Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (33870) > Seite 261 nach 565
Foto | Bezeichnung | Hersteller | Beschreibung |
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FRDM-17531EP-EVB | NXP USA Inc. |
Description: FREEDOM EVAL BOARD MPC17531 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC17531A Supplied Contents: Board(s) Primary Attributes: Dual Full-Bridge (H-Bridge) Driver |
Produkt ist nicht verfügbar |
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FRDM-17C724-EVB | NXP USA Inc. |
Description: FREEDOM EVAL BOARD MPC17C524 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC17C724 Supplied Contents: Board(s) Primary Attributes: Dual Full-Bridge (H-Bridge) Driver |
Produkt ist nicht verfügbar |
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FRDM-34933EP-EVB | NXP USA Inc. |
Description: FREEDOM EVAL BOARD MC34933 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC34933 Supplied Contents: Board(s) Primary Attributes: Dual Full-Bridge (H-Bridge) Driver Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-K22F-AGM01 | NXP USA Inc. |
Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01 Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K22, FXAS21002, FXOS8700, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 21-28 Tag (e) |
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FRDM-K64F-AGM01 | NXP USA Inc. |
Description: EVB KIT FRDM-K64F/FRDM-STBCAGM01 Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K24, K63, K64, FXAS21002, FXOS8700, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-KL27Z | NXP USA Inc. |
Description: FREEDOM KL17/KL27 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KL17, KL27 Platform: Freedom |
auf Bestellung 102 Stücke: Lieferzeit 21-28 Tag (e) |
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FRDM-SFUSION | NXP USA Inc. |
Description: KIT FRDM-K64F FRDM-FXS-MULTI-B Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FRDM-SFUSION-S | NXP USA Inc. |
Description: KIT FRDM-K64F FRDM-FXS-MULTI-BHW Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KIT12XS6EVM | NXP USA Inc. |
Description: EVAL KIT MC12XS6 BULB DRIVER Packaging: Bulk Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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KIT33664EVB | NXP USA Inc. |
Description: EVAL KIT MC33664 ISO NTWK TXRX Packaging: Bulk Function: Transceiver Type: Interface Utilized IC / Part: MC33664 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KIT33882EKEVB | NXP USA Inc. | Description: EVAL KIT MC33882 SW SPI PAR INP |
Produkt ist nicht verfügbar |
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KIT33907LAEEVB | NXP USA Inc. | Description: EVAL KIT MC33907 SBC BUCK BOOST |
Produkt ist nicht verfügbar |
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KIT33908LAEEVB | NXP USA Inc. | Description: EVAL KIT MC33908 SBC BUCK BOOST |
Produkt ist nicht verfügbar |
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KIT33978EKEVB | NXP USA Inc. |
Description: EVAL KIT MC33978 SWITCH DETECT Packaging: Bulk Function: Switch Detection Type: Interface Utilized IC / Part: MC33978 Supplied Contents: Board(s) Primary Attributes: 22-Channel Part Status: Active |
Produkt ist nicht verfügbar |
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KIT34CM0902EFEVB | NXP USA Inc. |
Description: EVAL KIT MC34CM0902 CAN TXRX Packaging: Bulk Type: Interface Utilized IC / Part: MC34CM0902 Supplied Contents: Board(s) Primary Attributes: 2-Channel (Dual) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KITPT2000FRDM3C | NXP USA Inc. |
Description: FREEDOM PLATFORM PT2000 DRIVER Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: PT2000 Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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KITPT2000FRDM6C | NXP USA Inc. | Description: KIT FREEDOM PT2000 |
Produkt ist nicht verfügbar |
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KITVALVECNTLEVM | NXP USA Inc. |
Description: EVAL KIT ABS ESP PWR MGMT Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC34SB0800 MC34SB0410 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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RAPPID5748GSW-N | NXP USA Inc. |
Description: SOFTWARE MPC5748G SHIPPED W/LIC Packaging: Bulk For Use With/Related Products: MPC5xx Type: Integrated Development Environment (IDE) Applications: Programming |
Produkt ist nicht verfügbar |
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RDAIRBAGPSI5 | NXP USA Inc. |
Description: REF DESIGN PSI5 AIRBAG SPC560X Packaging: Bulk Function: Airbag Type: Reference Design Utilized IC / Part: MPC5602P Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit |
Produkt ist nicht verfügbar |
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RDAIRBAGPSI5-1 | NXP USA Inc. |
Description: REF DESIGN AIRBAG SPC560X MCU Packaging: Bulk Function: Airbag Type: Reference Design Utilized IC / Part: MPC5602P Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit |
Produkt ist nicht verfügbar |
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T2080RDB-PB | NXP USA Inc. |
Description: T2080 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e6500 Board Type: Evaluation Platform Utilized IC / Part: T2080 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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T4240PCIE-PB | NXP USA Inc. | Description: T4240 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-34933EVB | NXP USA Inc. |
Description: EVALUATION BOARD TWR-34933 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC34933 Supplied Contents: Board(s) Primary Attributes: Dual Full-Bridge (H-Bridge) Driver Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-KM34Z50MV3 | NXP USA Inc. |
Description: TOWER SYSTEM KM1X/KM3X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: KM1x, KM3x Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-MC-MVHB1EVB | NXP USA Inc. |
Description: TOWER SYSTEM KIT MC33932 MC33926 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33926, MC33932 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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MK22FN128CAK10R | NXP USA Inc. | Description: IC MCU 32BIT 128KB FLASH 49WLCSP |
