U24 EVAL BRD
Part Status: Obsolete
Platform: BlueBoard
Utilized IC / Part: LPC11U24
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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OM13034,598 OM13034,598 NXP USA Inc. Description: IAR KICKSTART LPC1347 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1347
Core Processor: ARM® Cortex®-M3
Contents: Board(s), LCD
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OM13041,598 NXP USA Inc. Description: BLUEBOARD LPC11U37 EVAL BRD
Produkt ist nicht verfügbar
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OM7925/BGU7051,598 OM7925/BGU7051,598 NXP USA Inc. BGU7051.pdf Description: EVAL BOARD FOR BGU7051
Packaging: Box
For Use With/Related Products: BGU7051
Frequency: 500MHz ~ 1.5GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: BGU7051
Produkt ist nicht verfügbar
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SSL2101DB07,598 NXP USA Inc. SSL2101-02%20Manual.pdf Description: EVAL BOARD FOR SSL2101
Outputs and Type: 1 Non-Isolated Output
Utilized IC / Part: SSL2101
Current - Output / Channel: 415mA
Contents: Board(s)
Voltage - Input: 230VAC
Voltage - Output: 15.6V
Features: Dimmable
Packaging: Box
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MCR20AVHM MCR20AVHM NXP USA Inc. Description: IC RF TXRX 802.15.4 41MAPLGA
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Serial Interfaces: SPI
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 8
Supplier Device Package: 41-MAPLGA (5x5)
Current - Transmitting: 17mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA ~ 19mA
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 41-VFLGA
Packaging: Tray
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FRDM-CR20A FRDM-CR20A NXP USA Inc. FRDMCR20AUG.pdf Description: DEV BOARD FREEDOM MCR20A KINETIS
Utilized IC / Part: MCR20A
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MCR20A
Packaging: Box
Produkt ist nicht verfügbar
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PCT2202UKZ NXP USA Inc. PCT2202.pdf Description: SENSOR DIGITAL -40C-125C 6WLCSP
Part Status: Obsolete
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Supplier Device Package: 6-WLCSP (0.69x1.09)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 1.65V ~ 1.95V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 6-XFBGA, WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2200GF3,132 NCX2200GF3,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2202GM,115 NCX2202GM,115 NXP USA Inc. NCX2202.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2202GW,125 NCX2202GW,125 NXP USA Inc. NCX2202.pdf Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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NCX2220GF,115 NCX2220GF,115 NXP USA Inc. NCX2220_Rev4.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NCX2222GTX NCX2222GTX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
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NCX8193GUX NCX8193GUX NXP USA Inc. NCX8193.pdf Description: IC DETECTION MONITOR 10XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Function: Detection Monitor
Interface: Analog
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.25V
Applications: Communication Systems
Supplier Device Package: 10-XQFN (1.4x1.8)
Part Status: Obsolete
Number of Channels: 1
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9+2.49 EUR
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NTB0101GS,132 NTB0101GS,132 NXP USA Inc. NTB0101.pdf Description: IC XLTR VL BIDIR 6-XSON/SOT1202
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 2005 Stücke:
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NTB0101GW,125 NTB0101GW,125 NXP USA Inc. NTB0101.pdf Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0102DP-Q100H NTB0102DP-Q100H NXP USA Inc. NTB0102_Q100.pdf Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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NTB0104BQ-Q100X NTB0104BQ-Q100X NXP USA Inc. NTB0104_Q100.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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NTS0101GW,125 NTS0101GW,125 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102DP-Q100H NTS0102DP-Q100H NXP USA Inc. NTS0102_Q100.pdf Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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NTS0104BQ-Q100X NTS0104BQ-Q100X NXP USA Inc. NTS0104_Q100.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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MMRF1009HR5
MMRF1009HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 200 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Last Time Buy
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 500W
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MMRF1014NT1 MMRF1014N.pdf
MMRF1014NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
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MMRF1015NR1
MMRF1015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Current - Test: 125 mA
Voltage - Test: 28 V
Voltage - Rated: 68 V
Part Status: Last Time Buy
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 18dB
Power - Output: 10W
Frequency: 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-2
Packaging: Cut Tape (CT)
