Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 266 nach 607
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NT3H2211W0FTTJ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8TSSOPPackaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-TSSOP Part Status: Active |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
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NT3H2111W0FT1X | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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NT3H2211W0FT1X | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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OM5569/NT322ERM | NXP USA Inc. |
Description: NTAG 12C PLUS EXPL KIT PLUS USBPackaging: Box For Use With/Related Products: NT3H1101 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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OM5569/NT322EM | NXP USA Inc. |
Description: NTAG 12C PLUS EXPLORER KITPackaging: Box For Use With/Related Products: NT3H1101 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NT3H2211W0FHKH | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8XQFNPackaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.6V Standards: ISO 14443 Supplier Device Package: 8-XQFN (1.6x1.6) Part Status: Active |
auf Bestellung 15110 Stücke: Lieferzeit 10-14 Tag (e) |
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NT3H2111W0FTTJ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8TSSOPPackaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-TSSOP Part Status: Active |
auf Bestellung 11613 Stücke: Lieferzeit 10-14 Tag (e) |
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NT3H2111W0FT1X | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 5100 Stücke: Lieferzeit 10-14 Tag (e) |
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NT3H2211W0FT1X | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Transponder Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.3V Standards: ISO 14443 Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 4986 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-KW24D512 | NXP USA Inc. |
Description: EVAL BOARD FOR WSN802G Packaging: Bulk For Use With/Related Products: KW2x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s) Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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NX5P3201CUKAZ | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSPFault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO Supplier Device Package: 30-WLCSP (2.26x2.56) Ratio - Input:Output: 1:1 Current - Output (Max): 3A, 6A Voltage - Supply (Vcc/Vdd): Not Required Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V Input Type: Non-Inverting Rds On (Typ): 8mOhm, 32mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 85°C (TA) Switch Type: USB Switch Interface: Parallel Number of Outputs: 2 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 30-UFBGA, WLCSP Features: Slew Rate Controlled, Status Flag Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NX5P3201CUKAZ | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSPFault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO Supplier Device Package: 30-WLCSP (2.26x2.56) Ratio - Input:Output: 1:1 Current - Output (Max): 3A, 6A Voltage - Supply (Vcc/Vdd): Not Required Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V Input Type: Non-Inverting Rds On (Typ): 8mOhm, 32mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 85°C (TA) Switch Type: USB Switch Interface: Parallel Number of Outputs: 2 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 30-UFBGA, WLCSP Features: Slew Rate Controlled, Status Flag Packaging: Cut Tape (CT) |
auf Bestellung 3980 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33CD1030AE | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 48LQFPPart Status: Active Supplier Device Package: 48-HLQFP (7x7) Applications: Switch Monitoring Voltage - Supply: 4.5V ~ 36V Interface: SPI Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33HB2001EK | NXP USA Inc. |
Description: IC HALF-BRIDGE DRIVER SPI 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33SB0400ES | NXP USA Inc. |
Description: LOW SIDE DRIVER X4, WHEEL SPEED |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33SB0401ES | NXP USA Inc. |
Description: LOW SIDE DRIVER X2, WHEEL SPEEDPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6V ~ 20V Applications: Motorcycle Braking Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34FS6407NAE | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 36V Applications: System Basis Chip Current - Supply: 13mA Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34FS6408NAE | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 36V Applications: System Basis Chip Current - Supply: 13mA Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF3000A4EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF3000A7EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF3001A1EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF3001A2EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF3001A3EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF3001A5EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF3001A6EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF3001A7EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 140 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34VR500V4ES | NXP USA Inc. |
Description: IC REG 9OUT BUCK/LDO 56QFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) |
auf Bestellung 245 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F6AZES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 279 Stücke: Lieferzeit 10-14 Tag (e) |
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RD-KL25-AGMP01 | NXP USA Inc. |