Produkt ist nicht verfügbar |
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MK22FN256CAP12R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80WLCSP Packaging: Tape & Reel (TR) Package / Case: 80-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 80-WLCSP (4.13x3.56) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK22FN512CAP12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80WLCSP Packaging: Tape & Reel (TR) Package / Case: 80-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-WLCSP (4.13x3.56) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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NT3H1101W0FHKH | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8XQFN Packaging: Tape & Reel (TR) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C Type: RFID Transponder Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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NT3H1201W0FHKH | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8XQFN Packaging: Tape & Reel (TR) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C Type: RFID Transponder Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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MC33879APEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side or Low Side Rds On (Typ): 750mOhm Voltage - Load: 5.5V ~ 27.5V Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V Current - Output (Max): 600mA Ratio - Input:Output: 1:4 Supplier Device Package: 32-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC14489BDWER2 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Not For New Designs Current - Supply: 5.5 mA |
auf Bestellung 17899 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33660EFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Link Bus Interface Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Grade: Automotive Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BB171X | NXP USA Inc. |
Description: DIODE VHF VAR CAP 32V SOD323 Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Part Status: Obsolete Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 22 |
Produkt ist nicht verfügbar |
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BB172X | NXP USA Inc. |
Description: DIODE VHF VAR CAP 32V SOD323 Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 15 |
auf Bestellung 16 Stücke: Lieferzeit 21-28 Tag (e) |
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BB174X | NXP USA Inc. |
Description: DIODE VHF VAR CAP 30V SOD523 Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-523 Part Status: Active Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 10.9 |
auf Bestellung 9610 Stücke: Lieferzeit 21-28 Tag (e) |
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BFU768F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70MA 4DFP Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP Part Status: Active |
auf Bestellung 311 Stücke: Lieferzeit 21-28 Tag (e) |
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BGA2714,115 | NXP USA Inc. |
Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.7GHz Voltage - Supply: 4V Gain: 22dB Current - Supply: 10mA Noise Figure: 3dB P1dB: -9dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BUK98150-55,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 5.5A SOT-223 Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc) Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V Power Dissipation (Max): 8.3W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SC-73 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V |
Produkt ist nicht verfügbar |
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GTL2003PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 20TSSOP Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 8 Voltage - VCCA: 0.8 V ~ 5.5 V Voltage - VCCB: 0.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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GTL2014PW,118 | NXP USA Inc. | Description: IC TRNSLTR BIDIRECTIONAL 14TSSOP |
auf Bestellung 1500 Stücke: Lieferzeit 21-28 Tag (e) |
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GTL2107PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR UNIDIR 28TSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 28-TSSOP Channel Type: Unidirectional Output Signal: LVTTL Translator Type: Mixed Signal Channels per Circuit: 12 Input Signal: GTL Part Status: Obsolete Number of Circuits: 1 |
auf Bestellung 2249 Stücke: Lieferzeit 21-28 Tag (e) |
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KMZ41,118 | NXP USA Inc. |
Description: SENSOR MR ANALOG 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Axis: X, Y Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 9V Technology: Magnetoresistive Supplier Device Package: 8-SO |
Produkt ist nicht verfügbar |
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KTY82/220,215 | NXP USA Inc. |
Description: THERMISTOR PTC 2K OHM TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 2 kOhms |
Produkt ist nicht verfügbar |
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KTY82/222,215 | NXP USA Inc. |
Description: THERMISTOR PTC 2.02K OHM TO236AB Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 2.02 kOhms |
Produkt ist nicht verfügbar |
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LPC1114FDH28/102:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 28TSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 6x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 28-TSSOP Part Status: Active Number of I/O: 22 DigiKey Programmable: Verified |
auf Bestellung 20254 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC812M101JD20J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-SO Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MF1S5030XDA4/V1J | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ PLLMC Packaging: Cut Tape (CT) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: PLLMC Part Status: Not For New Designs |
auf Bestellung 16834 Stücke: Lieferzeit 21-28 Tag (e) |
