Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35406) > Seite 280 nach 591
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MMA5224NPIKGWR2 | NXP USA Inc. | Description: ACCELEROMETER PSI5 16QFN |
Produkt ist nicht verfügbar |
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| MMA5224NPIKWR2 | NXP USA Inc. | Description: ACCELEROMETER PSI5 16QFN |
Produkt ist nicht verfügbar |
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| MMA5224NPKGWR2 | NXP USA Inc. | Description: ACCELEROMETER PSI5 16QFN |
Produkt ist nicht verfügbar |
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| MMA5224NPKWR2 | NXP USA Inc. | Description: ACCELEROMETER PSI5 16QFN |
Produkt ist nicht verfügbar |
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| MMA6805AKGWR2 | NXP USA Inc. | Description: ACCELEROMETER 10BIT SPI 16QFN |
Produkt ist nicht verfügbar |
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| SX5101P5T1 | NXP USA Inc. | Description: ACCELEROMETER |
Produkt ist nicht verfügbar |
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| SX5212P1KWT1 | NXP USA Inc. | Description: ACCELEROMETER |
Produkt ist nicht verfügbar |
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SPC5777CK3MME3 | NXP USA Inc. |
 Description: IC MCU 32BIT 8MB FLASH 416MAPBGAPackaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5777CK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA Packaging: Tray Package / Case: 516-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 516-MAPBGA (27x27) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVML31F1WKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP |
auf Bestellung 318 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVML31F1WKF | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 4x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP-EP (7x7) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12VR32F0VLC | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFP |
auf Bestellung 99 Stücke: Lieferzeit 10-14 Tag (e) |
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S12VR32EVB | NXP USA Inc. |
Description: S12VR32 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12 Utilized IC / Part: S12VR32 |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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S12ZVM32EVB | NXP USA Inc. |
Description: S12ZVM32 EVALUATION BOARD FOR BL |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z256VLH7 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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MKE15Z256VLL7 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 28x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 331 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE18F512VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 2144 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE18F512VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 255 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-KE15Z | NXP USA Inc. |
Description: FREEDOM KE1XZ EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KE1xZ Platform: Freedom |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-TOUCH | NXP USA Inc. | Description: TOUCH BOARD FOR KE1XZ |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-KE18F | NXP USA Inc. |
Description: TOWER SYSTEM KE1XF EVAL BRD |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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U-CYCLONE-FX | NXP USA Inc. |
Description: CYCLONE UNIVERSAL FX PROGRAMMER Packaging: Bulk For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices Type: Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-S12ZVL | NXP USA Inc. |
Description: S12ZVL EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12Z Utilized IC / Part: S12ZVL Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-S12XE | NXP USA Inc. |
Description: MC9S12XE EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12X Board Type: Evaluation Platform Utilized IC / Part: MC9S12XE Part Status: Active |
Produkt ist nicht verfügbar |
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DEVKIT-ZVL128 | NXP USA Inc. |
Description: S12ZVLA128 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12Z Board Type: Evaluation Platform Utilized IC / Part: S12ZVLA128 Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-S12VR64 | NXP USA Inc. |
Description: S12VR64 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12 Board Type: Evaluation Platform Utilized IC / Part: S12VR64 Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-S12ZVC | NXP USA Inc. |
Description: S12ZVC EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12Z Board Type: Evaluation Platform Utilized IC / Part: S12ZVC Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-S12G128 | NXP USA Inc. |
Description: MC9S12G EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12 Board Type: Evaluation Platform Utilized IC / Part: MC9S12G Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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DEVKIT-COMM | NXP USA Inc. |
Description: DEVKIT CAN/LIN/SCI EXPANSION Packaging: Bulk Function: CANbus and LINbus Type: Interface Utilized IC / Part: TJA1022, TJA1048 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33978AESR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: SPI Voltage - Supply: 3V ~ 5.25V Applications: Multiple Switch Detection Supplier Device Package: 32-QFN-EP (5x5) |
Produkt ist nicht verfügbar |