Description: DATA COLLECTION REFERENCE DESIGNPackaging: Bulk Contents: Board(s), Cable(s) Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2 Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6QP6AVT1AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6QP6AVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 852MHZ 624FCBGAPart Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART SATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 852MHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6QP7CVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 800MHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6QP5EYM1AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGAPackaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 130 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6DP6AVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 852MHZ 624FCBGAPart Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 852MHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6DP5EYM1AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGAUSB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6QP-SDB | NXP USA Inc. |
Description: SABRE I.MX 6QUADPLUS EVAL BRD Part Status: Active Platform: SABRE Utilized IC / Part: i.MX 6QuadPlus Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A9 Contents: Board(s), Power Supply, Accessories Type: MPU Mounting Type: Fixed Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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AFT05MS004NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V SOT89APackaging: Cut Tape (CT) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 4.9W Gain: 20.9dB Technology: LDMOS Supplier Device Package: SOT-89A Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 5903 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT05MS006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5WPackaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 6W Gain: 18.3dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Not For New Designs Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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AFT09MS007NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5WPackaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 7.3W Gain: 15.2dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 5899 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09MS015NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V PLD-1.5WPackaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 16W Gain: 17.2dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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AFT27S006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5WPackaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 28.8dBm Gain: 22dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 70 mA |
auf Bestellung 989 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF1535FNT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V TO272-6Packaging: Cut Tape (CT) Package / Case: TO-272BA Current Rating (Amps): 6A Mounting Type: Chassis Mount Frequency: 520MHz Power - Output: 35W Gain: 13.5dB Technology: LDMOS Supplier Device Package: TO-272-6 Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRFE6VS25LR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI360 Packaging: Cut Tape (CT) Package / Case: NI-360 Mounting Type: Chassis Mount Frequency: 512MHz Power - Output: 25W Gain: 25.9dB Technology: LDMOS Supplier Device Package: NI-360 Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6638HW/V106ZK | NXP USA Inc. |
Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14x14) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
NXQ1TXH5DB1401UL | NXP USA Inc. |
Description: EVAL BOARD FOR NXQ1TXH5Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: NXQ1TXH5 Supplied Contents: Board(s) Primary Attributes: Transmitter Secondary Attributes: USB Powered Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| A2G22S160-01SR3 | NXP USA Inc. |
Description: RF MOSFET 48V NI400Package / Case: NI-400S-2S Packaging: Tape & Reel (TR) Current - Test: 150 mA Voltage - Test: 48 V Voltage - Rated: 125 V Part Status: Obsolete Supplier Device Package: NI-400S-2S Gain: 19.6dB Power - Output: 32W Frequency: 2.11GHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
A2I08H040GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-15 Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 9W Gain: 30.7dB Technology: LDMOS Supplier Device Package: TO-270WBG-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 25 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
A2I08H040NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-15 Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 9W Gain: 30.7dB Technology: LDMOS Supplier Device Package: TO-270WB-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 25 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
A2I20H060GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-15 Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 1.84GHz Configuration: Dual Power - Output: 12W Gain: 28.9dB Technology: LDMOS Supplier Device Package: TO-270WBG-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 24 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
A2I25D025GNR1 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I25H060GNR1 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
A2I25H060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-17 Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 2.59GHz Configuration: Dual Power - Output: 10.5W Gain: 26.1dB Technology: LDMOS Supplier Device Package: TO-270WB-17 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 26 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| A2T09VD250NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V TO270-6 Packaging: Tape & Reel (TR) Package / Case: TO-270-6 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 65W Gain: 22.5dB Technology: LDMOS Supplier Device Package: TO-270WB-6A Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| A2T09VD300NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V TO270-6 Packaging: Tape & Reel (TR) Package / Case: TO-270-6 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 79W Gain: 21.5dB Technology: LDMOS Supplier Device Package: TO-270WB-6A Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| A2T18H160-24SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780Current - Test: 400 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780S-4L2L Technology: LDMOS Gain: 17.9dB Power - Output: 28W Configuration: Dual Frequency: 1.81GHz Mounting Type: Chassis Mount Package / Case: NI-780S-4L2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
A2T18H410-24SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230Current - Test: 800 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-1230-4LS2L Technology: LDMOS Gain: 17.4dB Power - Output: 71W Configuration: Dual Frequency: 1.81GHz Mounting Type: Chassis Mount Package / Case: NI-1230-4LS2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| A2T18S160W31GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780Current - Test: 1 A Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780GS-2L2LA Technology: LDMOS Gain: 19.9dB Power - Output: 32W Frequency: 1.88GHz Mounting Type: Chassis Mount Package / Case: NI-780GS-2L2LA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| A2T18S162W31GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780Current - Test: 1 A Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780GS-2L2LA Technology: LDMOS Gain: 20.1dB Power - Output: 32W Frequency: 1.84GHz Mounting Type: Chassis Mount Package / Case: NI-780GS-2L2LA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
A2T20H330W24SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230Current - Test: 700 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-1230-4LS2L Technology: LDMOS Gain: 16.5dB Power - Output: 58W Configuration: Dual Frequency: 1.88GHz Mounting Type: Chassis Mount Package / Case: NI-1230-4LS2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| A2T21S260-12SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-2S2L Mounting Type: Chassis Mount Frequency: 2.17GHz Power - Output: 65W Gain: 18.7dB Technology: LDMOS Supplier Device Package: NI-780-2S2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| NT3H2211W0FTTJ |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 1.28 EUR |
| 5000+ | 1.23 EUR |
| 7500+ | 1.21 EUR |
| NT3H2111W0FT1X |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.11 EUR |
| 2000+ | 1.05 EUR |
| NT3H2211W0FT1X |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.34 EUR |
| 2000+ | 1.29 EUR |
| 3000+ | 1.26 EUR |
| OM5569/NT322ERM |
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Hersteller: NXP USA Inc.
Description: NTAG 12C PLUS EXPL KIT PLUS USB
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: NTAG 12C PLUS EXPL KIT PLUS USB
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM5569/NT322EM |
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Hersteller: NXP USA Inc.
Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NT3H2211W0FHKH |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
auf Bestellung 15110 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.09 EUR |
| 10+ | 1.79 EUR |
| 25+ | 1.69 EUR |
| 100+ | 1.55 EUR |
| 250+ | 1.47 EUR |
| 500+ | 1.41 EUR |
| 1000+ | 1.35 EUR |
| NT3H2111W0FTTJ |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 11613 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.81 EUR |
| 12+ | 1.56 EUR |
| 25+ | 1.47 EUR |
| 100+ | 1.35 EUR |
| 250+ | 1.28 EUR |
| 500+ | 1.22 EUR |
| 1000+ | 1.18 EUR |
| NT3H2111W0FT1X |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.32 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.59 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.26 EUR |
| 500+ | 1.18 EUR |
| NT3H2211W0FT1X |
![]() |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4986 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.08 EUR |
| 10+ | 1.78 EUR |
| 25+ | 1.68 EUR |
| 100+ | 1.54 EUR |
| 250+ | 1.46 EUR |
| 500+ | 1.4 EUR |
| FRDM-KW24D512 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WSN802G
Packaging: Bulk
For Use With/Related Products: KW2x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Description: EVAL BOARD FOR WSN802G
Packaging: Bulk
For Use With/Related Products: KW2x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 399.15 EUR |
| NX5P3201CUKAZ |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 30-WLCSP (2.26x2.56)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A, 6A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 8mOhm, 32mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: Parallel
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 30-UFBGA, WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 30-WLCSP (2.26x2.56)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A, 6A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 8mOhm, 32mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: Parallel
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 30-UFBGA, WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX5P3201CUKAZ |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 30-WLCSP (2.26x2.56)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A, 6A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 8mOhm, 32mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: Parallel
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 30-UFBGA, WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Supplier Device Package: 30-WLCSP (2.26x2.56)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A, 6A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 8mOhm, 32mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: Parallel
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 30-UFBGA, WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
auf Bestellung 3980 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.45 EUR |
| 10+ | 2.2 EUR |
| 25+ | 2.07 EUR |
| 100+ | 1.77 EUR |
| 250+ | 1.66 EUR |
| 500+ | 1.45 EUR |
| 1000+ | 1.2 EUR |
| MC33CD1030AE |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48LQFP
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: Switch Monitoring
Voltage - Supply: 4.5V ~ 36V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: IC INTERFACE SPECIALIZED 48LQFP
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: Switch Monitoring
Voltage - Supply: 4.5V ~ 36V
Interface: SPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 8.99 EUR |
| 10+ | 6.88 EUR |
| 25+ | 6.35 EUR |
| 80+ | 5.85 EUR |
| MC33HB2001EK |
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Hersteller: NXP USA Inc.