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MMRF1304NR1
MMRF1304NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Current - Test: 10 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: TO-270-2
Technology: LDMOS
Gain: 25.4dB
Power - Output: 25W
Frequency: 512MHz
Mounting Type: Surface Mount
Package / Case: TO-270AA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MMRF1305HR5
MMRF1305HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26dB
Power - Output: 100W
Configuration: Dual
Frequency: 512MHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
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MMRF1308HR5 www.nxp.com
MMRF1308HR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 25dB
Power - Output: 600W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Produkt ist nicht verfügbar
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MMRF1310HR5 MMRF1310H.pdf
MMRF1310HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Part Status: Active
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.5dB
Power - Output: 300W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
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MMRF1316NR1
MMRF1316NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MKL33Z64VLH4 KL33P80M48SF3.pdf
MKL33Z64VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MKL33Z64VLK4 KL33P80M48SF3.pdf
MKL33Z64VLK4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tube
Produkt ist nicht verfügbar
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MKL17Z64VDA4 KL17P64M48SF2.pdf
MKL17Z64VDA4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
Packaging: Tray
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
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3+9.2 EUR
10+7 EUR
25+6.45 EUR
100+5.84 EUR
490+5.39 EUR
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MKL17Z64VLH4 KL17P64M48SF2.pdf
MKL17Z64VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 798 Stücke:
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3+8.32 EUR
10+6.3 EUR
25+5.8 EUR
160+5.11 EUR
320+4.93 EUR
640+4.77 EUR
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MKL27Z64VDA4 KL27P64M48SF2.pdf
MKL27Z64VDA4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 36XFBGA
DigiKey Programmable: Not Verified
Number of I/O: 30
Supplier Device Package: 36-XFBGA (3.5x3.5)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 36-XFBGA
Packaging: Tray
auf Bestellung 467 Stücke:
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AnzahlPrivatkunde
2+12.21 EUR
10+9.38 EUR
25+8.68 EUR
100+7.89 EUR
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MKL27Z64VLH4 KL27P64M48SF2.pdf
MKL27Z64VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x16b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
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3+9.81 EUR
10+7.47 EUR
25+6.89 EUR
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LPC54102J512UK49Z LPC5410X.pdf
LPC54102J512UK49Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
auf Bestellung 8000 Stücke:
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AnzahlPrivatkunde
8000+8.82 EUR
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LPC54102J512UK49Z LPC5410X.pdf
LPC54102J512UK49Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 49-WLCSP (3.29x3.29)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 49-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 11435 Stücke:
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3+8.98 EUR
10+8.82 EUR
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MC32PF3000A0EP PF3000.pdf
MC32PF3000A0EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 495 Stücke:
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2+10.86 EUR
10+8.4 EUR
25+8.33 EUR
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MC32PF3000A1EP PF3000.pdf
MC32PF3000A1EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 588 Stücke:
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AnzahlPrivatkunde
2+14.2 EUR
10+10.97 EUR
25+10.16 EUR
100+9.27 EUR
260+8.83 EUR
520+8.58 EUR
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MC34PF3000A0EP PF3000.pdf
MC34PF3000A0EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1377 Stücke:
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AnzahlPrivatkunde
2+12.86 EUR
10+9.97 EUR
25+9.25 EUR
100+8.46 EUR
260+8.19 EUR
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MC34PF3000A1EP PF3000.pdf
MC34PF3000A1EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
auf Bestellung 215 Stücke:
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AnzahlPrivatkunde
2+15.24 EUR
10+11.79 EUR
25+10.92 EUR
100+9.98 EUR
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MC34PF3000A2EP PF3000.pdf
MC34PF3000A2EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
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AnzahlPrivatkunde
2+12.92 EUR
10+10.02 EUR
25+9.29 EUR
100+8.75 EUR
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MC34PF3000A3EP PF3000.pdf
MC34PF3000A3EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.49 EUR
10+11.2 EUR
25+10.39 EUR
100+9.59 EUR
Mindestbestellmenge: 2 Stücke
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KITPF3000FRDMEVM PF3000.pdf
KITPF3000FRDMEVM
Hersteller: NXP USA Inc.
