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TEA1993TS/1X TEA1993TS/1X NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Supplier Device Package: SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TFF1025HN/N1X NXP USA Inc. Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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JN5169/001K JN5169/001K NXP USA Inc. JN5169.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+10.96 EUR
10+9.5 EUR
25+8.99 EUR
100+8.29 EUR
250+7.87 EUR
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LPC18S10FET180E LPC18S10FET180E NXP USA Inc. Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
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LPC18S30FBD144E LPC18S30FBD144E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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LPC18S30FET100E LPC18S30FET100E NXP USA Inc. LPC18S50_30_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
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LPC18S37JBD144E LPC18S37JBD144E NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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LPC18S57JBD208E LPC18S57JBD208E NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208LQFP
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LPC43S20FET180E LPC43S20FET180E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FBD144E LPC43S30FBD144E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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LPC43S30FET100E LPC43S30FET100E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC43S37JBD144E LPC43S37JBD144E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
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LPC43S57JBD208E LPC43S57JBD208E NXP USA Inc. LPC43S5X_S3X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC43S70FET100E LPC43S70FET100E NXP USA Inc. LPC43S70.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LPC54114J256BD64QL LPC54114J256BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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160+8.79 EUR
320+8.51 EUR
640+8.29 EUR
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PN5180A0ET/C1QL PN5180A0ET/C1QL NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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PN5180A0HN/C1E PN5180A0HN/C1E NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
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TDA19971AHN/C181E NXP USA Inc. Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Packaging: Tray
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TDF8546AJ/N1ZU TDF8546AJ/N1ZU NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546AJS/N1ZS TDF8546AJS/N1ZS NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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TDF8546ASD/N1ZU NXP USA Inc. TDF854x_BR.pdf Description: IC AMP CLASS AB QUAD 25W 27RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
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TDF8546J/N2ZU TDF8546J/N2ZU NXP USA Inc. TDF8546.pdf Description: IC AMP CLASS AB QUAD 25W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546JS/N2ZS TDF8546JS/N2ZS NXP USA Inc. TDF8546.pdf Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
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TDF8548AJ/N1ZU NXP USA Inc. Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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TDA8037T/C1S TDA8037T/C1S NXP USA Inc. TDA8037.pdf Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
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TDA8579T/N1SU TDA8579T/N1SU NXP USA Inc. TDA8579T.pdf Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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FRDMSTBCDP5004 NXP USA Inc. MP3V5004G.pdf Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
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MPC17529EJ MPC17529EJ NXP USA Inc. Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MCIMX6G2CVK05AA MCIMX6G2CVK05AA NXP USA Inc. MCIMX6GxCzzzzzA.pdf Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MPC5777C-416DS MPC5777C-416DS NXP USA Inc. MPC5777C.pdf Description: MPC5777C EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5777C
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
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MPC574XG-256DS MPC574XG-256DS NXP USA Inc. MPC5748G.pdf Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
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MPC574XG-324DS MPC574XG-324DS NXP USA Inc. MPC5748G.pdf Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
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MPC574XG-MB MPC574XG-MB NXP USA Inc. MPC5748G.pdf Description: MPC574XC/G EVAL BRD
Utilized IC / Part: MPC574xC/G
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
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SPC5748GGK1MMJ6 SPC5748GGK1MMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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SPC5748GK1MKU6 SPC5748GK1MKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
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FRDM-HB2001-EVM FRDM-HB2001-EVM NXP USA Inc. MOTORDRIVERFLYR.pdf Description: HB2001 BOARD WITH FRDM-KL25Z
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: KL1x, KL2x, MC33HB2001, mbed-Enabled Development
Supplied Contents: Board(s)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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74HC4066PWHL 74HC4066PWHL NXP USA Inc. 74HC%28T%294066_Rev_Feb_2017.pdf Description: IC SW SPST-NOX4 95OHM 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 4
Produkt ist nicht verfügbar
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TFF1024HN/N1,135 NXP USA Inc. TFF1024HN.pdf Description: IC CLOCK
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1131HW/5V0,518 UJA1131HW/5V0,518 NXP USA Inc. UJA113x.pdf Description: IC TRANSCEIVER
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UJA1169TK/FZ NXP USA Inc. UJA1169.pdf Description: IC TRANSCEIVER
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UJA1169TK/X/FZ UJA1169TK/X/FZ NXP USA Inc. UJA1169.pdf Description: IC INTFACE SPECIALIZED 20HVSON
Part Status: Obsolete
Supplier Device Package: 20-HVSON (3.5x5.5)
Applications: System Basis Chip
