Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36617) > Seite 378 nach 611
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BF1100WR,115 | NXP USA Inc. |
 Description: RF MOSFET 9V CMPAK-4Packaging: Bulk Package / Case: SC-82A, SOT-343 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: CMPAK-4 Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
auf Bestellung 66000 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F541N,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-DIP Part Status: Obsolete |
auf Bestellung 2088 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF6G20-180PN112 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMEG2010EA115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 20V 1A SOD323 Current - Reverse Leakage @ Vr: 50 µA @ 15 V Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A Voltage - DC Reverse (Vr) (Max): 20 V Part Status: Active Operating Temperature - Junction: 125°C (Max) Supplier Device Package: SOD-323 Current - Average Rectified (Io): 1A Capacitance @ Vr, F: 25pF @ 5V, 1MHz Technology: Schottky Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FS32K116LIT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 43 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, PWM, WDT Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 13x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 17K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6G2AVM07AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Obsolete Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: LCD, LVDS Graphics Acceleration: No RAM Controllers: LPDDR2, DDR3, DDR3L Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (2) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A7 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 696MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PESD5V0S1UA/ZL115 | NXP USA Inc. |
Description: TVS DIODE Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912XDT256F1VALR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP RAM Size: 16K x 8 Program Memory Size: 256KB (256K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 91 Part Status: Not For New Designs Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912XDT256F1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Part Status: Not For New Designs Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 256KB (256K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1113JBD48/303151 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 24KB (24K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Bulk Number of I/O: 28 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1172CVM8A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289MAPBGA Number of I/O: 13 DigiKey Programmable: Not Verified Supplier Device Package: 289-LFBGA (14x14) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 2M x 8 Speed: 800MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
auf Bestellung 129 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEP100W1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 112LQFP Number of I/O: 91 Part Status: Active Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray Operating Temperature: -40°C ~ 125°C (TA) DigiKey Programmable: Not Verified |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA3131J | NXP USA Inc. |
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN Supplier Device Package: 20-HVQFN (5x5) Noise Figure: 6.5dB ~ 15dB Current - Supply: 660mA Gain: 37dB Voltage - Supply: 4.75V ~ 5.25V RF Type: CATV Frequency: 5MHz ~ 205MHz Mounting Type: Surface Mount Package / Case: 20-VQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC688DB118 | NXP USA Inc. |
Description: IC COMPARATOR IDENTITY 8B 20SSOP Operating Temperature: -40°C ~ 125°C Type: Identity Comparator Output: Active Low Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Bulk Number of Bits: 8 Output Function: A=B Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF Supplier Device Package: 20-SSOP Current - Output High, Low: 5.2mA, 5.2mA Current - Quiescent (Iq): 8 µA Voltage - Supply: 2V ~ 6V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 74HCT574PW/C1118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Number of Bits per Element: 8 Part Status: Active Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 3.5 pF Clock Frequency: 76 MHz Trigger Type: Positive Edge Current - Output High, Low: 6mA, 6mA Current - Quiescent (Iq): 8 µA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74HCT574PW-Q100118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Output Type: Tri-State, Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk Number of Bits per Element: 8 Part Status: Active Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 3.5 pF Clock Frequency: 76 MHz Trigger Type: Positive Edge Current - Output High, Low: 6mA, 6mA Current - Quiescent (Iq): 8 µA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMXRT1062DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 1021 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT1G14GW/C125 | NXP USA Inc. |
Description: INVERTER, AHCT/VHCT/VT SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AHCT1G14GW-Q100125 | NXP USA Inc. |
Description: INVERTER, AHCT/VHCT/VT SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVT16373ADGG653 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT Packaging: Bulk |
auf Bestellung 26800 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT16374ADGG653 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP Packaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX585-C2V4135 | NXP USA Inc. |
Description: NOW NEXPERIA BZX585-C2V4 - ZENER |
auf Bestellung 174425 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 15000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6G2DVM05AA-NXP | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 147 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G2DVK05AA-NXP | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Bulk Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 7797 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G3DVM05AA-NXP | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 3184 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV00N,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14DIP Number of Inputs: 2 Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Packaging: Tube Current - Quiescent (Max): 40 µA Number of Circuits: 4 Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF Input Logic Level - Low: 0.3V ~ 0.8V Input Logic Level - High: 0.9V ~ 2V Supplier Device Package: 14-DIP |
auf Bestellung 6421 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTN16244BBX,518 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 60HXQFNU Supplier Device Package: 60-HXQFNU (4x6) Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 4 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 60-XFQFN Dual Rows, Exposed Pad Packaging: Bulk |
auf Bestellung 4800 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTN16244BDGG112 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT Supplier Device Package: 48-TSSOP Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 4 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 48-TFSOP (0.240", 6.10mm Width) Packaging: Bulk |
auf Bestellung 10125 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTN16245BDGG112 | NXP USA Inc. |
Description: BUS TRANSCVR, LVT SERIES, 8-BIT Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 48-TFSOP (0.240", 6.10mm Width) Packaging: Bulk Supplier Device Package: 48-TSSOP Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 8 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting |
auf Bestellung 8770 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL6416AER118 | NXP USA Inc. |
Description: LOW VOLTAGE TRANSLATING, 8 BIT I Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PCAL6416AER115 | NXP USA Inc. |
Description: LOW VOLTAGE TRANSLATING, 8 BIT I Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HCT02DB118 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14SSOP Current - Quiescent (Max): 2 µA Number of Circuits: 4 Part Status: Active Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-SSOP Number of Inputs: 2 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
Produkt ist nicht verfügbar |
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74AUP1G158GF,132 | NXP USA Inc. |
Description: IC MUX LP 2-INPUT 6-XSON Circuit: 1 x 2:1 Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Bulk Supplier Device Package: 6-XSON, SOT891 (1x1) Voltage Supply Source: Single Supply Current - Output High, Low: 4mA, 4mA Independent Circuits: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Type: Multiplexer |
auf Bestellung 19800 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908GP32CFBER528 | NXP USA Inc. |
Description: I/C HC908 FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9511AD,112 | NXP USA Inc. |
Description: BUFFER, ACCELERATOR 1 CHANNEL 40 Capacitance - Input: 5 pF Supplier Device Package: 8-SO Data Rate (Max): 400kHz Current - Supply: 6mA Applications: I²C - Hotswap Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Input: 2-Wire Bus Type: Buffer, Accelerator Output: 2-Wire Bus Mounting Type: Surface Mount Number of Channels: 1 Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
auf Bestellung 33929 Stücke: Lieferzeit 10-14 Tag (e) |
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8MNANOD4-EVK | NXP USA Inc. |
Description: 8MNANOD4-EVK Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX 8M Nano Part Status: Active |
Produkt ist nicht verfügbar |
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| OM12001/000557 | NXP USA Inc. |
Description: AUTOMOTIVE TELEMATICS ON-BOARD U Packaging: Bulk Mounting Type: Surface Mount RF Type: Cellular Part Status: Active |
Produkt ist nicht verfügbar |
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| OM12000/0000000557 | NXP USA Inc. |
Description: AUTOMOTIVE TELEMATICS ON-BOARD U Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PZT2222A135 | NXP USA Inc. |
Description: NOW NEXPERIA PZT2222A SMALL SIGN DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
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PCA85176H/Q900/1518 | NXP USA Inc. |
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA85176H/Q900/155 | NXP USA Inc. |
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PCF85176/1518 | NXP USA Inc. |
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR |
Produkt ist nicht verfügbar |
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PEMI2STD/RM,115 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: SOT-665 Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 16pF (Total) Height: 0.024" (0.60mm) Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
Produkt ist nicht verfügbar |
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TJA1055T/1118 | NXP USA Inc. |
Description: IC ENHANCED FAULT TOLERANT Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
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TJA1055T/3/1118 | NXP USA Inc. |
Description: IC ENHANCED FAULT TOLERANT Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
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TJA1055T/3/C,512 | NXP USA Inc. |
Description: IC PDSO14 Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| TJA1055TC512 | NXP USA Inc. |
Description: IC CAN TXRX FAULT-TOL 14-SOIC Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
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74LVC1G00GF/S505125 | NXP USA Inc. |
Description: NAND GATE, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G00GF/S500132 | NXP USA Inc. |
Description: NAND GATE, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74AHC138PW112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHC138PW - DECODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6G1AVM05ABR | NXP USA Inc. |
Description: IC MPU I.MX6G 528MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BAS16/LF1215 | NXP USA Inc. |
Description: RECTIFIER DIODE, 0.215A, 100V Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4 ns Technology: Standard Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Current - Average Rectified (Io): 215mA Supplier Device Package: TO-236AB Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
auf Bestellung 96000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1131HW/FD/3V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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2PC4081R/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Bulk Power - Max: 200 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 150 mA Supplier Device Package: SOT-323 Frequency - Transition: 100MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V Current - Collector Cutoff (Max): 100nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA Operating Temperature: 150°C (TJ) |
auf Bestellung 1950000 Stücke: Lieferzeit 10-14 Tag (e) |
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_SOT226%20Pkg.jpg "BUK7E4R3-75C,127") |
BUK7E4R3-75C,127 | NXP USA Inc. | Description: MOSFET N-CH 75V 100A I2PAK |
auf Bestellung 542 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1G66GV-Q100125 | NXP USA Inc. |
Description: 74LVC1G66GV-Q100 - SPST Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MK20DN512ZVMC10557 | NXP USA Inc. |
Description: KINETIS K20: 100MHZ CORTEX M4 PE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BZX84-B39/LF1R | NXP USA Inc. |
Description: DIODE ZENER 39V 250MW SOT23 Tolerance: ±2% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 39 V Impedance (Max) (Zzt): 130 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AHC1G06GV,125 | NXP USA Inc. |
Description: IC INVERTER 1CH 1-INP 5TSOP Current - Quiescent (Max): 1 µA Number of Circuits: 1 Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF Input Logic Level - Low: 0.5V ~ 1.65V Input Logic Level - High: 1.5V ~ 3.85V Supplier Device Package: 5-TSOP Number of Inputs: 1 Current - Output High, Low: -, 8mA Voltage - Supply: 2V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: Inverter Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Features: Open Drain Packaging: Bulk |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC1G07GW-Q100125 | NXP USA Inc. |
Description: BUFFER, AHC/VHC/H/U/V SERIES |
auf Bestellung 180000 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 10340 Stücke Im Einkaufswagen Stück im Wert von UAH |
| BF1100WR,115 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
auf Bestellung 66000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1567+ | 0.38 EUR |
| N74F541N,602 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 2088 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 270+ | 2.13 EUR |
| PMEG2010EA115 |
|
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: 125°C (Max)
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Description: DIODE SCHOTTKY 20V 1A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: 125°C (Max)
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K116LIT0VLFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 43
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6G2AVM07AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 696MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 696MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XDT256F1VALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XDT256F1VAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Not For New Designs
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC1113JBD48/303151 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1172CVM8A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Number of I/O: 13
DigiKey Programmable: Not Verified
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Number of I/O: 13
DigiKey Programmable: Not Verified
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.49 EUR |
| 10+ | 34.02 EUR |
| 25+ | 31.89 EUR |
| S912XEP100W1MAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 68.67 EUR |
| 10+ | 55.07 EUR |
| BGA3131J |
|
Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 6.5dB ~ 15dB
Current - Supply: 660mA
Gain: 37dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: CATV
Frequency: 5MHz ~ 205MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 6.5dB ~ 15dB
Current - Supply: 660mA
Gain: 37dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: CATV
Frequency: 5MHz ~ 205MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.14 EUR |
| 10+ | 5.3 EUR |
| 25+ | 5.01 EUR |
| 100+ | 4.61 EUR |
| 250+ | 4.37 EUR |
| 500+ | 4.2 EUR |
| 1000+ | 4.03 EUR |
| 74HC688DB118 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR IDENTITY 8B 20SSOP
Operating Temperature: -40°C ~ 125°C
Type: Identity Comparator
Output: Active Low
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of Bits: 8
Output Function: A=B
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Supplier Device Package: 20-SSOP
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Description: IC COMPARATOR IDENTITY 8B 20SSOP
Operating Temperature: -40°C ~ 125°C
Type: Identity Comparator
Output: Active Low
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of Bits: 8
Output Function: A=B
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Supplier Device Package: 20-SSOP
Current - Output High, Low: 5.2mA, 5.2mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 2V ~ 6V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT574PW/C1118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT574PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 3.5 pF
Clock Frequency: 76 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 6mA, 6mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1062DVL6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1021 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.87 EUR |
| 10+ | 18.77 EUR |
| 25+ | 17.49 EUR |
| 240+ | 15.45 EUR |
| 480+ | 15.03 EUR |
| 720+ | 14.83 EUR |
| 74AHCT1G14GW/C125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT1G14GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT16373ADGG653 |
|
auf Bestellung 26800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1025+ | 0.56 EUR |
| 74LVT16374ADGG653 |
|
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1025+ | 0.56 EUR |
| BZX585-C2V4135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C2V4 - ZENER
Description: NOW NEXPERIA BZX585-C2V4 - ZENER
auf Bestellung 174425 Stücke:
Lieferzeit 10-14 Tag (e)
| MCIMX6G2DVM05AA-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 20+ | 27.43 EUR |
| MCIMX6G2DVK05AA-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 7797 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 22+ | 25.26 EUR |
| MCIMX6G3DVM05AA-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 3184 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 19+ | 28.44 EUR |
| 74LV00N,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DIP
Description: IC GATE NAND 4CH 2-INP 14DIP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DIP
auf Bestellung 6421 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 620+ | 0.96 EUR |
| 74LVTN16244BBX,518 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Supplier Device Package: 60-HXQFNU (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Supplier Device Package: 60-HXQFNU (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 833+ | 0.69 EUR |
| 74LVTN16244BDGG112 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Description: BUS DRIVER, LVT SERIES, 4-BIT
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
auf Bestellung 10125 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 815+ | 0.71 EUR |
| 74LVTN16245BDGG112 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
auf Bestellung 8770 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 784+ | 0.73 EUR |
| PCAL6416AER118 |
|
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCAL6416AER115 |
|
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Part Status: Active
Packaging: Bulk
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT02DB118 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC GATE NOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP1G158GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC MUX LP 2-INPUT 6-XSON
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
Description: IC MUX LP 2-INPUT 6-XSON
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Supplier Device Package: 6-XSON, SOT891 (1x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Multiplexer
auf Bestellung 19800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1972+ | 0.29 EUR |
| MC908GP32CFBER528 |
|
Hersteller: NXP USA Inc.
Description: I/C HC908 FLASH
Description: I/C HC908 FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA9511AD,112 |
|
Hersteller: NXP USA Inc.
Description: BUFFER, ACCELERATOR 1 CHANNEL 40
Capacitance - Input: 5 pF
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 6mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, Accelerator
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: BUFFER, ACCELERATOR 1 CHANNEL 40
Capacitance - Input: 5 pF
Supplier Device Package: 8-SO
Data Rate (Max): 400kHz
Current - Supply: 6mA
Applications: I²C - Hotswap
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, Accelerator
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 33929 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 582+ | 1.8 EUR |
| 8MNANOD4-EVK |
|
Hersteller: NXP USA Inc.
Description: 8MNANOD4-EVK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Part Status: Active
Description: 8MNANOD4-EVK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM12001/000557 |
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM12000/0000000557 |
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| PZT2222A135 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZT2222A SMALL SIGN
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA PZT2222A SMALL SIGN
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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| PCA85176H/Q900/1518 |
|
Hersteller: NXP USA Inc.
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| PCA85176H/Q900/155 |
|
Hersteller: NXP USA Inc.
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| PCF85176/1518 |
|
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Produkt ist nicht verfügbar
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| PEMI2STD/RM,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
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| TJA1055TC512 |
|
Hersteller: NXP USA Inc.
Description: IC CAN TXRX FAULT-TOL 14-SOIC
Part Status: Active
Packaging: Bulk
Description: IC CAN TXRX FAULT-TOL 14-SOIC
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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| 74LVC1G00GF/S505125 |
|
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 720+ | 0.83 EUR |
| 74LVC1G00GF/S500132 |
|
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2221+ | 0.27 EUR |
| 74AHC138PW112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC138PW - DECODE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHC138PW - DECODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| MCIMX6G1AVM05ABR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| BAS16/LF1215 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 0.215A, 100V
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 215mA
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: RECTIFIER DIODE, 0.215A, 100V
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 215mA
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
auf Bestellung 96000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.038 EUR |
| UJA1131HW/FD/3V/4Y |
|
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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Stück im Wert von UAH
| 2PC4081R/ZL115 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 150 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Bulk
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 150 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
auf Bestellung 1950000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.039 EUR |
| BUK7E4R3-75C,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 100A I2PAK
Description: MOSFET N-CH 75V 100A I2PAK
auf Bestellung 542 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 188+ | 3.24 EUR |
| MK20DN512ZVMC10557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K20: 100MHZ CORTEX M4 PE
Description: KINETIS K20: 100MHZ CORTEX M4 PE
Produkt ist nicht verfügbar
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| BZX84-B39/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 39V 250MW SOT23
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Qualification: AEC-Q101
Description: DIODE ZENER 39V 250MW SOT23
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| 74AHC1G06GV,125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5TSOP
Current - Quiescent (Max): 1 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Input Logic Level - Low: 0.5V ~ 1.65V
Input Logic Level - High: 1.5V ~ 3.85V
Supplier Device Package: 5-TSOP
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Features: Open Drain
Packaging: Bulk
Description: IC INVERTER 1CH 1-INP 5TSOP
Current - Quiescent (Max): 1 µA
Number of Circuits: 1
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Input Logic Level - Low: 0.5V ~ 1.65V
Input Logic Level - High: 1.5V ~ 3.85V
Supplier Device Package: 5-TSOP
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Features: Open Drain
Packaging: Bulk
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5323+ | 0.12 EUR |
| 74AHC1G07GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: BUFFER, AHC/VHC/H/U/V SERIES
Description: BUFFER, AHC/VHC/H/U/V SERIES
auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)