Description: IC HALF-BRIDGE DRIVER SPI 32SOIC
Description: IC HALF-BRIDGE DRIVER SPI 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33SB0400ES |
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Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X4, WHEEL SPEED
Description: LOW SIDE DRIVER X4, WHEEL SPEED
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33SB0401ES |
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Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 17.83 EUR |
| 10+ | 13.93 EUR |
| 25+ | 12.96 EUR |
| 80+ | 12.04 EUR |
| 260+ | 11.36 EUR |
| MC34FS6407NAE |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC34FS6408NAE |
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Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| MC34PF3000A4EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MC34PF3000A7EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.57 EUR |
| 10+ | 10.53 EUR |
| 25+ | 9.77 EUR |
| 100+ | 8.93 EUR |
| MC34PF3001A1EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12 EUR |
| 10+ | 9.26 EUR |
| 25+ | 8.57 EUR |
| 80+ | 7.92 EUR |
| 260+ | 7.44 EUR |
| MC34PF3001A2EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
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| MC34PF3001A3EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12 EUR |
| 10+ | 9.26 EUR |
| 25+ | 8.57 EUR |
| 80+ | 7.92 EUR |
| MC34PF3001A5EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Description: IC POWER MANAGEMENT 48QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF3001A6EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF3001A7EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.21 EUR |
| 10+ | 7.84 EUR |
| 25+ | 7.25 EUR |
| 100+ | 6.61 EUR |
| MC34VR500V4ES |
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Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 21.37 EUR |
| 10+ | 16.82 EUR |
| 25+ | 15.68 EUR |
| 100+ | 14.43 EUR |
| MMPF0100F6AZES |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 279 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.72 EUR |
| 10+ | 12.26 EUR |
| 25+ | 11.4 EUR |
| 100+ | 10.45 EUR |
| 260+ | 9.98 EUR |
| RD-KL25-AGMP01 |
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Hersteller: NXP USA Inc.
Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 77.25 EUR |
| MCIMX6QP6AVT1AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 250.08 EUR |
| 10+ | 212.02 EUR |
| 60+ | 195.46 EUR |
| MCIMX6QP6AVT8AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
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| MCIMX6QP7CVT8AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 184.45 EUR |
| 10+ | 154.96 EUR |
| 60+ | 142.12 EUR |
| MCIMX6QP5EYM1AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 185.05 EUR |
| 10+ | 155.62 EUR |
| 60+ | 142.82 EUR |
| MCIMX6DP6AVT8AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 146.96 EUR |
| 10+ | 122.88 EUR |
| MCIMX6DP5EYM1AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
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| MCIMX6QP-SDB |
Hersteller: NXP USA Inc.