Description: EVALUATION KIT PF3000 PMIC
Outputs and Type: 12, Non-Isolated
Main Purpose: DC/DC, Step Up or Down with LDO
Supplied Contents: Board(s)
Utilized IC / Part: PF3000
Board Type: Fully Populated
Regulator Topology: Boost, Buck
Current - Output: 1.75A, 1.5A, 1.25A, 1A, 600mA, 350mA, 350mA, 250mA, 100mA, 100mA, 100mA, 1mA
Voltage - Input: 2.8V ~ 5.5V
Packaging: Box
Produkt ist nicht verfügbar
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KITPF3000FRDMPGM PF3000%20Overview.pdf
KITPF3000FRDMPGM
Hersteller: NXP USA Inc.
Description: EVAL KIT PROGRAM BOARD PF3000
Produkt ist nicht verfügbar
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OM11029,598
OM11029,598
Hersteller: NXP USA Inc.
Description: LPC3152 EVAL BRD
Utilized IC / Part: LPC3152
Board Type: Evaluation Platform
Core Processor: ARM9
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Obsolete
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+392.05 EUR
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OM11034,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC1768 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1768
Platform: IAR KickStart
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM11036,598
OM11036,598
Hersteller: NXP USA Inc.
Description: LPC1758 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: LPC1758
Core Processor: ARM® Cortex®-M3
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM11037,598 LPC3141_43.pdf
OM11037,598
Hersteller: NXP USA Inc.
Description: LPC3141 EVAL BRD
Part Status: Not For New Designs
Utilized IC / Part: LPC3141
Board Type: Evaluation Platform
Core Processor: ARM9
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+538.97 EUR
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OM11040,598
OM11040,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC1343 EVAL BRD
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1343
Core Processor: ARM® Cortex®-M3
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+314.37 EUR
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OM11045,598
OM11045,598
Hersteller: NXP USA Inc.
Description: LPC3250 EVAL BRD
Utilized IC / Part: LPC3250
Core Processor: ARM9
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+646.86 EUR
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OM11084,598
OM11084,598
Hersteller: NXP USA Inc.
Description: LPC1769 EVAL BRD
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: LPC1769
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar
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OM11085,598
OM11085,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC1114 EVAL BRD
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1114
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM11086,598
OM11086,598
Hersteller: NXP USA Inc.
Description: LPC1114 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: LPC1114
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13003,598
OM13003,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC11C14 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11C14
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+268.63 EUR
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OM13004,598
OM13004,598
Hersteller: NXP USA Inc.
Description: LPC11C14 EVAL BRD
Produkt ist nicht verfügbar
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OM13011,598
OM13011,598
Hersteller: NXP USA Inc.
Description: LPC1227 EVAL BRD
Utilized IC / Part: LPC1227
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13018,598
OM13018,598
Hersteller: NXP USA Inc.
Description: LPC11U14 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC11U14
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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OM13019,598
Hersteller: NXP USA Inc.
Description: EA 7" WVGA LCD DISPLAY KIT
Part Status: Obsolete
Accessory Type: LCD Display
For Use With/Related Products: LPC1788
Packaging: Box
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+296.88 EUR
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OM13025,598
OM13025,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC11A14 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11A14
Core Processor: ARM® Cortex®-M0
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+522.7 EUR
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OM13033,598
OM13033,598
Hersteller: NXP USA Inc.
Description: BLUEBOARD LPC11U24 EVAL BRD
Part Status: Obsolete
Platform: BlueBoard
Utilized IC / Part: LPC11U24
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s), Cable(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+159.97 EUR
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OM13034,598
OM13034,598
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC1347 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Not For New Designs
Platform: IAR KickStart
Utilized IC / Part: LPC1347
Core Processor: ARM® Cortex®-M3
Contents: Board(s), LCD
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+470.55 EUR
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OM13041,598
Hersteller: NXP USA Inc.