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N74F273AD,623 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 38 mA Current - Output High, Low: 1mA, 20mA Trigger Type: Positive Edge Clock Frequency: 170 MHz Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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NT2H0301F0DTL,125 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 4HXSON Packaging: Cut Tape (CT) Package / Case: 4-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443 Supplier Device Package: 4-HXSON (2x1.5) Part Status: Active |
auf Bestellung 4165 Stücke: Lieferzeit 21-28 Tag (e) |
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NT3H1101W0FHKH | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8XQFN Packaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C Type: RFID Transponder Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Last Time Buy |
auf Bestellung 8549 Stücke: Lieferzeit 21-28 Tag (e) |
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NT3H1201W0FHKH | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8XQFN Packaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C Type: RFID Transponder Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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NTB0102DP,125 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 12322 Stücke: Lieferzeit 21-28 Tag (e) |
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NTS0102DP,125 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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NX3DV221GM,115 | NXP USA Inc. |
Description: IC USB 2.0 SWITCH HS 10XQFN Packaging: Cut Tape (CT) Features: Bi-Directional Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: USB On-State Resistance (Max): 7Ohm -3db Bandwidth: 1GHz Supplier Device Package: 10-XQFN (1.55x2) Voltage - Supply, Single (V+): 2.3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 1 |
auf Bestellung 19263 Stücke: Lieferzeit 21-28 Tag (e) |
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P89LPC935FDH,518 | NXP USA Inc. | Description: IC MCU 8BIT 8KB FLASH 28TSSOP |
Produkt ist nicht verfügbar |
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PCA8574AD,518 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 16SO Packaging: Cut Tape (CT) Features: POR Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-SO Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9501PW,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 20TSSOP Packaging: Cut Tape (CT) Features: EEPROM Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 20-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 7269 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9502BS,128 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SPI Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 7501 Stücke: Lieferzeit 21-28 Tag (e) |
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FRDM-17531EP-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17531
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Description: FREEDOM EVAL BOARD MPC17531
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-17C724-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MPC17C524
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Description: FREEDOM EVAL BOARD MPC17C524
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Produkt ist nicht verfügbar
FRDM-34933EP-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD MC34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Description: FREEDOM EVAL BOARD MC34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
FRDM-K22F-AGM01 |
Hersteller: NXP USA Inc.
Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K22, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVB KIT FRDM-K22F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K22, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 161.3 EUR |
FRDM-K64F-AGM01 |
Hersteller: NXP USA Inc.
Description: EVB KIT FRDM-K64F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVB KIT FRDM-K64F/FRDM-STBCAGM01
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002, FXOS8700, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
FRDM-KL27Z |
Hersteller: NXP USA Inc.
Description: FREEDOM KL17/KL27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27
Platform: Freedom
Description: FREEDOM KL17/KL27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KL17, KL27
Platform: Freedom
auf Bestellung 102 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 121.47 EUR |
FRDM-SFUSION |
Hersteller: NXP USA Inc.
Description: KIT FRDM-K64F FRDM-FXS-MULTI-B
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Description: KIT FRDM-K64F FRDM-FXS-MULTI-B
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
FRDM-SFUSION-S |
Hersteller: NXP USA Inc.
Description: KIT FRDM-K64F FRDM-FXS-MULTI-BHW
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Description: KIT FRDM-K64F FRDM-FXS-MULTI-BHW
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer, Pressure
Utilized IC / Part: FXAS21000, FXLS8471Q, FXOS8700CQ, K24, K63, K64, MAG3110, MMA8652FC, MMA9553L, MPL3115A2, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT12XS6EVM |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC12XS6 BULB DRIVER
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL KIT MC12XS6 BULB DRIVER
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT33664EVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33664 ISO NTWK TXRX
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL KIT MC33664 ISO NTWK TXRX
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
KIT33882EKEVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33882 SW SPI PAR INP
Description: EVAL KIT MC33882 SW SPI PAR INP
Produkt ist nicht verfügbar
KIT33907LAEEVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33907 SBC BUCK BOOST
Description: EVAL KIT MC33907 SBC BUCK BOOST
Produkt ist nicht verfügbar
KIT33908LAEEVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33908 SBC BUCK BOOST
Description: EVAL KIT MC33908 SBC BUCK BOOST
Produkt ist nicht verfügbar
KIT33978EKEVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC33978 SWITCH DETECT
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: MC33978
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Description: EVAL KIT MC33978 SWITCH DETECT
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: MC33978
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Produkt ist nicht verfügbar
KIT34CM0902EFEVB |
Hersteller: NXP USA Inc.
Description: EVAL KIT MC34CM0902 CAN TXRX
Packaging: Bulk
Type: Interface
Utilized IC / Part: MC34CM0902
Supplied Contents: Board(s)
Primary Attributes: 2-Channel (Dual)
Part Status: Obsolete
Description: EVAL KIT MC34CM0902 CAN TXRX
Packaging: Bulk
Type: Interface
Utilized IC / Part: MC34CM0902
Supplied Contents: Board(s)
Primary Attributes: 2-Channel (Dual)
Part Status: Obsolete
Produkt ist nicht verfügbar
KITPT2000FRDM3C |
Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM PT2000 DRIVER
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: FREEDOM PLATFORM PT2000 DRIVER
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
KITVALVECNTLEVM |
Hersteller: NXP USA Inc.
Description: EVAL KIT ABS ESP PWR MGMT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34SB0800 MC34SB0410
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL KIT ABS ESP PWR MGMT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34SB0800 MC34SB0410
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
RAPPID5748GSW-N |
Hersteller: NXP USA Inc.
Description: SOFTWARE MPC5748G SHIPPED W/LIC
Packaging: Bulk
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Description: SOFTWARE MPC5748G SHIPPED W/LIC
Packaging: Bulk
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Produkt ist nicht verfügbar
RDAIRBAGPSI5 |
Hersteller: NXP USA Inc.
Description: REF DESIGN PSI5 AIRBAG SPC560X
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Description: REF DESIGN PSI5 AIRBAG SPC560X
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
RDAIRBAGPSI5-1 |
Hersteller: NXP USA Inc.
Description: REF DESIGN AIRBAG SPC560X MCU
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Description: REF DESIGN AIRBAG SPC560X MCU
Packaging: Bulk
Function: Airbag
Type: Reference Design
Utilized IC / Part: MPC5602P
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
T2080RDB-PB |
Hersteller: NXP USA Inc.
Description: T2080 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Description: T2080 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Produkt ist nicht verfügbar
TWR-34933EVB |
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD TWR-34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Description: EVALUATION BOARD TWR-34933
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34933
Supplied Contents: Board(s)
Primary Attributes: Dual Full-Bridge (H-Bridge) Driver
Part Status: Active
Produkt ist nicht verfügbar
TWR-KM34Z50MV3 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KM1X/KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM1x, KM3x
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM KM1X/KM3X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KM1x, KM3x
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-MC-MVHB1EVB |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT MC33932 MC33926
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926, MC33932
Supplied Contents: Board(s)
Part Status: Active
Description: TOWER SYSTEM KIT MC33932 MC33926
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926, MC33932
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
MK22FN128CAK10R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 49WLCSP
Description: IC MCU 32BIT 128KB FLASH 49WLCSP
Produkt ist nicht verfügbar
MK22FN256CAP12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN512CAP12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NT3H1101W0FHKH |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
NT3H1201W0FHKH |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC33879APEKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side or Low Side
Rds On (Typ): 750mOhm
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 600mA
Ratio - Input:Output: 1:4
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
MC14489BDWER2 |
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
auf Bestellung 17899 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 21.16 EUR |
10+ | 19.1 EUR |
25+ | 18.22 EUR |
100+ | 15.82 EUR |
250+ | 15.11 EUR |
500+ | 13.77 EUR |
MC33660EFR2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
BB171X |
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Obsolete
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22
Produkt ist nicht verfügbar
BB172X |
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
auf Bestellung 16 Stücke:
Lieferzeit 21-28 Tag (e)BB174X |
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Description: DIODE VHF VAR CAP 30V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
auf Bestellung 9610 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
21+ | 1.27 EUR |
27+ | 0.99 EUR |
100+ | 0.59 EUR |
500+ | 0.55 EUR |
1000+ | 0.37 EUR |
BFU768F,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
auf Bestellung 311 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
25+ | 1.07 EUR |
29+ | 0.92 EUR |
100+ | 0.64 EUR |
BGA2714,115 |
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC RF AMP 0HZ-2.7GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.7GHz
Voltage - Supply: 4V
Gain: 22dB
Current - Supply: 10mA
Noise Figure: 3dB
P1dB: -9dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
BUK98150-55,135 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 5.5A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
Description: MOSFET N-CH 55V 5.5A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 5V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
Produkt ist nicht verfügbar
GTL2003PW,118 |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
GTL2014PW,118 |
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 14TSSOP
Description: IC TRNSLTR BIDIRECTIONAL 14TSSOP
auf Bestellung 1500 Stücke:
Lieferzeit 21-28 Tag (e)GTL2107PW,118 |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 2249 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 4.91 EUR |
10+ | 4.42 EUR |
25+ | 4.17 EUR |
100+ | 3.55 EUR |
250+ | 3.33 EUR |
500+ | 2.92 EUR |
1000+ | 2.42 EUR |
KMZ41,118 |
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: X, Y
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: X, Y
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 9V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
KTY82/220,215 |
Hersteller: NXP USA Inc.
Description: THERMISTOR PTC 2K OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2 kOhms
Description: THERMISTOR PTC 2K OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2 kOhms
Produkt ist nicht verfügbar
KTY82/222,215 |
Hersteller: NXP USA Inc.
Description: THERMISTOR PTC 2.02K OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2.02 kOhms
Description: THERMISTOR PTC 2.02K OHM TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 2.02 kOhms
Produkt ist nicht verfügbar
LPC1114FDH28/102:5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Verified
auf Bestellung 20254 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.74 EUR |
10+ | 6.83 EUR |
100+ | 5.6 EUR |
500+ | 5.48 EUR |
1000+ | 4.62 EUR |
LPC812M101JD20J |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SO
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MF1S5030XDA4/V1J |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 16834 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 3.56 EUR |
10+ | 3.18 EUR |
25+ | 3.02 EUR |
100+ | 2.48 EUR |
250+ | 2.32 EUR |
500+ | 2.05 EUR |
1000+ | 1.62 EUR |
2500+ | 1.51 EUR |
5000+ | 1.44 EUR |
N74F273AD,623 |
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
NT2H0301F0DTL,125 |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Cut Tape (CT)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Cut Tape (CT)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
auf Bestellung 4165 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 2.89 EUR |
11+ | 2.57 EUR |
25+ | 2.44 EUR |
100+ | 2.01 EUR |
250+ | 1.88 EUR |
500+ | 1.66 EUR |
1000+ | 1.31 EUR |
NT3H1101W0FHKH |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
auf Bestellung 8549 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 3.77 EUR |
10+ | 3.36 EUR |
25+ | 3.19 EUR |
100+ | 2.62 EUR |
250+ | 2.45 EUR |
500+ | 2.16 EUR |
1000+ | 1.71 EUR |
NT3H1201W0FHKH |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
NTB0102DP,125 |
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 12322 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 2.86 EUR |
11+ | 2.56 EUR |
25+ | 2.43 EUR |
100+ | 1.99 EUR |
250+ | 1.86 EUR |
500+ | 1.65 EUR |
1000+ | 1.3 EUR |
NTS0102DP,125 |
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NX3DV221GM,115 |
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Cut Tape (CT)
Features: Bi-Directional
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Cut Tape (CT)
Features: Bi-Directional
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
auf Bestellung 19263 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 2.05 EUR |
15+ | 1.84 EUR |
25+ | 1.74 EUR |
100+ | 1.43 EUR |
250+ | 1.34 EUR |
500+ | 1.18 EUR |
1000+ | 0.93 EUR |
2500+ | 0.87 EUR |
P89LPC935FDH,518 |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Produkt ist nicht verfügbar
PCA8574AD,518 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 16SO
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 16SO
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9501PW,118 |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 20TSSOP
Packaging: Cut Tape (CT)
Features: EEPROM
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 20TSSOP
Packaging: Cut Tape (CT)
Features: EEPROM
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 7269 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 6.97 EUR |
10+ | 6.25 EUR |
25+ | 5.89 EUR |
100+ | 5.02 EUR |
250+ | 4.72 EUR |
500+ | 4.13 EUR |
1000+ | 3.42 EUR |
PCA9502BS,128 |
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 7501 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 6.76 EUR |
10+ | 6.09 EUR |
25+ | 5.75 EUR |
100+ | 4.9 EUR |
250+ | 4.6 EUR |
500+ | 4.02 EUR |