Description: SABRE I.MX 6QUADPLUS EVAL BRD
Part Status: Active
Platform: SABRE
Utilized IC / Part: i.MX 6QuadPlus
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A9
Contents: Board(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: SABRE I.MX 6QUADPLUS EVAL BRD
Part Status: Active
Platform: SABRE
Utilized IC / Part: i.MX 6QuadPlus
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A9
Contents: Board(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| AFT05MS004NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 5903 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.86 EUR |
| 10+ | 4.41 EUR |
| 25+ | 4.05 EUR |
| 100+ | 3.65 EUR |
| 250+ | 3.46 EUR |
| 500+ | 3.35 EUR |
| AFT05MS006NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| AFT09MS007NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 5899 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.47 EUR |
| 10+ | 15.28 EUR |
| 25+ | 14.23 EUR |
| 100+ | 13.07 EUR |
| 250+ | 12.52 EUR |
| 500+ | 12.19 EUR |
| AFT09MS015NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| AFT27S006NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 989 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 31.06 EUR |
| 10+ | 24.74 EUR |
| 25+ | 23.16 EUR |
| 100+ | 21.42 EUR |
| 250+ | 20.6 EUR |
| 500+ | 20.27 EUR |
| MRF1535FNT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272BA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272BA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRFE6VS25LR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 146.77 EUR |
| 10+ | 122.54 EUR |
| 25+ | 116.49 EUR |
| TEF6638HW/V106ZK |
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| NXQ1TXH5DB1401UL |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NXQ1TXH5
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Secondary Attributes: USB Powered
Part Status: Active
Description: EVAL BOARD FOR NXQ1TXH5
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Secondary Attributes: USB Powered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2G22S160-01SR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 48V NI400
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Current - Test: 150 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Gain: 19.6dB
Power - Output: 32W
Frequency: 2.11GHz
Mounting Type: Surface Mount
Description: RF MOSFET 48V NI400
Package / Case: NI-400S-2S
Packaging: Tape & Reel (TR)
Current - Test: 150 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Obsolete
Supplier Device Package: NI-400S-2S
Gain: 19.6dB
Power - Output: 32W
Frequency: 2.11GHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2I08H040GNR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2I08H040NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2I20H060GNR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
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| A2I25D025GNR1 |
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Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
Description: IC TRANS RF LDMOS
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 500+ | 42.72 EUR |
| A2I25H060GNR1 |
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Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
Description: IC TRANS RF LDMOS
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| A2I25H060NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Description: RF MOSFET LDMOS 28V TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2T09VD250NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 65W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 65W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1 A
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| A2T09VD300NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 79W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 79W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T18H160-24SR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L2L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 28W
Configuration: Dual
Frequency: 1.81GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S-4L2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L2L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 28W
Configuration: Dual
Frequency: 1.81GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S-4L2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2T18H410-24SR6 |
![]() |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS
Gain: 17.4dB
Power - Output: 71W
Configuration: Dual
Frequency: 1.81GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS
Gain: 17.4dB
Power - Output: 71W
Configuration: Dual
Frequency: 1.81GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T18S160W31GSR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-2L2LA
Technology: LDMOS
Gain: 19.9dB
Power - Output: 32W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-2L2LA
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-2L2LA
Technology: LDMOS
Gain: 19.9dB
Power - Output: 32W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-2L2LA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T18S162W31GSR3 |
![]() |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-2L2LA
Technology: LDMOS
Gain: 20.1dB
Power - Output: 32W
Frequency: 1.84GHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-2L2LA
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780GS-2L2LA
Technology: LDMOS
Gain: 20.1dB
Power - Output: 32W
Frequency: 1.84GHz
Mounting Type: Chassis Mount
Package / Case: NI-780GS-2L2LA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T20H330W24SR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 700 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS
Gain: 16.5dB
Power - Output: 58W
Configuration: Dual
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 700 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS
Gain: 16.5dB
Power - Output: 58W
Configuration: Dual
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2T21S260-12SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-2S2L
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 65W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: NI-780-2S2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-2S2L
Mounting Type: Chassis Mount
Frequency: 2.17GHz
Power - Output: 65W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: NI-780-2S2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
Im Einkaufswagen
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