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LPC1111FHN33/101551 LPC1111FHN33/101551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 35 Stücke
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LPC1112LVFHN24/003151 LPC1112LVFHN24/003151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Produkt ist nicht verfügbar
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LPC1111FHN33/201,5 LPC1111FHN33/201,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1112FHN33/202551 LPC1112FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Produkt ist nicht verfügbar
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LPC1112JHN33/203551 LPC1112JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112FHI33/203551 LPC1112FHI33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC1113FHN33/203551 LPC1113FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
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LPC1113FHN33/202551 LPC1113FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/203,5 LPC1113FHN33/203,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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LPC1114LVFHN24/103151 LPC1114LVFHN24/103151 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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LPC1113JHN33/203551 LPC1113JHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 LPC1112FHN33/201551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1112LVFHI33/103 LPC1112LVFHI33/103 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
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LPC1113FHN33/303551 LPC1113FHN33/303551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
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LPC1112LVFHI33/103551 LPC1112LVFHI33/103551 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
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LPC1114FHN33/203551 LPC1114FHN33/203551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1114FHN33/202551 LPC1114FHN33/202551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
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LPC1113FHN33/301551 LPC1113FHN33/301551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 32HVQFN
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LPC1113FBD48/303151 LPC1113FBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 LPC1114FHN33/303 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC18S10FET100551 NXP USA Inc. PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
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LPC54606J256ET100551 LPC54606J256ET100551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC4370FET100551 LPC4370FET100551 NXP USA Inc. PHGLS29822-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
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LPC43S70FET100551 NXP USA Inc. PHGL-S-A0001691352-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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LPC1812JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1813JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1823JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1815JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 180MHz
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LPC1833JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1817JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4313JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1827JET100551 LPC1827JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4323JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC1837JET100551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC18S37JET100551 NXP USA Inc. PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4333JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
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LPC4325JET100551 LPC4325JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC4327JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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LPC4337JET100551 LPC4337JET100551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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LPC43S37JET100551 NXP USA Inc. PHGL-S-A0001691376-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S67JET100551 NXP USA Inc. PHGL-S-A0001691607-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
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LPC54606J512ET100551 LPC54606J512ET100551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLSH 100TFBGA
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC4367JET100551 NXP USA Inc. PHGL-S-A0001691629-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 100TFBGA
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BAW56SRA147 NXP USA Inc. BAW56QA.pdf Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74ABT00N,112 74ABT00N,112 NXP USA Inc. 74ABT00.pdf Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
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74ABT00DB118 74ABT00DB118 NXP USA Inc. 74ABT00.pdf Description: NOW NEXPERIA 74ABT00DB - NAND GA
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
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PDTC114YT235 NXP USA Inc. PDTC114Y_SER.pdf Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
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PDTC114YM315 NXP USA Inc. PHGLS24123-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PDTC114YM - SMALL S
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistor - Base (R1): 10 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Active
Supplier Device Package: DFN1006-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Emitter Base (R2): 47 kOhms
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PDTC124XMB315 NXP USA Inc. PDTC124XMB.pdf Description: NOW NEXPERIA PDTC124XMB - SMALL
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PDTC124TMB315 PDTC124TMB315 NXP USA Inc. PDTC124TMB.pdf Description: TRANS PREBIAS
Qualification: AEC-Q101
Resistor - Base (R1): 22 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
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BAS21AVD/DG/B2135 BAS21AVD/DG/B2135 NXP USA Inc. PHGLS28417-1.pdf?t.download=true&u=5oefqw Description: BAS21AVD - RECTIFIER DIODE
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BAS21AVD135 NXP USA Inc. Description: NOW NEXPERIA BAS21AVD - RECTIFIE
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MC912D60AVFUE8 MC912D60AVFUE8 NXP USA Inc. MC68HC912D60A.pdf Description: IC MCU 16BIT 60KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912D60AH2VPVE NXP USA Inc. Description: IC MCU 16BIT SGF 112LQFP
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S912D60AH2VPVER NXP USA Inc. Description: IC MCU 16BIT SGF 112LQFP
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74LV241DB,112 74LV241DB,112 NXP USA Inc. 74LV241.pdf Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
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74LV241N,112 74LV241N,112 NXP USA Inc. 74LV241.pdf Description: IC BUFFER NON-INVERT 3.6V 20DIP
Supplier Device Package: 20-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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MC68HC908QT2CPE-NXP MC68HC908QT2CPE-NXP NXP USA Inc. Description: MICROCONTROLLER, 8 BIT, HC08/S08
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Part Status: Active
Supplier Device Package: 8-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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LPC2148FBD64,157 LPC2148FBD64,157 NXP USA Inc. LPC2141_42_44_46_48.pdf Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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74LVC161DB118 74LVC161DB118 NXP USA Inc. 74LVC161.pdf Description: BINARY COUNTER, LVC/LCX/Z SERIES
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LPC1111FHN33/101551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/101551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Produkt ist nicht verfügbar
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LPC1112LVFHN24/003151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1112LVFHN24/003151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24HVQFN
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LPC1111FHN33/201,5 UM10398.pdf
LPC1111FHN33/201,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1112FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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LPC1112JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112FHI33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHI33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC1113FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
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LPC1113FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
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LPC1113FHN33/203,5 UM10398.pdf
LPC1113FHN33/203,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
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AnzahlPreis
167+3.02 EUR
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LPC1114LVFHN24/103151 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHN24/103151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 20
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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LPC1113JHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113JHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1112FHN33/201551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/201551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 27
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 2137 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
167+2.79 EUR
Mindestbestellmenge: 167 Stücke
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LPC1113FHN33/303551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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LPC1112LVFHI33/103551 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHI33/103551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1114FHN33/203551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/203551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/202551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/202551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1113FHN33/301551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FHN33/301551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1113FBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/303 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S10FET100551 PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 61 Stücke
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LPC54606J256ET100551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54606J256ET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4370FET100551 PHGLS29822-1.pdf?t.download=true&u=5oefqw
LPC4370FET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
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LPC43S70FET100551 PHGL-S-A0001691352-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1812JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
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LPC1813JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 38 Stücke
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LPC1823JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 34 Stücke
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LPC1815JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 180MHz
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LPC1833JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
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LPC1817JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 32 Stücke
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LPC4313JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
28+19.9 EUR
Mindestbestellmenge: 28 Stücke
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LPC1827JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1827JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 31 Stücke
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LPC4323JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
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LPC1837JET100551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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LPC18S37JET100551 PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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LPC4333JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
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LPC4325JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4325JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC4327JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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LPC4337JET100551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4337JET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S37JET100551 PHGL-S-A0001691376-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC43S67JET100551 PHGL-S-A0001691607-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
Produkt ist nicht verfügbar
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LPC54606J512ET100551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54606J512ET100551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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LPC4367JET100551 PHGL-S-A0001691629-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
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BAW56SRA147 BAW56QA.pdf
Hersteller: NXP USA Inc.
Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
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74ABT00N,112 74ABT00.pdf
74ABT00N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
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74ABT00DB118 74ABT00.pdf
74ABT00DB118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT00DB - NAND GA
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
auf Bestellung 1990 Stücke:
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645+0.78 EUR
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PDTC114YT235 PDTC114Y_SER.pdf
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
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PDTC114YM315 PHGLS24123-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC114YM - SMALL S
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Resistor - Base (R1): 10 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Active
Supplier Device Package: DFN1006-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Emitter Base (R2): 47 kOhms
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PDTC124XMB315 PDTC124XMB.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC124XMB - SMALL
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PDTC124TMB315 PDTC124TMB.pdf
PDTC124TMB315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Qualification: AEC-Q101
Resistor - Base (R1): 22 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
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AnzahlPreis
11225+0.048 EUR
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BAS21AVD/DG/B2135 PHGLS28417-1.pdf?t.download=true&u=5oefqw
BAS21AVD/DG/B2135
Hersteller: NXP USA Inc.
Description: BAS21AVD - RECTIFIER DIODE
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BAS21AVD135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS21AVD - RECTIFIE
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MC912D60AVFUE8 MC68HC912D60A.pdf
MC912D60AVFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912D60AH2VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
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S912D60AH2VPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
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74LV241DB,112 74LV241.pdf
74LV241DB,112
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
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888+0.57 EUR
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74LV241N,112 74LV241.pdf
74LV241N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20DIP
Supplier Device Package: 20-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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MC68HC908QT2CPE-NXP
MC68HC908QT2CPE-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Part Status: Active
Supplier Device Package: 8-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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LPC2148FBD64,157 LPC2141_42_44_46_48.pdf
LPC2148FBD64,157
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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1+41.22 EUR
10+33.18 EUR
25+31.17 EUR
160+28.39 EUR
320+27.67 EUR
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74LVC161DB118 74LVC161.pdf
74LVC161DB118
Hersteller: NXP USA Inc.
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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