Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36094) > Seite 391 nach 602
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MK22FN512VFX12R | NXP USA Inc. |
 Description: IC MCU 32BIT 512KB FLASH 88QFNPackaging: Cut Tape (CT) Package / Case: 88-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 88-QFN (10x10) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN512VDC12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGA Packaging: Cut Tape (CT) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 711 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1206,115 | NXP USA Inc. |
Description: RF MOSFET 5V 6TSSOP Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 400MHz Configuration: N-Channel Dual Gate Gain: 30dB Technology: MOSFET Noise Figure: 1.3dB Supplier Device Package: 6-TSSOP Part Status: Obsolete Voltage - Rated: 6 V Voltage - Test: 5 V Current - Test: 18 mA |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BA792,115 | NXP USA Inc. |
Description: RF DIODE STANDARD 35V SOD110 Packaging: Bulk Package / Case: SOD-110 Diode Type: Standard - Single Operating Temperature: 150°C (TJ) Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz Resistance @ If, F: 700mOhm @ 3mA, 200MHz Voltage - Peak Reverse (Max): 35V Supplier Device Package: SOD-110 Current - Max: 100 mA |
auf Bestellung 493000 Stücke: Lieferzeit 10-14 Tag (e) |
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TLVH431QDBVR,125 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 1.5% 5TSOP |
auf Bestellung 42000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMMA1200KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS 250G ROHS |
Produkt ist nicht verfügbar |
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| PMMA1250KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
Produkt ist nicht verfügbar |
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| PMMA1254KEGR2 | NXP USA Inc. | Description: IC ACCEL 5G Z-AXIS |
Produkt ist nicht verfügbar |
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| PMMA1260KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSUS 1.5 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA1270KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSSUS 2.5G |
Produkt ist nicht verfügbar |
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| PMMA2201KEGR2 | NXP USA Inc. | Description: IC ACCEL X-AXIS 50MV/G ROHS |
Produkt ist nicht verfügbar |
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| PMMA2202KEGR2 | NXP USA Inc. | Description: IC ACCEL SMT LN X SOIC 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA2206KEGR2 | NXP USA Inc. | Description: IC ACCEL X-LATERAL 80G |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA2240KEGR2 | NXP USA Inc. | Description: IC ACCEL X- LATERAL 300MV G |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA2241KEGR2 | NXP USA Inc. | Description: IC ACCEL X-LATERAL 10G |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA2301KEGR2 | NXP USA Inc. | Description: IC ACCEL X- AXIS 200G NOMINAL |
Produkt ist nicht verfügbar |
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| PMMA3221KEGR2 | NXP USA Inc. | Description: IC ACCEL 50 / 20 XY- AXIS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PMMA8205KEGR2 | NXP USA Inc. | Description: IC ACCEL X- AXIS 50G SOIC 16 |
Produkt ist nicht verfügbar |
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| PMMA9550LR1 | NXP USA Inc. | Description: IC ACCEL 3-AXIS W/ 32-BIT MCU |
Produkt ist nicht verfügbar |
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| PMMA9551LR1 | NXP USA Inc. | Description: IC ACCEL XYZ W/ MCU&GESTURE |
Produkt ist nicht verfügbar |
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BUK964R2-55B/C | NXP USA Inc. |
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL Packaging: Bulk Part Status: Active |
auf Bestellung 2824 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC1G665GV125 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC1G665GV 0 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZV90-C6V2135 | NXP USA Inc. |
Description: NOW NEXPERIA BZV90-C6V2 - ZENER Packaging: Bulk Tolerance: ±5% Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 6.2 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SOT-223 Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 3 µA @ 4 V |
auf Bestellung 15990 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9538ABS,128 | NXP USA Inc. |
Description: IC I/O EXPANDER I2C 8B 16HVQFN Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVML32F3WKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MVF50NS152CMK50R | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGA Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5742PK1AMMM8 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5643LK0MMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5775KK2MMY3AR | NXP USA Inc. | Description: IC 4M FLASH 1.5M RAM 356MAPBGA |
Produkt ist nicht verfügbar |
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| BUK9535-55A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 34A (Tc) Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V Power Dissipation (Max): 85W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V |
Produkt ist nicht verfügbar |
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SPC5602PEF0VLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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SPC5602PEF0VLH6R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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| PMGD290UCEA/DG/B2115 | NXP USA Inc. | Description: P-CHANNEL MOSFET |
Produkt ist nicht verfügbar |
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BZX84-B3V3/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BAV99/LF1215 | NXP USA Inc. |
Description: RECTIFIER DIODE Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 215mA (DC) Supplier Device Package: TO-236AB Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
Produkt ist nicht verfügbar |
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LPC11E67JBD64551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 10x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC11E36FBD64/501551 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC11E37FBD64/501551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC11E68JBD64551 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 10x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC11U37FBD64/50EL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 569 Stücke: Lieferzeit 10-14 Tag (e) |
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BCP56-10115 | NXP USA Inc. |
Description: NOW NEXPERIA BCP56-10 - SMALL SI Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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AFT09MS031GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 13.6V TO270-2 Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 31W Gain: 17.2dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 500 mA |
auf Bestellung 1167 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C47/LF1R | NXP USA Inc. |
Description: DIODE ZENER 47V 250MW SOT23 Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 47 V Impedance (Max) (Zzt): 170 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C47/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 47V 250MW SOT23 Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 47 V Impedance (Max) (Zzt): 170 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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| MKL17Z128VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN |
Produkt ist nicht verfügbar |
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IMX-LVDS-HDMI | NXP USA Inc. |
Description: LVDS TO HDMI ADAPT CARD-MINI SAS Packaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82748VLH,557 | NXP USA Inc. |
Description: DIGITAL SIGNAL CONTROLLER |
Produkt ist nicht verfügbar |
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BUK754R7-60E,127 | NXP USA Inc. |
Description: MOSFET N-CH 60V 100A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 4.6mOhm @ 25A, 10V Power Dissipation (Max): 234W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 82 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6230 pF @ 25 V |
auf Bestellung 1957 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK754R3-40B,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 75A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V Power Dissipation (Max): 254W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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NCF29A3MHN/0500VJ | NXP USA Inc. |
Description: TOKEN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF29A3MHN/0504GJ | NXP USA Inc. |
Description: TOKEN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF29A3XHN/0500VJ | NXP USA Inc. | Description: TOKEN |
Produkt ist nicht verfügbar |
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NCF29A3MHN/0500OJ | NXP USA Inc. |
Description: TOKEN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PCA9624PW,118 | NXP USA Inc. |
Description: IC LED DRIVER LINEAR DIM 24TSSOP |
auf Bestellung 8460 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMV32UP/MI215 | NXP USA Inc. |
Description: P-CHANNEL MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PMV32UP215 | NXP USA Inc. |
Description: NOW NEXPERIA PMV32UP - SMALL SIG Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT4094D-Q100118 | NXP USA Inc. |
Description: SERIAL IN PARALLEL OUT Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Tri-State Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SO Grade: Automotive Number of Bits per Element: 8 Qualification: AEC-Q100 |
auf Bestellung 2480 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4094DB-Q100118 | NXP USA Inc. |
Description: SERIAL IN PARALLEL OUT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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TJA1043AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 14SO Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 120 mV Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1043ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 14HVSON Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 120 mV Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MK22FN512VFX12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.58 EUR |
| 10+ | 13.75 EUR |
| 25+ | 12.78 EUR |
| 100+ | 11.73 EUR |
| 250+ | 11.22 EUR |
| 500+ | 10.92 EUR |
| MK22FN512VDC12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 711 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 18.74 EUR |
| 10+ | 14.68 EUR |
| 25+ | 13.66 EUR |
| 100+ | 12.54 EUR |
| 250+ | 12.01 EUR |
| 500+ | 11.69 EUR |
| BF1206,115 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 919+ | 0.55 EUR |
| BA792,115 |
|
Hersteller: NXP USA Inc.
Description: RF DIODE STANDARD 35V SOD110
Packaging: Bulk
Package / Case: SOD-110
Diode Type: Standard - Single
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz
Resistance @ If, F: 700mOhm @ 3mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-110
Current - Max: 100 mA
Description: RF DIODE STANDARD 35V SOD110
Packaging: Bulk
Package / Case: SOD-110
Diode Type: Standard - Single
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 1.1pF @ 3V, 1MHz
Resistance @ If, F: 700mOhm @ 3mA, 200MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-110
Current - Max: 100 mA
auf Bestellung 493000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.14 EUR |
| TLVH431QDBVR,125 |
|
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
auf Bestellung 42000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| PMMA1200KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS 250G ROHS
Description: IC ACCEL Z-AXIS 250G ROHS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA1250KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS
Description: IC ACCEL Z-AXIS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA1254KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL 5G Z-AXIS
Description: IC ACCEL 5G Z-AXIS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA1260KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL COLOSUS 1.5
Description: IC ACCEL COLOSUS 1.5
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA1270KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Description: IC ACCEL COLOSSUS 2.5G
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2201KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 50MV/G ROHS
Description: IC ACCEL X-AXIS 50MV/G ROHS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2202KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL SMT LN X SOIC 16
Description: IC ACCEL SMT LN X SOIC 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2206KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-LATERAL 80G
Description: IC ACCEL X-LATERAL 80G
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2240KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X- LATERAL 300MV G
Description: IC ACCEL X- LATERAL 300MV G
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2241KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-LATERAL 10G
Description: IC ACCEL X-LATERAL 10G
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA2301KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X- AXIS 200G NOMINAL
Description: IC ACCEL X- AXIS 200G NOMINAL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA3221KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL 50 / 20 XY- AXIS
Description: IC ACCEL 50 / 20 XY- AXIS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA8205KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X- AXIS 50G SOIC 16
Description: IC ACCEL X- AXIS 50G SOIC 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA9550LR1 |
Hersteller: NXP USA Inc.
Description: IC ACCEL 3-AXIS W/ 32-BIT MCU
Description: IC ACCEL 3-AXIS W/ 32-BIT MCU
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA9551LR1 |
Hersteller: NXP USA Inc.
Description: IC ACCEL XYZ W/ MCU&GESTURE
Description: IC ACCEL XYZ W/ MCU&GESTURE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK964R2-55B/C |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Packaging: Bulk
Part Status: Active
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Packaging: Bulk
Part Status: Active
auf Bestellung 2824 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 417+ | 1.22 EUR |
| BZV90-C6V2135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C6V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
Description: NOW NEXPERIA BZV90-C6V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
auf Bestellung 15990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1745+ | 0.28 EUR |
| PCA9538ABS,128 |
|
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER I2C 8B 16HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I/O EXPANDER I2C 8B 16HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML32F3WKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MVF50NS152CMK50R |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5742PK1AMMM8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5643LK0MMM1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5775KK2MMY3AR |
Hersteller: NXP USA Inc.
Description: IC 4M FLASH 1.5M RAM 356MAPBGA
Description: IC 4M FLASH 1.5M RAM 356MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK9535-55A127 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 25A, 10V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1173 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5602PEF0VLH6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5602PEF0VLH6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMGD290UCEA/DG/B2115 |
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Description: P-CHANNEL MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAV99/LF1215 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E67JBD64551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E36FBD64/501551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E37FBD64/501551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E68JBD64551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U37FBD64/50EL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 569 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.3 EUR |
| 10+ | 7.92 EUR |
| 25+ | 7.33 EUR |
| 160+ | 6.51 EUR |
| 320+ | 6.3 EUR |
| BCP56-10115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCP56-10 - SMALL SI
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BCP56-10 - SMALL SI
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| AFT09MS031GNR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 1167 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 43.58 EUR |
| 10+ | 35.18 EUR |
| 25+ | 33.08 EUR |
| 100+ | 30.77 EUR |
| 250+ | 29.76 EUR |
| BZX84-C47/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 47V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V
Qualification: AEC-Q101
Description: DIODE ZENER 47V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C47/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 47V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V
Qualification: AEC-Q101
Description: DIODE ZENER 47V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 32.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKL17Z128VFM4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Description: IC MCU 32BIT 128KB FLASH 32QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IMX-LVDS-HDMI |
|
Hersteller: NXP USA Inc.
Description: LVDS TO HDMI ADAPT CARD-MINI SAS
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Description: LVDS TO HDMI ADAPT CARD-MINI SAS
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 217.68 EUR |
| MC56F82748VLH,557 |
|
Hersteller: NXP USA Inc.
Description: DIGITAL SIGNAL CONTROLLER
Description: DIGITAL SIGNAL CONTROLLER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK754R7-60E,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 82 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6230 pF @ 25 V
Description: MOSFET N-CH 60V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 82 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6230 pF @ 25 V
auf Bestellung 1957 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 386+ | 1.37 EUR |
| BUK754R3-40B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 344+ | 1.4 EUR |
| NCF29A3XHN/0500VJ |
Hersteller: NXP USA Inc.
Description: TOKEN
Description: TOKEN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9624PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR DIM 24TSSOP
Description: IC LED DRIVER LINEAR DIM 24TSSOP
auf Bestellung 8460 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| PMV32UP215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMV32UP - SMALL SIG
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA PMV32UP - SMALL SIG
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT4094D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Grade: Automotive
Number of Bits per Element: 8
Qualification: AEC-Q100
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Grade: Automotive
Number of Bits per Element: 8
Qualification: AEC-Q100
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1317+ | 0.37 EUR |
| 74HCT4094DB-Q100118 |
|
Hersteller: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Description: SERIAL IN PARALLEL OUT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1043AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 120 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 120 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 3.82 EUR |
| 10+ | 2.84 EUR |
| 25+ | 2.59 EUR |
| TJA1043ATK/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH