Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 280 nach 607
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LPC54605J256ET180E | NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLSH 180TFBGAPackaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54605J512ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54606J256ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 189 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC54606J512BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54607J512ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 568 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54608J512BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Speed: 180MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray Number of I/O: 171 Part Status: Discontinued at Digi-Key Supplier Device Package: 208-LQFP (28x28) Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 200K x 8 Program Memory Size: 512KB (512K x 8) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54608J512ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 266 Stücke: Lieferzeit 10-14 Tag (e) |
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OM13092UL | NXP USA Inc. |
Description: LPCXPRESSO LPC54608 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC54608 Platform: LPCXpresso™ Part Status: Active |
Produkt ist nicht verfügbar |
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74HC151D,118 | NXP USA Inc. |
Description: IC MULTIPLEXER 1 X 8:1 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC17XS6400BEK | NXP USA Inc. |
Description: IC SWITCH HIGH SIDE 32SOIC |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT1403DR,112 | NXP USA Inc. |
Description: IC BUFFER/DRIVER 32TSSOP |
Produkt ist nicht verfügbar |
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74LVT1403DR,118 | NXP USA Inc. |
Description: IC BUFFER/DRIVER 32TSSOP |
Produkt ist nicht verfügbar |
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S912ZVMC12F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVMC64F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 |
Produkt ist nicht verfügbar |
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S912ZVML12F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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S912ZVML12F1WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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S912ZVML32F1MKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad |
Produkt ist nicht verfügbar |
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S912ZVML32F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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S912ZVML64F1MKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray Number of I/O: 31 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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S912ZVML64F1MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVML64F1WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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S912ZVML64F2MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Obsolete Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT |
Produkt ist nicht verfügbar |
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MC8640DTHJ1067NE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.067GHZ 1023BGA Additional Interfaces: DUART, HSSI, I2C, RapidIO Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 2 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 1023-FCCBGA (33x33) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e600 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.067GHz Mounting Type: Surface Mount Package / Case: 1023-BCBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
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MC8640THJ1067NE | NXP USA Inc. | Description: IC MPU MPC86XX 1.067GHZ 994BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC8640THJ1250HE | NXP USA Inc. | Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32K144EVB-Q100X | NXP USA Inc. |
Description: S32K144 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K144 |
Produkt ist nicht verfügbar |
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| S08SU16-EVK | NXP USA Inc. |
Description: MC9S08SU EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SU Part Status: Active |
Produkt ist nicht verfügbar |
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OM13094UL | NXP USA Inc. |
Description: LPCXPRESSO LPC54618 EVAL BRD |
Produkt ist nicht verfügbar |
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TWR-LS1021A-PC | NXP USA Inc. |
Description: TOWER SYSTEM LS1021A EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A7 Utilized IC / Part: LS1021A Platform: Tower System Part Status: Active |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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MK27FN2M0VMI15 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 169-MAPBGA (9x9) Part Status: Discontinued at Digi-Key Number of I/O: 120 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDM-K28F | NXP USA Inc. |
Description: FREEDOM K27/K28 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: K27, K28 Platform: Freedom Part Status: Active |
Produkt ist nicht verfügbar |
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MK28FN2M0VMI15 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 169-MAPBGA (9x9) Part Status: Not For New Designs Number of I/O: 120 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX7D2DVM12SC | NXP USA Inc. |
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Display & Interface Controllers: Keypad, LCD, MIPI Graphics Acceleration: No RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 541-MAPBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Operating Temperature: 0°C ~ 85°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 541-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NX5P3290UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP Features: Slew Rate Controlled, Status Flag Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 35mOhm Input Type: Non-Inverting Voltage - Load: 4V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3.3A Ratio - Input:Output: 1:1 Supplier Device Package: 16-WLCSP (2.05x2.05) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO Part Status: Active |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3152/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 24HVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 3.6V Standards: ISO 14443 Supplier Device Package: 24-HVQFN (4x4) Part Status: Active |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTU02043HEJ | NXP USA Inc. |
