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74LVC2G08GT/S505115 74LVC2G08GT/S505115 NXP USA Inc. PHGLS27069-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND
Packaging: Bulk
Part Status: Active
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74HC4351N,652 74HC4351N,652 NXP USA Inc. 74HC%28T%294351_Rev_Feb2017.pdf Description: IC MUX 8:1 120OHM 20DIP
Channel-to-Channel Matching (ΔRon): 6Ohm
Multiplexer/Demultiplexer Circuit: 8:1
Voltage - Supply, Dual (V±): ±1V ~ 5V
Voltage - Supply, Single (V+): 2V ~ 10V
Supplier Device Package: 20-DIP
-3db Bandwidth: 170MHz
On-State Resistance (Max): 120Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 100nA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 55ns, 45ns
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74AHC1G4210GW125 74AHC1G4210GW125 NXP USA Inc. 74AHC1G4210.pdf Description: 10-STAGE DIVIDER AND OSCILLATOR
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74AHC1G4212GW125 74AHC1G4212GW125 NXP USA Inc. 74AHC1G4212.pdf Description: 12-STAGE DIVIDER AND OSCILLATOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PSMN7R0-30YL115/BKN PSMN7R0-30YL115/BKN NXP USA Inc. PSMN7R0-30YL.pdf Description: N-CHANNEL POWER MOSFET
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PUMD2125 PUMD2125 NXP USA Inc. PEMD2_PIMD2_PUMD2.pdf Description: NOW NEXPERIA PUMD2 SMALL SIGNAL
Produkt ist nicht verfügbar
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PCA9601DP/S911118 PCA9601DP/S911118 NXP USA Inc. _PCA9601.pdf?t.download=true&u=ovmfp3 Description: DUAL BIDIRECTIONAL BUS BUFFER
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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IP4385CX4/LF,135 IP4385CX4/LF,135 NXP USA Inc. IP4085%2C4385%2C4386%2C4387%28CX4%29.pdf Description: TVS DIODE 5.5VWM 10VC 4WLCSP
Part Status: Obsolete
Power Line Protection: No
Voltage - Clamping (Max) @ Ipp: 10V
Voltage - Breakdown (Min): 7V
Unidirectional Channels: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Current - Peak Pulse (10/1000µs): 33A (8/20µs)
Capacitance @ Frequency: 450pF @ 1MHz
Applications: General Purpose
Operating Temperature: -35°C ~ 85°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Packaging: Bulk
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IP4055CX6/LF135 IP4055CX6/LF135 NXP USA Inc. Description: CONSUMER CIRCUIT
Part Status: Active
Packaging: Bulk
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IP4359CX4/LF,135 IP4359CX4/LF,135 NXP USA Inc. IP4359CX4.pdf Description: TVS DIODE 5.5VWM 4CSP
Packaging: Bulk
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IP4059CX5/LF,135 IP4059CX5/LF,135 NXP USA Inc. IP4059CX5.pdf Description: TVS DIODE 5.5VWM 5CSP
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 3
Supplier Device Package: 5-CSP (1.33x0.96)
Voltage - Reverse Standoff (Typ): 5.5V
Capacitance @ Frequency: 3pF @ 1MHz
Applications: Ethernet, USB OTG
Operating Temperature: -40°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 5-UFBGA, WLCSP
Packaging: Bulk
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IP4053CX15/LF135 NXP USA Inc. Description: CONSUMER CIRCUIT
Packaging: Bulk
auf Bestellung 13500 Stücke:
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IP4350CX24/LF,135 NXP USA Inc. IP4350CX24.pdf Description: TVS DIODE 24WLCSP
Operating Temperature: -35°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 24-WFBGA, WLCSP
Packaging: Bulk
Part Status: Obsolete
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 9
Supplier Device Package: 24-WLCSP (1.95x2.11)
Applications: Multimedia Card Interface
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NX2301P215 NXP USA Inc. NX2301P.pdf Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD2088 LPC4357JBD2088 NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
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LPC4357FET256K LPC4357FET256K NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 256LBGA
DigiKey Programmable: Not Verified
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
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90+18.95 EUR
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TEF6621T/V1512 TEF6621T/V1512 NXP USA Inc. Description: TEF6621T - CAR RADIO TUNER IC
Packaging: Bulk
DigiKey Programmable: Not Verified
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TEF6621T/V1518 TEF6621T/V1518 NXP USA Inc. Description: IC TUNER CAR RADIO 32SO
Packaging: Bulk
DigiKey Programmable: Not Verified
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LD6806F/22P,115 LD6806F/22P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.2V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
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MKL17Z32VDA4R MKL17Z32VDA4R NXP USA Inc. KL17P64M48SF2.pdf Description: IC MCU 32BIT 32KB FLASH 36XFBGA
Packaging: Cut Tape (CT)
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
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100+4.44 EUR
250+4.22 EUR
500+4.17 EUR
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MKL46Z128VLH4,557 NXP USA Inc. Description: KINETIS KL46: 48MHZ CORTEX M0+ U
Produkt ist nicht verfügbar
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BYV415W-600P127 BYV415W-600P127 NXP USA Inc. BYV415W-600P.pdf Description: ULTRAFAST RECTIFIER DIODE TO 24
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BZV55-C20135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV55-C20 - ZENER D
Part Status: Active
Packaging: Bulk
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 500 mW
Supplier Device Package: LLDS; MiniMelf
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Surface Mount
Package / Case: DO-213AC, MINI-MELF, SOD-80
Tolerance: ±5%
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
Produkt ist nicht verfügbar
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LS1046AXN8Q1A LS1046AXN8Q1A NXP USA Inc. LS1046AFS.pdf Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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60+163.96 EUR
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PBSS4120T/S500,215 NXP USA Inc. Description: PBSS4120T/S500,215
Produkt ist nicht verfügbar
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MCF52230CAF60557 MCF52230CAF60557 NXP USA Inc. MCF52235DS.pdf Description: MCF5223X 32 BIT MCU, COLDFIRE V2
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BF1100WR,115 BF1100WR,115 NXP USA Inc. BF1100WR.pdf Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
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N74F541N,602 N74F541N,602 NXP USA Inc. N74F540%2C541.pdf Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
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BLF6G20-180PN112 NXP USA Inc. PHGLS18506-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG2010EA115 NXP USA Inc. PMEG2010EA.pdf Description: DIODE SCHOTTKY 20V 1A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: 125°C (Max)
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Produkt ist nicht verfügbar
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FS32K116LIT0VLFT FS32K116LIT0VLFT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MCIMX6G2AVM07AA MCIMX6G2AVM07AA NXP USA Inc. MCIMX6GxAzzzzzA.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 696MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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PESD5V0S1UA/ZL115 PESD5V0S1UA/ZL115 NXP USA Inc. PESD5V0S1UA_PESD12VS1UA.pdf Description: TVS DIODE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XDT256F1VALR S912XDT256F1VALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
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S912XDT256F1VAL S912XDT256F1VAL NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1113JBD48/303151 LPC1113JBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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MIMXRT1172CVM8A MIMXRT1172CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Number of I/O: 13
DigiKey Programmable: Not Verified
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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10+28.59 EUR
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S912XEP100W1MAL S912XEP100W1MAL NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
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BGA3131J BGA3131J NXP USA Inc. BGA3131.pdf Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 6.5dB ~ 15dB
Current - Supply: 660mA
Gain: 37dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: CATV
Frequency: 5MHz ~ 205MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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10+4.45 EUR
25+4.21 EUR
100+3.87 EUR
250+3.67 EUR
500+3.53 EUR
1000+3.39 EUR
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74HC688DB118 74HC688DB118 NXP USA Inc. 74HC688.pdf Description: IC COMPARATOR IDENTITY 8B 20SSOP
Operating Temperature: -40°C ~ 125°C
Type: Identity Comparator
Output: Active Low
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of Bits: 8
Output Function: A=B
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Supplier Device Package: 20-SSOP
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Produkt ist nicht verfügbar
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74HCT574PW/C1118 NXP USA Inc. PHGL-S-A0000283113-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT574PW-Q100118 NXP USA Inc. 74HC_HCT574_Q100.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MIMXRT1062DVL6B MIMXRT1062DVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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2+17.32 EUR
10+13.55 EUR
25+12.61 EUR
240+11.1 EUR
480+10.8 EUR
720+10.65 EUR
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74AHCT1G14GW/C125 74AHCT1G14GW/C125 NXP USA Inc. PHGLS19320-1.pdf?t.download=true&u=5oefqw Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
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74AHCT1G14GW-Q100125 74AHCT1G14GW-Q100125 NXP USA Inc. 74AHC_AHCT1G14_Q100.pdf Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT16373ADGG653 74LVT16373ADGG653 NXP USA Inc. PHGLS16242-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
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74LVT16374ADGG653 74LVT16374ADGG653 NXP USA Inc. PHGLS24369-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
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BZX585-C2V4135 BZX585-C2V4135 NXP USA Inc. BZX585_SERIES.pdf Description: NOW NEXPERIA BZX585-C2V4 - ZENER
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MCIMX6G2DVM05AA-NXP MCIMX6G2DVM05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G2DVK05AA-NXP MCIMX6G2DVK05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MCIMX6G3DVM05AA-NXP MCIMX6G3DVM05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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74LV00N,112 74LV00N,112 NXP USA Inc. 74LV00_Rev3.pdf Description: IC GATE NAND 4CH 2-INP 14DIP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DIP
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74LVTN16244BBX,518 74LVTN16244BBX,518 NXP USA Inc. PHGLS24361-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Supplier Device Package: 60-HXQFNU (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
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74LVTN16244BDGG112 74LVTN16244BDGG112 NXP USA Inc. 74LVTN16244B.pdf Description: BUS DRIVER, LVT SERIES, 4-BIT
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
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74LVTN16245BDGG112 74LVTN16245BDGG112 NXP USA Inc. 74LVTN16245B.pdf Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
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PCAL6416AER118 PCAL6416AER118 NXP USA Inc. PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AER115 NXP USA Inc. PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT02DB118 74HCT02DB118 NXP USA Inc. 74HC_HCT02.pdf Description: IC GATE NOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G158GF,132 74AUP1G158GF,132 NXP USA Inc. 74AUP1G158.pdf Description: IC MUX LP 2-INPUT 6-XSON
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
auf Bestellung 19800 Stücke:
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MC908GP32CFBER528 MC908GP32CFBER528 NXP USA Inc. MC68HC908GP32.pdf Description: I/C HC908 FLASH
Produkt ist nicht verfügbar
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74LVC2G08GT/S505115 PHGLS27069-1.pdf?t.download=true&u=5oefqw
74LVC2G08GT/S505115
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Active
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3806+0.13 EUR
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74HC4351N,652 74HC%28T%294351_Rev_Feb2017.pdf
74HC4351N,652
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 120OHM 20DIP
Channel-to-Channel Matching (ΔRon): 6Ohm
Multiplexer/Demultiplexer Circuit: 8:1
Voltage - Supply, Dual (V±): ±1V ~ 5V
Voltage - Supply, Single (V+): 2V ~ 10V
Supplier Device Package: 20-DIP
-3db Bandwidth: 170MHz
On-State Resistance (Max): 120Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Bulk
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 100nA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 55ns, 45ns
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74AHC1G4210GW125 74AHC1G4210.pdf
74AHC1G4210GW125
Hersteller: NXP USA Inc.
Description: 10-STAGE DIVIDER AND OSCILLATOR
Produkt ist nicht verfügbar
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74AHC1G4212GW125 74AHC1G4212.pdf
74AHC1G4212GW125
Hersteller: NXP USA Inc.
Description: 12-STAGE DIVIDER AND OSCILLATOR
Packaging: Bulk
Part Status: Active
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PSMN7R0-30YL115/BKN PSMN7R0-30YL.pdf
PSMN7R0-30YL115/BKN
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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PUMD2125 PEMD2_PIMD2_PUMD2.pdf
PUMD2125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PUMD2 SMALL SIGNAL
Produkt ist nicht verfügbar
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PCA9601DP/S911118 _PCA9601.pdf?t.download=true&u=ovmfp3
PCA9601DP/S911118
Hersteller: NXP USA Inc.
Description: DUAL BIDIRECTIONAL BUS BUFFER
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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IP4385CX4/LF,135 IP4085%2C4385%2C4386%2C4387%28CX4%29.pdf
IP4385CX4/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 10VC 4WLCSP
Part Status: Obsolete
Power Line Protection: No
Voltage - Clamping (Max) @ Ipp: 10V
Voltage - Breakdown (Min): 7V
Unidirectional Channels: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Current - Peak Pulse (10/1000µs): 33A (8/20µs)
Capacitance @ Frequency: 450pF @ 1MHz
Applications: General Purpose
Operating Temperature: -35°C ~ 85°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 4-UFBGA, WLCSP
Packaging: Bulk
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13172+0.032 EUR
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IP4055CX6/LF135
IP4055CX6/LF135
Hersteller: NXP USA Inc.
Description: CONSUMER CIRCUIT
Part Status: Active
Packaging: Bulk
auf Bestellung 193500 Stücke:
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AnzahlPreis
5770+0.088 EUR
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IP4359CX4/LF,135 IP4359CX4.pdf
IP4359CX4/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 4CSP
Packaging: Bulk
auf Bestellung 2799200 Stücke:
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2664+0.19 EUR
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IP4059CX5/LF,135 IP4059CX5.pdf
IP4059CX5/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5CSP
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 3
Supplier Device Package: 5-CSP (1.33x0.96)
Voltage - Reverse Standoff (Typ): 5.5V
Capacitance @ Frequency: 3pF @ 1MHz
Applications: Ethernet, USB OTG
Operating Temperature: -40°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 5-UFBGA, WLCSP
Packaging: Bulk
auf Bestellung 25168 Stücke:
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AnzahlPreis
2049+0.24 EUR
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IP4053CX15/LF135
Hersteller: NXP USA Inc.
Description: CONSUMER CIRCUIT
Packaging: Bulk
auf Bestellung 13500 Stücke:
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AnzahlPreis
1158+0.46 EUR
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IP4350CX24/LF,135 IP4350CX24.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Operating Temperature: -35°C ~ 85°C (TA)
Type: Steering (Rail to Rail)
Mounting Type: Surface Mount
Package / Case: 24-WFBGA, WLCSP
Packaging: Bulk
Part Status: Obsolete
Power Line Protection: Yes
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 9
Supplier Device Package: 24-WLCSP (1.95x2.11)
Applications: Multimedia Card Interface
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1158+0.42 EUR
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NX2301P215 NX2301P.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD2088 LPC435X_3X_2X_1X.pdf
LPC4357JBD2088
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Produkt ist nicht verfügbar
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LPC4357FET256K LPC435X_3X_2X_1X.pdf
LPC4357FET256K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
DigiKey Programmable: Not Verified
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
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1+27.16 EUR
10+21.71 EUR
90+18.95 EUR
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TEF6621T/V1512
TEF6621T/V1512
Hersteller: NXP USA Inc.
Description: TEF6621T - CAR RADIO TUNER IC
Packaging: Bulk
DigiKey Programmable: Not Verified
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94+5.36 EUR
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TEF6621T/V1518
TEF6621T/V1518
Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 32SO
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 559 Stücke:
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78+6.46 EUR
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LD6806F/22P,115 LD6806_Series.pdf
LD6806F/22P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
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2404+0.2 EUR
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MKL17Z32VDA4R KL17P64M48SF2.pdf
MKL17Z32VDA4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 36XFBGA
Packaging: Cut Tape (CT)
Package / Case: 36-XFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 36-XFBGA (3.5x3.5)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
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3+7.02 EUR
10+5.32 EUR
25+4.9 EUR
100+4.44 EUR
250+4.22 EUR
500+4.17 EUR
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MKL46Z128VLH4,557
Hersteller: NXP USA Inc.
Description: KINETIS KL46: 48MHZ CORTEX M0+ U
Produkt ist nicht verfügbar
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BYV415W-600P127 BYV415W-600P.pdf
BYV415W-600P127
Hersteller: NXP USA Inc.
Description: ULTRAFAST RECTIFIER DIODE TO 24
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BZV55-C20135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV55-C20 - ZENER D
Part Status: Active
Packaging: Bulk
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 500 mW
Supplier Device Package: LLDS; MiniMelf
Impedance (Max) (Zzt): 55 Ohms
Voltage - Zener (Nom) (Vz): 20 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Surface Mount
Package / Case: DO-213AC, MINI-MELF, SOD-80
Tolerance: ±5%
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
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LS1046AXN8Q1A LS1046AFS.pdf
LS1046AXN8Q1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Part Status: Active
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (3) + PHY
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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1+201.03 EUR
10+170.07 EUR
60+163.96 EUR
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PBSS4120T/S500,215
Hersteller: NXP USA Inc.
Description: PBSS4120T/S500,215
Produkt ist nicht verfügbar
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MCF52230CAF60557 MCF52235DS.pdf
MCF52230CAF60557
Hersteller: NXP USA Inc.
Description: MCF5223X 32 BIT MCU, COLDFIRE V2
Produkt ist nicht verfügbar
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BF1100WR,115 BF1100WR.pdf
BF1100WR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
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1567+0.32 EUR
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N74F541N,602 N74F540%2C541.pdf
N74F541N,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
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270+1.79 EUR
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BLF6G20-180PN112 PHGLS18506-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG2010EA115 PMEG2010EA.pdf
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: 125°C (Max)
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Produkt ist nicht verfügbar
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FS32K116LIT0VLFT S32K-DS.pdf
FS32K116LIT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6G2AVM07AA MCIMX6GxAzzzzzA.pdf
MCIMX6G2AVM07AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 696MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PESD5V0S1UA/ZL115 PESD5V0S1UA_PESD12VS1UA.pdf
PESD5V0S1UA/ZL115
Hersteller: NXP USA Inc.
Description: TVS DIODE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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S912XDT256F1VALR
S912XDT256F1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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S912XDT256F1VAL
S912XDT256F1VAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1113JBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113JBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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MIMXRT1172CVM8A i.MX-RT1170-FS.pdf
MIMXRT1172CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Number of I/O: 13
DigiKey Programmable: Not Verified
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
auf Bestellung 129 Stücke:
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1+35.71 EUR
10+28.59 EUR
25+26.8 EUR
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S912XEP100W1MAL
S912XEP100W1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
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AnzahlPreis
1+57.71 EUR
10+46.28 EUR
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BGA3131J BGA3131.pdf
BGA3131J
Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 6.5dB ~ 15dB
Current - Supply: 660mA
Gain: 37dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: CATV
Frequency: 5MHz ~ 205MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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AnzahlPreis
4+5.16 EUR
10+4.45 EUR
25+4.21 EUR
100+3.87 EUR
250+3.67 EUR
500+3.53 EUR
1000+3.39 EUR
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74HC688DB118 74HC688.pdf
74HC688DB118
Hersteller: NXP USA Inc.
Description: IC COMPARATOR IDENTITY 8B 20SSOP
Operating Temperature: -40°C ~ 125°C
Type: Identity Comparator
Output: Active Low
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of Bits: 8
Output Function: A=B
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Supplier Device Package: 20-SSOP
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Produkt ist nicht verfügbar
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74HCT574PW/C1118 PHGL-S-A0000283113-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT574PW-Q100118 74HC_HCT574_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MIMXRT1062DVL6B IMXRT1060CEC.pdf
MIMXRT1062DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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AnzahlPreis
2+17.32 EUR
10+13.55 EUR
25+12.61 EUR
240+11.1 EUR
480+10.8 EUR
720+10.65 EUR
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74AHCT1G14GW/C125 PHGLS19320-1.pdf?t.download=true&u=5oefqw
74AHCT1G14GW/C125
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G14GW-Q100125 74AHC_AHCT1G14_Q100.pdf
74AHCT1G14GW-Q100125
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT16373ADGG653 PHGLS16242-1.pdf?t.download=true&u=5oefqw
74LVT16373ADGG653
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
auf Bestellung 26800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1025+0.47 EUR
Mindestbestellmenge: 1025 Stücke
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74LVT16374ADGG653 PHGLS24369-1.pdf?t.download=true&u=5oefqw
74LVT16374ADGG653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1025+0.47 EUR
Mindestbestellmenge: 1025 Stücke
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BZX585-C2V4135 BZX585_SERIES.pdf
BZX585-C2V4135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C2V4 - ZENER
auf Bestellung 174425 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 15000 Stücke
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MCIMX6G2DVM05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVM05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
20+22.63 EUR
Mindestbestellmenge: 20 Stücke
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MCIMX6G2DVK05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVK05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 7797 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
22+20.44 EUR
Mindestbestellmenge: 22 Stücke
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MCIMX6G3DVM05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G3DVM05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 3184 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
19+23.01 EUR
Mindestbestellmenge: 19 Stücke
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74LV00N,112 74LV00_Rev3.pdf
74LV00N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DIP
auf Bestellung 6421 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
620+0.81 EUR
Mindestbestellmenge: 620 Stücke
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74LVTN16244BBX,518 PHGLS24361-1.pdf?t.download=true&u=5oefqw
74LVTN16244BBX,518
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Supplier Device Package: 60-HXQFNU (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
833+0.58 EUR
Mindestbestellmenge: 833 Stücke
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74LVTN16244BDGG112 74LVTN16244B.pdf
74LVTN16244BDGG112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
auf Bestellung 10125 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
815+0.6 EUR
Mindestbestellmenge: 815 Stücke
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74LVTN16245BDGG112 74LVTN16245B.pdf
74LVTN16245BDGG112
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
auf Bestellung 8770 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
784+0.61 EUR
Mindestbestellmenge: 784 Stücke
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PCAL6416AER118 PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw
PCAL6416AER118
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AER115 PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT02DB118 74HC_HCT02.pdf
74HCT02DB118
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G158GF,132 74AUP1G158.pdf
74AUP1G158GF,132
Hersteller: NXP USA Inc.
Description: IC MUX LP 2-INPUT 6-XSON
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
auf Bestellung 19800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1972+0.24 EUR
Mindestbestellmenge: 1972 Stücke
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MC908GP32CFBER528 MC68HC908GP32.pdf
MC908GP32CFBER528
Hersteller: NXP USA Inc.
Description: I/C HC908 FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
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