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PDTC123JU PDTC123JU NXP USA Inc. PHGLS24124-1.pdf?t.download=true&u=5oefqw Description: PDTC123J SERIES - NPN RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDTC123JU/ZLX NXP USA Inc. PHGLS24124-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN SC70
Packaging: Tape & Reel (TR)
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PESD3V3X1BL315 PESD3V3X1BL315 NXP USA Inc. PESD3V3X1BL.pdf Description: NOW NEXPERIA PESD3V3X1BL TRANS V
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT4066DB118 74HCT4066DB118 NXP USA Inc. 74HC_HCT4066.pdf Description: NOW NEXPERIA 74HCT4066DB - SPST,
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 20Ohm (Typ)
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Active
Number of Circuits: 4
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NXQ1TXH5DB1355 NXP USA Inc. UM11152.pdf Description: NXQ1TXH5 PLUG IN
Packaging: Bulk
For Use With/Related Products: LPC824
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
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PBSS4021NT/WD215 PBSS4021NT/WD215 NXP USA Inc. PHGLS20430-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 400mA, 4A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 2A, 2V
Frequency - Transition: 165MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 4.3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 1.1 W
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PBSS4032NX/DG/B2115 PBSS4032NX/DG/B2115 NXP USA Inc. PHGLS20538-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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S9S08RN32W1VLF S9S08RN32W1VLF NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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PMEG4030ER115 PMEG4030ER115 NXP USA Inc. PMEG4030ER.pdf Description: NOW NEXPERIA PMEG4030ER RECTIFIE
Packaging: Bulk
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74ALVC16245DGG/C1118 74ALVC16245DGG/C1118 NXP USA Inc. PHGLS17690-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCVR
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74LVC27DB,118 74LVC27DB,118 NXP USA Inc. 74LVC27.pdf Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
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LPC4088FBD144,551 LPC4088FBD144,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
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MCIMX7S5EVK08SD MCIMX7S5EVK08SD NXP USA Inc. IMX7SCEC.pdf Description: IC MPU I.MX7S 800MHZ 488TFBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 488-TFBGA (12x12)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 488-TFBGA
Packaging: Bulk
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MCIMX7U3CVP06SD MCIMX7U3CVP06SD NXP USA Inc. IMX7ULPCEC.pdf Description: IC I.MX 7ULP MAPBGA 393
Packaging: Tray
Package / Case: 393-LFBGA
Mounting Type: Surface Mount
Speed: 650MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 393-VFBGA (14x14)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
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MCIMX7U5CVP06SD MCIMX7U5CVP06SD NXP USA Inc. IMX7ULPIECB2.pdf Description: IC I.MX 7ULP MAPBGA 393
Packaging: Tray
Package / Case: 393-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 393-VFBGA (14x14)
Part Status: Active
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LPC11E11FHN33/101551 LPC11E11FHN33/101551 NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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PTN5150AHX528 NXP USA Inc. PTN5150H.pdf Description: CC LOGIC FOR USB TYPE-C APPLICAT
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN5150AHX NXP USA Inc. PTN5150A.pdf Description: CC LOGIC FOR USB TYPE-C APPLICAT
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BZV85-C11,133 BZV85-C11,133 NXP USA Inc. PHGLS22780-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 11V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7.7 V
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IP4254CZ8-4,118 IP4254CZ8-4,118 NXP USA Inc. IP4251%2C52%2C53%2C54-TTL.pdf Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4
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IP4254CZ12-6,118 IP4254CZ12-6,118 NXP USA Inc. IP4251%2C52%2C53%2C54-TTL.pdf Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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MPC8248CVRPIEA MPC8248CVRPIEA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
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MC9S08QE4CWJ MC9S08QE4CWJ NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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MCIMX6Y2CVM05ABR MCIMX6Y2CVM05ABR NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6Y 528MHZ 289MAPBGA
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MCIMX6S6AVM10ADR NXP USA Inc. IMX6SDLIEC.pdf Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
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FS32V232BMN1VUB NXP USA Inc. Description: ISP GPU NO CSE800MHZ
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FS32V234BJN1VUB FS32V234BJN1VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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TEA1998TS/1X TEA1998TS/1X NXP USA Inc. TEA1998TS.pdf Description: FLYBACK SR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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TEA1993TS/1X TEA1993TS/1X NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
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KITVR5510DA0EVM KITVR5510DA0EVM NXP USA Inc. VR5510.pdf Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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KITVR5510MA0EVM KITVR5510MA0EVM NXP USA Inc. VR5510.pdf Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
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KITVR5510BA0EVM NXP USA Inc. Description: EVAL BOARD VR5510 PMIC
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KITVR5510SKTEVM NXP USA Inc. Description: VR5510 OTP PROG BOARD - SOCKET
Packaging: Bulk
For Use With/Related Products: VR5510
Module/Board Type: Socket Module
Part Status: Active
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74LV164N,112 74LV164N,112 NXP USA Inc. 74LV164_Rev3.pdf Description: IC 8BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 14-DIP
Part Status: Obsolete
Number of Bits per Element: 8
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BZX84-B5V6/DG/B4215 BZX84-B5V6/DG/B4215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZX84-B5V6 - ZENER
Produkt ist nicht verfügbar
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MIMXRT1062CVL5B MIMXRT1062CVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1200+13.64 EUR
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MIMXRT1062CVJ5BR MIMXRT1062CVJ5BR NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1062CVJ5AR NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVL6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVL5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVJ6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVJ5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FET180557 NXP USA Inc. PHGL-S-A0002884601-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 37 Stücke
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LPC4088FET180 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FBD208K LPC4088FBD208K NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
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108+19.74 EUR
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OM13050UL NXP USA Inc. Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 NXP USA Inc. PHGLS24309-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
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74LVT162245BDL,112 74LVT162245BDL,112 NXP USA Inc. 74LVT162245B.pdf Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
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LPC1817JBD144551 LPC1817JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816CX4/16P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6816CX4/C14P,315 LD6816CX4/C14P,315 NXP USA Inc. PHGLS25656-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6816CX4/18P,315 LD6816CX4/18P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6816CX4/25P,315 LD6816CX4/25P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
auf Bestellung 27000 Stücke:
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BLF6G20S-45112 NXP USA Inc. Description: RF POWER TRANSISTORS
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC MCIMX6X1EVK10AC NXP USA Inc. IMX6SXAEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 760 Stücke
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XC540203CZT75A NXP USA Inc. Description: PROCESSOR
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XC540203CZT75AR2 NXP USA Inc. Description: INTEGRATED CIRCUIT
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MCIMX6S1AVM10AD MCIMX6S1AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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MCIMX6S6AVM10AD MCIMX6S6AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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PBSM5240PFH115 NXP USA Inc. PBSM5240PFH.pdf Description: NOW NEXPERIA PBSM5240PFH SMALL S
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 6-HUSON (2x2)
Applications: General Purpose
Transistor Type: PNP, N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 1.8A
Package / Case: 6-UDFN Exposed Pad
Voltage - Rated: 40V
auf Bestellung 63000 Stücke:
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2544+0.23 EUR
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PDTC123JU PHGLS24124-1.pdf?t.download=true&u=5oefqw
PDTC123JU
Hersteller: NXP USA Inc.
Description: PDTC123J SERIES - NPN RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDTC123JU/ZLX PHGLS24124-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN SC70
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PESD3V3X1BL315 PESD3V3X1BL.pdf
PESD3V3X1BL315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PESD3V3X1BL TRANS V
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT4066DB118 74HC_HCT4066.pdf
74HCT4066DB118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4066DB - SPST,
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 20Ohm (Typ)
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Active
Number of Circuits: 4
Produkt ist nicht verfügbar
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NXQ1TXH5DB1355 UM11152.pdf
Hersteller: NXP USA Inc.
Description: NXQ1TXH5 PLUG IN
Packaging: Bulk
For Use With/Related Products: LPC824
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
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PBSS4021NT/WD215 PHGLS20430-1.pdf?t.download=true&u=5oefqw
PBSS4021NT/WD215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 400mA, 4A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 2A, 2V
Frequency - Transition: 165MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 4.3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 1.1 W
Produkt ist nicht verfügbar
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PBSS4032NX/DG/B2115 PHGLS20538-1.pdf?t.download=true&u=5oefqw
PBSS4032NX/DG/B2115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
auf Bestellung 15000 Stücke:
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AnzahlPrivatkunde
1268+0.48 EUR
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S9S08RN32W1VLF S9S08RN60DS.pdf
S9S08RN32W1VLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMEG4030ER115 PMEG4030ER.pdf
PMEG4030ER115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMEG4030ER RECTIFIE
Packaging: Bulk
Produkt ist nicht verfügbar
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74ALVC16245DGG/C1118 PHGLS17690-1.pdf?t.download=true&u=5oefqw
74ALVC16245DGG/C1118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR
auf Bestellung 2000 Stücke:
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545+1.11 EUR
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74LVC27DB,118 74LVC27.pdf
74LVC27DB,118
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
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AnzahlPrivatkunde
1902+0.31 EUR
Mindestbestellmenge: 1902 Stücke
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LPC4088FBD144,551 LPC408X_7X.pdf
LPC4088FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX7S5EVK08SD IMX7SCEC.pdf
MCIMX7S5EVK08SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 488-TFBGA (12x12)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 488-TFBGA
Packaging: Bulk
auf Bestellung 1033 Stücke:
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AnzahlPrivatkunde
12+43.29 EUR
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MCIMX7U3CVP06SD IMX7ULPCEC.pdf
MCIMX7U3CVP06SD
Hersteller: NXP USA Inc.
Description: IC I.MX 7ULP MAPBGA 393
Packaging: Tray
Package / Case: 393-LFBGA
Mounting Type: Surface Mount
Speed: 650MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 393-VFBGA (14x14)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
auf Bestellung 150 Stücke:
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MCIMX7U5CVP06SD IMX7ULPIECB2.pdf
MCIMX7U5CVP06SD
Hersteller: NXP USA Inc.
Description: IC I.MX 7ULP MAPBGA 393
Packaging: Tray
Package / Case: 393-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 393-VFBGA (14x14)
Part Status: Active
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LPC11E11FHN33/101551 LPC11E1X.pdf
LPC11E11FHN33/101551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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PTN5150AHX528 PTN5150H.pdf
Hersteller: NXP USA Inc.
Description: CC LOGIC FOR USB TYPE-C APPLICAT
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN5150AHX PTN5150A.pdf
Hersteller: NXP USA Inc.
Description: CC LOGIC FOR USB TYPE-C APPLICAT
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BZV85-C11,133 PHGLS22780-1.pdf?t.download=true&u=5oefqw
BZV85-C11,133
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 1.3W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-41
Part Status: Active
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7.7 V
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9072+0.058 EUR
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IP4254CZ8-4,118 IP4251%2C52%2C53%2C54-TTL.pdf
IP4254CZ8-4,118
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4
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3806+0.17 EUR
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IP4254CZ12-6,118 IP4251%2C52%2C53%2C54-TTL.pdf
IP4254CZ12-6,118
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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2959+0.2 EUR
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MPC8248CVRPIEA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8248CVRPIEA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Produkt ist nicht verfügbar
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MC9S08QE4CWJ MC9S08QE128.pdf
MC9S08QE4CWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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3+8.07 EUR
10+6.1 EUR
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MCIMX6Y2CVM05ABR IMX6ULLIEC.pdf
MCIMX6Y2CVM05ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Y 528MHZ 289MAPBGA
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1000+17.98 EUR
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MCIMX6S6AVM10ADR IMX6SDLIEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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FS32V232BMN1VUB
Hersteller: NXP USA Inc.
Description: ISP GPU NO CSE800MHZ
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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FS32V234BJN1VUB S32V234.pdf
FS32V234BJN1VUB
Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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TEA1998TS/1X TEA1998TS.pdf
TEA1998TS/1X
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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420+1.25 EUR
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TEA1993TS/1X TEA1993TS.pdf
TEA1993TS/1X
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
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561+1.04 EUR
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KITVR5510DA0EVM VR5510.pdf
KITVR5510DA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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KITVR5510MA0EVM VR5510.pdf
KITVR5510MA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
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1+706.59 EUR
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KITVR5510BA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD VR5510 PMIC
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1+759.09 EUR
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KITVR5510SKTEVM
Hersteller: NXP USA Inc.
Description: VR5510 OTP PROG BOARD - SOCKET
Packaging: Bulk
For Use With/Related Products: VR5510
Module/Board Type: Socket Module
Part Status: Active
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1+1343.97 EUR
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74LV164N,112 74LV164_Rev3.pdf
74LV164N,112
Hersteller: NXP USA Inc.
Description: IC 8BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 14-DIP
Part Status: Obsolete
Number of Bits per Element: 8
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437+1.33 EUR
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BZX84-B5V6/DG/B4215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B5V6/DG/B4215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B5V6 - ZENER
Produkt ist nicht verfügbar
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MIMXRT1062CVL5B IMXRT1060IEC.pdf
MIMXRT1062CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+22.38 EUR
10+17.56 EUR
25+16.36 EUR
240+14.43 EUR
480+14.04 EUR
720+13.85 EUR
1200+13.64 EUR
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MIMXRT1062CVJ5BR IMXRT1060CEC.pdf
MIMXRT1062CVJ5BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1000+15.05 EUR
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MIMXRT1062CVJ5AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FET180557 PHGL-S-A0002884601-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FET180 LPC408X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FBD208K LPC408X_7X.pdf
LPC4088FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
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1+33.07 EUR
10+26.32 EUR
36+20.62 EUR
108+19.74 EUR
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OM13050UL
Hersteller: NXP USA Inc.
Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 PHGLS24309-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4475 Stücke:
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833+0.7 EUR
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74LVT162245BDL,112 74LVT162245B.pdf
74LVT162245BDL,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
auf Bestellung 1414 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
494+1.27 EUR
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LPC1817JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1817JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816.pdf
LD6816CX4/16P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 36000 Stücke:
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AnzahlPrivatkunde
3328+0.18 EUR
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LD6816CX4/C14P,315 PHGLS25656-1.pdf?t.download=true&u=5oefqw
LD6816CX4/C14P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3328+0.18 EUR
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LD6816CX4/18P,315 LD6816.pdf
LD6816CX4/18P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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3328+0.18 EUR
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LD6816CX4/25P,315 LD6816.pdf
LD6816CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
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3328+0.18 EUR
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BLF6G20S-45112
Hersteller: NXP USA Inc.
Description: RF POWER TRANSISTORS
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC IMX6SXAEC.pdf
MCIMX6X1EVK10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC540203CZT75A
Hersteller: NXP USA Inc.
Description: PROCESSOR
auf Bestellung 7091 Stücke:
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XC540203CZT75AR2
Hersteller: NXP USA Inc.
Description: INTEGRATED CIRCUIT
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MCIMX6S1AVM10AD
MCIMX6S1AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6S6AVM10AD
MCIMX6S6AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PBSM5240PFH115 PBSM5240PFH.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSM5240PFH SMALL S
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 6-HUSON (2x2)
Applications: General Purpose
Transistor Type: PNP, N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 1.8A
Package / Case: 6-UDFN Exposed Pad
Voltage - Rated: 40V
auf Bestellung 63000 Stücke:
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2544+0.23 EUR
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