Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34145) > Seite 283 nach 570
| Foto | Bezeichnung | Hersteller | Beschreibung |
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S912ZVMBA6F0MLF | NXP USA Inc. |
 Description: IC MCU 16BIT 64KB FLASH 48LQFP |
auf Bestellung 1250 Stücke: Lieferzeit 21-28 Tag (e) |
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S12ZVMBEVB | NXP USA Inc. |
Description: S12ZVMBEVB EVALUATION BOARD |
auf Bestellung 13 Stücke: Lieferzeit 21-28 Tag (e) |
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| NHS3152THADADKUL | NXP USA Inc. |
Description: THERAPY ADHERENCE NHS3152 KIT Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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MCIMX7D2DVM12SD | NXP USA Inc. |
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA Packaging: Tray Package / Case: 541-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 541-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART Part Status: Active |
auf Bestellung 168 Stücke: Lieferzeit 21-28 Tag (e) |
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| PREV601M | NXP USA Inc. |
Description: EVAL BOARD FOR PRH601 |
Produkt ist nicht verfügbar |
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MCIMX6G1CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 760 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6G2CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 1083 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX6G3CVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 272BGA |
Produkt ist nicht verfügbar |
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MCIMX6G3CVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 104 Stücke: Lieferzeit 21-28 Tag (e) |
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A2I20D040NR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 35dB Test Frequency: 2.2GHz Supplier Device Package: TO-270WB-17 Part Status: Active |
Produkt ist nicht verfügbar |
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| A2T21H140-24SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Tape & Reel (TR) Package / Case: OM780-4 Current Rating (Amps): 10µA Frequency: 2.11GHz ~ 2.17GHz Configuration: Dual Power - Output: 169W Gain: 17.4dB Technology: LDMOS Supplier Device Package: OM780-4 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 350 mA |
Produkt ist nicht verfügbar |
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| A2T20H160W04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Tape & Reel (TR) Package / Case: OM780-4 Current Rating (Amps): 10µA Frequency: 1.88GHz ~ 2.025GHz Configuration: Dual Power - Output: 200W Gain: 17dB Technology: LDMOS Supplier Device Package: OM780-4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 400 mA |
Produkt ist nicht verfügbar |
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OL2385AHN/00100Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TFA9896UK/N1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 2.1W 30WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Package / Case: 30-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm Supplier Device Package: 30-WLCSP (2.72x2.06) Part Status: Active |
Produkt ist nicht verfügbar |
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| JN5168-RD6040/S1Z | NXP USA Inc. | Description: REF DESIGN IOT GATEWAY |
Produkt ist nicht verfügbar |
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| JN5168DB/01Z | NXP USA Inc. | Description: DEMO BOARD JN5168 |
Produkt ist nicht verfügbar |
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| JN5168DB01UL | NXP USA Inc. | Description: DEMO BOARD JN516X |
Produkt ist nicht verfügbar |
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| JN5168KIT/03Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
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| JN5168MOD/02Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TRACE ANT Packaging: Bulk Sensitivity: -95dBm Frequency: 2.4GHz ~ 2.5GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Data Rate: 1Mbps Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 15mA Antenna Type: Integrated, Trace Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I²C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| JN5168RF4/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
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| JN5169KIT/03Z | NXP USA Inc. | Description: MODULE WIRELESS MCU |
Produkt ist nicht verfügbar |
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| JN5169LIGHT/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
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| JN5169MOD/02Z | NXP USA Inc. | Description: RX TXRX MOD 802.15.4 TRACE ANT |
Produkt ist nicht verfügbar |
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| JN5169SMA/EVAL1Z | NXP USA Inc. | Description: DEMO BOARD WIRELESS MCU |
Produkt ist nicht verfügbar |
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| JN516X-EK001Z | NXP USA Inc. |
Description: EVAL KIT JN516X Packaging: Bulk For Use With/Related Products: JN516x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| JN5179-001-SMAZ | NXP USA Inc. |
Description: DEMO OM15025 + OM15026 |
Produkt ist nicht verfügbar |
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| JN5179-001-T00Z | NXP USA Inc. |
Description: DEMO OM15024+OM15026 |
Produkt ist nicht verfügbar |
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| JN5179-001-T06Z | NXP USA Inc. |
Description: DEMO OM15027+ OM15026 |
Produkt ist nicht verfügbar |
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| JN5179DB/01Z | NXP USA Inc. |
Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179KIT/03Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179MOD/02Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179-SMA-EVAL1Z | NXP USA Inc. | Description: DEMO OM15025 + OM15026 |
Produkt ist nicht verfügbar |
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| E1TDA19978/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA19978RX+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E1TDA19988AET/KIT, | NXP USA Inc. |
Description: KIT MB+DBTDA19988+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E1TDA9984A/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA9984AHWC1HLD+19978N2T Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E2TDA19998/BOARD,5 | NXP USA Inc. | Description: EVAL BOARD TDA19998 |
Produkt ist nicht verfügbar |
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| MC33663BSEF | NXP USA Inc. | Description: IC TRANSCEIVER HALF 2/2 14SOIC |
Produkt ist nicht verfügbar |
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MC33901SNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33901SNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33909D3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L5ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N5AD | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N5ADR2 | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC34901WNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC34901WNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MFRC53101W/X3E,005 | NXP USA Inc. | Description: CL READER SYSTEMS UNCASED |
Produkt ist nicht verfügbar |
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| OM15031Z | NXP USA Inc. | Description: BOARD LIGHTING DVR SLN61 |
Produkt ist nicht verfügbar |
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| OM15035Z | NXP USA Inc. | Description: DEMO RASPBERRY PI MODEL |
Produkt ist nicht verfügbar |
| S912ZVMBA6F0MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Description: IC MCU 16BIT 64KB FLASH 48LQFP
auf Bestellung 1250 Stücke:
Lieferzeit 21-28 Tag (e)| S12ZVMBEVB |
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Hersteller: NXP USA Inc.
