Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 281 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MCIMX6G2AVM07AB | NXP USA Inc. |
 Description: IC MPU I.MX6UL 696MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 696MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 567 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G2CVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G3DVM05AB | NXP USA Inc. |
Description: IC MPU I.MC6UL 528MHZ 289BGA |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PRFX1K80HR5 | NXP USA Inc. |
Description: RF FET 65V 1800W |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S912ZVMBA6F0WLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 15 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S912ZVMBA6F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 15 DigiKey Programmable: Not Verified |
auf Bestellung 1248 Stücke: Lieferzeit 10-14 Tag (e) |
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S12ZVMBEVB | NXP USA Inc. |
Description: S12ZVMBEVB EVALUATION BOARD |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| NHS3152THADADKUL | NXP USA Inc. |
Description: THERAPY ADHERENCE NHS3152 KIT Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX7D2DVM12SD | NXP USA Inc. |
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA Part Status: Active Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Display & Interface Controllers: Keypad, LCD, MIPI Graphics Acceleration: No Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 541-LFBGA Packaging: Tray Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 541-MAPBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Operating Temperature: 0°C ~ 85°C (TJ) |
auf Bestellung 252 Stücke: Lieferzeit 10-14 Tag (e) |
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| PREV601M | NXP USA Inc. |
Description: EVAL BOARD FOR PRH601 Utilized IC / Part: PRH601 Contents: Board(s) Supplied Contents: Board(s) Type: Near Field Communication (NFC) Frequency: 13.56MHz For Use With/Related Products: PRH601 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX6G1CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 786 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G2CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 1009 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G3CVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 272BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCIMX6G3CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 713 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I20D040NR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB Part Status: Active Supplier Device Package: TO-270WB-17 Test Frequency: 2.2GHz Gain: 35dB Voltage - Supply: 28V RF Type: W-CDMA Frequency: 1.4GHz ~ 2.2GHz Mounting Type: Surface Mount Package / Case: TO-270-17 Variant, Flat Leads Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| A2T21H140-24SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Current - Test: 350 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: OM780-4 Technology: LDMOS Gain: 17.4dB Power - Output: 169W Configuration: Dual Frequency: 2.11GHz ~ 2.17GHz Current Rating (Amps): 10µA Package / Case: OM780-4 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| A2T20H160W04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Tape & Reel (TR) Package / Case: OM780-4 Current Rating (Amps): 10µA Frequency: 1.88GHz ~ 2.025GHz Configuration: Dual Power - Output: 200W Gain: 17dB Technology: LDMOS Supplier Device Package: OM780-4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 400 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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OL2385AHN/00100Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48HVQFN DigiKey Programmable: Not Verified Part Status: Active Serial Interfaces: SPI, UART Modulation: ASK, FSK GPIO: 12 Supplier Device Package: 48-HVQFN (7x7) Current - Transmitting: 29mA Power - Output: 14dBm Voltage - Supply: 1.9V ~ 5.5V Operating Temperature: -40°C ~ 85°C Type: TxRx + MCU Mounting Type: Surface Mount Sensitivity: -124dBm Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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TFA9896UK/N1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 2.1W 30WLCSP Voltage - Supply: 2.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 30-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 30-WLCSP (2.72x2.06) Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| JN5168-RD6040/S1Z | NXP USA Inc. | Description: REF DESIGN IOT GATEWAY |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5168DB/01Z | NXP USA Inc. | Description: DEMO BOARD JN5168 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5168DB01UL | NXP USA Inc. | Description: DEMO BOARD JN516X |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5168KIT/03Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5168MOD/02Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TRACE ANT DigiKey Programmable: Not Verified Part Status: Obsolete Serial Interfaces: I²C, SPI, UART RF Family/Standard: 802.15.4 Modulation: O-QPSK Antenna Type: Integrated, Trace Current - Transmitting: 15mA Current - Receiving: 17mA Protocol: Zigbee® Data Rate: 1Mbps Power - Output: 2.5dBm Voltage - Supply: 2V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Frequency: 2.4GHz ~ 2.5GHz Sensitivity: -95dBm Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5168RF4/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5169KIT/03Z | NXP USA Inc. | Description: MODULE WIRELESS MCU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5169LIGHT/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5169MOD/02Z | NXP USA Inc. | Description: RX TXRX MOD 802.15.4 TRACE ANT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5169SMA/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN516X-EK001Z | NXP USA Inc. |
Description: EVAL KIT JN516X Part Status: Obsolete Supplied Contents: Board(s) Type: Transceiver; 802.15.4 (ZigBee®) Frequency: 2.4GHz For Use With/Related Products: JN516x Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179-001-SMAZ | NXP USA Inc. |
Description: DEMO OM15025 + OM15026 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179-001-T00Z | NXP USA Inc. |
Description: DEMO OM15024+OM15026 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179-001-T06Z | NXP USA Inc. |
Description: DEMO OM15027+ OM15026 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179DB/01Z | NXP USA Inc. |
Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179KIT/03Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179MOD/02Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| JN5179-SMA-EVAL1Z | NXP USA Inc. | Description: DEMO OM15025 + OM15026 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| E1TDA19978/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA19978RX+TDA19978 Part Status: Obsolete Supplied Contents: Board(s) Utilized IC / Part: TDA19978 Type: Video Function: Video Processing Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| E1TDA19988AET/KIT, | NXP USA Inc. |
