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BGU8309Z BGU8309Z NXP USA Inc. BGU8309.pdf Description: IC MMIC RF AMP LNA X2SON5
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CBTL08GP053EVAZ CBTL08GP053EVAZ NXP USA Inc. CBTL08GP053.pdf Description: IC MUX CROSSBAR SW USB VFBGA40
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NCX8200UKZ NCX8200UKZ NXP USA Inc. NCX8200.pdf Description: IC AUDIO SWITCH 1-CH 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
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NTB0101GW-Q100H NTB0101GW-Q100H NXP USA Inc. NTB0101_Q100.pdf Description: IC TRNSLTR BIDIRECTIONAL 6TSSOP
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NVT4857UKZ NXP USA Inc. NVT4857UK.pdf Description: IC INTERFACE SPECIALIZED 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: Memory Card
Supplier Device Package: 20-WLCSP
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NX5P2553GU6Z NX5P2553GU6Z NXP USA Inc. NX5P2553.pdf Description: IC PWR SWITCH N-CHAN 1:1 6HXSON
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NX5P2553GUZ NX5P2553GUZ NXP USA Inc. NX5P2553.pdf Description: IC POWER SWITCH PREC 6HXSON
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PCF2003DUS/DAAZ NXP USA Inc. PCF2003.pdf Description: IC WATCH CIRCUIT 8-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Watch Circuit
Applications: Wrist Watches
Supplier Device Package: 8-WLCSP (1.16x0.86)
DigiKey Programmable: Not Verified
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PCF85063AT/AAZ PCF85063AT/AAZ NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
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PTN3356R1BSZ PTN3356R1BSZ NXP USA Inc. PTN3356R1.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
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PTN3460IBS/F2Z PTN3460IBS/F2Z NXP USA Inc. PTN3460I.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Supplier Device Package: 56-HVQFN (7x7)
Applications: LVDS
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PTN36241GHXAZ PTN36241GHXAZ NXP USA Inc. PTN36241G.pdf Description: IC REDRIVER USB 3.0 12X2QFN
Part Status: Obsolete
Signal Conditioning: Input Equalization, Output De-Emphasis
Data Rate (Max): 5Gbps
Current - Supply: 105mA
Applications: USB 3.0
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Buffer, ReDriver
Mounting Type: Surface Mount
Number of Channels: 2
Delay Time: 500ps
Package / Case: 12-XFQFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 12-X2QFN (1.25x2.10)
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PTN5100ABSZ PTN5100ABSZ NXP USA Inc. PTN5100.pdf Description: IC USB PD PHY TYPE C 20HVQFN
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PTN5100DABSBZ PTN5100DABSBZ NXP USA Inc. PTN5100D.pdf Description: IC USB PD PHY TYPE C 20HVQFN
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PTN5150HHXZ PTN5150HHXZ NXP USA Inc. PTN5150H.pdf Description: IC USB HOST CTLR 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
DigiKey Programmable: Not Verified
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SA604AHRZ SA604AHRZ NXP USA Inc. SA604A.pdf Description: IC FM IF SYSTEM LOW PWR 16UHXQFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HXQFN (3x3)
RF Type: FM
Frequency: 25MHz
Function: IF Receiver
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
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SL2S1412FTBX NXP USA Inc. Description: IC I-CODE ILT-M 3XSON
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Tape & Reel (TR)
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SL2S1612FTBX NXP USA Inc. Description: IC I-CODE ILT-M 3XSON
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SL2S5302FTBX NXP USA Inc. Description: IC I-CODE SLI 3XSON
Packaging: Tape & Reel (TR)
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SL3S1204FTB0X SL3S1204FTB0X NXP USA Inc. SL3S1204.pdf Description: IC RFID TRANSP 840-960MHZ 6XSON
Supplier Device Package: 6-XSON (1.45x1.00)
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
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SL3S1214FTB0X SL3S1214FTB0X NXP USA Inc. SL3S1214.pdf Description: IC RFID TRANSP 840-960MHZ 6XSON
Supplier Device Package: 6-XSON (1.45x1.00)
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
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TEA1833LTS/1H TEA1833LTS/1H NXP USA Inc. Description: IC OFFLINE SWITCH FLYBACK SC74
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
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TEA1833LTS/1X TEA1833LTS/1X NXP USA Inc. TEA1833LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
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TEA1833TS/1H TEA1833TS/1H NXP USA Inc. TEA1833LTS_Aug31_2015_DS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
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TEA1833TS/1X TEA1833TS/1X NXP USA Inc. TEA1833LTS_Aug31_2015_DS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
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TEA1993TS/1H TEA1993TS/1H NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Part Status: Active
Supplier Device Package: SC-74
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TEA1993TS/1X TEA1993TS/1X NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Supplier Device Package: SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
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TFF1025HN/N1X NXP USA Inc. Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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JN5169/001K JN5169/001K NXP USA Inc. JN5169.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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100+9.87 EUR
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LPC18S10FET180E LPC18S10FET180E NXP USA Inc. Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
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LPC18S30FBD144E LPC18S30FBD144E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC18S30FET100E LPC18S30FET100E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC18S37JBD144E LPC18S37JBD144E NXP USA Inc. LPC18S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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LPC18S57JBD208E LPC18S57JBD208E NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208LQFP
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LPC43S20FET180E LPC43S20FET180E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
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LPC43S30FBD144E LPC43S30FBD144E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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LPC43S30FET100E LPC43S30FET100E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC43S37JBD144E LPC43S37JBD144E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
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LPC43S57JBD208E LPC43S57JBD208E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC43S70FET100E LPC43S70FET100E NXP USA Inc. LPC43S70.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LPC54114J256BD64QL LPC54114J256BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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PN5180A0ET/C1QL PN5180A0ET/C1QL NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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PN5180A0HN/C1E PN5180A0HN/C1E NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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TDA19971AHN/C181E NXP USA Inc. Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
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TDF8546AJ/N1ZU TDF8546AJ/N1ZU NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546AJS/N1ZS TDF8546AJS/N1ZS NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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TDF8546ASD/N1ZU TDF8546ASD/N1ZU NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLASS AB QUAD 25W 27RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
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TDF8546J/N2ZU TDF8546J/N2ZU NXP USA Inc. TDF8546.pdf Description: IC AMP CLASS AB QUAD 25W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546JS/N2ZS TDF8546JS/N2ZS NXP USA Inc. TDF8546.pdf Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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TDF8548AJ/N1ZU NXP USA Inc. Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8037T/C1S TDA8037T/C1S NXP USA Inc. TDA8037.pdf Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
Produkt ist nicht verfügbar
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TDA8579T/N1SU TDA8579T/N1SU NXP USA Inc. TDA8579T.pdf Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8548ATH/N1ZU NXP USA Inc. Description: IC AMP CLASS AB QUAD 28W 36HSOP
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FRDMSTBCDP5004 FRDMSTBCDP5004 NXP USA Inc. MPXV5004G.pdf Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Produkt ist nicht verfügbar
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MPC17529EJ MPC17529EJ NXP USA Inc. Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MCIMX6G2CVK05AA MCIMX6G2CVK05AA NXP USA Inc. MCIMX6GxCzzzzzA.pdf Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MPC5777C-416DS MPC5777C-416DS NXP USA Inc. MPC5777C.pdf Description: MPC5777C EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5777C
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC574XG-256DS MPC574XG-256DS NXP USA Inc. MPC5748G.pdf Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
auf Bestellung 4 Stücke:
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1+972.27 EUR
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MPC574XG-324DS MPC574XG-324DS NXP USA Inc. MPC5748G.pdf Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
Produkt ist nicht verfügbar
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BGU8309Z BGU8309.pdf
BGU8309Z
Hersteller: NXP USA Inc.
Description: IC MMIC RF AMP LNA X2SON5
Produkt ist nicht verfügbar
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CBTL08GP053EVAZ CBTL08GP053.pdf
CBTL08GP053EVAZ
Hersteller: NXP USA Inc.
Description: IC MUX CROSSBAR SW USB VFBGA40
Produkt ist nicht verfügbar
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NCX8200UKZ NCX8200.pdf
NCX8200UKZ
Hersteller: NXP USA Inc.
Description: IC AUDIO SWITCH 1-CH 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
Produkt ist nicht verfügbar
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NTB0101GW-Q100H NTB0101_Q100.pdf
NTB0101GW-Q100H
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 6TSSOP
Produkt ist nicht verfügbar
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NVT4857UKZ NVT4857UK.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: Memory Card
Supplier Device Package: 20-WLCSP
Produkt ist nicht verfügbar
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NX5P2553GU6Z NX5P2553.pdf
NX5P2553GU6Z
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 6HXSON
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NX5P2553GUZ NX5P2553.pdf
NX5P2553GUZ
Hersteller: NXP USA Inc.
Description: IC POWER SWITCH PREC 6HXSON
Produkt ist nicht verfügbar
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PCF2003DUS/DAAZ PCF2003.pdf
Hersteller: NXP USA Inc.
Description: IC WATCH CIRCUIT 8-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Watch Circuit
Applications: Wrist Watches
Supplier Device Package: 8-WLCSP (1.16x0.86)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85063AT/AAZ PCF85063A.pdf
PCF85063AT/AAZ
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3356R1BSZ PTN3356R1.pdf
PTN3356R1BSZ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Produkt ist nicht verfügbar
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PTN3460IBS/F2Z PTN3460I.pdf
PTN3460IBS/F2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Supplier Device Package: 56-HVQFN (7x7)
Applications: LVDS
Voltage - Supply: 3.3V
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN36241GHXAZ PTN36241G.pdf
PTN36241GHXAZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 12X2QFN
Part Status: Obsolete
Signal Conditioning: Input Equalization, Output De-Emphasis
Data Rate (Max): 5Gbps
Current - Supply: 105mA
Applications: USB 3.0
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Buffer, ReDriver
Mounting Type: Surface Mount
Number of Channels: 2
Delay Time: 500ps
Package / Case: 12-XFQFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 12-X2QFN (1.25x2.10)
Produkt ist nicht verfügbar
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PTN5100ABSZ PTN5100.pdf
PTN5100ABSZ
Hersteller: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Produkt ist nicht verfügbar
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PTN5100DABSBZ PTN5100D.pdf
PTN5100DABSBZ
Hersteller: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Produkt ist nicht verfügbar
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PTN5150HHXZ PTN5150H.pdf
PTN5150HHXZ
Hersteller: NXP USA Inc.
Description: IC USB HOST CTLR 12X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SA604AHRZ SA604A.pdf
SA604AHRZ
Hersteller: NXP USA Inc.
Description: IC FM IF SYSTEM LOW PWR 16UHXQFN
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HXQFN (3x3)
RF Type: FM
Frequency: 25MHz
Function: IF Receiver
Mounting Type: Surface Mount
Package / Case: 16-XFQFN Exposed Pad
Produkt ist nicht verfügbar
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SL2S1412FTBX
Hersteller: NXP USA Inc.
Description: IC I-CODE ILT-M 3XSON
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Part Status: Active
Supplier Device Package: 3-XSON (1x1.45)
Standards: ISO 18000-6, EPC
Voltage - Supply: 1.5V ~ 1.7V
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 3-XDFN
Packaging: Tape & Reel (TR)
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AnzahlPrivatkunde
5000+0.44 EUR
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SL2S1612FTBX
Hersteller: NXP USA Inc.
Description: IC I-CODE ILT-M 3XSON
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SL2S5302FTBX
Hersteller: NXP USA Inc.
Description: IC I-CODE SLI 3XSON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SL3S1204FTB0X SL3S1204.pdf
SL3S1204FTB0X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 6XSON
Supplier Device Package: 6-XSON (1.45x1.00)
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SL3S1214FTB0X SL3S1214.pdf
SL3S1214FTB0X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 6XSON
Supplier Device Package: 6-XSON (1.45x1.00)
Operating Temperature: -40°C ~ 85°C
Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA1833LTS/1H
TEA1833LTS/1H
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Produkt ist nicht verfügbar
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TEA1833LTS/1X TEA1833LTS.pdf
TEA1833LTS/1X
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA1833TS/1H TEA1833LTS_Aug31_2015_DS.pdf
TEA1833TS/1H
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TEA1833TS/1X TEA1833LTS_Aug31_2015_DS.pdf
TEA1833TS/1X
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Tape & Reel (TR)
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Produkt ist nicht verfügbar
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TEA1993TS/1H TEA1993TS.pdf
TEA1993TS/1H
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Part Status: Active
Supplier Device Package: SC-74
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3000+1.3 EUR
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TEA1993TS/1X TEA1993TS.pdf
TEA1993TS/1X
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Supplier Device Package: SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TFF1025HN/N1X
Hersteller: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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JN5169/001K JN5169.pdf
JN5169/001K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+13.04 EUR
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100+9.87 EUR
250+9.37 EUR
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LPC18S10FET180E
LPC18S10FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC18S30FBD144E LPC18S50_30_10.pdf
LPC18S30FBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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10+17.99 EUR
60+15.85 EUR
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LPC18S30FET100E LPC18S50_30_10.pdf
LPC18S30FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC18S37JBD144E LPC18S5X_S3X.pdf
LPC18S37JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC18S57JBD208E
LPC18S57JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Produkt ist nicht verfügbar
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LPC43S20FET180E LPC43S50_30_20.pdf
LPC43S20FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FBD144E LPC43S50_30_20.pdf
LPC43S30FBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FET100E LPC43S50_30_20.pdf
LPC43S30FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC43S37JBD144E LPC43S5X_S3X.pdf
LPC43S37JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
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LPC43S57JBD208E LPC43S5X_S3X.pdf
LPC43S57JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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LPC43S70FET100E LPC43S70.pdf
LPC43S70FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LPC54114J256BD64QL LPC5410X.pdf
LPC54114J256BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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2+16.26 EUR
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160+10.46 EUR
320+10.13 EUR
640+9.87 EUR
1120+9.69 EUR
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PN5180A0ET/C1QL PN5180A0XX-C1-C2.pdf
PN5180A0ET/C1QL
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Produkt ist nicht verfügbar
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PN5180A0HN/C1E PN5180A0XX-C1-C2.pdf
PN5180A0HN/C1E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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2+18.55 EUR
10+14.47 EUR
25+13.46 EUR
100+12.33 EUR
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TDA19971AHN/C181E
Hersteller: NXP USA Inc.
Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
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TDF8546AJ/N1ZU TDF854x_BR.pdf
TDF8546AJ/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546AJS/N1ZS TDF854x_BR.pdf
TDF8546AJS/N1ZS
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Produkt ist nicht verfügbar
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TDF8546ASD/N1ZU TDF854x_BR.pdf
TDF8546ASD/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 27RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
Produkt ist nicht verfügbar
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TDF8546J/N2ZU TDF8546.pdf
TDF8546J/N2ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546JS/N2ZS TDF8546.pdf
TDF8546JS/N2ZS
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Produkt ist nicht verfügbar
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TDF8548AJ/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8037T/C1S TDA8037.pdf
TDA8037T/C1S
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
Produkt ist nicht verfügbar
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TDA8579T/N1SU TDA8579T.pdf
TDA8579T/N1SU
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8548ATH/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W 36HSOP
Produkt ist nicht verfügbar
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FRDMSTBCDP5004 MPXV5004G.pdf
FRDMSTBCDP5004
Hersteller: NXP USA Inc.
Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Produkt ist nicht verfügbar
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MPC17529EJ
MPC17529EJ
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MCIMX6G2CVK05AA MCIMX6GxCzzzzzA.pdf
MCIMX6G2CVK05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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MPC5777C-416DS MPC5777C.pdf
MPC5777C-416DS
Hersteller: NXP USA Inc.
Description: MPC5777C EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5777C
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
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MPC574XG-256DS MPC5748G.pdf
MPC574XG-256DS
Hersteller: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+972.27 EUR
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MPC574XG-324DS MPC5748G.pdf
MPC574XG-324DS
Hersteller: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
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