Description: BLUEBOARD LPC11U37 EVAL BRD
Produkt ist nicht verfügbar
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OM7925/BGU7051,598 BGU7051.pdf
OM7925/BGU7051,598
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR BGU7051
Packaging: Box
For Use With/Related Products: BGU7051
Frequency: 500MHz ~ 1.5GHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: BGU7051
Produkt ist nicht verfügbar
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SSL2101DB07,598 SSL2101-02%20Manual.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SSL2101
Outputs and Type: 1 Non-Isolated Output
Utilized IC / Part: SSL2101
Current - Output / Channel: 415mA
Contents: Board(s)
Voltage - Input: 230VAC
Voltage - Output: 15.6V
Features: Dimmable
Packaging: Box
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+200.76 EUR
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MCR20AVHM
MCR20AVHM
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 41MAPLGA
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Serial Interfaces: SPI
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 8
Supplier Device Package: 41-MAPLGA (5x5)
Current - Transmitting: 17mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA ~ 19mA
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 41-VFLGA
Packaging: Tray
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.63 EUR
Mindestbestellmenge: 3 Stücke
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FRDM-CR20A FRDMCR20AUG.pdf
FRDM-CR20A
Hersteller: NXP USA Inc.
Description: DEV BOARD FREEDOM MCR20A KINETIS
Utilized IC / Part: MCR20A
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MCR20A
Packaging: Box
Produkt ist nicht verfügbar
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PCT2202UKZ PCT2202.pdf
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 6WLCSP
Part Status: Obsolete
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±1°C (±2°C)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Supplier Device Package: 6-WLCSP (0.69x1.09)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 1.65V ~ 1.95V
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 6-XFBGA, WLCSP
Features: One-Shot, Output Switch, Shutdown Mode
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2200GF3,132 NCX2200.pdf
NCX2200GF3,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2202GM,115 NCX2202.pdf
NCX2202GM,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2202GW,125 NCX2202.pdf
NCX2202GW,125
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Not For New Designs
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NCX2220GF,115 NCX2220_Rev4.pdf
NCX2220GF,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NCX2222GTX NCX2222.pdf
NCX2222GTX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
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15+1.44 EUR
21+1.04 EUR
25+0.93 EUR
100+0.82 EUR
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NCX8193GUX NCX8193.pdf
NCX8193GUX
Hersteller: NXP USA Inc.
Description: IC DETECTION MONITOR 10XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Function: Detection Monitor
Interface: Analog
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.25V
Applications: Communication Systems
Supplier Device Package: 10-XQFN (1.4x1.8)
Part Status: Obsolete
Number of Channels: 1
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AnzahlPrivatkunde
9+2.49 EUR
10+2.24 EUR
25+2.13 EUR
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NTB0101GS,132 NTB0101.pdf
NTB0101GS,132
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-XSON/SOT1202
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 2005 Stücke:
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31+0.69 EUR
45+0.48 EUR
50+0.42 EUR
100+0.37 EUR
250+0.33 EUR
500+0.32 EUR
1000+0.31 EUR
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NTB0101GW,125 NTB0101.pdf
NTB0101GW,125
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 6-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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26+0.82 EUR
37+0.57 EUR
42+0.51 EUR
100+0.44 EUR
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1000+0.37 EUR
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NTB0102DP-Q100H NTB0102_Q100.pdf
NTB0102DP-Q100H
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
auf Bestellung 21658 Stücke:
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11+2.05 EUR
15+1.48 EUR
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100+1.18 EUR
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500+1.06 EUR
1000+1.04 EUR
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NTB0104BQ-Q100X NTB0104_Q100.pdf
NTB0104BQ-Q100X
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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10+2.15 EUR
14+1.58 EUR
25+1.43 EUR
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NTS0101GW,125 NTS0101.pdf
NTS0101GW,125
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102DP-Q100H NTS0102_Q100.pdf
NTS0102DP-Q100H
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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11+2.01 EUR
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NTS0104BQ-Q100X NTS0104_Q100.pdf
NTS0104BQ-Q100X
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7082 Stücke:
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10+2.12 EUR
14+1.54 EUR
25+1.38 EUR
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250+1.14 EUR
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1000+1.07 EUR
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