Description: IC DIFF SWITCH 2:1 HUQFN16 Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: USB -3db Bandwidth: 12GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PTN5110THQZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 16HX2QFN Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Applications: USB Supplier Device Package: 16-HX2QFN (2.6x2.6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA19361T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SO Part Status: Active Voltage - Start Up: 14.9 V Fault Protection: Over Power, Over Temperature, Over Voltage Supplier Device Package: 10-SO Voltage - Supply (Vcc/Vdd): 0V ~ 120V Topology: Flyback Output Isolation: Isolated Internal Switch(s): No Frequency - Switching: 25.5kHz ~ 128kHz Operating Temperature: -25°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA85063ATT/AJ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 8TSSOP Packaging: Cut Tape (CT) Features: Alarm, Leap Year, Square Wave Output Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 105°C Voltage - Supply: 0.9V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 8-TSSOP Current - Timekeeping (Max): 1.8µA @ 5V Part Status: Not For New Designs DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 7407 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8551BTT/AJ | NXP USA Inc. |
Description: IC DRVR 144 SEGMENT 48TSSOP Current - Supply: 1.8 µA Part Status: Obsolete Supplier Device Package: 48-TSSOP Digits or Characters: 9 Characters, 18 Characters, 144 Elements Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 105°C Configuration: 144 Segment Interface: SPI Mounting Type: Surface Mount Display Type: LCD Package / Case: 48-TFSOP (0.240", 6.10mm Width) Packaging: Cut Tape (CT) Qualification: AEC-Q100 Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PTN3366BSMP | NXP USA Inc. |
Description: IC VIDEO LEVEL SHIFTER 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Shifter Voltage - Supply: 3.0V ~ 3.6V Applications: DisplayPort to HDMI, DVI Adapters Standards: DVI v1.0, HDMI v1.4b Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Control Interface: I2C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA1723BT/N1,118 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 7SOIC Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Duty Cycle: 75% Frequency - Switching: 22.5kHz ~ 50.5kHz Internal Switch(s): Yes Voltage - Breakdown: 700V Output Isolation: Non-Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V Supplier Device Package: 7-SOIC Fault Protection: Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 17 V Part Status: Active Power (Watts): 11 W |
auf Bestellung 31351 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1723FT/N1,118 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 7SOIC Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Duty Cycle: 75% Frequency - Switching: 22.5kHz ~ 50.5kHz Internal Switch(s): Yes Voltage - Breakdown: 700V Output Isolation: Non-Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V Supplier Device Package: 7-SOIC Fault Protection: Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 17 V Part Status: Active Power (Watts): 11 W |
auf Bestellung 9162 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1833LTS/1H | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 Topology: Flyback Output Isolation: Isolated Internal Switch(s): No Frequency - Switching: 65kHz Duty Cycle: 90% Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Voltage - Start Up: 22 V Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Supplier Device Package: SC-74 Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Package / Case: SC-74, SOT-457 Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NX5P3290UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP Packaging: Cut Tape (CT) Features: Slew Rate Controlled, Status Flag Package / Case: 16-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 35mOhm Input Type: Non-Inverting Voltage - Load: 4V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3.3A Ratio - Input:Output: 1:1 Supplier Device Package: 16-WLCSP (2.05x2.05) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO Part Status: Active |
auf Bestellung 18040 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3152/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 24HVQFN Part Status: Active Supplier Device Package: 24-HVQFN (4x4) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 1897 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA19361T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SO Part Status: Active Voltage - Start Up: 14.9 V Fault Protection: Over Power, Over Temperature, Over Voltage Supplier Device Package: 10-SO Voltage - Supply (Vcc/Vdd): 0V ~ 120V Topology: Flyback Output Isolation: Isolated Internal Switch(s): No Frequency - Switching: 25.5kHz ~ 128kHz Operating Temperature: -25°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 2690 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3152UK/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 25WLCSP Part Status: Active Supplier Device Package: 25-WLCSP (2.51x2.51) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NHS3152UK/A1Z | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 25WLCSP Part Status: Active Supplier Device Package: 25-WLCSP (2.51x2.51) Standards: ISO 14443 Voltage - Supply: 1.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: RFID Reader Interface: I2C, SPI Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 422 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN5110HQZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 16HX2QFN Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Applications: USB Supplier Device Package: 16-HX2QFN (2.6x2.6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NXH5104UK/A1Z | NXP USA Inc. |
Description: IC EEPROM 4MBIT SPI 13WLCSP Packaging: Tape & Reel (TR) Package / Case: 13-XFBGA, WLCSP Mounting Type: Surface Mount Memory Size: 4Mbit Memory Type: Non-Volatile Operating Temperature: -20°C ~ 85°C (TA) Voltage - Supply: 1V ~ 2.6V Technology: EEPROM Clock Frequency: 10 MHz Memory Format: EEPROM Supplier Device Package: 13-WLCSP (2.8x2.74) Part Status: Active Memory Interface: SPI Memory Organization: 512K x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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OM26630FDKM | NXP USA Inc. |
Description: EVAL BOARD FOR CLRC663 Packaging: Bulk For Use With/Related Products: CLRC663 Frequency: 13.56MHz Type: RFID Reader Supplied Contents: Board(s) Contents: Board(s) Utilized IC / Part: CLRC663 |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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CLRC66303HNE | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443 Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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CLRC66303HNY | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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OM5577/PN7120ARDM | NXP USA Inc. |
Description: PN7120 NFC DEV KIT ARDUINO CONN Packaging: Bulk For Use With/Related Products: PN7120S Type: Near Field Communication (NFC) Contents: Board(s) Utilized IC / Part: PN7120S Supplied Contents: Board(s) Part Status: Obsolete |
auf Bestellung 62 Stücke: Lieferzeit 10-14 Tag (e) |
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OM5569/NT322FM | NXP USA Inc. |
Description: NTAG I2C PLUS ANTENNA KIT Packaging: Bulk For Use With/Related Products: NT3H1101 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CLEV6630BM | NXP USA Inc. |
Description: CLRC663 PLUS DEV BOARD Packaging: Bulk For Use With/Related Products: CLRC663 Frequency: 13.56MHz Type: RFID Reader Contents: Board(s) Utilized IC / Part: CLRC663 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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PNEV5180BM | NXP USA Inc. |
Description: EVAL BOARD FOR PN5180 Packaging: Bulk For Use With/Related Products: PN5180 Frequency: 13.56MHz Type: Near Field Communication (NFC) Contents: Board(s) Utilized IC / Part: PN5180 Supplied Contents: Board(s) |
auf Bestellung 64 Stücke: Lieferzeit 10-14 Tag (e) |
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CLRC66303HNY | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.5V ~ 5.5V Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 10356 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G2AVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 736 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC54605J256ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.31 EUR |
| 10+ | 8.85 EUR |
| LPC54605J512ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54606J256ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC54606J512BD208E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54607J512ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 568 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.82 EUR |
| 10+ | 15.55 EUR |
| 25+ | 14.48 EUR |
| 189+ | 12.53 EUR |
| 378+ | 12.33 EUR |
| 567+ | 12.14 EUR |
| LPC54608J512BD208E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Number of I/O: 171
Part Status: Discontinued at Digi-Key
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Number of I/O: 171
Part Status: Discontinued at Digi-Key
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54608J512ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 20.84 EUR |
| 10+ | 16.41 EUR |
| 25+ | 15.3 EUR |
| 189+ | 13.66 EUR |
| OM13092UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54608 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54608
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC54608 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54608
Platform: LPCXpresso™
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC151D,118 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 8:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 1 X 8:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC17XS6400BEK |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Description: IC SWITCH HIGH SIDE 32SOIC
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
| 74LVT1403DR,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER/DRIVER 32TSSOP
Description: IC BUFFER/DRIVER 32TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT1403DR,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER/DRIVER 32TSSOP
Description: IC BUFFER/DRIVER 32TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVMC12F1MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVMC64F1MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML12F1MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML12F1WKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML32F1MKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML32F1MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML64F1MKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Obsolete
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML64F1MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML64F1WKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML64F2MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC8640DTHJ1067NE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BCBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 2 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 1023-FCCBGA (33x33)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e600
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.067GHz
Mounting Type: Surface Mount
Package / Case: 1023-BCBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC8640THJ1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 994BGA
Description: IC MPU MPC86XX 1.067GHZ 994BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC8640THJ1250HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA
Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K144EVB-Q100X |
|
Hersteller: NXP USA Inc.