Voltage - Supply: 5V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 20-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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UJA1169TK/XZ NXP USA Inc. UJA1169.pdf Description: IC INTFACE SPECIALIZED 20HVSON
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UJA1169TKZ NXP USA Inc. UJA1169.pdf Description: IC TRANSCEIVER
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FRDM-KEAZ64Q64 FRDM-KEAZ64Q64 NXP USA Inc. FRDMKEADEVPLTFS.pdf Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
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FRDM-KEAZ128Q80 FRDM-KEAZ128Q80 NXP USA Inc. FRDMKEADEVPLTFS.pdf Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
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MCIMX6UL-EVKB MCIMX6UL-EVKB NXP USA Inc. EVKIMX6ULFS.pdf Description: I.MX 6ULTRALITE EVAL BRD
Utilized IC / Part: i.MX 6UltraLite
Core Processor: ARM® Cortex®-A7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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MKV11Z128VLH7 MKV11Z128VLH7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MKV11Z128VLF7 MKV11Z128VLF7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MKV10Z64VLF7 MKV10Z64VLF7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
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MKV46F256VLL16 MKV46F256VLL16 NXP USA Inc. KV4XP100M168.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 74
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 38x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MKV46F256VLH16 MKV46F256VLH16 NXP USA Inc. KV4XP100M168.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MKV31F256VLH12P MKV31F256VLH12P NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MKV31F128VLH10P MKV31F128VLH10P NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 46
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TWR-KV11Z75M TWR-KV11Z75M NXP USA Inc. KV11P64M75.pdf Description: TOWER SYSTEM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Tower System
Produkt ist nicht verfügbar
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AFT05MS003NT1 AFT05MS003NT1 NXP USA Inc. Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 20.8dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Obsolete
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VP61K25NR6 MRFE6VP61K25NR6 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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SPC5777MK0MVU8 SPC5777MK0MVU8 NXP USA Inc. MPC5777M.pdf Description: IC MCU 32BIT 8.64MB FLSH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8.64MB (8M x 8)
RAM Size: 404K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5777MK0MVA8 SPC5777MK0MVA8 NXP USA Inc. MPC5777M.pdf Description: IC MCU 32B 8.64MB FLSH 512TEPBGA
Packaging: Tray
Package / Case: 512-FBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8.64MB (8M x 8)
RAM Size: 404K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 512-FBGA (25x25)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5746RK1MMT5 SPC5746RK1MMT5 NXP USA Inc. MPC5746R.pdf Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tray
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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SPC5743RK1MLU5 SPC5743RK1MLU5 NXP USA Inc. SPC5743RK1MLU5_Summary.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1X TEA1993TS.pdf
TEA1993TS/1X
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
DigiKey Programmable: Not Verified
Current - Supply: 200 µA
Supplier Device Package: SC-74
Applications: Secondary-Side Controller, Synchronous Rectifier
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TFF1025HN/N1X
Hersteller: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 16DHVQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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JN5169/001K JN5169.pdf
JN5169/001K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 14.7mA
Current - Transmitting: 23mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+10.96 EUR
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25+8.99 EUR
100+8.29 EUR
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LPC18S10FET180E
LPC18S10FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC18S30FBD144E LPC18S50_30_10.pdf
LPC18S30FBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
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AnzahlPreis
1+19.27 EUR
10+15.12 EUR
60+13.32 EUR
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LPC18S30FET100E LPC18S50_30_10.pdf
LPC18S30FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC18S37JBD144E
LPC18S37JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC18S57JBD208E
LPC18S57JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Produkt ist nicht verfügbar
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LPC43S20FET180E LPC43S50_30_20.pdf
LPC43S20FET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FBD144E LPC43S50_30_20.pdf
LPC43S30FBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FET100E LPC43S50_30_20.pdf
LPC43S30FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC43S37JBD144E LPC43S5X_S3X.pdf
LPC43S37JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
auf Bestellung 48 Stücke:
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AnzahlPreis
1+18.06 EUR
10+17.49 EUR
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LPC43S57JBD208E LPC43S5X_S3X.pdf
LPC43S57JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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LPC43S70FET100E LPC43S70.pdf
LPC43S70FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
auf Bestellung 72 Stücke:
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AnzahlPreis
1+18.15 EUR
10+14.16 EUR
25+12.3 EUR
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LPC54114J256BD64QL LPC5410X.pdf
LPC54114J256BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 2655 Stücke:
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AnzahlPreis
2+13.66 EUR
10+10.61 EUR
25+9.84 EUR
160+8.79 EUR
320+8.51 EUR
640+8.29 EUR
1120+8.14 EUR
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PN5180A0ET/C1QL PN5180A0XX-C1-C2.pdf
PN5180A0ET/C1QL
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Produkt ist nicht verfügbar
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PN5180A0HN/C1E PN5180A0XX-C1-C2.pdf
PN5180A0HN/C1E
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.59 EUR
10+12.16 EUR
25+11.31 EUR
100+10.36 EUR
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TDA19971AHN/C181E
Hersteller: NXP USA Inc.
Description: IC VIDEO RECEIVER 72HVQFN
Control Interface: I²C
Part Status: Active
Standards: HDMI 1.4a, IEC 60958, IEC 61937, ITU-R BT.656
Applications: Consumer Video
Voltage - Supply: 1.71V ~ 1.89V, 3.13V ~ 3.47V
Function: Receiver
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
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TDF8546AJ/N1ZU TDF854x_BR.pdf
TDF8546AJ/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Packaging: Tray
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546AJS/N1ZS TDF854x_BR.pdf
TDF8546AJS/N1ZS
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Packaging: Tube
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Produkt ist nicht verfügbar
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TDF8546ASD/N1ZU TDF854x_BR.pdf
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 27RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
Produkt ist nicht verfügbar
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TDF8546J/N2ZU TDF8546.pdf
TDF8546J/N2ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF8546JS/N2ZS TDF8546.pdf
TDF8546JS/N2ZS
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB QUAD 25W 27DBSMSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-PowerSMD Module
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-DBSMSP
Part Status: Active
Produkt ist nicht verfügbar
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TDF8548AJ/N1ZU
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8037T/C1S TDA8037.pdf
TDA8037T/C1S
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 28-SO
Produkt ist nicht verfügbar
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TDA8579T/N1SU TDA8579T.pdf
TDA8579T/N1SU
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 0/2 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 0/2
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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FRDMSTBCDP5004 MP3V5004G.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL PRESSURE SENS BOARD
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Produkt ist nicht verfügbar
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MPC17529EJ
MPC17529EJ
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.6V 20SSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.6V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 20-TSSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MCIMX6G2CVK05AA MCIMX6GxCzzzzzA.pdf
MCIMX6G2CVK05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MPC5777C-416DS MPC5777C.pdf
MPC5777C-416DS
Hersteller: NXP USA Inc.
Description: MPC5777C EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5777C
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC574XG-256DS MPC5748G.pdf
MPC574XG-256DS
Hersteller: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
auf Bestellung 4 Stücke:
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AnzahlPreis
1+817.03 EUR
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MPC574XG-324DS MPC5748G.pdf
MPC574XG-324DS
Hersteller: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC574xC/G
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG-MB MPC5748G.pdf
MPC574XG-MB
Hersteller: NXP USA Inc.
Description: MPC574XC/G EVAL BRD
Utilized IC / Part: MPC574xC/G
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Socket
Packaging: Bulk
auf Bestellung 5 Stücke:
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AnzahlPreis
1+1049.58 EUR
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SPC5748GGK1MMJ6 MPC5748G.pdf
SPC5748GGK1MMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 419 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+66.9 EUR
10+54.98 EUR
25+52.01 EUR
100+50.47 EUR
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SPC5748GK1MKU6 MPC5748G.pdf
SPC5748GK1MKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+69.64 EUR
10+57.02 EUR
25+53.86 EUR
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FRDM-HB2001-EVM MOTORDRIVERFLYR.pdf
FRDM-HB2001-EVM
Hersteller: NXP USA Inc.
Description: HB2001 BOARD WITH FRDM-KL25Z
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: KL1x, KL2x, MC33HB2001, mbed-Enabled Development
Supplied Contents: Board(s)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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74HC4066PWHL 74HC%28T%294066_Rev_Feb_2017.pdf
74HC4066PWHL
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX4 95OHM 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 4
Produkt ist nicht verfügbar
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TFF1024HN/N1,135 TFF1024HN.pdf
Hersteller: NXP USA Inc.
Description: IC CLOCK
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 2.15MHz
Input: Clock, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1131HW/5V0,518 UJA113x.pdf
UJA1131HW/5V0,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Produkt ist nicht verfügbar
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UJA1169TK/FZ UJA1169.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Produkt ist nicht verfügbar
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UJA1169TK/X/FZ UJA1169.pdf
UJA1169TK/X/FZ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Part Status: Obsolete
Supplier Device Package: 20-HVSON (3.5x5.5)
Applications: System Basis Chip
Voltage - Supply: 5V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 20-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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UJA1169TK/XZ UJA1169.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 20HVSON
Produkt ist nicht verfügbar
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UJA1169TKZ UJA1169.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Produkt ist nicht verfügbar
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FRDM-KEAZ64Q64 FRDMKEADEVPLTFS.pdf
FRDM-KEAZ64Q64
Hersteller: NXP USA Inc.
Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
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AnzahlPreis
1+108.93 EUR
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FRDM-KEAZ128Q80 FRDMKEADEVPLTFS.pdf
FRDM-KEAZ128Q80
Hersteller: NXP USA Inc.
Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
auf Bestellung 9 Stücke:
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AnzahlPreis
1+173.41 EUR
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MCIMX6UL-EVKB EVKIMX6ULFS.pdf
MCIMX6UL-EVKB
Hersteller: NXP USA Inc.
Description: I.MX 6ULTRALITE EVAL BRD
Utilized IC / Part: i.MX 6UltraLite
Core Processor: ARM® Cortex®-A7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 16 Stücke:
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AnzahlPreis
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MKV11Z128VLH7 KV11P64M75.pdf
MKV11Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MKV11Z128VLF7 KV11P64M75.pdf
MKV11Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 7 Stücke:
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AnzahlPreis
3+8.66 EUR
Mindestbestellmenge: 3 Stücke
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MKV10Z64VLF7 KV11P64M75.pdf
MKV10Z64VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 75MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKV46F256VLL16 KV4XP100M168.pdf
MKV46F256VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 74
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 38x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.42 EUR
10+8.78 EUR
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MKV46F256VLH16 KV4XP100M168.pdf
MKV46F256VLH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18 EUR
10+14.09 EUR
25+13.11 EUR
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MKV31F256VLH12P KV30P64M100SFA.pdf
MKV31F256VLH12P
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MKV31F128VLH10P KV30P64M100SFA.pdf
MKV31F128VLH10P
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 46
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TWR-KV11Z75M KV11P64M75.pdf
TWR-KV11Z75M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Tower System
Produkt ist nicht verfügbar
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AFT05MS003NT1
AFT05MS003NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 20.8dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Obsolete
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VP61K25NR6 RF_%20Gde.pdf
MRFE6VP61K25NR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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AnzahlPreis
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SPC5777MK0MVU8 MPC5777M.pdf
SPC5777MK0MVU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8.64MB FLSH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8.64MB (8M x 8)
RAM Size: 404K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
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AnzahlPreis
1+103.8 EUR
10+86 EUR
25+81.55 EUR
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SPC5777MK0MVA8 MPC5777M.pdf
SPC5777MK0MVA8
Hersteller: NXP USA Inc.
Description: IC MCU 32B 8.64MB FLSH 512TEPBGA
Packaging: Tray
Package / Case: 512-FBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8.64MB (8M x 8)
RAM Size: 404K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 512-FBGA (25x25)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 196 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+90.64 EUR
10+75.17 EUR
25+71.31 EUR
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SPC5746RK1MMT5 MPC5746R.pdf
SPC5746RK1MMT5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tray
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5743RK1MLU5 SPC5743RK1MLU5_Summary.pdf
SPC5743RK1MLU5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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