Description: KIT MB+DBTDA19988+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| E1TDA9984A/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA9984AHWC1HLD+19978N2T Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| E2TDA19998/BOARD,5 | NXP USA Inc. | Description: EVAL BOARD TDA19998 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MC33663BSEF | NXP USA Inc. | Description: IC TRANSCEIVER HALF 2/2 14SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC33901SNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33901SNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909D3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909D3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909D5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909D5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909L3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909L3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909L5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909L5ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909N3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909N3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909N5AD | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909N5ADR2 | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33909Q3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
MC33909Q3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
MC33909Q5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
MC33909Q5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCIMX6G2AVM07AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 567 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 42.56 EUR |
| 10+ | 34.3 EUR |
| 25+ | 32.23 EUR |
| 100+ | 29.96 EUR |
| 250+ | 28.88 EUR |
| MCIMX6G2CVK05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 30.5 EUR |
| 10+ | 24.32 EUR |
| 25+ | 22.78 EUR |
| 100+ | 21.08 EUR |
| 260+ | 20.24 EUR |
| MCIMX6G3DVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MC6UL 528MHZ 289BGA
Description: IC MPU I.MC6UL 528MHZ 289BGA
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| PRFX1K80HR5 |
|
Hersteller: NXP USA Inc.
Description: RF FET 65V 1800W
Description: RF FET 65V 1800W
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVMBA6F0WLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVMBA6F0MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 1248 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.25 EUR |
| 10+ | 9.49 EUR |
| 25+ | 8.8 EUR |
| 100+ | 8.14 EUR |
| S12ZVMBEVB |
|
Hersteller: NXP USA Inc.
Description: S12ZVMBEVB EVALUATION BOARD
Description: S12ZVMBEVB EVALUATION BOARD
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| NHS3152THADADKUL |
|
Hersteller: NXP USA Inc.
Description: THERAPY ADHERENCE NHS3152 KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: THERAPY ADHERENCE NHS3152 KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX7D2DVM12SD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 85°C (TJ)
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 85°C (TJ)
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 60.63 EUR |
| 10+ | 49.38 EUR |
| 25+ | 46.57 EUR |
| 152+ | 42.77 EUR |
| PREV601M |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PRH601
Utilized IC / Part: PRH601
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: PRH601
Packaging: Box
Description: EVAL BOARD FOR PRH601
Utilized IC / Part: PRH601
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: PRH601
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6G1CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 786 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 27.67 EUR |
| 10+ | 21.99 EUR |
| 25+ | 20.57 EUR |
| 152+ | 18.65 EUR |
| 304+ | 18.14 EUR |
| 608+ | 17.71 EUR |
| MCIMX6G2CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 1009 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 29.15 EUR |
| 10+ | 23.2 EUR |
| 25+ | 21.71 EUR |
| 152+ | 19.7 EUR |
| 304+ | 19.16 EUR |
| 608+ | 18.72 EUR |
| MCIMX6G3CVK05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 272BGA
Description: IC MPU I.MX6UL 272BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6G3CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 713 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 33.95 EUR |
| 10+ | 27.17 EUR |
| 25+ | 25.48 EUR |
| 100+ | 23.61 EUR |
| 250+ | 22.72 EUR |
| A2I20D040NR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Part Status: Active
Supplier Device Package: TO-270WB-17
Test Frequency: 2.2GHz
Gain: 35dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Part Status: Active
Supplier Device Package: TO-270WB-17
Test Frequency: 2.2GHz
Gain: 35dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| A2T21H140-24SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Current - Test: 350 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM780-4
Technology: LDMOS
Gain: 17.4dB
Power - Output: 169W
Configuration: Dual
Frequency: 2.11GHz ~ 2.17GHz
Current Rating (Amps): 10µA
Package / Case: OM780-4
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V OM780-4
Current - Test: 350 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: OM780-4
Technology: LDMOS
Gain: 17.4dB
Power - Output: 169W
Configuration: Dual
Frequency: 2.11GHz ~ 2.17GHz
Current Rating (Amps): 10µA
Package / Case: OM780-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2T20H160W04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 1.88GHz ~ 2.025GHz
Configuration: Dual
Power - Output: 200W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: OM780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 1.88GHz ~ 2.025GHz
Configuration: Dual
Power - Output: 200W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: OM780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
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| OL2385AHN/00100Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: SPI, UART
Modulation: ASK, FSK
GPIO: 12
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 29mA
Power - Output: 14dBm
Voltage - Supply: 1.9V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Mounting Type: Surface Mount
Sensitivity: -124dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF TXRX+MCU 48HVQFN
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: SPI, UART
Modulation: ASK, FSK
GPIO: 12
Supplier Device Package: 48-HVQFN (7x7)
Current - Transmitting: 29mA
Power - Output: 14dBm
Voltage - Supply: 1.9V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Mounting Type: Surface Mount
Sensitivity: -124dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| TFA9896UK/N1Z |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 30-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 30-WLCSP (2.72x2.06)
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 30-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 30-WLCSP (2.72x2.06)
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Produkt ist nicht verfügbar
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| JN5168-RD6040/S1Z |
Hersteller: NXP USA Inc.
Description: REF DESIGN IOT GATEWAY
Description: REF DESIGN IOT GATEWAY
Produkt ist nicht verfügbar
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| JN5168DB/01Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD JN5168
Description: DEMO BOARD JN5168
Produkt ist nicht verfügbar
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| JN5168DB01UL |
Hersteller: NXP USA Inc.
Description: DEMO BOARD JN516X
Description: DEMO BOARD JN516X
Produkt ist nicht verfügbar
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| JN5168KIT/03Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
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| JN5168MOD/02Z |
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: I²C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15mA
Current - Receiving: 17mA
Protocol: Zigbee®
Data Rate: 1Mbps
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz ~ 2.5GHz
Sensitivity: -95dBm
Packaging: Bulk
Description: RF TXRX MOD 802.15.4 TRACE ANT
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: I²C, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
Antenna Type: Integrated, Trace
Current - Transmitting: 15mA
Current - Receiving: 17mA
Protocol: Zigbee®
Data Rate: 1Mbps
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Frequency: 2.4GHz ~ 2.5GHz
Sensitivity: -95dBm
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| JN5168RF4/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
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| JN5169KIT/03Z |
Hersteller: NXP USA Inc.
Description: MODULE WIRELESS MCU
Description: MODULE WIRELESS MCU
Produkt ist nicht verfügbar
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| JN5169LIGHT/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
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| JN5169MOD/02Z |
Hersteller: NXP USA Inc.
Description: RX TXRX MOD 802.15.4 TRACE ANT
Description: RX TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
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| JN5169SMA/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
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| JN516X-EK001Z |
|
Hersteller: NXP USA Inc.
Description: EVAL KIT JN516X
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: JN516x
Packaging: Bulk
Description: EVAL KIT JN516X
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4 (ZigBee®)
Frequency: 2.4GHz
For Use With/Related Products: JN516x
Packaging: Bulk
Produkt ist nicht verfügbar
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| JN5179-001-SMAZ |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15025 + OM15026
Description: DEMO OM15025 + OM15026
Produkt ist nicht verfügbar
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| JN5179-001-T00Z |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15024+OM15026
Description: DEMO OM15024+OM15026
Produkt ist nicht verfügbar
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| JN5179-001-T06Z |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15027+ OM15026
Description: DEMO OM15027+ OM15026
Produkt ist nicht verfügbar
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| JN5179DB/01Z |
|
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
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| JN5179KIT/03Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
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| JN5179MOD/02Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
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| JN5179-SMA-EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO OM15025 + OM15026
Description: DEMO OM15025 + OM15026
Produkt ist nicht verfügbar
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| E1TDA19978/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA19978RX+TDA19978
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA19978
Type: Video
Function: Video Processing
Packaging: Box
Description: EVALKIT TDA19978RX+TDA19978
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA19978
Type: Video
Function: Video Processing
Packaging: Box
Produkt ist nicht verfügbar
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| E1TDA19988AET/KIT, |
Hersteller: NXP USA Inc.
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| E1TDA9984A/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| E2TDA19998/BOARD,5 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD TDA19998
Description: EVAL BOARD TDA19998
Produkt ist nicht verfügbar
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| MC33663BSEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Produkt ist nicht verfügbar
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| MC33901SNEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33901SNEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909D3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909D3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909D5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909D5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909L3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909L3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909L5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909L5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909N3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909N3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909N5AD |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909N5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909Q3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909Q3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909Q5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33909Q5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH