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LPC55S06-EVK LPC55S06-EVK NXP USA Inc. LPC55S06-EVK-QSG.pdf Description: EVAL KIT LPC55
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S06
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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LPC55S04JBD64E LPC55S04JBD64E NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
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100+6.34 EUR
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LPC5502JHI48QL LPC5502JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC5504JHI48QL LPC5504JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S04JHI48QL LPC55S04JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S06JHI48QL LPC55S06JHI48QL NXP USA Inc. LPC55S0x_LPC550x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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74LVC1G07GM/S500115 74LVC1G07GM/S500115 NXP USA Inc. 74LVC1G07.pdf Description: BUFFER, LVC/LCX/Z SERIES
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: -, 32mA
Number of Bits per Element: 1
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Part Status: Active
Packaging: Bulk
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74LVC1G07GF/S500132 74LVC1G07GF/S500132 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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74LVC1G07GF/S505125 74LVC1G07GF/S505125 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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LPC1763FBD100Y LPC1763FBD100Y NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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250+10.61 EUR
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LPC1765FET100K LPC1765FET100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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BZV85-C7V5133 BZV85-C7V5133 NXP USA Inc. NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.3 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 3 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Part Status: Active
Packaging: Bulk
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
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1000+5 EUR
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TJA1081TS TJA1081TS NXP USA Inc. PHGLS25769-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
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MCF5213CAF66R MCF5213CAF66R NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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LPC1837JBD144551 LPC1837JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AESFC315 NXP USA Inc. PMEG4005AEA.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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PMEG4002ESFC315 PMEG4002ESFC315 NXP USA Inc. PMEG4002ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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PMEG2005ESFC315 PMEG2005ESFC315 NXP USA Inc. PMEG2005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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PMEG4005ESFC315 PMEG4005ESFC315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
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PMEG4002AESFC315 PMEG4002AESFC315 NXP USA Inc. PMEG4002AESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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PMEG1201AESFC315 PMEG1201AESFC315 NXP USA Inc. Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
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74CBTLV3245DS,118 74CBTLV3245DS,118 NXP USA Inc. 74CBTLV3245_Rev_Feb2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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IP4281CZ10/2115 NXP USA Inc. IP4281CZ10.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
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MCR908JK3ECPE MCR908JK3ECPE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
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MCR908JL3ECDWER MCR908JL3ECDWER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 28SOIC
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MCR908JK1ECDWER MCR908JK1ECDWER NXP USA Inc. MC68HC908Jx%281%2C3%29.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387FBD100K NXP USA Inc. LPC2387.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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10+34.69 EUR
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100+30.19 EUR
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OM11013598 OM11013598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
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MC68HC705C9ACFNE MC68HC705C9ACFNE NXP USA Inc. MC68HC705C9A.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
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74HC14PW/C1118 74HC14PW/C1118 NXP USA Inc. PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB MIMX8ML8DVNLZAB NXP USA Inc. IMX8MPCEC.pdf Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
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10+80.96 EUR
25+76.58 EUR
126+71.14 EUR
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MIMX8ML8CVNKZAB MIMX8ML8CVNKZAB NXP USA Inc. i.MX%208M%20Plus.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
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1+106.37 EUR
10+87.64 EUR
25+82.97 EUR
126+77.15 EUR
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MIMX8ML6DVNLZAB MIMX8ML6DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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10+79.94 EUR
25+75.6 EUR
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MIMX8ML3DVNLZAB MIMX8ML3DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
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1+92.46 EUR
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MIMX8ML4CVNKZAB MIMX8ML4CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 796 Stücke:
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1+96.53 EUR
10+79.25 EUR
25+74.95 EUR
126+69.58 EUR
252+67.93 EUR
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MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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10+86.79 EUR
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126+76.34 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB NXP USA Inc. MIMX8ML3CVNKZAB_Rev1_8-2021.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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10+86.93 EUR
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FRDMCD1020EVM FRDMCD1020EVM NXP USA Inc. CD1020.pdf Description: EVAL BOARD FOR CD1020
Contents: Board(s)
Part Status: Active
Primary Attributes: 22-Channel
Supplied Contents: Board(s)
Utilized IC / Part: CD1020
Type: Interface
Function: Switch Detection
Packaging: Bulk
auf Bestellung 23 Stücke:
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LS1028AXE7PQA LS1028AXE7PQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.5GHZ 448FBGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Produkt ist nicht verfügbar
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LS1028ASN7HNA LS1028ASN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASN7KQA LS1028ASN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASE7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASN7NQA LS1028ASN7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASE7KQA NXP USA Inc. Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXN7HNA LS1028AXN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXN7KQA LS1028AXN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASE7NQA NXP USA Inc. Description: IC MPU QORIQ 1.3GHZ 448FBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXE7HNA LS1028AXE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXE7KQA LS1028AXE7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXE7NQA LS1028AXE7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AYE7HNA LS1028AYE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ACN7NQA NXP USA Inc. Description: IC MPU QORIQ 1.3GHZ 448FBGA
Produkt ist nicht verfügbar
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74HCT4060DB-Q100118 74HCT4060DB-Q100118 NXP USA Inc. 74HC_HCT4060_Q100.pdf Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
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816+0.74 EUR
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PESD24VS2UT/ZL215 PESD24VS2UT/ZL215 NXP USA Inc. NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 NXP USA Inc. PESD24VF1BSF.pdf Description: TVS DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 300000 Stücke:
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4133+0.14 EUR
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BAV170M315 BAV170M315 NXP USA Inc. BAV170M.pdf Description: DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1006-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
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11632+0.06 EUR
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BAV170QA147 BAV170QA147 NXP USA Inc. BAV170QA.pdf Description: DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
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9746+0.06 EUR
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BAV170235 BAV170235 NXP USA Inc. BAV170.pdf Description: RECTIFIER DIODE, 2 ELEMENT, 0.21
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Produkt ist nicht verfügbar
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LPC55S06-EVK LPC55S06-EVK-QSG.pdf
LPC55S06-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT LPC55
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S06
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 8 Stücke:
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AnzahlPrivatkunde
1+85.16 EUR
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LPC55S04JBD64E LPC55S0x_LPC550x.pdf
LPC55S04JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.92 EUR
10+7.58 EUR
50+6.63 EUR
100+6.34 EUR
160+6.18 EUR
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LPC5502JHI48QL LPC55S0x_LPC550x.pdf
LPC5502JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC5504JHI48QL LPC55S0x_LPC550x.pdf
LPC5504JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S04JHI48QL LPC55S0x_LPC550x.pdf
LPC55S04JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S06JHI48QL LPC55S0x_LPC550x_DS.pdf
LPC55S06JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07.pdf
74LVC1G07GM/S500115
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: -, 32mA
Number of Bits per Element: 1
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Part Status: Active
Packaging: Bulk
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74LVC1G07GF/S500132 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S500132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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74LVC1G07GF/S505125 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S505125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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LPC1763FBD100Y LPC1769_68_67_66_65_64_63.pdf
LPC1763FBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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2+16.18 EUR
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LPC1765FET100K LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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BZV85-C7V5133 NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw
BZV85-C7V5133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.3 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 3 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Part Status: Active
Packaging: Bulk
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9043+0.057 EUR
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
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3+9.47 EUR
10+8.5 EUR
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1000+5 EUR
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TJA1081TS PHGLS25769-1.pdf?t.download=true&u=5oefqw
TJA1081TS
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
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135+4.74 EUR
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MCF5213CAF66R MCF5282UM.pdf
MCF5213CAF66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC1837JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1837JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AEA.pdf
PMEG4005AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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6662+0.099 EUR
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PMEG4002ESFC315 PMEG4002ESF.pdf
PMEG4002ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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7212+0.083 EUR
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PMEG2005ESFC315 PMEG2005ESF.pdf
PMEG2005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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PMEG4005ESFC315 PMEG4005ESF.pdf
PMEG4005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
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PMEG4002AESFC315 PMEG4002AESF.pdf
PMEG4002AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
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7212+0.083 EUR
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PMEG1201AESFC315
PMEG1201AESFC315
Hersteller: NXP USA Inc.
Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
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7212+0.083 EUR
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74CBTLV3245DS,118 74CBTLV3245_Rev_Feb2017.pdf
74CBTLV3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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1332+0.44 EUR
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IP4281CZ10/2115 IP4281CZ10.pdf
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
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4121+0.14 EUR
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MCR908JK3ECPE MC68HC908Jx(1,3).pdf
MCR908JK3ECPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
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MCR908JL3ECDWER
MCR908JL3ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MC68HC908Jx%281%2C3%29.pdf
MCR908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387.pdf
LPC2387FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 512 Stücke:
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1+43.27 EUR
10+34.69 EUR
25+32.55 EUR
100+30.19 EUR
450+28.48 EUR
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OM11013598
OM11013598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC68HC705C9ACFNE MC68HC705C9A.pdf
MC68HC705C9ACFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC14PW/C1118 PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw
74HC14PW/C1118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB IMX8MPCEC.pdf
MIMX8ML8DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 171 Stücke:
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1+98.48 EUR
10+80.96 EUR
25+76.58 EUR
126+71.14 EUR
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MIMX8ML8CVNKZAB i.MX%208M%20Plus.pdf
MIMX8ML8CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+106.37 EUR
10+87.64 EUR
25+82.97 EUR
126+77.15 EUR
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MIMX8ML6DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 41 Stücke:
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AnzahlPrivatkunde
1+97.33 EUR
10+79.94 EUR
25+75.6 EUR
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MIMX8ML3DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML3DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
auf Bestellung 56 Stücke:
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1+92.46 EUR
10+75.83 EUR
25+71.67 EUR
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MIMX8ML4CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML4CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 796 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+96.53 EUR
10+79.25 EUR
25+74.95 EUR
126+69.58 EUR
252+67.93 EUR
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MIMX8ML6CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+105.43 EUR
10+86.79 EUR
25+82.13 EUR
126+76.34 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB_Rev1_8-2021.pdf
MIMX8ML3CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+105.6 EUR
10+86.93 EUR
25+82.26 EUR
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FRDMCD1020EVM CD1020.pdf
FRDMCD1020EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR CD1020
Contents: Board(s)
Part Status: Active
Primary Attributes: 22-Channel
Supplied Contents: Board(s)
Utilized IC / Part: CD1020
Type: Interface
Function: Switch Detection
Packaging: Bulk
auf Bestellung 23 Stücke:
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AnzahlPrivatkunde
1+190.64 EUR
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LS1028AXE7PQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.5GHZ 448FBGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Produkt ist nicht verfügbar
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LS1028ASN7HNA Download?colCode=LS1027A&amp;location=null
LS1028ASN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028ASN7KQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ASE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ASN7NQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ASE7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXN7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXN7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ASE7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7NQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028AYE7HNA Download?colCode=LS1027A&amp;location=null
LS1028AYE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ACN7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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74HCT4060DB-Q100118 74HC_HCT4060_Q100.pdf
74HCT4060DB-Q100118
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
816+0.74 EUR
Mindestbestellmenge: 816 Stücke
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PESD24VS2UT/ZL215 NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw
PESD24VS2UT/ZL215
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 PESD24VF1BSF.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4133+0.14 EUR
Mindestbestellmenge: 4133 Stücke
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BAV170M315 BAV170M.pdf
BAV170M315
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1006-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
auf Bestellung 480000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11632+0.06 EUR
Mindestbestellmenge: 11632 Stücke
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BAV170QA147 BAV170QA.pdf
BAV170QA147
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
auf Bestellung 164300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9746+0.06 EUR
Mindestbestellmenge: 9746 Stücke
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BAV170235 BAV170.pdf
BAV170235
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 2 ELEMENT, 0.21
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Produkt ist nicht verfügbar
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