Description: S32K144 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144
Description: S32K144 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S08SU16-EVK |
|
Hersteller: NXP USA Inc.
Description: MC9S08SU EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SU
Part Status: Active
Description: MC9S08SU EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SU
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13094UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54618 EVAL BRD
Description: LPCXPRESSO LPC54618 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-LS1021A-PC |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 2584.91 EUR |
| MK27FN2M0VMI15 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDM-K28F |
|
Hersteller: NXP USA Inc.
Description: FREEDOM K27/K28 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K27, K28
Platform: Freedom
Part Status: Active
Description: FREEDOM K27/K28 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K27, K28
Platform: Freedom
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MK28FN2M0VMI15 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| MCIMX7D2DVM12SC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 85°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 85°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
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| NX5P3290UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.05x2.05)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP
Features: Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.05x2.05)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3000+ | 1.22 EUR |
| 6000+ | 1.19 EUR |
| 9000+ | 1.18 EUR |
| NHS3152/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 3.64 EUR |
| CBTU02043HEJ |
|
Hersteller: NXP USA Inc.
Description: IC DIFF SWITCH 2:1 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
-3db Bandwidth: 12GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC DIFF SWITCH 2:1 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
-3db Bandwidth: 12GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 10000 Stücke
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Stück im Wert von UAH
| PTN5110THQZ |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19361T/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 1.02 EUR |
| PCA85063ATT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.8µA @ 5V
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.8µA @ 5V
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7407 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.41 EUR |
| 11+ | 1.75 EUR |
| 25+ | 1.59 EUR |
| 100+ | 1.42 EUR |
| 250+ | 1.33 EUR |
| 500+ | 1.28 EUR |
| 1000+ | 1.24 EUR |
| PCA8551BTT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 144 SEGMENT 48TSSOP
Current - Supply: 1.8 µA
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 144 Segment
Interface: SPI
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Description: IC DRVR 144 SEGMENT 48TSSOP
Current - Supply: 1.8 µA
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 144 Segment
Interface: SPI
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PTN3366BSMP |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Control Interface: I2C
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Control Interface: I2C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1723BT/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 31351 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.34 EUR |
| 11+ | 1.7 EUR |
| 25+ | 1.54 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.29 EUR |
| 500+ | 1.24 EUR |
| 1000+ | 1.2 EUR |
| TEA1723FT/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
auf Bestellung 9162 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.24 EUR |
| 11+ | 1.62 EUR |
| 25+ | 1.47 EUR |
| 100+ | 1.3 EUR |
| 250+ | 1.22 EUR |
| 500+ | 1.18 EUR |
| 1000+ | 1.14 EUR |
| TEA1833LTS/1H |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
Description: IC OFFLINE SWITCH FLYBACK SC74
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 65kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX5P3290UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled, Status Flag
Package / Case: 16-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.05x2.05)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Description: IC PWR SWITCH P-CHAN 1:1 16WLCSP
Packaging: Cut Tape (CT)
Features: Slew Rate Controlled, Status Flag
Package / Case: 16-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 35mOhm
Input Type: Non-Inverting
Voltage - Load: 4V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.3A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-WLCSP (2.05x2.05)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
auf Bestellung 18040 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.41 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.61 EUR |
| 100+ | 1.43 EUR |
| 250+ | 1.34 EUR |
| 500+ | 1.29 EUR |
| 1000+ | 1.28 EUR |
| NHS3152/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC RFID READER 13.56MHZ 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1897 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.65 EUR |
| 10+ | 4.88 EUR |
| 25+ | 4.62 EUR |
| 100+ | 4.25 EUR |
| 250+ | 4.03 EUR |
| 500+ | 3.87 EUR |
| TEA19361T/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC OFFLINE SWITCH FLYBACK 10SO
Part Status: Active
Voltage - Start Up: 14.9 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2690 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.09 EUR |
| 12+ | 1.53 EUR |
| 25+ | 1.38 EUR |
| 100+ | 1.22 EUR |
| 250+ | 1.15 EUR |
| 500+ | 1.1 EUR |
| 1000+ | 1.07 EUR |
| NHS3152UK/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NHS3152UK/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC RFID READER 13.56MHZ 25WLCSP
Part Status: Active
Supplier Device Package: 25-WLCSP (2.51x2.51)
Standards: ISO 14443
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Interface: I2C, SPI
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 422 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.58 EUR |
| 10+ | 5.86 EUR |
| 25+ | 5.28 EUR |
| 100+ | 4.81 EUR |
| 250+ | 4.34 EUR |
| PTN5110HQZ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NXH5104UK/A1Z |
|
Hersteller: NXP USA Inc.
Description: IC EEPROM 4MBIT SPI 13WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 13-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 2.6V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 13-WLCSP (2.8x2.74)
Part Status: Active
Memory Interface: SPI
Memory Organization: 512K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 4MBIT SPI 13WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 13-XFBGA, WLCSP
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 2.6V
Technology: EEPROM
Clock Frequency: 10 MHz
Memory Format: EEPROM
Supplier Device Package: 13-WLCSP (2.8x2.74)
Part Status: Active
Memory Interface: SPI
Memory Organization: 512K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OM26630FDKM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR CLRC663
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: CLRC663
Description: EVAL BOARD FOR CLRC663
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: CLRC663
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 369.92 EUR |
| CLRC66303HNE |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 17.72 EUR |
| 10+ | 16 EUR |
| 25+ | 15.26 EUR |
| 80+ | 13.25 EUR |
| 230+ | 12.65 EUR |
| CLRC66303HNY |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6000+ | 8.34 EUR |
| OM5577/PN7120ARDM |
|
Hersteller: NXP USA Inc.
Description: PN7120 NFC DEV KIT ARDUINO CONN
Packaging: Bulk
For Use With/Related Products: PN7120S
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7120S
Supplied Contents: Board(s)
Part Status: Obsolete
Description: PN7120 NFC DEV KIT ARDUINO CONN
Packaging: Bulk
For Use With/Related Products: PN7120S
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7120S
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 62 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 173.4 EUR |
| OM5569/NT322FM |
Hersteller: NXP USA Inc.
Description: NTAG I2C PLUS ANTENNA KIT
Packaging: Bulk
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: NTAG I2C PLUS ANTENNA KIT
Packaging: Bulk
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CLEV6630BM |
|
Hersteller: NXP USA Inc.
Description: CLRC663 PLUS DEV BOARD
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Contents: Board(s)
Utilized IC / Part: CLRC663
Supplied Contents: Board(s)
Part Status: Active
Description: CLRC663 PLUS DEV BOARD
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Contents: Board(s)
Utilized IC / Part: CLRC663
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 236.63 EUR |
| PNEV5180BM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5180
Packaging: Bulk
For Use With/Related Products: PN5180
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5180
Supplied Contents: Board(s)
Description: EVAL BOARD FOR PN5180
Packaging: Bulk
For Use With/Related Products: PN5180
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5180
Supplied Contents: Board(s)
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 286.11 EUR |
| CLRC66303HNY |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 10356 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.59 EUR |
| 10+ | 11.33 EUR |
| 25+ | 10.52 EUR |
| 100+ | 9.63 EUR |
| 250+ | 9.2 EUR |
| 500+ | 8.94 EUR |
| 1000+ | 8.83 EUR |
| MCIMX6G2AVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 736 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 34.25 EUR |
| 10+ | 27.41 EUR |
| 25+ | 25.7 EUR |
| 152+ | 23.39 EUR |
| 304+ | 22.77 EUR |
| 608+ | 22.26 EUR |