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NX5P2925CUKZ NX5P2925CUKZ NXP USA Inc. NX5P2925C.pdf Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 18mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-WLCSP (0.87x1.37)
Fault Protection: Reverse Current
Produkt ist nicht verfügbar
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NX20P5090UKAZ NX20P5090UKAZ NXP USA Inc. NX20P5090.pdf Description: IC PWR SWITCH N-CHAN 1:1 15WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 15-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 30mOhm
Voltage - Load: 2.5V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 15-WLCSP (2.56x1.54)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Part Status: Active
auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+1.33 EUR
6000+1.30 EUR
9000+1.29 EUR
Mindestbestellmenge: 3000
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NX5P3201CUKZ NX5P3201CUKZ NXP USA Inc. NX5P3201.pdf Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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NX5P2925CUKZ NX5P2925CUKZ NXP USA Inc. NX5P2925C.pdf Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 6-XFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 18mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-WLCSP (0.87x1.37)
Fault Protection: Reverse Current
Produkt ist nicht verfügbar
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NX20P5090UKAZ NX20P5090UKAZ NXP USA Inc. NX20P5090.pdf Description: IC PWR SWITCH N-CHAN 1:1 15WLCSP
Packaging: Cut Tape (CT)
Package / Case: 15-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 30mOhm
Voltage - Load: 2.5V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 15-WLCSP (2.56x1.54)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Part Status: Active
auf Bestellung 100985 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.68 EUR
10+1.96 EUR
25+1.79 EUR
100+1.59 EUR
250+1.49 EUR
500+1.44 EUR
1000+1.39 EUR
Mindestbestellmenge: 7
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CBTV24DD12ETY CBTV24DD12ETY NXP USA Inc. CBTV24DD12.pdf Description: IC SWITCH SPDT X 12 9OHM 48TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 85°C (TA)
On-State Resistance (Max): 9Ohm
-3db Bandwidth: 7.4GHz
Supplier Device Package: 48-TFBGA (3x8)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 400mOhm
Number of Circuits: 12
Produkt ist nicht verfügbar
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NT3H2211W0FHKH NT3H2211W0FHKH NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+1.16 EUR
Mindestbestellmenge: 4000
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NT3H2111W0FTTJ NT3H2111W0FTTJ NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 24960 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.04 EUR
5000+1.00 EUR
7500+0.98 EUR
12500+0.95 EUR
Mindestbestellmenge: 2500
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NT3H2211W0FTTJ NT3H2211W0FTTJ NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.29 EUR
5000+1.24 EUR
Mindestbestellmenge: 2500
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NT3H2111W0FT1X NT3H2111W0FT1X NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+1.11 EUR
2000+1.05 EUR
Mindestbestellmenge: 1000
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NT3H2211W0FT1X NT3H2211W0FT1X NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+1.08 EUR
2000+1.01 EUR
5000+0.96 EUR
Mindestbestellmenge: 1000
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OM5569/NT322ERM OM5569/NT322ERM NXP USA Inc. NTAG I2C_Leaflet.pdf Description: NTAG 12C PLUS EXPL KIT PLUS USB
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM5569/NT322EM OM5569/NT322EM NXP USA Inc. NTAG I2C_Leaflet.pdf Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NT3H2211W0FHKH NT3H2211W0FHKH NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
auf Bestellung 6358 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.94 EUR
11+1.66 EUR
25+1.57 EUR
100+1.44 EUR
250+1.36 EUR
500+1.31 EUR
1000+1.25 EUR
Mindestbestellmenge: 10
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NT3H2111W0FTTJ NT3H2111W0FTTJ NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 25223 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.69 EUR
13+1.46 EUR
25+1.37 EUR
100+1.26 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.10 EUR
Mindestbestellmenge: 11
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NT3H2111W0FT1X NT3H2111W0FT1X NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5100 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.32 EUR
10+1.77 EUR
25+1.59 EUR
100+1.37 EUR
250+1.26 EUR
500+1.18 EUR
Mindestbestellmenge: 8
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NT3H2211W0FT1X NT3H2211W0FT1X NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5739 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.53 EUR
10+2.24 EUR
25+2.02 EUR
100+1.77 EUR
250+1.55 EUR
500+1.37 EUR
Mindestbestellmenge: 7
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FRDM-KW24D512 FRDM-KW24D512 NXP USA Inc. Description: EVAL BOARD FOR WSN802G
Packaging: Bulk
For Use With/Related Products: KW2x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+399.15 EUR
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NX5P3201CUKAZ NX5P3201CUKAZ NXP USA Inc. NX5P3201.pdf Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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NX5P3201CUKAZ NX5P3201CUKAZ NXP USA Inc. NX5P3201.pdf Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
auf Bestellung 3980 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.45 EUR
10+2.20 EUR
25+2.07 EUR
100+1.77 EUR
250+1.66 EUR
500+1.45 EUR
1000+1.20 EUR
Mindestbestellmenge: 8
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MC33CD1030AE MC33CD1030AE NXP USA Inc. CD1030.pdf Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.5V ~ 36V
Applications: Switch Monitoring
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.99 EUR
10+6.88 EUR
25+6.35 EUR
80+5.85 EUR
Mindestbestellmenge: 2
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MC33HB2001EK MC33HB2001EK NXP USA Inc. MC33HB2001.pdf Description: IC HALF-BRIDGE DRIVER SPI 32SOIC
Produkt ist nicht verfügbar
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MC33SB0400ES MC33SB0400ES NXP USA Inc. MC33SB0400.pdf Description: LOW SIDE DRIVER X4, WHEEL SPEED
Produkt ist nicht verfügbar
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MC33SB0401ES MC33SB0401ES NXP USA Inc. Download?colCode=MC33SB0401&amp;appType=moderatedWithoutFAE Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.83 EUR
10+13.93 EUR
25+12.96 EUR
80+12.04 EUR
260+11.36 EUR
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MC34FS6407NAE MC34FS6407NAE NXP USA Inc. MC34FS6407-08.pdf Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC34FS6408NAE MC34FS6408NAE NXP USA Inc. MC34FS6407-08.pdf Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF3000A4EP MC34PF3000A4EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3000A7EP MC34PF3000A7EP NXP USA Inc. PF3000.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.57 EUR
10+10.53 EUR
25+9.77 EUR
100+8.93 EUR
Mindestbestellmenge: 2
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MC34PF3001A1EP MC34PF3001A1EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.00 EUR
10+9.26 EUR
25+8.57 EUR
80+7.92 EUR
260+7.44 EUR
Mindestbestellmenge: 2
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MC34PF3001A2EP MC34PF3001A2EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3001A3EP MC34PF3001A3EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.00 EUR
10+9.26 EUR
25+8.57 EUR
80+7.92 EUR
Mindestbestellmenge: 2
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MC34PF3001A5EP MC34PF3001A5EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Produkt ist nicht verfügbar
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MC34PF3001A6EP MC34PF3001A6EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3001A7EP MC34PF3001A7EP NXP USA Inc. PF3001.pdf Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.28 EUR
10+7.09 EUR
25+6.55 EUR
100+5.95 EUR
260+5.65 EUR
Mindestbestellmenge: 2
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MC34VR500V4ES MC34VR500V4ES NXP USA Inc. MC34VR500.pdf Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.37 EUR
10+16.82 EUR
25+15.68 EUR
100+14.43 EUR
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MMPF0100F6AZES MMPF0100F6AZES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 339 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.88 EUR
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25+11.50 EUR
100+10.54 EUR
260+10.07 EUR
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RD-KL25-AGMP01 RD-KL25-AGMP01 NXP USA Inc. RD-KL25-AGMP01-UG.pdf Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s), Cable(s)
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Lieferzeit 10-14 Tag (e)
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MCIMX6QP6AVT1AA MCIMX6QP6AVT1AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 511 Stücke:
Lieferzeit 10-14 Tag (e)
1+206.13 EUR
10+173.96 EUR
60+159.97 EUR
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MCIMX6QP6AVT8AA MCIMX6QP6AVT8AA NXP USA Inc. IMX6SRSFS.pdf Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AA MCIMX6QP7CVT8AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
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Lieferzeit 10-14 Tag (e)
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10+146.04 EUR
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MCIMX6QP5EYM1AA MCIMX6QP5EYM1AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
1+152.61 EUR
10+127.74 EUR
60+116.92 EUR
120+114.00 EUR
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MCIMX6DP6AVT8AA MCIMX6DP6AVT8AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+146.96 EUR
10+122.88 EUR
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MCIMX6DP5EYM1AA MCIMX6DP5EYM1AA NXP USA Inc. IMX6SRSFS.pdf Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP-SDB MCIMX6QP-SDB NXP USA Inc. Description: SABRE I.MX 6QUADPLUS EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6QuadPlus
Platform: SABRE
Part Status: Active
Produkt ist nicht verfügbar
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AFT05MS004NT1 AFT05MS004NT1 NXP USA Inc. AFT05MS004N.pdf Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 25285 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.87 EUR
10+2.88 EUR
25+2.63 EUR
100+2.36 EUR
250+2.24 EUR
Mindestbestellmenge: 5
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AFT05MS006NT1 AFT05MS006NT1 NXP USA Inc. AFT05MS006N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 1142 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.96 EUR
10+6.06 EUR
25+5.58 EUR
100+5.06 EUR
250+4.97 EUR
Mindestbestellmenge: 3
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AFT09MS007NT1 AFT09MS007NT1 NXP USA Inc. AFT09MS007N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 3120 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.65 EUR
10+5.04 EUR
25+4.64 EUR
100+4.19 EUR
250+4.09 EUR
Mindestbestellmenge: 3
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AFT09MS015NT1 AFT09MS015NT1 NXP USA Inc. AFT09MS015N.pdf Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
auf Bestellung 997 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.26 EUR
10+7.90 EUR
25+7.30 EUR
100+6.65 EUR
250+6.63 EUR
Mindestbestellmenge: 2
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AFT27S006NT1 AFT27S006NT1 NXP USA Inc. AFT27S006N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 1035 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.90 EUR
10+14.84 EUR
25+13.83 EUR
100+13.01 EUR
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MRF1535FNT1 MRF1535FNT1 NXP USA Inc. MRF1535N.pdf Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272BA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRFE6VS25LR5 MRFE6VS25LR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
1+146.77 EUR
10+122.54 EUR
25+116.49 EUR
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TEF6638HW/V106ZK TEF6638HW/V106ZK NXP USA Inc. Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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NXQ1TXH5DB1401UL NXQ1TXH5DB1401UL NXP USA Inc. NXQ1TXH5.pdf Description: EVAL BOARD FOR NXQ1TXH5
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Part Status: Active
Contents: Board(s)
Secondary Attributes: USB Powered
Produkt ist nicht verfügbar
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A2G22S160-01SR3 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.11GHz
Power - Output: 32W
Gain: 19.6dB
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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A2I08H040GNR1 A2I08H040GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
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A2I08H040NR1 A2I08H040NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
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A2I20H060GNR1 A2I20H060GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Produkt ist nicht verfügbar
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A2I25D025GNR1 A2I25D025GNR1 NXP USA Inc. A2I25D025N.pdf Description: IC TRANS RF LDMOS
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
500+42.72 EUR
Mindestbestellmenge: 500
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A2I25H060GNR1 A2I25H060GNR1 NXP USA Inc. A2I25H060N.pdf Description: IC TRANS RF LDMOS
Produkt ist nicht verfügbar
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A2I25H060NR1 A2I25H060NR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Produkt ist nicht verfügbar
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NX5P2925CUKZ NX5P2925C.pdf
NX5P2925CUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 18mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-WLCSP (0.87x1.37)
Fault Protection: Reverse Current
Produkt ist nicht verfügbar
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NX20P5090UKAZ NX20P5090.pdf
NX20P5090UKAZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 15WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 15-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 30mOhm
Voltage - Load: 2.5V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 15-WLCSP (2.56x1.54)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Part Status: Active
auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+1.33 EUR
6000+1.30 EUR
9000+1.29 EUR
Mindestbestellmenge: 3000
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NX5P3201CUKZ NX5P3201.pdf
NX5P3201CUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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NX5P2925CUKZ NX5P2925C.pdf
NX5P2925CUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 6-XFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 18mOhm
Input Type: Non-Inverting
Voltage - Load: 0.8V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 6-WLCSP (0.87x1.37)
Fault Protection: Reverse Current
Produkt ist nicht verfügbar
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NX20P5090UKAZ NX20P5090.pdf
NX20P5090UKAZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 15WLCSP
Packaging: Cut Tape (CT)
Package / Case: 15-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 30mOhm
Voltage - Load: 2.5V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 15-WLCSP (2.56x1.54)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Part Status: Active
auf Bestellung 100985 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.68 EUR
10+1.96 EUR
25+1.79 EUR
100+1.59 EUR
250+1.49 EUR
500+1.44 EUR
1000+1.39 EUR
Mindestbestellmenge: 7
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CBTV24DD12ETY CBTV24DD12.pdf
CBTV24DD12ETY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 12 9OHM 48TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 85°C (TA)
On-State Resistance (Max): 9Ohm
-3db Bandwidth: 7.4GHz
Supplier Device Package: 48-TFBGA (3x8)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 400mOhm
Number of Circuits: 12
Produkt ist nicht verfügbar
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NT3H2211W0FHKH NT3H2111_2211.pdf
NT3H2211W0FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+1.16 EUR
Mindestbestellmenge: 4000
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NT3H2111W0FTTJ NT3H2111_2211.pdf
NT3H2111W0FTTJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 24960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.04 EUR
5000+1.00 EUR
7500+0.98 EUR
12500+0.95 EUR
Mindestbestellmenge: 2500
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NT3H2211W0FTTJ NT3H2111_2211.pdf
NT3H2211W0FTTJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.29 EUR
5000+1.24 EUR
Mindestbestellmenge: 2500
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NT3H2111W0FT1X NT3H2111_2211.pdf
NT3H2111W0FT1X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+1.11 EUR
2000+1.05 EUR
Mindestbestellmenge: 1000
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NT3H2211W0FT1X NT3H2111_2211.pdf
NT3H2211W0FT1X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+1.08 EUR
2000+1.01 EUR
5000+0.96 EUR
Mindestbestellmenge: 1000
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OM5569/NT322ERM NTAG I2C_Leaflet.pdf
OM5569/NT322ERM
Hersteller: NXP USA Inc.
Description: NTAG 12C PLUS EXPL KIT PLUS USB
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM5569/NT322EM NTAG I2C_Leaflet.pdf
OM5569/NT322EM
Hersteller: NXP USA Inc.
Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NT3H2211W0FHKH NT3H2111_2211.pdf
NT3H2211W0FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.6V
Standards: ISO 14443
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
auf Bestellung 6358 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.94 EUR
11+1.66 EUR
25+1.57 EUR
100+1.44 EUR
250+1.36 EUR
500+1.31 EUR
1000+1.25 EUR
Mindestbestellmenge: 10
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NT3H2111W0FTTJ NT3H2111_2211.pdf
NT3H2111W0FTTJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 25223 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.69 EUR
13+1.46 EUR
25+1.37 EUR
100+1.26 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.10 EUR
Mindestbestellmenge: 11
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NT3H2111W0FT1X NT3H2111_2211.pdf
NT3H2111W0FT1X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.32 EUR
10+1.77 EUR
25+1.59 EUR
100+1.37 EUR
250+1.26 EUR
500+1.18 EUR
Mindestbestellmenge: 8
Im Einkaufswagen  Stück im Wert von  UAH
NT3H2211W0FT1X NT3H2111_2211.pdf
NT3H2211W0FT1X
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 5739 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.53 EUR
10+2.24 EUR
25+2.02 EUR
100+1.77 EUR
250+1.55 EUR
500+1.37 EUR
Mindestbestellmenge: 7
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FRDM-KW24D512
FRDM-KW24D512
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WSN802G
Packaging: Bulk
For Use With/Related Products: KW2x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+399.15 EUR
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NX5P3201CUKAZ NX5P3201.pdf
NX5P3201CUKAZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Produkt ist nicht verfügbar
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NX5P3201CUKAZ NX5P3201.pdf
NX5P3201CUKAZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 30WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Cut Tape (CT)
Package / Case: 30-UFBGA, WLCSP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Parallel
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 32mOhm
Input Type: Non-Inverting
Voltage - Load: 2.7V ~ 5.5V, 3.4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 30-WLCSP (2.26x2.56)
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
auf Bestellung 3980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.45 EUR
10+2.20 EUR
25+2.07 EUR
100+1.77 EUR
250+1.66 EUR
500+1.45 EUR
1000+1.20 EUR
Mindestbestellmenge: 8
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MC33CD1030AE CD1030.pdf
MC33CD1030AE
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.5V ~ 36V
Applications: Switch Monitoring
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.99 EUR
10+6.88 EUR
25+6.35 EUR
80+5.85 EUR
Mindestbestellmenge: 2
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MC33HB2001EK MC33HB2001.pdf
MC33HB2001EK
Hersteller: NXP USA Inc.
Description: IC HALF-BRIDGE DRIVER SPI 32SOIC
Produkt ist nicht verfügbar
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MC33SB0400ES MC33SB0400.pdf
MC33SB0400ES
Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X4, WHEEL SPEED
Produkt ist nicht verfügbar
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MC33SB0401ES Download?colCode=MC33SB0401&amp;appType=moderatedWithoutFAE
MC33SB0401ES
Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.83 EUR
10+13.93 EUR
25+12.96 EUR
80+12.04 EUR
260+11.36 EUR
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MC34FS6407NAE MC34FS6407-08.pdf
MC34FS6407NAE
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC34FS6408NAE MC34FS6407-08.pdf
MC34FS6408NAE
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF3000A4EP PF3000.pdf
MC34PF3000A4EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3000A7EP PF3000.pdf
MC34PF3000A7EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.57 EUR
10+10.53 EUR
25+9.77 EUR
100+8.93 EUR
Mindestbestellmenge: 2
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MC34PF3001A1EP PF3001.pdf
MC34PF3001A1EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.00 EUR
10+9.26 EUR
25+8.57 EUR
80+7.92 EUR
260+7.44 EUR
Mindestbestellmenge: 2
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MC34PF3001A2EP PF3001.pdf
MC34PF3001A2EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3001A3EP PF3001.pdf
MC34PF3001A3EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.00 EUR
10+9.26 EUR
25+8.57 EUR
80+7.92 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF3001A5EP PF3001.pdf
MC34PF3001A5EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Produkt ist nicht verfügbar
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MC34PF3001A6EP PF3001.pdf
MC34PF3001A6EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC34PF3001A7EP PF3001.pdf
MC34PF3001A7EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.28 EUR
10+7.09 EUR
25+6.55 EUR
100+5.95 EUR
260+5.65 EUR
Mindestbestellmenge: 2
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MC34VR500V4ES MC34VR500.pdf
MC34VR500V4ES
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.37 EUR
10+16.82 EUR
25+15.68 EUR
100+14.43 EUR
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MMPF0100F6AZES MMPF0100.pdf
MMPF0100F6AZES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 339 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.88 EUR
10+12.38 EUR
25+11.50 EUR
100+10.54 EUR
260+10.07 EUR
Mindestbestellmenge: 2
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RD-KL25-AGMP01 RD-KL25-AGMP01-UG.pdf
RD-KL25-AGMP01
Hersteller: NXP USA Inc.
Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s), Cable(s)
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+77.25 EUR
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MCIMX6QP6AVT1AA IMX6DQPCEC.pdf
MCIMX6QP6AVT1AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 511 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+206.13 EUR
10+173.96 EUR
60+159.97 EUR
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MCIMX6QP6AVT8AA IMX6SRSFS.pdf
MCIMX6QP6AVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AA IMX6DQPCEC.pdf
MCIMX6QP7CVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+173.84 EUR
10+146.04 EUR
60+133.94 EUR
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MCIMX6QP5EYM1AA IMX6DQPCEC.pdf
MCIMX6QP5EYM1AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+152.61 EUR
10+127.74 EUR
60+116.92 EUR
120+114.00 EUR
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MCIMX6DP6AVT8AA IMX6DQPCEC.pdf
MCIMX6DP6AVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+146.96 EUR
10+122.88 EUR
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MCIMX6DP5EYM1AA IMX6SRSFS.pdf
MCIMX6DP5EYM1AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP-SDB
MCIMX6QP-SDB
Hersteller: NXP USA Inc.
Description: SABRE I.MX 6QUADPLUS EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6QuadPlus
Platform: SABRE
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
AFT05MS004NT1 AFT05MS004N.pdf
AFT05MS004NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 25285 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.87 EUR
10+2.88 EUR
25+2.63 EUR
100+2.36 EUR
250+2.24 EUR
Mindestbestellmenge: 5
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AFT05MS006NT1 AFT05MS006N.pdf
AFT05MS006NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 1142 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.96 EUR
10+6.06 EUR
25+5.58 EUR
100+5.06 EUR
250+4.97 EUR
Mindestbestellmenge: 3
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AFT09MS007NT1 AFT09MS007N.pdf
AFT09MS007NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 3120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.65 EUR
10+5.04 EUR
25+4.64 EUR
100+4.19 EUR
250+4.09 EUR
Mindestbestellmenge: 3
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AFT09MS015NT1 AFT09MS015N.pdf
AFT09MS015NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
auf Bestellung 997 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.26 EUR
10+7.90 EUR
25+7.30 EUR
100+6.65 EUR
250+6.63 EUR
Mindestbestellmenge: 2
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AFT27S006NT1 AFT27S006N.pdf
AFT27S006NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 1035 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.90 EUR
10+14.84 EUR
25+13.83 EUR
100+13.01 EUR
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MRF1535FNT1 MRF1535N.pdf
MRF1535FNT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272BA
Current Rating (Amps): 6A
Mounting Type: Chassis Mount
Frequency: 520MHz
Power - Output: 35W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRFE6VS25LR5
MRFE6VS25LR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+146.77 EUR
10+122.54 EUR
25+116.49 EUR
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TEF6638HW/V106ZK
TEF6638HW/V106ZK
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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NXQ1TXH5DB1401UL NXQ1TXH5.pdf
NXQ1TXH5DB1401UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NXQ1TXH5
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Part Status: Active
Contents: Board(s)
Secondary Attributes: USB Powered
Produkt ist nicht verfügbar
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A2G22S160-01SR3 RF_%20Gde.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.11GHz
Power - Output: 32W
Gain: 19.6dB
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A2I08H040GNR1
A2I08H040GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
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A2I08H040NR1
A2I08H040NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
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A2I20H060GNR1
A2I20H060GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Produkt ist nicht verfügbar
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A2I25D025GNR1 A2I25D025N.pdf
A2I25D025GNR1
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+42.72 EUR
Mindestbestellmenge: 500
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A2I25H060GNR1 A2I25H060N.pdf
A2I25H060GNR1
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A2I25H060NR1
A2I25H060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Produkt ist nicht verfügbar
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