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S912ZVMC25F1WKK | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80TQFP Packaging: Tray Package / Case: 80-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 80-TQFP-EP (12x12) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S12ZVMC256EVB | NXP USA Inc. |
Description: S12ZVMC256 EVALUATION BOARD Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S12ZVM Supplied Contents: Board(s) Primary Attributes: Motors (BLDC, PMSM) Embedded: Yes, MCU, 16-Bit Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y0CVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: I2C, SPI, UART |
Produkt ist nicht verfügbar |
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MCIMX6ULL-EVK | NXP USA Inc. |
Description: I.MX 6ULL EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A7 Board Type: Evaluation Platform Utilized IC / Part: i.MX 6ULL Part Status: Active |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| PC34VR5100A1EP | NXP USA Inc. |
Description: IC REG 9OUT BUCK/LDO 48QFN |
Produkt ist nicht verfügbar |
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LS1088A-RDB | NXP USA Inc. |
Description: LS1088A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Board Type: Evaluation Platform Utilized IC / Part: LS1088A Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MRF1K50NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM1230-4 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L Mounting Type: Surface Mount Frequency: 1.8MHz ~ 500MHz Power - Output: 1500W Gain: 23dB Technology: LDMOS Supplier Device Package: OM-1230-4L Part Status: Active Voltage - Rated: 50 V Voltage - Test: 50 V |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF1K50GNR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM1230G-4 Packaging: Tape & Reel (TR) Package / Case: OM-1230G-4L Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 500MHz Power - Output: 1500W Gain: 23dB Technology: LDMOS Supplier Device Package: OM-1230G-4L Part Status: Active Voltage - Rated: 50 V Voltage - Test: 50 V |
Produkt ist nicht verfügbar |
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MRF1K50NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM1230-4 Packaging: Cut Tape (CT) Package / Case: OM-1230-4L Mounting Type: Surface Mount Frequency: 1.8MHz ~ 500MHz Power - Output: 1500W Gain: 23dB Technology: LDMOS Supplier Device Package: OM-1230-4L Part Status: Active Voltage - Rated: 50 V Voltage - Test: 50 V |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF1K50GNR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM1230G-4 Packaging: Cut Tape (CT) Package / Case: OM-1230G-4L Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 500MHz Power - Output: 1500W Gain: 23dB Technology: LDMOS Supplier Device Package: OM-1230G-4L Part Status: Active Voltage - Rated: 50 V Voltage - Test: 50 V |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN5150AHXMP | NXP USA Inc. |
Description: IC USB HOST CTLR 12X2QFN Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Function: Controller Interface: USB Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Protocol: USB Supplier Device Package: 12-X2QFN (1.6x1.6) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4668 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN5100DBSMP | NXP USA Inc. |
Description: IC USB PD PHY TYPE C 20HVQFN Packaging: Cut Tape (CT) Package / Case: 20-VFQFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 85°C Protocol: USB Supplier Device Package: 20-HVQFN (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
auf Bestellung 9119 Stücke: Lieferzeit 10-14 Tag (e) |
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BB170X | NXP USA Inc. |
Description: DIODE VHF VAR CAP 30V SOD323 Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Part Status: Active Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 15.0 |
auf Bestellung 5640 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU730LXZ | NXP USA Inc. |
Description: RF TRANS NPN 3V 53GHZ 3DFN1006 Packaging: Cut Tape (CT) Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: NPN Gain: 15.8dB Power - Max: 160mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 3V DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 3V Frequency - Transition: 53GHz Noise Figure (dB Typ @ f): 0.75dB @ 6GHz Supplier Device Package: DFN1006C-3 |
auf Bestellung 14688 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU910FX | NXP USA Inc. |
Description: RF TRANS NPN 9.5V SOT343F Packaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 13.5dB Power - Max: 300mW Current - Collector (Ic) (Max): 15mA Voltage - Collector Emitter Breakdown (Max): 9.5V Supplier Device Package: 4-DFP |
Produkt ist nicht verfügbar |
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BGA2867,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 4.5V ~ 5.5V Gain: 27.2dB Current - Supply: 20.1mA Noise Figure: 3.8dB P1dB: 5dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP Part Status: Active |
auf Bestellung 935 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8052X | NXP USA Inc. |
Description: IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON Packaging: Cut Tape (CT) Package / Case: 8-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.5GHz ~ 2.5GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75V ~ 5.25V Gain: 18.5dB Current - Supply: 48mA Noise Figure: 0.5dB P1dB: 18dBm Test Frequency: 1.9GHz Supplier Device Package: 8-HWSON (2x2) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2138FBD64/01,11 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 16x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 47 DigiKey Programmable: Not Verified |
