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MMA5224NPIKWR2 NXP USA Inc. Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
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MMA5224NPKGWR2 NXP USA Inc. Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
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MMA5224NPKWR2 NXP USA Inc. Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
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MMA6805AKGWR2 NXP USA Inc. Description: ACCELEROMETER 10BIT SPI 16QFN
Produkt ist nicht verfügbar
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SX5101P5T1 NXP USA Inc. Description: ACCELEROMETER
Produkt ist nicht verfügbar
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SX5212P1KWT1 NXP USA Inc. Description: ACCELEROMETER
Produkt ist nicht verfügbar
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SPC5777CK3MME3 SPC5777CK3MME3 NXP USA Inc. MPC5777C.pdf Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5777CK3MMO3 SPC5777CK3MMO3 NXP USA Inc. MPC5777C.pdf Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
1+114.54 EUR
10+95.05 EUR
25+90.18 EUR
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S912ZVML31F1WKH S912ZVML31F1WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML31F1WKF S912ZVML31F1WKF NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.82 EUR
10+11.52 EUR
25+10.69 EUR
80+9.9 EUR
230+9.38 EUR
440+9.13 EUR
1250+8.81 EUR
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S9S12VR32F0VLC S9S12VR32F0VLC NXP USA Inc. S12VRFS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
auf Bestellung 99 Stücke:
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S12VR32EVB S12VR32EVB NXP USA Inc. S12VR32EVB-QSG.pdf Description: S12VR32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR32
auf Bestellung 13 Stücke:
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1+223.45 EUR
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S12ZVM32EVB S12ZVM32EVB NXP USA Inc. S12ZVMFS.pdf Description: EVAL BOARD FOR S12ZVM
auf Bestellung 1 Stücke:
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1+565.19 EUR
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MKE15Z256VLH7 MKE15Z256VLH7 NXP USA Inc. KE1XZ256PB.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 727 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.42 EUR
10+6.33 EUR
25+6.02 EUR
160+5.21 EUR
Mindestbestellmenge: 2 Stücke
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MKE15Z256VLL7 MKE15Z256VLL7 NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 319 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.45 EUR
10+6.59 EUR
24+6.54 EUR
90+6.44 EUR
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MKE18F512VLH16 MKE18F512VLH16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1702 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.09 EUR
10+12.55 EUR
25+11.67 EUR
160+10.45 EUR
320+10.13 EUR
640+9.87 EUR
1120+9.7 EUR
Mindestbestellmenge: 2 Stücke
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MKE18F512VLL16 MKE18F512VLL16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 181 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.76 EUR
10+13.09 EUR
24+12.21 EUR
90+11.23 EUR
Mindestbestellmenge: 2 Stücke
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FRDM-KE15Z FRDM-KE15Z NXP USA Inc. KE1xZP100M72SF0.pdf Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+96.57 EUR
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FRDM-TOUCH FRDM-TOUCH NXP USA Inc. Description: TOUCH BOARD FOR KE1XZ
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+52.78 EUR
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TWR-KE18F TWR-KE18F NXP USA Inc. Description: TOWER SYSTEM KE1XF EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: KE1xF
Platform: Tower System
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
1+276.69 EUR
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U-CYCLONE-FX U-CYCLONE-FX NXP USA Inc. U-Cyclone-FX_Web.pdf Description: CYCLONE UNIVERSAL FX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
1+2579.21 EUR
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DEVKIT-S12ZVL DEVKIT-S12ZVL NXP USA Inc. DEVKIT-S12ZVL-QSG.pdf Description: S12ZVL EVAL BRD
Part Status: Active
Utilized IC / Part: S12ZVL
Core Processor: HCS12Z
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+119.13 EUR
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DEVKIT-S12XE DEVKIT-S12XE NXP USA Inc. DEVKIT-S12XE-QSG.pdf Description: MC9S12XE EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XE
Part Status: Active
Produkt ist nicht verfügbar
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DEVKIT-ZVL128 DEVKIT-ZVL128 NXP USA Inc. DVKITZVL128QSG.pdf Description: S12ZVLA128 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVLA128
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+256.84 EUR
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DEVKIT-S12VR64 DEVKIT-S12VR64 NXP USA Inc. DVKITZVL128QSG.pdf Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VR64
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.61 EUR
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DEVKIT-S12ZVC DEVKIT-S12ZVC NXP USA Inc. MC9S12ZVMRM.pdf Description: S12ZVC EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+208 EUR
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DEVKIT-S12G128 DEVKIT-S12G128 NXP USA Inc. DVKITZVL128QSG.pdf Description: MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+121.99 EUR
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DEVKIT-COMM DEVKIT-COMM NXP USA Inc. MC9S12ZVMRM.pdf Description: EVAL BOARD FOR TJA1022 TJA1048
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1022, TJA1048
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+113.13 EUR
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MC33978AESR2 MC33978AESR2 NXP USA Inc. MC33978.pdf Description: IC INTERFACE SPECIALIZED 32QFN
Supplier Device Package: 32-QFN-EP (5x5)
Applications: Multiple Switch Detection
Voltage - Supply: 3V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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S912ZVMC25F1WKK S912ZVMC25F1WKK NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 80-TQFP-EP (12x12)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Produkt ist nicht verfügbar
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S12ZVMC256EVB S12ZVMC256EVB NXP USA Inc. S12ZVMFS.pdf Description: S12ZVMC256 EVALUATION BOARD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+1003.52 EUR
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MCIMX6Y0CVM05AA MCIMX6Y0CVM05AA NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Additional Interfaces: I2C, SPI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers: Electrophoretic, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6ULL-EVK MCIMX6ULL-EVK NXP USA Inc. IMX6ULLQSG.pdf Description: I.MX 6ULL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6ULL
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+303.93 EUR
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PC34VR5100A1EP NXP USA Inc. VR5100.pdf Description: IC REG 9OUT BUCK/LDO 48QFN
Produkt ist nicht verfügbar
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LS1088A-RDB LS1088A-RDB NXP USA Inc. LS1088AFS.pdf Description: LS1088A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: LS1088A
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF1K50NR5 MRF1K50NR5 NXP USA Inc. MRF1K50N.pdf Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
50+292.95 EUR
Mindestbestellmenge: 50 Stücke
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MRF1K50GNR5 MRF1K50GNR5 NXP USA Inc. MRF1K50N.pdf Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
 Mindestbestellmenge: 50 Stücke
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MRF1K50NR5 MRF1K50NR5 NXP USA Inc. MRF1K50N.pdf Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
1+367.15 EUR
10+320.92 EUR
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MRF1K50GNR5 MRF1K50GNR5 NXP USA Inc. MRF1K50N.pdf Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
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PTN5150AHXMP PTN5150AHXMP NXP USA Inc. PTN5150A.pdf Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 39237 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.87 EUR
14+1.35 EUR
25+1.22 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
1000+0.95 EUR
Mindestbestellmenge: 10 Stücke
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PTN5100DBSMP PTN5100DBSMP NXP USA Inc. PTN5100D.pdf Description: IC USB PD PHY TYPE C 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 85°C
Protocol: USB
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 9114 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.15 EUR
10+3.1 EUR
25+2.83 EUR
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BB170X BB170X NXP USA Inc. BB170.pdf Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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BFU730LXZ BFU730LXZ NXP USA Inc. BFU730LX.pdf Description: RF TRANS NPN 3V 53GHZ DFN1006C-3
Supplier Device Package: DFN1006C-3
Noise Figure (dB Typ @ f): 0.75dB @ 6GHz
Frequency - Transition: 53GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 3V
Voltage - Collector Emitter Breakdown (Max): 3V
Current - Collector (Ic) (Max): 30mA
Power - Max: 160mW
Gain: 15.8dB
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XFDFN
Packaging: Cut Tape (CT)
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BFU910FX BFU910FX NXP USA Inc. BFU910F.pdf Description: RF TRANS NPN 9.5V SOT343F
Supplier Device Package: 4-DFP
Voltage - Collector Emitter Breakdown (Max): 9.5V
Current - Collector (Ic) (Max): 15mA
Power - Max: 300mW
Gain: 13.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
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BGA2867,115 BGA2867,115 NXP USA Inc. BGA2867.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: 5dBm
Noise Figure: 3.8dB
Current - Supply: 20.1mA
Gain: 27.2dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
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BGU8052X BGU8052X NXP USA Inc. BGU8052.pdf Description: IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 1.9GHz
P1dB: 18dBm
Noise Figure: 0.5dB
Current - Supply: 48mA
Gain: 18.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 1.5GHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
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LPC2138FBD64/01,11 LPC2138FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
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LPC811M001JDH16J LPC811M001JDH16J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
DigiKey Programmable: Not Verified
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PCA9512AD,118 PCA9512AD,118 NXP USA Inc. PCA9512A.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 10 pF
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PCA9539BS,115 PCA9539BS,115 NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9541APW/03,118 PCA9541APW/03,118 NXP USA Inc. PCA9541A.pdf Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 16-TSSOP
Part Status: Active
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PCF2123BS/1,518 PCF2123BS/1,518 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
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PCF8551ATT/AJ PCF8551ATT/AJ NXP USA Inc. PCF8551.pdf Description: IC DRVR 7 SEGMENT 48TSSOP
Current - Supply: 1.2 µA
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PN5120A0HN1/C2,118 PN5120A0HN1/C2,118 NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 11736 Stücke:
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SA630D/01,118 SA630D/01,118 NXP USA Inc. SA630.pdf Description: IC RF SWITCH SPDT 1GHZ 8SO
Packaging: Cut Tape (CT)
Features: Single Line Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
RF Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Insertion Loss: 2dB
Frequency Range: 0Hz ~ 1GHz
Topology: Absorptive
P1dB: 18dBm
Test Frequency: 900MHz
Isolation: 30dB
Supplier Device Package: 8-SO
IIP3: 33dBm
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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SC16IS750IBS,128 SC16IS750IBS,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SGTL5000XNLA3R2 SGTL5000XNLA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 9480 Stücke:
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SL3S1013FTB0,115 SL3S1013FTB0,115 NXP USA Inc. SL3S1003_1013.pdf Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Cut Tape (CT)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
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TDA8922CTH/N1,118 TDA8922CTH/N1,118 NXP USA Inc. TDA8922C.pdf Description: IC AMP D MONO/STEREO 155W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 155W x 1 @ 8Ohm; 75W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8953TH/N1,118 TDA8953TH/N1,118 NXP USA Inc. TDA8953.pdf Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm, 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA5224NPIKWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
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MMA5224NPKGWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
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MMA5224NPKWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
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MMA6805AKGWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 10BIT SPI 16QFN
Produkt ist nicht verfügbar
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SX5101P5T1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER
Produkt ist nicht verfügbar
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SX5212P1KWT1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER
Produkt ist nicht verfügbar
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SPC5777CK3MME3 MPC5777C.pdf
SPC5777CK3MME3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
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SPC5777CK3MMO3 MPC5777C.pdf
SPC5777CK3MMO3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
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1+114.54 EUR
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25+90.18 EUR
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S912ZVML31F1WKH S12ZVMFS.pdf
S912ZVML31F1WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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S912ZVML31F1WKF S12ZVMFS.pdf
S912ZVML31F1WKF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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2+14.82 EUR
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25+10.69 EUR
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S9S12VR32F0VLC S12VRFS.pdf
S9S12VR32F0VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
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S12VR32EVB S12VR32EVB-QSG.pdf
S12VR32EVB
Hersteller: NXP USA Inc.
Description: S12VR32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR32
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S12ZVM32EVB S12ZVMFS.pdf
S12ZVM32EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S12ZVM
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MKE15Z256VLH7 KE1XZ256PB.pdf
MKE15Z256VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 727 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.42 EUR
10+6.33 EUR
25+6.02 EUR
160+5.21 EUR
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MKE15Z256VLL7 KE1xZP100M72SF0.pdf
MKE15Z256VLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 319 Stücke:
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AnzahlPreis
3+8.45 EUR
10+6.59 EUR
24+6.54 EUR
90+6.44 EUR
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MKE18F512VLH16 KE1xFP100M168SF0.pdf
MKE18F512VLH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1702 Stücke:
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2+16.09 EUR
10+12.55 EUR
25+11.67 EUR
160+10.45 EUR
320+10.13 EUR
640+9.87 EUR
1120+9.7 EUR
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MKE18F512VLL16 KE1xFP100M168SF0.pdf
MKE18F512VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 181 Stücke:
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AnzahlPreis
2+16.76 EUR
10+13.09 EUR
24+12.21 EUR
90+11.23 EUR
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FRDM-KE15Z KE1xZP100M72SF0.pdf
FRDM-KE15Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
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AnzahlPreis
1+96.57 EUR
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FRDM-TOUCH
FRDM-TOUCH
Hersteller: NXP USA Inc.
Description: TOUCH BOARD FOR KE1XZ
auf Bestellung 7 Stücke:
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AnzahlPreis
1+52.78 EUR
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TWR-KE18F
TWR-KE18F
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KE1XF EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: KE1xF
Platform: Tower System
auf Bestellung 22 Stücke:
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AnzahlPreis
1+276.69 EUR
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U-CYCLONE-FX U-Cyclone-FX_Web.pdf
U-CYCLONE-FX
Hersteller: NXP USA Inc.
Description: CYCLONE UNIVERSAL FX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
Part Status: Active
auf Bestellung 57 Stücke:
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AnzahlPreis
1+2579.21 EUR
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DEVKIT-S12ZVL DEVKIT-S12ZVL-QSG.pdf
DEVKIT-S12ZVL
Hersteller: NXP USA Inc.
Description: S12ZVL EVAL BRD
Part Status: Active
Utilized IC / Part: S12ZVL
Core Processor: HCS12Z
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 2 Stücke:
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AnzahlPreis
1+119.13 EUR
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DEVKIT-S12XE DEVKIT-S12XE-QSG.pdf
DEVKIT-S12XE
Hersteller: NXP USA Inc.
Description: MC9S12XE EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XE
Part Status: Active
Produkt ist nicht verfügbar
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DEVKIT-ZVL128 DVKITZVL128QSG.pdf
DEVKIT-ZVL128
Hersteller: NXP USA Inc.
Description: S12ZVLA128 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVLA128
Part Status: Active
auf Bestellung 1 Stücke:
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1+256.84 EUR
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DEVKIT-S12VR64 DVKITZVL128QSG.pdf
DEVKIT-S12VR64
Hersteller: NXP USA Inc.
Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VR64
Part Status: Active
auf Bestellung 28 Stücke:
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AnzahlPreis
1+47.61 EUR
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DEVKIT-S12ZVC MC9S12ZVMRM.pdf
DEVKIT-S12ZVC
Hersteller: NXP USA Inc.
Description: S12ZVC EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVC
Part Status: Active
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1+208 EUR
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DEVKIT-S12G128 DVKITZVL128QSG.pdf
DEVKIT-S12G128
Hersteller: NXP USA Inc.
Description: MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Part Status: Active
auf Bestellung 12 Stücke:
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1+121.99 EUR
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DEVKIT-COMM MC9S12ZVMRM.pdf
DEVKIT-COMM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1022 TJA1048
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1022, TJA1048
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Part Status: Active
auf Bestellung 20 Stücke:
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AnzahlPreis
1+113.13 EUR
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MC33978AESR2 MC33978.pdf
MC33978AESR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32QFN
Supplier Device Package: 32-QFN-EP (5x5)
Applications: Multiple Switch Detection
Voltage - Supply: 3V ~ 5.25V
Interface: SPI
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVMC25F1WKK S12ZVMFS.pdf
S912ZVMC25F1WKK
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 80-TQFP-EP (12x12)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Produkt ist nicht verfügbar
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S12ZVMC256EVB S12ZVMFS.pdf
S12ZVMC256EVB
Hersteller: NXP USA Inc.
Description: S12ZVMC256 EVALUATION BOARD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
auf Bestellung 1 Stücke:
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AnzahlPreis
1+1003.52 EUR
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MCIMX6Y0CVM05AA IMX6ULLIEC.pdf
MCIMX6Y0CVM05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Additional Interfaces: I2C, SPI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers: Electrophoretic, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6ULL-EVK IMX6ULLQSG.pdf
MCIMX6ULL-EVK
Hersteller: NXP USA Inc.
Description: I.MX 6ULL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6ULL
Part Status: Active
auf Bestellung 26 Stücke:
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AnzahlPreis
1+303.93 EUR
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PC34VR5100A1EP VR5100.pdf
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 48QFN
Produkt ist nicht verfügbar
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LS1088A-RDB LS1088AFS.pdf
LS1088A-RDB
Hersteller: NXP USA Inc.
Description: LS1088A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: LS1088A
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF1K50NR5 MRF1K50N.pdf
MRF1K50NR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 50 Stücke:
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AnzahlPreis
50+292.95 EUR
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MRF1K50GNR5 MRF1K50N.pdf
MRF1K50GNR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
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MRF1K50NR5 MRF1K50N.pdf
MRF1K50NR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 75 Stücke:
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AnzahlPreis
1+367.15 EUR
10+320.92 EUR
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MRF1K50GNR5 MRF1K50N.pdf
MRF1K50GNR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
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PTN5150AHXMP PTN5150A.pdf
PTN5150AHXMP
Hersteller: NXP USA Inc.
Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 39237 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
10+1.87 EUR
14+1.35 EUR
25+1.22 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
1000+0.95 EUR
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PTN5100DBSMP PTN5100D.pdf
PTN5100DBSMP
Hersteller: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 85°C
Protocol: USB
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 9114 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.15 EUR
10+3.1 EUR
25+2.83 EUR
100+2.54 EUR
250+2.4 EUR
500+2.31 EUR
1000+2.24 EUR
2500+2.17 EUR
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BB170X BB170.pdf
BB170X
Hersteller: NXP USA Inc.
Description: DIODE VARACTOR 30V SNGL SOD-323
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 30 V
Part Status: Active
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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BFU730LXZ BFU730LX.pdf
BFU730LXZ
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 3V 53GHZ DFN1006C-3
Supplier Device Package: DFN1006C-3
Noise Figure (dB Typ @ f): 0.75dB @ 6GHz
Frequency - Transition: 53GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 3V
Voltage - Collector Emitter Breakdown (Max): 3V
Current - Collector (Ic) (Max): 30mA
Power - Max: 160mW
Gain: 15.8dB
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 4246 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
13+1.36 EUR
22+0.83 EUR
100+0.54 EUR
500+0.41 EUR
1000+0.37 EUR
2000+0.34 EUR
Mindestbestellmenge: 13 Stücke
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BFU910FX BFU910F.pdf
BFU910FX
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 9.5V SOT343F
Supplier Device Package: 4-DFP
Voltage - Collector Emitter Breakdown (Max): 9.5V
Current - Collector (Ic) (Max): 15mA
Power - Max: 300mW
Gain: 13.5dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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BGA2867,115 BGA2867.pdf
BGA2867,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 2.15GHz
P1dB: 5dBm
Noise Figure: 3.8dB
Current - Supply: 20.1mA
Gain: 27.2dB
Voltage - Supply: 4.5V ~ 5.5V
RF Type: General Purpose
Frequency: 0Hz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
auf Bestellung 4945 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
34+0.53 EUR
39+0.45 EUR
42+0.43 EUR
100+0.39 EUR
250+0.37 EUR
500+0.35 EUR
1000+0.34 EUR
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BGU8052X BGU8052.pdf
BGU8052X
Hersteller: NXP USA Inc.
Description: IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 1.9GHz
P1dB: 18dBm
Noise Figure: 0.5dB
Current - Supply: 48mA
Gain: 18.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 1.5GHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1504 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.75 EUR
10+8.45 EUR
25+7.99 EUR
100+7.37 EUR
250+6.99 EUR
500+6.73 EUR
1000+6.48 EUR
Mindestbestellmenge: 2 Stücke
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LPC2138FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2138FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 2087 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+34.06 EUR
10+27.27 EUR
25+25.58 EUR
100+23.72 EUR
250+22.83 EUR
500+22.3 EUR
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LPC811M001JDH16J LPC81XM.pdf
LPC811M001JDH16J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
DigiKey Programmable: Not Verified
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8+2.48 EUR
12+1.5 EUR
25+1.42 EUR
100+1.34 EUR
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500+1.31 EUR
1000+1.27 EUR
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PCA9512AD,118 PCA9512A.pdf
PCA9512AD,118
Hersteller: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 84 Stücke:
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5+4.14 EUR
10+3.07 EUR
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PCA9539BS,115 PCA9539_PCA9539R.pdf
PCA9539BS,115
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9541APW/03,118 PCA9541A.pdf
PCA9541APW/03,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 13673 Stücke:
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5+4.05 EUR
10+3.01 EUR
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PCF2123BS/1,518 PCF2123.pdf
PCF2123BS/1,518
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
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9+2.13 EUR
12+1.55 EUR
25+1.4 EUR
100+1.24 EUR
250+1.17 EUR
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1000+1.08 EUR
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PCF8551ATT/AJ PCF8551.pdf
PCF8551ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Current - Supply: 1.2 µA
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PN5120A0HN1/C2,118 PN512.pdf
PN5120A0HN1/C2,118
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 11736 Stücke:
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2+14.77 EUR
10+12.81 EUR
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SA630D/01,118 SA630.pdf
SA630D/01,118
Hersteller: NXP USA Inc.
Description: IC RF SWITCH SPDT 1GHZ 8SO
Packaging: Cut Tape (CT)
Features: Single Line Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
RF Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Insertion Loss: 2dB
Frequency Range: 0Hz ~ 1GHz
Topology: Absorptive
P1dB: 18dBm
Test Frequency: 900MHz
Isolation: 30dB
Supplier Device Package: 8-SO
IIP3: 33dBm
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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SC16IS750IBS,128 SC16IS740_750_760.pdf
SC16IS750IBS,128
Hersteller: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SGTL5000XNLA3R2 SGTL5000.pdf
SGTL5000XNLA3R2
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 9480 Stücke:
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2+9.22 EUR
10+7.06 EUR
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SL3S1013FTB0,115 SL3S1003_1013.pdf
SL3S1013FTB0,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Cut Tape (CT)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
auf Bestellung 24320 Stücke:
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27+0.67 EUR
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33+0.54 EUR
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TDA8922CTH/N1,118 TDA8922C.pdf
TDA8922CTH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 155W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 155W x 1 @ 8Ohm; 75W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8953TH/N1,118 TDA8953.pdf
TDA8953TH/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 420W 24HSOP
Features: Depop, Differential Inputs, Mute, Short-Circuit Protection
Packaging: Cut Tape (CT)
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 42.5V
Max Output Power x Channels @ Load: 420W x 1 @ 8Ohm, 210W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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