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74HC2G14GV-Q100125 74HC2G14GV-Q100125 NXP USA Inc. 74HC_HCT2G14_Q100.pdf Description: IC INVERT SCHMITT 2CH 2-IN 6TSOP
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Features: Schmitt Trigger
Packaging: Bulk
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.5V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 6-TSOP
Number of Inputs: 2
Produkt ist nicht verfügbar
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TJA1051AT/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1051T/3/2Z TJA1051T/3/2Z NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1051T/2Z TJA1051T/2Z NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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PDTC123JMB315 PDTC123JMB315 NXP USA Inc. PDTC123JMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
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PDTC123YMB315 PDTC123YMB315 NXP USA Inc. PDTC123YMB.pdf Description: NOW NEXPERIA PDTC123YMB - SMALL
Packaging: Bulk
Part Status: Active
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PDTC123EMB PDTC123EMB NXP USA Inc. PHGLS24439-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PDTC123EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S9S08DZ128F2VLL S9S08DZ128F2VLL NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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PN5180A0HN/C4Y PN5180A0HN/C4Y NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: PN5180 HVQFN40 REEL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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PN5180A0HN/C4Y PN5180A0HN/C4Y NXP USA Inc. PN5180A0XX_C3_C4.pdf Description: PN5180 HVQFN40 REEL
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
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PN5180A0HN/C4E PN5180A0HN/C4E NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: PN5180 HVQFN40 TRAY
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
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MPC8360ECVVAJDGA MPC8360ECVVAJDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BZX384-B3V3135 BZX384-B3V3135 NXP USA Inc. NEXP-S-A0003107829-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZX384-B3V3 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9698DGG,518 PCA9698DGG,518 NXP USA Inc. PCA9698.pdf Description: IC XPNDR 1MHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1176DVMAA MIMXRT1176DVMAA NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1176CVM8A MIMXRT1176CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1176AVM8A MIMXRT1176AVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1170-EVK MIMXRT1170-EVK NXP USA Inc. i.MX-RT1170-FS.pdf Description: I.MX RT1170 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Utilized IC / Part: RT1170
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MIMXRT1171DVMAA MIMXRT1171DVMAA NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1171CVM8A MIMXRT1171CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1172DVMAA MIMXRT1172DVMAA NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1175DVMAA MIMXRT1175DVMAA NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1171AVM8A MIMXRT1171AVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1175CVM8A MIMXRT1175CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1173CVM8A MIMXRT1173CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1172AVM8A MIMXRT1172AVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MIMXRT1175AVM8A MIMXRT1175AVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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74AUP1G14GN,132 74AUP1G14GN,132 NXP USA Inc. PHGL-S-A0000296408-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 1CH 1-IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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MKL17Z128VMP4R MKL17Z128VMP4R NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL33Z128VMP4 MKL33Z128VMP4 NXP USA Inc. KL33P64M48SF6.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b; D/A 1x12b
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MKL17Z256VMP4R MKL17Z256VMP4R NXP USA Inc. KL17P64M48SF6.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
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TJA1052IT/2518 TJA1052IT/2518 NXP USA Inc. TJA1052I.pdf Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
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TJA1052IT/5,518 NXP USA Inc. TJA1052I.pdf Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
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BC52-10PAS115 BC52-10PAS115 NXP USA Inc. BC51_52_53PAS_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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BC52-16PAS115 BC52-16PAS115 NXP USA Inc. BC51_52_53PAS_SER.pdf Description: NOW NEXPERIA BC52-16PAS - SMALL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P128J0MFTR S9S12P128J0MFTR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 48QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Produkt ist nicht verfügbar
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S9S12P128J0CFTR S9S12P128J0CFTR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 48QFN
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S9S12P128J0VLH S9S12P128J0VLH NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 64LQFP
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S9S12P128J0VLHR S9S12P128J0VLHR NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 49
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S9S12P128J0MLHR S9S12P128J0MLHR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF295AXHN4/0300ZY NXP USA Inc. Description: ACTIC-SRX
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF295AMHN4/0300ZY NXP USA Inc. Description: ACTIC-SRX
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NCF29AAXHN4/0300ZY NXP USA Inc. Description: TOKEN
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NCF29AAVHN4/0300ZY NXP USA Inc. Description: TOKEN
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NCF29AAMHN4/0300ZY NXP USA Inc. Description: TOKEN
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NX3L1G53GT,115 NX3L1G53GT,115 NXP USA Inc. NX3L1G53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Number of Circuits: 1
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
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100+1.07 EUR
250+1 EUR
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PSMN1R5-30BLE118 NXP USA Inc. PSMN1R5-30BLE.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6L2EVN10ABR MCIMX6L2EVN10ABR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
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TDA18254AHN/C1518 TDA18254AHN/C1518 NXP USA Inc. TDA18250AHN_SDS.pdf Description: IC CABLE TUNER DGTL 48HVQFN
Packaging: Bulk
auf Bestellung 7950 Stücke:
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PDTA143XMB315 PDTA143XMB315 NXP USA Inc. PDTA143XMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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PDTA143ZMB315 PDTA143ZMB315 NXP USA Inc. PDTA143ZMB.pdf Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
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PDTA143EMB PDTA143EMB NXP USA Inc. PHGLS24661-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PDTA143EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDF8541JS/N3512 NXP USA Inc. Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P87C51X2FA, 512 NXP USA Inc. PHGLS11165-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 8BIT 4KB OTP 44PLCC
Produkt ist nicht verfügbar
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PMST5088,115 PMST5088,115 NXP USA Inc. PHGLS19705-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PMST5088 - SMALL SI
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 30 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
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MKE14F512VLL16 MKE14F512VLL16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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HEF4030BT-Q100J HEF4030BT-Q100J NXP USA Inc. HEF4030B_Q100.pdf Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 2.4mA, 2.4mA
Voltage - Supply: 4.5V ~ 15.5V
Operating Temperature: -40°C ~ 85°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
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BAS21SW115 BAS21SW115 NXP USA Inc. BAS21W_SER.pdf Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G08GW165 NXP USA Inc. 74AHC_AHCT1G08.pdf Description: AND GATE, HC/UH SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G08GW/C2125 NXP USA Inc. PHGL-S-A0000133340-1.pdf?t.download=true&u=5oefqw Description: AND GATE, HC/UH SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HC2G14GV-Q100125 74HC_HCT2G14_Q100.pdf
74HC2G14GV-Q100125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2-IN 6TSOP
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Features: Schmitt Trigger
Packaging: Bulk
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.5V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 6-TSOP
Number of Inputs: 2
Produkt ist nicht verfügbar
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TJA1051AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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6+3.75 EUR
10+2.75 EUR
25+2.51 EUR
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250+2.11 EUR
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1000+2 EUR
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TJA1051T/3/2Z TJA1051.pdf
TJA1051T/3/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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8+2.62 EUR
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1000+1.37 EUR
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TJA1051T/2Z TJA1051.pdf
TJA1051T/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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8+2.62 EUR
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100+1.54 EUR
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500+1.38 EUR
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PDTC123JMB315 PDTC123JMB.pdf
PDTC123JMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
auf Bestellung 166576 Stücke:
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11225+0.057 EUR
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PDTC123YMB315 PDTC123YMB.pdf
PDTC123YMB315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC123YMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDTC123EMB PHGLS24439-1.pdf?t.download=true&u=5oefqw
PDTC123EMB
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC123EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S9S08DZ128F2VLL MC9S08DZ128.pdf
S9S08DZ128F2VLL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 450 Stücke:
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2+18.52 EUR
10+15.01 EUR
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PN5180A0HN/C4Y PN5180A0XX_C3_C4.pdf
PN5180A0HN/C4Y
Hersteller: NXP USA Inc.
Description: PN5180 HVQFN40 REEL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 4000 Stücke:
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4000+11.51 EUR
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PN5180A0HN/C4Y PN5180A0XX_C3_C4.pdf
PN5180A0HN/C4Y
Hersteller: NXP USA Inc.
Description: PN5180 HVQFN40 REEL
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 6541 Stücke:
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AnzahlPrivatkunde
2+19.73 EUR
10+15.39 EUR
25+14.3 EUR
100+13.11 EUR
250+12.54 EUR
500+12.21 EUR
1000+12.1 EUR
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PN5180A0HN/C4E PN5180A0XX-C1-C2.pdf
PN5180A0HN/C4E
Hersteller: NXP USA Inc.
Description: PN5180 HVQFN40 TRAY
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
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MPC8360ECVVAJDGA MPC8360E%2C8358E.pdf
MPC8360ECVVAJDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BZX384-B3V3135 NEXP-S-A0003107829-1.pdf?t.download=true&u=5oefqw
BZX384-B3V3135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX384-B3V3 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9698DGG,518 PCA9698.pdf
PCA9698DGG,518
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2871 Stücke:
Lieferzeit 10-14 Tag (e)
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2+11.08 EUR
10+8.5 EUR
25+7.85 EUR
100+7.15 EUR
250+6.81 EUR
500+6.6 EUR
1000+6.44 EUR
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MIMXRT1176DVMAA i.MX-RT1170-FS.pdf
MIMXRT1176DVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 134 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+37.59 EUR
10+29.95 EUR
25+28.04 EUR
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MIMXRT1176CVM8A i.MX-RT1170-FS.pdf
MIMXRT1176CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 276 Stücke:
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AnzahlPrivatkunde
1+38.41 EUR
10+30.67 EUR
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152+26.12 EUR
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MIMXRT1176AVM8A i.MX-RT1170-FS.pdf
MIMXRT1176AVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+39.65 EUR
10+31.69 EUR
25+29.7 EUR
152+27.01 EUR
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MIMXRT1170-EVK i.MX-RT1170-FS.pdf
MIMXRT1170-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT1170 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Utilized IC / Part: RT1170
auf Bestellung 3 Stücke:
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AnzahlPrivatkunde
1+365.47 EUR
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MIMXRT1171DVMAA i.MX-RT1170-FS.pdf
MIMXRT1171DVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 153 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+30.26 EUR
10+23.98 EUR
25+22.41 EUR
152+20.28 EUR
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MIMXRT1171CVM8A i.MX-RT1170-FS.pdf
MIMXRT1171CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+39.6 EUR
10+31.63 EUR
25+29.63 EUR
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MIMXRT1172DVMAA i.MX-RT1170-FS.pdf
MIMXRT1172DVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+39.6 EUR
10+31.63 EUR
25+29.63 EUR
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MIMXRT1175DVMAA i.MX-RT1170-FS.pdf
MIMXRT1175DVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+33.28 EUR
10+26.44 EUR
25+24.74 EUR
152+22.43 EUR
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MIMXRT1171AVM8A i.MX-RT1170-FS.pdf
MIMXRT1171AVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1175CVM8A i.MX-RT1170-FS.pdf
MIMXRT1175CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.78 EUR
10+29.3 EUR
25+27.43 EUR
152+24.89 EUR
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MIMXRT1173CVM8A i.MX-RT1170-FS.pdf
MIMXRT1173CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+37.2 EUR
10+29.87 EUR
25+28.02 EUR
152+27.89 EUR
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MIMXRT1172AVM8A i.MX-RT1170-FS.pdf
MIMXRT1172AVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+45.64 EUR
10+36.66 EUR
25+34.41 EUR
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MIMXRT1175AVM8A i.MX-RT1170-FS.pdf
MIMXRT1175AVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1G14GN,132 PHGL-S-A0000296408-1.pdf?t.download=true&u=5oefqw
74AUP1G14GN,132
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 1CH 1-IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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MKL17Z128VMP4R KL17P64M48SF6.pdf
MKL17Z128VMP4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL33Z128VMP4 KL33P64M48SF6.pdf
MKL33Z128VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b; D/A 1x12b
Produkt ist nicht verfügbar
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MKL17Z256VMP4R KL17P64M48SF6.pdf
MKL17Z256VMP4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Produkt ist nicht verfügbar
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TJA1052IT/2518 TJA1052I.pdf
TJA1052IT/2518
Hersteller: NXP USA Inc.
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1052IT/5,518 TJA1052I.pdf
Hersteller: NXP USA Inc.
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Produkt ist nicht verfügbar
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BC52-10PAS115 BC51_52_53PAS_SER.pdf
BC52-10PAS115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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BC52-16PAS115 BC51_52_53PAS_SER.pdf
BC52-16PAS115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC52-16PAS - SMALL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P128J0MFTR
S9S12P128J0MFTR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Produkt ist nicht verfügbar
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S9S12P128J0CFTR
S9S12P128J0CFTR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Produkt ist nicht verfügbar
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S9S12P128J0VLH
S9S12P128J0VLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S9S12P128J0VLHR MC9S12P128RMV1.pdf
S9S12P128J0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 49
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S9S12P128J0MLHR
S9S12P128J0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF295AXHN4/0300ZY
Hersteller: NXP USA Inc.
Description: ACTIC-SRX
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF295AMHN4/0300ZY
Hersteller: NXP USA Inc.
Description: ACTIC-SRX
Produkt ist nicht verfügbar
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NCF29AAXHN4/0300ZY
Hersteller: NXP USA Inc.
Description: TOKEN
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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NCF29AAVHN4/0300ZY
Hersteller: NXP USA Inc.
Description: TOKEN
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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NCF29AAMHN4/0300ZY
Hersteller: NXP USA Inc.
Description: TOKEN
Produkt ist nicht verfügbar
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NX3L1G53GT,115 NX3L1G53.pdf
NX3L1G53GT,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Number of Circuits: 1
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 4557 Stücke:
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AnzahlPrivatkunde
12+1.87 EUR
16+1.36 EUR
25+1.23 EUR
100+1.07 EUR
250+1 EUR
500+0.96 EUR
1000+0.94 EUR
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PSMN1R5-30BLE118 PSMN1R5-30BLE.pdf
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6L2EVN10ABR IMX6SLCEC.pdf
MCIMX6L2EVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDA18254AHN/C1518 TDA18250AHN_SDS.pdf
TDA18254AHN/C1518
Hersteller: NXP USA Inc.
Description: IC CABLE TUNER DGTL 48HVQFN
Packaging: Bulk
auf Bestellung 7950 Stücke:
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AnzahlPrivatkunde
146+4.08 EUR
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PDTA143XMB315 PDTA143XMB.pdf
PDTA143XMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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11225+0.057 EUR
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PDTA143ZMB315 PDTA143ZMB.pdf
PDTA143ZMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
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11225+0.057 EUR
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PDTA143EMB PHGLS24661-1.pdf?t.download=true&u=5oefqw
PDTA143EMB
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTA143EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDF8541JS/N3512
Hersteller: NXP USA Inc.
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P87C51X2FA, 512 PHGLS11165-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Produkt ist nicht verfügbar
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PMST5088,115 PHGLS19705-1.pdf?t.download=true&u=5oefqw
PMST5088,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMST5088 - SMALL SI
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 30 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
auf Bestellung 581293 Stücke:
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15000+0.039 EUR
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MKE14F512VLL16 KE1xFP100M168SF0.pdf
MKE14F512VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 342 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.39 EUR
10+13.52 EUR
24+12.59 EUR
90+11.57 EUR
270+10.96 EUR
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HEF4030BT-Q100J HEF4030B_Q100.pdf
HEF4030BT-Q100J
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 2.4mA, 2.4mA
Voltage - Supply: 4.5V ~ 15.5V
Operating Temperature: -40°C ~ 85°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
auf Bestellung 2930 Stücke:
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1269+0.44 EUR
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BAS21SW115 BAS21W_SER.pdf
BAS21SW115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G08GW165 74AHC_AHCT1G08.pdf
Hersteller: NXP USA Inc.
Description: AND GATE, HC/UH SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G08GW/C2125 PHGL-S-A0000133340-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: AND GATE, HC/UH SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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