auf Bestellung 2327 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC811M001JDH16J | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 3490 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9512AD,118 | NXP USA Inc. |
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, Accelerator Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 1.8mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Active Capacitance - Input: 10 pF |
auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9539BS,115 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN Packaging: Cut Tape (CT) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9541APW/03,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 16-TSSOP Part Status: Active |
auf Bestellung 4897 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF2123BS/1,518 | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR SPI 16HVQFN Packaging: Cut Tape (CT) Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.6V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HVQFN (3x3) Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 5962 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF8551ATT/AJ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 48TSSOP Packaging: Cut Tape (CT) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I²C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Part Status: Obsolete Current - Supply: 1.2 µA |
Produkt ist nicht verfügbar |
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PN5120A0HN1/C2,118 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 16728 Stücke: Lieferzeit 10-14 Tag (e) |
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SA630D/01,118 | NXP USA Inc. |
Description: IC RF SWITCH SPDT 1GHZ 8SO Packaging: Cut Tape (CT) Features: Single Line Control Package / Case: 8-SOIC (0.154", 3.90mm Width) Impedance: 50Ohm Mounting Type: Surface Mount Circuit: SPDT RF Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 5.5V Insertion Loss: 2dB Frequency Range: 0Hz ~ 1GHz Topology: Absorptive P1dB: 18dBm Test Frequency: 900MHz Isolation: 30dB Supplier Device Package: 8-SO IIP3: 33dBm Part Status: Last Time Buy |
auf Bestellung 967 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16IS750IBS,128 | NXP USA Inc. |
Description: IC UART I2C/SPI 24-HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Function: Controller Interface: I2C, SPI, UART Operating Temperature: -40°C ~ 95°C Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Protocol: RS232, RS485 Supplier Device Package: 24-HVQFN (4x4) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1395 Stücke: Lieferzeit 10-14 Tag (e) |
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SGTL5000XNLA3R2 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 20-QFN Packaging: Cut Tape (CT) Package / Case: 20-UFQFN Exposed Pad Mounting Type: Surface Mount Type: Stereo Audio Data Interface: I2C, Serial, SPI™ Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Supplier Device Package: 20-QFN-EP (3x3) Part Status: Active |
auf Bestellung 11666 Stücke: Lieferzeit 10-14 Tag (e) |
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SL3S1013FTB0,115 | NXP USA Inc. |
Description: RFID TAG R/W 840-960MHZ INLAY Packaging: Cut Tape (CT) Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Style: Inlay Frequency: 840MHz ~ 960MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Technology: Passive Standards: EPC Writable Memory: 256b (EPC) Part Status: Active |
auf Bestellung 6364 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA8922CTH/N1,118 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 155W 24HSOP Packaging: Cut Tape (CT) Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±12.5V ~ 32.5V Max Output Power x Channels @ Load: 155W x 1 @ 8Ohm; 75W x 2 @ 6Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
| MMA5224NPIKGWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
| MMA5224NPIKWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
| MMA5224NPKGWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
| MMA5224NPKWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER PSI5 16QFN
Description: ACCELEROMETER PSI5 16QFN
Produkt ist nicht verfügbar
| MMA6805AKGWR2 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 10BIT SPI 16QFN
Description: ACCELEROMETER 10BIT SPI 16QFN
Produkt ist nicht verfügbar
| SPC5777CK3MME3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5777CK3MMO3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 93.21 EUR |
| 10+ | 72.64 EUR |
| 25+ | 67.39 EUR |
| S912ZVML31F1WKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Description: IC MCU 16BIT 32KB FLASH 64LQFP
auf Bestellung 318 Stücke:
Lieferzeit 10-14 Tag (e)| S912ZVML31F1WKF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 4x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP-EP (7x7)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.21 EUR |
| 10+ | 9.59 EUR |
| 80+ | 7.94 EUR |
| 1250+ | 7.86 EUR |
| S9S12VR32F0VLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Description: IC MCU 16BIT 32KB FLASH 32LQFP
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)| S12VR32EVB |
|
Hersteller: NXP USA Inc.
Description: S12VR32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR32
Description: S12VR32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Utilized IC / Part: S12VR32
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 223.45 EUR |
| S12ZVM32EVB |
|
Hersteller: NXP USA Inc.
Description: S12ZVM32 EVALUATION BOARD FOR BL
Description: S12ZVM32 EVALUATION BOARD FOR BL
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 570.8 EUR |
| MKE15Z256VLH7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
| MKE15Z256VLL7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.25 EUR |
| 10+ | 10.42 EUR |
| 90+ | 8.62 EUR |
| MKE18F512VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 2144 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.32 EUR |
| 10+ | 13.6 EUR |
| 25+ | 12.13 EUR |
| 160+ | 10.05 EUR |
| 320+ | 9.5 EUR |
| 480+ | 9.23 EUR |
| 960+ | 8.82 EUR |
| MKE18F512VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.28 EUR |
| 10+ | 16.71 EUR |
| 90+ | 13.83 EUR |
| FRDM-KE15Z |
|
Hersteller: NXP USA Inc.
Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
Description: FREEDOM KE1XZ EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE1xZ
Platform: Freedom
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 97.03 EUR |
| FRDM-TOUCH |
Hersteller: NXP USA Inc.
Description: TOUCH BOARD FOR KE1XZ
Description: TOUCH BOARD FOR KE1XZ
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.78 EUR |
| TWR-KE18F |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KE1XF EVAL BRD
Description: TOWER SYSTEM KE1XF EVAL BRD
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| U-CYCLONE-FX |
|
Hersteller: NXP USA Inc.
Description: CYCLONE UNIVERSAL FX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Description: CYCLONE UNIVERSAL FX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 2255.81 EUR |
| DEVKIT-S12ZVL |
|
Hersteller: NXP USA Inc.
Description: S12ZVL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVL
Part Status: Active
Description: S12ZVL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Utilized IC / Part: S12ZVL
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 119.13 EUR |
| DEVKIT-S12XE |
|
Hersteller: NXP USA Inc.
Description: MC9S12XE EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XE
Part Status: Active
Description: MC9S12XE EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XE
Part Status: Active
Produkt ist nicht verfügbar
| DEVKIT-ZVL128 |
|
Hersteller: NXP USA Inc.
Description: S12ZVLA128 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVLA128
Part Status: Active
Description: S12ZVLA128 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVLA128
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 257.22 EUR |
| DEVKIT-S12VR64 |
|
Hersteller: NXP USA Inc.
Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VR64
Part Status: Active
Description: S12VR64 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VR64
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 119.12 EUR |
| DEVKIT-S12ZVC |
|
Hersteller: NXP USA Inc.
Description: S12ZVC EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVC
Part Status: Active
Description: S12ZVC EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12Z
Board Type: Evaluation Platform
Utilized IC / Part: S12ZVC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 215.71 EUR |
| DEVKIT-S12G128 |
|
Hersteller: NXP USA Inc.
Description: MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Part Status: Active
Description: MC9S12G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12G
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 120.81 EUR |
| DEVKIT-COMM |
|
Hersteller: NXP USA Inc.
Description: DEVKIT CAN/LIN/SCI EXPANSION
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: TJA1022, TJA1048
Supplied Contents: Board(s)
Part Status: Active
Description: DEVKIT CAN/LIN/SCI EXPANSION
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: TJA1022, TJA1048
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 120.31 EUR |
| MC33978AESR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Description: IC INTERFACE SPECIALIZED 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: SPI
Voltage - Supply: 3V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Produkt ist nicht verfügbar
| S912ZVMC25F1WKK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 80-TQFP-EP (12x12)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S12ZVMC256EVB |
|
Hersteller: NXP USA Inc.
Description: S12ZVMC256 EVALUATION BOARD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Description: S12ZVMC256 EVALUATION BOARD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVM
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1003.52 EUR |
| MCIMX6Y0CVM05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
| MCIMX6ULL-EVK |
|
Hersteller: NXP USA Inc.
Description: I.MX 6ULL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6ULL
Part Status: Active
Description: I.MX 6ULL EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6ULL
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 294.8 EUR |
| PC34VR5100A1EP |
|
Hersteller: NXP USA Inc.
Description: IC REG 9OUT BUCK/LDO 48QFN
Description: IC REG 9OUT BUCK/LDO 48QFN
Produkt ist nicht verfügbar
| LS1088A-RDB |
|
Hersteller: NXP USA Inc.
Description: LS1088A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: LS1088A
Part Status: Obsolete
Description: LS1088A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Board Type: Evaluation Platform
Utilized IC / Part: LS1088A
Part Status: Obsolete
Produkt ist nicht verfügbar
| MRF1K50NR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 50+ | 249.43 EUR |
| MRF1K50GNR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
| MRF1K50NR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 266.31 EUR |
| 10+ | 255.05 EUR |
| 25+ | 249.43 EUR |
| MRF1K50GNR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Rated: 50 V
Voltage - Test: 50 V
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 300.87 EUR |
| 10+ | 288.17 EUR |
| 25+ | 281.81 EUR |
| PTN5150AHXMP |
|
Hersteller: NXP USA Inc.
Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC USB HOST CTLR 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Protocol: USB
Supplier Device Package: 12-X2QFN (1.6x1.6)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4668 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.85 EUR |
| 10+ | 1.8 EUR |
| 25+ | 1.53 EUR |
| 100+ | 1.22 EUR |
| 250+ | 1.07 EUR |
| 500+ | 0.98 EUR |
| 1000+ | 0.9 EUR |
| 2500+ | 0.82 EUR |
| PTN5100DBSMP |
|
Hersteller: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 85°C
Protocol: USB
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: IC USB PD PHY TYPE C 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 85°C
Protocol: USB
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
auf Bestellung 9119 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.52 EUR |
| 10+ | 4.06 EUR |
| 25+ | 3.83 EUR |
| 100+ | 3.26 EUR |
| 250+ | 3.06 EUR |
| 500+ | 2.68 EUR |
| 1000+ | 2.22 EUR |
| 2500+ | 2.07 EUR |
| BB170X |
|
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 15.0
Description: DIODE VHF VAR CAP 30V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 15.0
auf Bestellung 5640 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15+ | 1.21 EUR |
| 24+ | 0.75 EUR |
| 100+ | 0.49 EUR |
| 500+ | 0.37 EUR |
| 1000+ | 0.33 EUR |
| BFU730LXZ |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 3V 53GHZ 3DFN1006
Packaging: Cut Tape (CT)
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: NPN
Gain: 15.8dB
Power - Max: 160mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 3V
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 3V
Frequency - Transition: 53GHz
Noise Figure (dB Typ @ f): 0.75dB @ 6GHz
Supplier Device Package: DFN1006C-3
Description: RF TRANS NPN 3V 53GHZ 3DFN1006
Packaging: Cut Tape (CT)
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: NPN
Gain: 15.8dB
Power - Max: 160mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 3V
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 3V
Frequency - Transition: 53GHz
Noise Figure (dB Typ @ f): 0.75dB @ 6GHz
Supplier Device Package: DFN1006C-3
auf Bestellung 14688 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 23+ | 0.79 EUR |
| 26+ | 0.69 EUR |
| 100+ | 0.48 EUR |
| 500+ | 0.37 EUR |
| 1000+ | 0.3 EUR |
| 2000+ | 0.27 EUR |
| 5000+ | 0.26 EUR |
| BFU910FX |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 9.5V SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 13.5dB
Power - Max: 300mW
Current - Collector (Ic) (Max): 15mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 9.5V SOT343F
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 13.5dB
Power - Max: 300mW
Current - Collector (Ic) (Max): 15mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
| BGA2867,115 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 27.2dB
Current - Supply: 20.1mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 27.2dB
Current - Supply: 20.1mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 935 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 35+ | 0.51 EUR |
| 39+ | 0.45 EUR |
| 44+ | 0.41 EUR |
| 100+ | 0.36 EUR |
| 250+ | 0.31 EUR |
| 500+ | 0.28 EUR |
| BGU8052X |
|
Hersteller: NXP USA Inc.