Description: S12ZVMBEVB EVALUATION BOARD
Description: S12ZVMBEVB EVALUATION BOARD
auf Bestellung 13 Stücke:
Lieferzeit 21-28 Tag (e)| NHS3152THADADKUL |
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Hersteller: NXP USA Inc.
Description: THERAPY ADHERENCE NHS3152 KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: THERAPY ADHERENCE NHS3152 KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MCIMX7D2DVM12SD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Packaging: Tray
Package / Case: 541-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 541-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Part Status: Active
Description: IC MPU I.MX7D 1.2GHZ 541MAPBGA
Packaging: Tray
Package / Case: 541-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 541-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Part Status: Active
auf Bestellung 168 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 86.66 EUR |
| 10+ | 69.48 EUR |
| 152+ | 59.34 EUR |
| MCIMX6G1CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 760 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 48.1 EUR |
| 10+ | 38.45 EUR |
| 152+ | 32.47 EUR |
| 456+ | 32.28 EUR |
| MCIMX6G2CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 1083 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 50.93 EUR |
| 10+ | 40.69 EUR |
| 152+ | 34.36 EUR |
| 456+ | 34.15 EUR |
| MCIMX6G3CVK05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 272BGA
Description: IC MPU I.MX6UL 272BGA
Produkt ist nicht verfügbar
| MCIMX6G3CVM05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 104 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 55.33 EUR |
| 10+ | 44.37 EUR |
| 80+ | 37.89 EUR |
| A2I20D040NR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Produkt ist nicht verfügbar
| A2T21H140-24SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.17GHz
Configuration: Dual
Power - Output: 169W
Gain: 17.4dB
Technology: LDMOS
Supplier Device Package: OM780-4
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 350 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 2.11GHz ~ 2.17GHz
Configuration: Dual
Power - Output: 169W
Gain: 17.4dB
Technology: LDMOS
Supplier Device Package: OM780-4
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
| A2T20H160W04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 1.88GHz ~ 2.025GHz
Configuration: Dual
Power - Output: 200W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: OM780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM780-4
Current Rating (Amps): 10µA
Frequency: 1.88GHz ~ 2.025GHz
Configuration: Dual
Power - Output: 200W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: OM780-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 400 mA
Produkt ist nicht verfügbar
| OL2385AHN/00100Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TFA9896UK/N1Z |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 30-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Supplier Device Package: 30-WLCSP (2.72x2.06)
Part Status: Active
Produkt ist nicht verfügbar
| JN5168-RD6040/S1Z |
Hersteller: NXP USA Inc.
Description: REF DESIGN IOT GATEWAY
Description: REF DESIGN IOT GATEWAY
Produkt ist nicht verfügbar
| JN5168KIT/03Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
| JN5168MOD/02Z |
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Packaging: Bulk
Sensitivity: -95dBm
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Data Rate: 1Mbps
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TRACE ANT
Packaging: Bulk
Sensitivity: -95dBm
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Data Rate: 1Mbps
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5168RF4/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
| JN5169LIGHT/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
| JN5169MOD/02Z |
Hersteller: NXP USA Inc.
Description: RX TXRX MOD 802.15.4 TRACE ANT
Description: RX TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
| JN5169SMA/EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
| JN516X-EK001Z |
|
Hersteller: NXP USA Inc.
Description: EVAL KIT JN516X
Packaging: Bulk
For Use With/Related Products: JN516x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL KIT JN516X
Packaging: Bulk
For Use With/Related Products: JN516x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| JN5179-001-SMAZ |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15025 + OM15026
Description: DEMO OM15025 + OM15026
Produkt ist nicht verfügbar
| JN5179-001-T00Z |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15024+OM15026
Description: DEMO OM15024+OM15026
Produkt ist nicht verfügbar
| JN5179-001-T06Z |
|
Hersteller: NXP USA Inc.
Description: DEMO OM15027+ OM15026
Description: DEMO OM15027+ OM15026
Produkt ist nicht verfügbar
| JN5179DB/01Z |
|
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179KIT/03Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179MOD/02Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179-SMA-EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO OM15025 + OM15026
Description: DEMO OM15025 + OM15026
Produkt ist nicht verfügbar
| E1TDA19978/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E1TDA19988AET/KIT, |
Hersteller: NXP USA Inc.
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E1TDA9984A/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E2TDA19998/BOARD,5 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD TDA19998
Description: EVAL BOARD TDA19998
Produkt ist nicht verfügbar
| MC33663BSEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Produkt ist nicht verfügbar
| MC33901SNEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC33901SNEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC33909D3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N5AD |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC34901WNEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC34901WNEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MFRC53101W/X3E,005 |
Hersteller: NXP USA Inc.
Description: CL READER SYSTEMS UNCASED
Description: CL READER SYSTEMS UNCASED
Produkt ist nicht verfügbar