Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34503) > Seite 386 nach 576
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
N74F00N,602 | NXP USA Inc. |
 Description: IC GATE NAND 4CH 2-INP 14DIPPackaging: Bulk Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 24476 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
74LV241DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SSOP |
auf Bestellung 1348 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MC68HC908QT2CPE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-PDIP Part Status: Active Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
LPC2148FBD64,157 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 14x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
BZB784-C12,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C12 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
74LVC161DB118 | NXP USA Inc. |
Description: BINARY COUNTER, LVC/LCX/Z SERIES |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
BFG480W,115 | NXP USA Inc. |
 Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4Packaging: Cut Tape (CT) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 16dB Power - Max: 360mW Current - Collector (Ic) (Max): 250mA Voltage - Collector Emitter Breakdown (Max): 4.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz Supplier Device Package: CMPAK-4 Part Status: Obsolete |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
SAF3566HV/V1100557 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
LPC11U12FHN33/201K | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1553 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| NCF2961EHN3/0200CY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||||
| NCF29A7XHN3/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||
 |
PCA2129T/Q900/2 | NXP USA Inc. |
Description: AUTOMOTIVE ACCURATE RTC WITH INT |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
74ALVC14D,112 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SOIC Packaging: Tube |
auf Bestellung 6780 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
74HCT138DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT138DB - DECODE Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
NTS0304EPWJ | NXP USA Inc. |
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
NTS0304EPWJ | NXP USA Inc. |
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
auf Bestellung 1648 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
OM13543 | NXP USA Inc. |
Description: EVAL BOARD NTS0304EPW Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NTS0304E Supplied Contents: Board(s) Primary Attributes: Level Shifter Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| MMA1250KEG | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC |
auf Bestellung 142 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||||
 |
MC33812EKR2518 | NXP USA Inc. |
Description: MULTIFUNCTIONAL IGNITION AND INJ Packaging: Bulk |
auf Bestellung 5690 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| A7101CGUK/T0B0407, | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
 |
BGA7350,115 | NXP USA Inc. |
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 50MHz ~ 250MHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 19.5dB Current - Supply: 245mA Noise Figure: 6dB P1dB: 17dBm Test Frequency: 50MHz Supplier Device Package: 32-HVQFN (5x5) |
auf Bestellung 1468 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
BGA7351,115 | NXP USA Inc. |
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 50MHz ~ 500MHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 21.5dB Current - Supply: 280mA Noise Figure: 6dB P1dB: 15.8dBm Test Frequency: 250MHz Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
auf Bestellung 2777 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
SPC5746BSK1MKU2R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
74AHC573PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 5463 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
74AHC573BQ-Q100115 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||||
| SL3S5050N0FUD/00BZ | NXP USA Inc. |
Description: IC RFID TRANSP UCODE DNA WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Type: RFID Transponder Standards: EPC, ISO 29167 Supplier Device Package: Wafer Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||
 |
MC9S08QG4CFKE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 24QFN Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN-EP (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 4186 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
PMEG6010AESBC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
auf Bestellung 883990 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
PMEG6010ELR/B115 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
IP4054CX15/LF135 | NXP USA Inc. |
Description: CONSUMER CIRCUIT Packaging: Bulk Part Status: Active |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
IP4054CX15/LF | NXP USA Inc. |
Description: CONSUMER CIRCUIT Packaging: Bulk Part Status: Active |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| MCIMX31LCVMN4DR2518 | NXP USA Inc. |
Description: I.MX31 32-BIT MPU, ARM1136JF-S C Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||
 |
MC33FS8430G1ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8430 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 133 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
74HCT540D-Q100118 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
SPC5601DF1VLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 33x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
SPC5601DF1VLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 33x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
SPC5602CF2MLH4R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
SPC5604BK0MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
SPC5604PEF1VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 30x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
SPC5603BF2VLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
SPC5604PEF1VLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 30x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
MPF5023AVNA0ES | NXP USA Inc. |
Description: PF5023 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
MPF5024AVNA0ES | NXP USA Inc. |
Description: PF5024 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Applications: High Performance i.MX 8 Processor Based Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 2865 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
JN5188THN/001Z | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Zigbee® Current - Receiving: 4.3mA Current - Transmitting: 7.36mA ~ 20.28mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
P89LPC913FDH,129 | NXP USA Inc. |
Description: IC MCU 8BIT 1KB FLASH 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 1KB (1K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 14-TSSOP Part Status: Obsolete Number of I/O: 12 DigiKey Programmable: Verified |
auf Bestellung 834 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
P89LPC952FAB512 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44PLCC Packaging: Bulk Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||||
| TDA8595J/N2S/S422112 | NXP USA Inc. |
Description: I2C-BUS CONTROLLED 4 X 45 W POWE Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||
 |
MC33FS5502Y3ES | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
MC33FS5502Y0ESR2 | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||||||||||||||||
|
|
MC33FS5502Y3ESR2 | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||||||||||||||||
| BUK7509-75A,127 | NXP USA Inc. |
Description: MOSFET N-CH 75V 75A TO220AB Packaging: Tube |
auf Bestellung 7296 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
|
|
N74F20D,602 | NXP USA Inc. |
Description: IC GATE NAND 2CH 4-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 4 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 2 |
auf Bestellung 8570 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
N74F20D,623 | NXP USA Inc. |
Description: IC GATE NAND 2CH 4-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 4 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 2 |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
SA56004HD112 | NXP USA Inc. |
Description: DIGITAL TEMPERATURE SENSOR, SMBU Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1565 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
PBSS2515M315 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS2515M - SMALL S Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||||
 |
RDVCU5775EVM | NXP USA Inc. |
Description: MPC5775B BMS & VCU REF DESIGN Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B Part Status: Active |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
BUK652R6-40C,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 120A TO220AB |
auf Bestellung 3041 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
74AUP2G157GF,115 | NXP USA Inc. |
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1 |
auf Bestellung 84985 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
CBTU4411EE,557 | NXP USA Inc. |
Description: IC BUS SWITCH 11 X 4:1 72LFBGA Packaging: Tray Package / Case: 72-LFBGA Mounting Type: Surface Mount Circuit: 11 x 4:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 72-LFBGA (7x7) Part Status: Obsolete |
auf Bestellung 1080 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
PDTB113EQA147 | NXP USA Inc. |
Description: NOW NEXPERIA PDTB113EQA SMALL SI |
auf Bestellung 40000 Stücke: Lieferzeit 10-14 Tag (e) |
| N74F00N,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 24476 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 784+ | 0.63 EUR |
| 74LV241DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
auf Bestellung 1348 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 888+ | 0.57 EUR |
| MC68HC908QT2CPE-NXP |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC2148FBD64,157 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BZB784-C12,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C12 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NOW NEXPERIA BZB784-C12 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
| 74LVC161DB118 |
|
Hersteller: NXP USA Inc.
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
| BFG480W,115 | |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF3566HV/V1100557 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 34+ | 16 EUR |
| LPC11U12FHN33/201K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1553 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.23 EUR |
| 10+ | 5.65 EUR |
| 80+ | 4.63 EUR |
| 520+ | 4.53 EUR |
| 1040+ | 3.82 EUR |
| NCF2961EHN3/0200CY |
Produkt ist nicht verfügbar
| NCF29A7XHN3/0200IY |
Produkt ist nicht verfügbar
| PCA2129T/Q900/2 |
|
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE ACCURATE RTC WITH INT
Description: AUTOMOTIVE ACCURATE RTC WITH INT
Produkt ist nicht verfügbar
| 74ALVC14D,112 |
|
auf Bestellung 6780 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2420+ | 0.2 EUR |
| 74HCT138DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 0.24 EUR |
| NTS0304EPWJ |
|
Hersteller: NXP USA Inc.
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
| NTS0304EPWJ |
|
Hersteller: NXP USA Inc.
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.94 EUR |
| 11+ | 1.72 EUR |
| 25+ | 1.63 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.25 EUR |
| 500+ | 1.11 EUR |
| 1000+ | 0.87 EUR |
| OM13543 |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD NTS0304EPW
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
Description: EVAL BOARD NTS0304EPW
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 152.36 EUR |
| MMA1250KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Description: ACCELEROMETER 5G ANALOG 16SOIC
auf Bestellung 142 Stücke:
Lieferzeit 10-14 Tag (e)| MC33812EKR2518 |
|
auf Bestellung 5690 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 127+ | 3.95 EUR |
| A7101CGUK/T0B0407, |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BGA7350,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 1468 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 78+ | 6.38 EUR |
| BGA7351,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
auf Bestellung 2777 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 132+ | 3.77 EUR |
| SPC5746BSK1MKU2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
| 74AHC573PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 5463 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1823+ | 0.26 EUR |
| 74AHC573BQ-Q100115 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| SL3S5050N0FUD/00BZ |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
| MC9S08QG4CFKE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 4186 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 135+ | 3.94 EUR |
| PMEG6010AESBC315 |
|
auf Bestellung 883990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6662+ | 0.083 EUR |
| IP4054CX15/LF135 |
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1255+ | 0.42 EUR |
| IP4054CX15/LF |
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 919+ | 0.53 EUR |
| MCIMX31LCVMN4DR2518 |
|
Hersteller: NXP USA Inc.
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MC33FS8430G1ES |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 133 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 17.62 EUR |
| 10+ | 15.91 EUR |
| 25+ | 15.17 EUR |
| 80+ | 13.17 EUR |
| 74HCT540D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
Produkt ist nicht verfügbar
| SPC5601DF1VLL4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5601DF1VLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5602CF2MLH4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
| SPC5604BK0MLH4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5604PEF1VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5603BF2VLQ4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5604PEF1VLL6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MPF5023AVNA0ES |
|
Hersteller: NXP USA Inc.
Description: PF5023
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: PF5023
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.7 EUR |
| 10+ | 8.76 EUR |
| 25+ | 8.35 EUR |
| 80+ | 7.25 EUR |
| 230+ | 6.92 EUR |
| 490+ | 6.31 EUR |
| MPF5024AVNA0ES |
|
Hersteller: NXP USA Inc.
Description: PF5024
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Description: PF5024
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 2865 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.02 EUR |
| 10+ | 9.95 EUR |
| 25+ | 9.49 EUR |
| 80+ | 8.24 EUR |
| 230+ | 7.87 EUR |
| 490+ | 7.17 EUR |
| 980+ | 6.25 EUR |
| 2450+ | 6.02 EUR |
| JN5188THN/001Z |
|
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Zigbee®
Current - Receiving: 4.3mA
Current - Transmitting: 7.36mA ~ 20.28mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| P89LPC913FDH,129 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
auf Bestellung 834 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 55+ | 8.87 EUR |
| P89LPC952FAB512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TDA8595J/N2S/S422112 |
|
Hersteller: NXP USA Inc.
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC33FS5502Y3ES |
|
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.32 EUR |
| 10+ | 12.03 EUR |
| 25+ | 11.47 EUR |
| 80+ | 9.96 EUR |
| 260+ | 9.52 EUR |
| 520+ | 8.68 EUR |
| 1040+ | 7.56 EUR |
| MC33FS5502Y0ESR2 |
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC33FS5502Y3ESR2 |
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| BUK7509-75A,127 |
|
auf Bestellung 7296 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 365+ | 1.35 EUR |
| N74F20D,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Description: IC GATE NAND 2CH 4-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
auf Bestellung 8570 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| N74F20D,623 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Description: IC GATE NAND 2CH 4-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| SA56004HD112 |
|
Hersteller: NXP USA Inc.
Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1565 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 634+ | 0.76 EUR |
| PBSS2515M315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| RDVCU5775EVM |
|
Hersteller: NXP USA Inc.
Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 696.22 EUR |
| BUK652R6-40C,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 120A TO220AB
Description: MOSFET N-CH 40V 120A TO220AB
auf Bestellung 3041 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 314+ | 1.63 EUR |
| 74AUP2G157GF,115 |
|
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
auf Bestellung 84985 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1655+ | 0.31 EUR |
| CBTU4411EE,557 |
|
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
auf Bestellung 1080 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 267+ | 1.81 EUR |
| PDTB113EQA147 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTB113EQA SMALL SI
Description: NOW NEXPERIA PDTB113EQA SMALL SI
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)