Description: IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.5dB
P1dB: 18dBm
Test Frequency: 1.9GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Description: IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.5GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.5dB
P1dB: 18dBm
Test Frequency: 1.9GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| LPC2138FBD64/01,11 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 2327 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 38.37 EUR |
| 10+ | 28.25 EUR |
| 25+ | 25.65 EUR |
| 100+ | 22.75 EUR |
| 250+ | 21.35 EUR |
| 500+ | 21.11 EUR |
| LPC811M001JDH16J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.91 EUR |
| 10+ | 2.52 EUR |
| 25+ | 2.15 EUR |
| 100+ | 1.74 EUR |
| 250+ | 1.54 EUR |
| 500+ | 1.42 EUR |
| 1000+ | 1.31 EUR |
| PCA9512AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 10 pF
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.58 EUR |
| 10+ | 4.12 EUR |
| 25+ | 3.89 EUR |
| 100+ | 3.37 EUR |
| PCA9539BS,115 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA9541APW/03,118 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 4897 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.89 EUR |
| 10+ | 4.39 EUR |
| 25+ | 4.15 EUR |
| 100+ | 3.6 EUR |
| 250+ | 3.41 EUR |
| 500+ | 3.06 EUR |
| 1000+ | 2.58 EUR |
| PCF2123BS/1,518 |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5962 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.52 EUR |
| 10+ | 2.26 EUR |
| 25+ | 1.93 EUR |
| 100+ | 1.55 EUR |
| 250+ | 1.37 EUR |
| 500+ | 1.26 EUR |
| 1000+ | 1.17 EUR |
| 2500+ | 1.07 EUR |
| PCF8551ATT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Current - Supply: 1.2 µA
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
| PN5120A0HN1/C2,118 |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 16728 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.17 EUR |
| 10+ | 13.91 EUR |
| 25+ | 12.65 EUR |
| 100+ | 11.38 EUR |
| 250+ | 10.43 EUR |
| 500+ | 9.48 EUR |
| 1000+ | 8.54 EUR |
| SA630D/01,118 |
|
Hersteller: NXP USA Inc.
Description: IC RF SWITCH SPDT 1GHZ 8SO
Packaging: Cut Tape (CT)
Features: Single Line Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
RF Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Insertion Loss: 2dB
Frequency Range: 0Hz ~ 1GHz
Topology: Absorptive
P1dB: 18dBm
Test Frequency: 900MHz
Isolation: 30dB
Supplier Device Package: 8-SO
IIP3: 33dBm
Part Status: Last Time Buy
Description: IC RF SWITCH SPDT 1GHZ 8SO
Packaging: Cut Tape (CT)
Features: Single Line Control
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
RF Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Insertion Loss: 2dB
Frequency Range: 0Hz ~ 1GHz
Topology: Absorptive
P1dB: 18dBm
Test Frequency: 900MHz
Isolation: 30dB
Supplier Device Package: 8-SO
IIP3: 33dBm
Part Status: Last Time Buy
auf Bestellung 967 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.27 EUR |
| 10+ | 13.57 EUR |
| 25+ | 12.1 EUR |
| 100+ | 10.45 EUR |
| 250+ | 9.66 EUR |
| 500+ | 9.17 EUR |
| SC16IS750IBS,128 |
|
Hersteller: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1395 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.32 EUR |
| 10+ | 4.77 EUR |
| 25+ | 4.51 EUR |
| 100+ | 3.91 EUR |
| 250+ | 3.71 EUR |
| 500+ | 3.33 EUR |
| SGTL5000XNLA3R2 |
|
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Cut Tape (CT)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 11666 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.52 EUR |
| 10+ | 7.65 EUR |
| 25+ | 7.23 EUR |
| 100+ | 6.27 EUR |
| 250+ | 5.94 EUR |
| 500+ | 5.33 EUR |
| 1000+ | 4.5 EUR |
| 2500+ | 4.27 EUR |
| SL3S1013FTB0,115 |
|
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Cut Tape (CT)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
Description: RFID TAG R/W 840-960MHZ INLAY
Packaging: Cut Tape (CT)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Inlay
Frequency: 840MHz ~ 960MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Standards: EPC
Writable Memory: 256b (EPC)
Part Status: Active
auf Bestellung 6364 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 20+ | 0.9 EUR |
| 27+ | 0.68 EUR |
| 30+ | 0.6 EUR |
| 100+ | 0.51 EUR |
| 250+ | 0.47 EUR |
| 500+ | 0.43 EUR |
| 1000+ | 0.41 EUR |
| TDA8922CTH/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 155W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 155W x 1 @ 8Ohm; 75W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 155W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±12.5V ~ 32.5V
Max Output Power x Channels @ Load: 155W x 1 @ 8Ohm; 75W x 2 @ 6Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar