Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 268 nach 572
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MC33SB0400ES | NXP USA Inc. |
 Description: LOW SIDE DRIVER X4, WHEEL SPEED |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC33SB0401ES | NXP USA Inc. |
Description: LOW SIDE DRIVER X2, WHEEL SPEED Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6V ~ 20V Applications: Motorcycle Braking Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
auf Bestellung 462 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MC34FS6407NAE | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 48LQFP |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34FS6408NAE | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 36V Applications: System Basis Chip Current - Supply: 13mA Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
MC34PF3000A4EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34PF3000A7EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34PF3001A1EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 260 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MC34PF3001A3EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34PF3001A5EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34PF3001A6EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MC34PF3001A7EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 1935 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MC34VR500V4ES | NXP USA Inc. |
Description: IC REG 9OUT BUCK/LDO 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 250µA Supplier Device Package: 56-QFN-EP (8x8) |
auf Bestellung 260 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
MMPF0100F6AZES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
RD-KL25-AGMP01 | NXP USA Inc. |
Description: DATA COLLECTION REFERENCE DESIGN Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2 Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 17 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MCIMX6QP6AVT1AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 590 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MCIMX6QP6AVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MCIMX6QP7CVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 800MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MCIMX6QP5EYM1AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 80 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
MCIMX6DP6AVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 25 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
MCIMX6DP5EYM1AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
MCIMX6QP-SDB | NXP USA Inc. |
Description: SABRE I.MX 6QUADPLUS EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A9 Board Type: Evaluation Platform Utilized IC / Part: i.MX 6QuadPlus Platform: SABRE Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFT05MS004NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V SOT89A Packaging: Cut Tape (CT) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 4.9W Gain: 20.9dB Technology: LDMOS Supplier Device Package: SOT-89A Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 30418 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
AFT05MS006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5W Packaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 6W Gain: 18.3dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Not For New Designs Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 889 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
AFT09MS007NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5W Packaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 7.3W Gain: 15.2dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
auf Bestellung 4876 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
AFT09MS015NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V PLD-1.5W Packaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 16W Gain: 17.2dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 100 mA |
auf Bestellung 2724 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
AFT27S006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5W Packaging: Cut Tape (CT) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 28.8dBm Gain: 22dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 70 mA |
auf Bestellung 1634 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MRF1535FNT1 | NXP USA Inc. |
Description: IC MOSFET RF N-CHAN TO272-6 |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
MRFE6VS25GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-2 GULL Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 512MHz Power - Output: 25W Gain: 25.4dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
auf Bestellung 107 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
MRFE6VS25LR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI360 Packaging: Cut Tape (CT) Package / Case: NI-360 Mounting Type: Chassis Mount Frequency: 512MHz Power - Output: 25W Gain: 25.9dB Technology: LDMOS Supplier Device Package: NI-360 Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
auf Bestellung 474 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
 |
TEF6638HW/V106ZK | NXP USA Inc. |
Description: IC DGTL CHIP AUTO RADIO 100HTQFP Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 100-HTQFP (14x14) Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
NXQ1TXH5DB1401UL | NXP USA Inc. |
Description: DEMO BOARD NXQ1TXH5 CHARGER Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: NXQ1TXH5 Supplied Contents: Board(s) Primary Attributes: Transmitter Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
| A2G22S160-01SR3 | NXP USA Inc. |
Description: RF MOSFET 48V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 2.11GHz Power - Output: 32W Gain: 19.6dB Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
A2I08H040GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-15 Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 9W Gain: 30.7dB Technology: LDMOS Supplier Device Package: TO-270WBG-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 25 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
A2I08H040NR1 | NXP USA Inc. |
Description: IC RF LDMOS AMP Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 9W Gain: 30.7dB Technology: LDMOS Supplier Device Package: TO-270WB-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 25 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
A2I20H060GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-15 Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 1.84GHz Configuration: Dual Power - Output: 12W Gain: 28.9dB Technology: LDMOS Supplier Device Package: TO-270WBG-15 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 24 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
A2I25D025GNR1 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
auf Bestellung 500 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
A2I25H060GNR1 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
A2I25H060NR1 | NXP USA Inc. |
Description: IC RF LDMOS AMP Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 2.59GHz Configuration: Dual Power - Output: 10.5W Gain: 26.1dB Technology: LDMOS Supplier Device Package: TO-270WB-17 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 26 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
| A2T09VD250NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V TO270-6 Packaging: Tape & Reel (TR) Package / Case: TO-270-6 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 65W Gain: 22.5dB Technology: LDMOS Supplier Device Package: TO-270WB-6A Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
||||||||||||||||
| A2T09VD300NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V TO270-6 Packaging: Tape & Reel (TR) Package / Case: TO-270-6 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 920MHz Configuration: Dual Power - Output: 79W Gain: 21.5dB Technology: LDMOS Supplier Device Package: TO-270WB-6A Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
A2T18H410-24SR6 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
| A2T18S160W31GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L2LA Mounting Type: Chassis Mount Frequency: 1.88GHz Power - Output: 32W Gain: 19.9dB Technology: LDMOS Supplier Device Package: NI-780GS-2L2LA Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
||||||||||||||||
| A2T18S162W31GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L2LA Mounting Type: Chassis Mount Frequency: 1.84GHz Power - Output: 32W Gain: 20.1dB Technology: LDMOS Supplier Device Package: NI-780GS-2L2LA Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
||||||||||||||||
|
|
A2T20H330W24SR6 | NXP USA Inc. |
Description: IC TRANS RF LDMOS Packaging: Tape & Reel (TR) Package / Case: NI-1230-4LS2L Mounting Type: Chassis Mount Frequency: 1.88GHz Configuration: Dual Power - Output: 58W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-1230-4LS2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 700 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
| A2T26H165-24SR3 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
A2T26H300-24SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4LS2L Mounting Type: Chassis Mount Frequency: 2.5GHz Configuration: Dual Power - Output: 60W Gain: 14.5dB Technology: LDMOS Supplier Device Package: NI-1230-4LS2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFIC10275GNR1 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 978MHz ~ 1.09GHz Voltage - Supply: 50V Gain: 32.6dB Supplier Device Package: TO-270 WB-14 GULL |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFIC10275NR1 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 978MHz ~ 1.09GHz Voltage - Supply: 50V Gain: 32.6dB Supplier Device Package: TO-270 WB-14 Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFIC901NT1 | NXP USA Inc. |
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.8MHz ~ 1GHz Voltage - Supply: 7.5V Gain: 30dB Supplier Device Package: 24-QFN (4x4) |
auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
|
||||||||||||||
|
|
AFT05MS003NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V SOT89A Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 3W Gain: 20.8dB Technology: LDMOS Supplier Device Package: SOT-89A Part Status: Obsolete Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFT09S220-02NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 920MHz Power - Output: 54W Gain: 19.5dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFV121KGSR5 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFV121KHR5 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
AFV121KHSR5 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
AFV141KGSR5 | NXP USA Inc. |
Description: IC TRANS RF LDMOS |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MD7IC1812GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.17GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 31.5dB P1dB: 12dBm Test Frequency: 1.8GHz ~ 2.17GHz Supplier Device Package: TO-270 WB-14 GULL |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MD7IC1812NR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270 |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MHT1003NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 250W Gain: 15.9dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 32 V |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
MMDS09254HT1 | NXP USA Inc. |
Description: ADVANCED DOHERTY ALIGNMENT MODUL Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Advanced Doherty Alignment Module Frequency: 700MHz ~ 1GHz Supplier Device Package: 32-QFN (6x6) Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MMG30271BT1 | NXP USA Inc. |
Description: IC AMP 900MHZ-4.3GHZ SOT89-3 Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 900MHz ~ 4.3GHz Voltage - Supply: 5V Gain: 25dB Current - Supply: 240mA P1dB: 27dBm Test Frequency: 2.14GHz Supplier Device Package: SOT-89-3 Part Status: Active |
Produkt ist nicht verfügbar |
| MC33SB0400ES |
|
Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X4, WHEEL SPEED
Description: LOW SIDE DRIVER X4, WHEEL SPEED
Produkt ist nicht verfügbar
| MC33SB0401ES |
|
Hersteller: NXP USA Inc.
Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: LOW SIDE DRIVER X2, WHEEL SPEED
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 20V
Applications: Motorcycle Braking
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 462 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 28.73 EUR |
| 10+ | 25.94 EUR |
| 25+ | 24.74 EUR |
| 80+ | 21.48 EUR |
| 260+ | 20.51 EUR |
| MC34FS6407NAE |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Produkt ist nicht verfügbar
| MC34FS6408NAE |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: IC SYSTEM BASIS CHIP CAN 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
| MC34PF3000A4EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
| MC34PF3000A7EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Description: IC POWER MANAGEMENT 48QFN
Produkt ist nicht verfügbar
| MC34PF3001A1EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 260 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 18.02 EUR |
| 10+ | 16.27 EUR |
| 25+ | 15.52 EUR |
| 80+ | 13.47 EUR |
| 260+ | 12.87 EUR |
| MC34PF3001A3EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
| MC34PF3001A5EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Description: IC POWER MANAGEMENT 48QFN
Produkt ist nicht verfügbar
| MC34PF3001A6EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
| MC34PF3001A7EP |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: IC POWER MANAGEMENT 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 1935 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.63 EUR |
| 10+ | 14.05 EUR |
| 25+ | 13.28 EUR |
| 80+ | 11.51 EUR |
| 260+ | 10.92 EUR |
| 520+ | 9.8 EUR |
| 1040+ | 8.26 EUR |
| MC34VR500V4ES |
|
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG 9OUT BUCK/LDO 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 250µA
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 260 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 29.98 EUR |
| 10+ | 27.57 EUR |
| 25+ | 26.42 EUR |
| 80+ | 23.28 EUR |
| 260+ | 22.14 EUR |
| MMPF0100F6AZES |
|
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| RD-KL25-AGMP01 |
|
Hersteller: NXP USA Inc.
Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DATA COLLECTION REFERENCE DESIGN
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature
Utilized IC / Part: BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 152.72 EUR |
| MCIMX6QP6AVT1AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 590 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 317.36 EUR |
| 10+ | 261.71 EUR |
| MCIMX6QP6AVT8AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
| MCIMX6QP7CVT8AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
| MCIMX6QP5EYM1AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 80 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 229.89 EUR |
| 10+ | 189.58 EUR |
| MCIMX6DP6AVT8AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 25 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 220.74 EUR |
| 10+ | 182.04 EUR |
| MCIMX6DP5EYM1AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
| MCIMX6QP-SDB |
|
Hersteller: NXP USA Inc.
Description: SABRE I.MX 6QUADPLUS EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6QuadPlus
Platform: SABRE
Part Status: Active
Description: SABRE I.MX 6QUADPLUS EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6QuadPlus
Platform: SABRE
Part Status: Active
Produkt ist nicht verfügbar
| AFT05MS004NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 30418 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 6.76 EUR |
| 10+ | 6.08 EUR |
| 25+ | 5.73 EUR |
| 100+ | 4.88 EUR |
| 250+ | 4.59 EUR |
| 500+ | 4.01 EUR |
| AFT05MS006NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 6W
Gain: 18.3dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Not For New Designs
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 889 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 11.91 EUR |
| 10+ | 10.7 EUR |
| 25+ | 10.11 EUR |
| 100+ | 8.77 EUR |
| 250+ | 8.32 EUR |
| 500+ | 7.46 EUR |
| AFT09MS007NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 4876 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 11.13 EUR |
| 10+ | 9.98 EUR |
| 25+ | 9.43 EUR |
| 100+ | 8.18 EUR |
| 250+ | 7.76 EUR |
| 500+ | 6.96 EUR |
| AFT09MS015NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 12.5V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 16W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 100 mA
auf Bestellung 2724 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.95 EUR |
| 10+ | 13.52 EUR |
| 25+ | 12.89 EUR |
| 100+ | 11.19 EUR |
| 250+ | 10.69 EUR |
| 500+ | 9.75 EUR |
| AFT27S006NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 1634 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 28 EUR |
| 10+ | 25.72 EUR |
| 25+ | 24.66 EUR |
| 100+ | 21.73 EUR |
| 250+ | 20.66 EUR |
| 500+ | 19.33 EUR |
| MRF1535FNT1 |
|
Hersteller: NXP USA Inc.
Description: IC MOSFET RF N-CHAN TO272-6
Description: IC MOSFET RF N-CHAN TO272-6
Produkt ist nicht verfügbar
| MRFE6VS25GNR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2 GULL
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V TO270-2 GULL
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 107 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 96.69 EUR |
| 10+ | 89.18 EUR |
| 25+ | 85.17 EUR |
| 100+ | 76.15 EUR |
| MRFE6VS25LR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V NI360
Packaging: Cut Tape (CT)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 474 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 186.39 EUR |
| 10+ | 177.08 EUR |
| 25+ | 172.42 EUR |
| TEF6638HW/V106ZK |
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 100-HTQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
| NXQ1TXH5DB1401UL |
|
Hersteller: NXP USA Inc.
Description: DEMO BOARD NXQ1TXH5 CHARGER
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Part Status: Active
Description: DEMO BOARD NXQ1TXH5 CHARGER
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Part Status: Active
Produkt ist nicht verfügbar
| A2G22S160-01SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.11GHz
Power - Output: 32W
Gain: 19.6dB
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Description: RF MOSFET 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 2.11GHz
Power - Output: 32W
Gain: 19.6dB
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
| A2I08H040GNR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
| A2I08H040NR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF LDMOS AMP
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Description: IC RF LDMOS AMP
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 9W
Gain: 30.7dB
Technology: LDMOS
Supplier Device Package: TO-270WB-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 25 mA
Produkt ist nicht verfügbar
| A2I20H060GNR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Description: RF MOSFET LDMOS 28V TO270-15
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.84GHz
Configuration: Dual
Power - Output: 12W
Gain: 28.9dB
Technology: LDMOS
Supplier Device Package: TO-270WBG-15
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 24 mA
Produkt ist nicht verfügbar
| A2I25D025GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
Description: IC TRANS RF LDMOS
auf Bestellung 500 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 500+ | 63.11 EUR |
| A2I25H060NR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF LDMOS AMP
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Description: IC RF LDMOS AMP
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.59GHz
Configuration: Dual
Power - Output: 10.5W
Gain: 26.1dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 26 mA
Produkt ist nicht verfügbar
| A2T09VD250NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 65W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 65W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1 A
Produkt ist nicht verfügbar
| A2T09VD300NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 79W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 48V TO270-6
Packaging: Tape & Reel (TR)
Package / Case: TO-270-6 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz
Configuration: Dual
Power - Output: 79W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: TO-270WB-6A
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| A2T18S160W31GSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L2LA
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 32W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L2LA
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L2LA
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 32W
Gain: 19.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L2LA
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
| A2T18S162W31GSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L2LA
Mounting Type: Chassis Mount
Frequency: 1.84GHz
Power - Output: 32W
Gain: 20.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L2LA
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L2LA
Mounting Type: Chassis Mount
Frequency: 1.84GHz
Power - Output: 32W
Gain: 20.1dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L2LA
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
| A2T20H330W24SR6 |
|
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 58W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Description: IC TRANS RF LDMOS
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 58W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
| A2T26H300-24SR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
| AFIC10275GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14 GULL
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14 GULL
Produkt ist nicht verfügbar
| AFIC10275NR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14
Part Status: Active
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14
Part Status: Active
Produkt ist nicht verfügbar
| AFIC901NT1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
Description: IC RF AMP 1.8MHZ-1GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 1GHz
Voltage - Supply: 7.5V
Gain: 30dB
Supplier Device Package: 24-QFN (4x4)
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 4.44 EUR |
| 2000+ | 4.22 EUR |
| AFT05MS003NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 20.8dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Obsolete
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 20.8dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Obsolete
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| AFT09S220-02NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 54W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 54W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
| MD7IC1812GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31.5dB
P1dB: 12dBm
Test Frequency: 1.8GHz ~ 2.17GHz
Supplier Device Package: TO-270 WB-14 GULL
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31.5dB
P1dB: 12dBm
Test Frequency: 1.8GHz ~ 2.17GHz
Supplier Device Package: TO-270 WB-14 GULL
Produkt ist nicht verfügbar
| MD7IC1812NR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270
Description: IC AMP W-CDMA 1.8-2.17GHZ TO270
Produkt ist nicht verfügbar
| MHT1003NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 250W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 32 V
Description: RF MOSFET LDMOS OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 250W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 32 V
Produkt ist nicht verfügbar
| MMDS09254HT1 |
|
Hersteller: NXP USA Inc.
Description: ADVANCED DOHERTY ALIGNMENT MODUL
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 700MHz ~ 1GHz
Supplier Device Package: 32-QFN (6x6)
Part Status: Active
Description: ADVANCED DOHERTY ALIGNMENT MODUL
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 700MHz ~ 1GHz
Supplier Device Package: 32-QFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
| MMG30271BT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP 900MHZ-4.3GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
Voltage - Supply: 5V
Gain: 25dB
Current - Supply: 240mA
P1dB: 27dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
Description: IC AMP 900MHZ-4.3GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 900MHz ~ 4.3GHz
Voltage - Supply: 5V
Gain: 25dB
Current - Supply: 240mA
P1dB: 27dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
Produkt ist nicht verfügbar