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MIMXRT1064CVL5B MIMXRT1064CVL5B NXP USA Inc. IMXRT1064IEC.pdf Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 436 Stücke:
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1+24.83 EUR
10+19.68 EUR
25+18.39 EUR
240+16.32 EUR
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T1042NSE7PQB T1042NSE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 60 Stücke:
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1+259.76 EUR
10+220.57 EUR
60+203.52 EUR
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BT132-600D,116 NXP USA Inc. Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Part Status: Active
auf Bestellung 16749 Stücke:
Lieferzeit 10-14 Tag (e)
2323+0.22 EUR
Mindestbestellmenge: 2323
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LPC54113J256UK49012 LPC54113J256UK49012 NXP USA Inc. LPC5411X.pdf Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
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MK20DX256VLH7557 MK20DX256VLH7557 NXP USA Inc. K20P64M72SF1.pdf Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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74HC4538PW-Q100118 74HC4538PW-Q100118 NXP USA Inc. 74HC4538_Q100.pdf Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Produkt ist nicht verfügbar
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PBSS3540E,115 PBSS3540E,115 NXP USA Inc. PBSS3540E.pdf Description: TRANS PNP 40V 0.5A SC-75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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FRWY-LS1046A-TP FRWY-LS1046A-TP NXP USA Inc. FRWY-LS1046AGSG.pdf Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
auf Bestellung 4 Stücke:
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1+1788.88 EUR
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NE57811S/N1,518 NE57811S/N1,518 NXP USA Inc. NE57811.pdf Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Bulk
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK
auf Bestellung 5501 Stücke:
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329+1.48 EUR
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MC68HCP11E1CFNE3,574 MC68HCP11E1CFNE3,574 NXP USA Inc. M68HC11E.pdf Description: MICROCONTROLLER, 8 BIT, HC11 CPU
auf Bestellung 1355 Stücke:
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19+27.33 EUR
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PMF87EN,115 PMF87EN,115 NXP USA Inc. PMF87EN.pdf Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
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2959+0.16 EUR
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SPC5747CBK0ACKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
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PCA9536D118 PCA9536D118 NXP USA Inc. PCA9536.pdf Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QT2ACDWER-NXP MC908QT2ACDWER-NXP NXP USA Inc. FSCLS07407-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
auf Bestellung 326 Stücke:
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114+4.30 EUR
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MC908QB4CDWE-NXP MC908QB4CDWE-NXP NXP USA Inc. FSCLS07008-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1645 Stücke:
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86+5.67 EUR
Mindestbestellmenge: 86
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MKE15Z64VFP4 MKE15Z64VFP4 NXP USA Inc. KE1xZP48M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
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3+6.35 EUR
10+4.80 EUR
25+4.41 EUR
80+4.04 EUR
230+3.79 EUR
490+3.65 EUR
Mindestbestellmenge: 3
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TJF1051T/CM118 TJF1051T/CM118 NXP USA Inc. TJF1051.pdf Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX384-B6V8/ZLX BZX384-B6V8/ZLX NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 6.8V 300MW SOD323
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Produkt ist nicht verfügbar
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PMEG045V150EPD139 PMEG045V150EPD139 NXP USA Inc. PMEG045V150EPD.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 1005000 Stücke:
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838+0.63 EUR
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PMEG045T150EPD139 NXP USA Inc. PMEG045T150EPD.pdf Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
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PMEG060V100EPD139 NXP USA Inc. PMEG060V100EPD.pdf Description: RECTIFIER DIODE, SCHOTTKY
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SLN-VIZNAS-IOT SLN-VIZNAS-IOT NXP USA Inc. SLN-VIZNAS-IOT-UG.pdf Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
auf Bestellung 10 Stücke:
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1+399.06 EUR
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MIMXRT1061DVJ6A NXP USA Inc. IMXRT1060CEC.pdf Description: I.MXRT1060
Produkt ist nicht verfügbar
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S9S12P96J0CFT S9S12P96J0CFT NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVCH8T245PW 74LVCH8T245PW NXP USA Inc. PHGLS23929-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Produkt ist nicht verfügbar
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BUK9E1R9-40E,127 BUK9E1R9-40E,127 NXP USA Inc. Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
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BUK762R9-40E118 BUK762R9-40E118 NXP USA Inc. BUK762R9-40E.pdf Description: NOW NEXPERIA BUK762R9-40E 100A,
Produkt ist nicht verfügbar
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PDTA114YU/L115 PDTA114YU/L115 NXP USA Inc. PHGLS24116-1.pdf?t.download=true&u=5oefqw Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PN5180A0ET/C4QL PN5180A0ET/C4QL NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Produkt ist nicht verfügbar
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TEF8101EN/N1E NXP USA Inc. TEF810XDS.pdf Description: RADAR
Produkt ist nicht verfügbar
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TEF8101EN/N1Y NXP USA Inc. TEF810XDS.pdf Description: RADAR
Produkt ist nicht verfügbar
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NVT2001GM,115 NVT2001GM,115 NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 460205 Stücke:
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792+0.64 EUR
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NVT2001GMZ NVT2001GMZ NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NVT2001GM,115 NVT2001GM,115 NXP USA Inc. NVT2001_NVT2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCA9306GF,115 PCA9306GF,115 NXP USA Inc. PCA9306.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
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BCP56H115 BCP56H115 NXP USA Inc. BCP56H_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAP64-04W NXP USA Inc. PHGLS21690-1.pdf?t.download=true&u=5oefqw Description: DIODE PIN 175V 100MA SOT-23
Produkt ist nicht verfügbar
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BAP64-06W,115 BAP64-06W,115 NXP USA Inc. BAP64-06W.pdf Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP64-02115 NXP USA Inc. Description: PIN DIODE 175V
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A7102CHTK2/T0BC2AJ A7102CHTK2/T0BC2AJ NXP USA Inc. A71CH-LEAFLET.pdf Description: SECURE AUTHENTICATION
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5905 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.44 EUR
10+4.09 EUR
25+3.75 EUR
100+3.38 EUR
250+3.20 EUR
500+3.09 EUR
1000+3.00 EUR
2500+2.91 EUR
Mindestbestellmenge: 4
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BZX585-C15135 BZX585-C15135 NXP USA Inc. BZX585_SERIES.pdf Description: DIODE ZENER 15V 300MW SOD523
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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BA591115 BA591115 NXP USA Inc. _BA591.pdf?t.download=true&u=ovmfp3 Description: DIODE STANDARD 35V 500MW SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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SPC5741PK1AMLQ5 SPC5741PK1AMLQ5 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMMM5 SPC5741PK1AMMM5 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMMM5R SPC5741PK1AMMM5R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMLQ9 SPC5741PK1AMLQ9 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMLQ9R SPC5741PK1AMLQ9R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AKLQ8 SPC5741PK1AKLQ8 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU768F115 BFU768F115 NXP USA Inc. BFU768F.pdf Description: NPN WIDEBAND SILICON GERMANIUM R
Packaging: Bulk
Part Status: Active
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
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BUK964R2-80E118 BUK964R2-80E118 NXP USA Inc. BUK964R2-80E.pdf Description: NOW NEXPERIA BUK964R2-80E - POWE
Produkt ist nicht verfügbar
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BF1118R,215 BF1118R,215 NXP USA Inc. BF1118%28R%2CW%2CWR%29.pdf Description: IC RF SWITCH 1GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143R
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BF1118,215 BF1118,215 NXP USA Inc. BF1118%28R%2CW%2CWR%29.pdf Description: IC RF SWITCH 1GHZ SOT143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143B
Part Status: Obsolete
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MCIMX6U6AVM08AC557 NXP USA Inc. IMX6SDLAEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XEQ384BMAG S912XEQ384BMAG NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UBA2021P_N2112 UBA2021P_N2112 NXP USA Inc. PHGLS15807-1.pdf?t.download=true&u=5oefqw Description: HALF BRIDGE BASED PERIPHERAL DRI
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13541UL NXP USA Inc. UM11099.pdf Description: EVAL BOARD FOR OM13541
Packaging: Box
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: OM13541
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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JN5189HN/001Z JN5189HN/001Z NXP USA Inc. JN5189.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
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1000+6.50 EUR
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74ALVC04PW,118 74ALVC04PW,118 NXP USA Inc. PHGLS17382-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 20 µA
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74ALVC04BQ,115 74ALVC04BQ,115 NXP USA Inc. PHGLS17382-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 20 µA
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BAT17235 BAT17235 NXP USA Inc. BAT17.pdf Description: NOW NEXPERIA BAT17 - SCHOTTKY BA
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: 100°C (TJ)
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Resistance @ If, F: 15Ohm @ 5mA, 1kHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: TO-236AB
Current - Max: 30 mA
Grade: Automotive
Qualification: AEC-Q100
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4768+0.10 EUR
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MIMXRT1064CVL5B IMXRT1064IEC.pdf
MIMXRT1064CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+24.83 EUR
10+19.68 EUR
25+18.39 EUR
240+16.32 EUR
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T1042NSE7PQB T1FAMILYFS.pdf
T1042NSE7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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1+259.76 EUR
10+220.57 EUR
60+203.52 EUR
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BT132-600D,116
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Part Status: Active
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Anzahl Preis
2323+0.22 EUR
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LPC54113J256UK49012 LPC5411X.pdf
LPC54113J256UK49012
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
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MK20DX256VLH7557 K20P64M72SF1.pdf
MK20DX256VLH7557
Hersteller: NXP USA Inc.
Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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74HC4538PW-Q100118 74HC4538_Q100.pdf
74HC4538PW-Q100118
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Produkt ist nicht verfügbar
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PBSS3540E,115 PBSS3540E.pdf
PBSS3540E,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.5A SC-75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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FRWY-LS1046A-TP FRWY-LS1046AGSG.pdf
FRWY-LS1046A-TP
Hersteller: NXP USA Inc.
Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
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NE57811S/N1,518 NE57811.pdf
NE57811S/N1,518
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 5SPAK
Packaging: Bulk
Package / Case: SPak-5 (5 leads + Tab)
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 1.6V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Applications: Converter, DDR
Supplier Device Package: 5-SPAK
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329+1.48 EUR
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MC68HCP11E1CFNE3,574 M68HC11E.pdf
MC68HCP11E1CFNE3,574
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC11 CPU
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19+27.33 EUR
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PMF87EN,115 PMF87EN.pdf
PMF87EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
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2959+0.16 EUR
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SPC5747CBK0ACKU6 MPC5748G.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
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PCA9536D118 PCA9536.pdf
PCA9536D118
Hersteller: NXP USA Inc.
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QT2ACDWER-NXP FSCLS07407-1.pdf?t.download=true&u=5oefqw
MC908QT2ACDWER-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
auf Bestellung 326 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
114+4.30 EUR
Mindestbestellmenge: 114
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MC908QB4CDWE-NXP FSCLS07008-1.pdf?t.download=true&u=5oefqw
MC908QB4CDWE-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1645 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
86+5.67 EUR
Mindestbestellmenge: 86
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MKE15Z64VFP4 KE1xZP48M48SF0.pdf
MKE15Z64VFP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.35 EUR
10+4.80 EUR
25+4.41 EUR
80+4.04 EUR
230+3.79 EUR
490+3.65 EUR
Mindestbestellmenge: 3
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TJF1051T/CM118 TJF1051.pdf
TJF1051T/CM118
Hersteller: NXP USA Inc.
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX384-B6V8/ZLX BZX384_SER.pdf
BZX384-B6V8/ZLX
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.8V 300MW SOD323
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Produkt ist nicht verfügbar
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PMEG045V150EPD139 PMEG045V150EPD.pdf
PMEG045V150EPD139
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 1005000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
838+0.63 EUR
Mindestbestellmenge: 838
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PMEG045T150EPD139 PMEG045T150EPD.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
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PMEG060V100EPD139 PMEG060V100EPD.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
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SLN-VIZNAS-IOT SLN-VIZNAS-IOT-UG.pdf
SLN-VIZNAS-IOT
Hersteller: NXP USA Inc.
Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+399.06 EUR
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MIMXRT1061DVJ6A IMXRT1060CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MXRT1060
Produkt ist nicht verfügbar
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S9S12P96J0CFT
S9S12P96J0CFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVCH8T245PW PHGLS23929-1.pdf?t.download=true&u=5oefqw
74LVCH8T245PW
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Produkt ist nicht verfügbar
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BUK9E1R9-40E,127
BUK9E1R9-40E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
auf Bestellung 4974 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
317+1.59 EUR
Mindestbestellmenge: 317
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BUK762R9-40E118 BUK762R9-40E.pdf
BUK762R9-40E118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK762R9-40E 100A,
Produkt ist nicht verfügbar
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PDTA114YU/L115 PHGLS24116-1.pdf?t.download=true&u=5oefqw
PDTA114YU/L115
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PN5180A0ET/C4QL PN5180A0XX-C1-C2.pdf
PN5180A0ET/C4QL
Hersteller: NXP USA Inc.
Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Produkt ist nicht verfügbar
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TEF8101EN/N1E TEF810XDS.pdf
Hersteller: NXP USA Inc.
Description: RADAR
Produkt ist nicht verfügbar
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TEF8101EN/N1Y TEF810XDS.pdf
Hersteller: NXP USA Inc.
Description: RADAR
Produkt ist nicht verfügbar
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NVT2001GM,115 NVT2001_NVT2002.pdf
NVT2001GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 460205 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
792+0.64 EUR
Mindestbestellmenge: 792
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NVT2001GMZ NVT2001_NVT2002.pdf
NVT2001GMZ
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NVT2001GM,115 NVT2001_NVT2002.pdf
NVT2001GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCA9306GF,115 PCA9306.pdf
PCA9306GF,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
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BCP56H115 BCP56H_SER.pdf
BCP56H115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAP64-04W PHGLS21690-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE PIN 175V 100MA SOT-23
Produkt ist nicht verfügbar
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BAP64-06W,115 BAP64-06W.pdf
BAP64-06W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 100V 240MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Anode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.35Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 100V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP64-02115
Hersteller: NXP USA Inc.
Description: PIN DIODE 175V
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A7102CHTK2/T0BC2AJ A71CH-LEAFLET.pdf
A7102CHTK2/T0BC2AJ
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5905 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.44 EUR
10+4.09 EUR
25+3.75 EUR
100+3.38 EUR
250+3.20 EUR
500+3.09 EUR
1000+3.00 EUR
2500+2.91 EUR
Mindestbestellmenge: 4
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BZX585-C15135 BZX585_SERIES.pdf
BZX585-C15135
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 300MW SOD523
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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BA591115 _BA591.pdf?t.download=true&u=ovmfp3
BA591115
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 35V 500MW SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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SPC5741PK1AMLQ5 MPC574xPFS.pdf
SPC5741PK1AMLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMMM5
SPC5741PK1AMMM5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMMM5R
SPC5741PK1AMMM5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AMLQ9
SPC5741PK1AMLQ9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5741PK1AMLQ9R
SPC5741PK1AMLQ9R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5741PK1AKLQ8 MPC574xPFS.pdf
SPC5741PK1AKLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU768F115 BFU768F.pdf
BFU768F115
Hersteller: NXP USA Inc.
Description: NPN WIDEBAND SILICON GERMANIUM R
Packaging: Bulk
Part Status: Active
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
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BUK964R2-80E118 BUK964R2-80E.pdf
BUK964R2-80E118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK964R2-80E - POWE
Produkt ist nicht verfügbar
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BF1118R,215 BF1118%28R%2CW%2CWR%29.pdf
BF1118R,215
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143R
auf Bestellung 6597 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1268+0.38 EUR
Mindestbestellmenge: 1268
Im Einkaufswagen  Stück im Wert von  UAH
BF1118,215 BF1118%28R%2CW%2CWR%29.pdf
BF1118,215
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ SOT143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143B
Part Status: Obsolete
auf Bestellung 6190 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1268+0.38 EUR
Mindestbestellmenge: 1268
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MCIMX6U6AVM08AC557 IMX6SDLAEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XEQ384BMAG
S912XEQ384BMAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UBA2021P_N2112 PHGLS15807-1.pdf?t.download=true&u=5oefqw
UBA2021P_N2112
Hersteller: NXP USA Inc.
Description: HALF BRIDGE BASED PERIPHERAL DRI
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13541UL UM11099.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR OM13541
Packaging: Box
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: OM13541
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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JN5189HN/001Z JN5189.pdf
JN5189HN/001Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+6.50 EUR
Mindestbestellmenge: 1000
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74ALVC04PW,118 PHGLS17382-1.pdf?t.download=true&u=5oefqw
74ALVC04PW,118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 20 µA
auf Bestellung 12500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2086+0.23 EUR
Mindestbestellmenge: 2086
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74ALVC04BQ,115 PHGLS17382-1.pdf?t.download=true&u=5oefqw
74ALVC04BQ,115
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 20 µA
auf Bestellung 32491 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2187+0.23 EUR
Mindestbestellmenge: 2187
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BAT17235 BAT17.pdf
BAT17235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAT17 - SCHOTTKY BA
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - Single
Operating Temperature: 100°C (TJ)
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Resistance @ If, F: 15Ohm @ 5mA, 1kHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: TO-236AB
Current - Max: 30 mA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4768+0.10 EUR
Mindestbestellmenge: 4768
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