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MCIMX31LCVMN4DR2518 NXP USA Inc. MCIMX31_5.pdf Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS8430G1ES MC33FS8430G1ES NXP USA Inc. PB_FS84_FS85C.pdf Description: SYSTEM BASIS CHIP FS8430
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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80+15.67 EUR
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74HCT540D-Q100118 74HCT540D-Q100118 NXP USA Inc. 74HC_HCT540_Q100.pdf Description: IC BUFFER INVERT 5.5V 20SO
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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SPC5601DF1VLL4R SPC5601DF1VLL4R NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 33x12b
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SPC5601DF1VLL4 SPC5601DF1VLL4 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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SPC5602CF2MLH4R SPC5602CF2MLH4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
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SPC5604BK0MLH4 SPC5604BK0MLH4 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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SPC5604PEF1VLL6R SPC5604PEF1VLL6R NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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SPC5603BF2VLQ4R SPC5603BF2VLQ4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5604PEF1VLL6 SPC5604PEF1VLL6 NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MPF5023AVNA0ES MPF5023AVNA0ES NXP USA Inc. PF5023.pdf Description: PF5023
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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2+11.54 EUR
10+10.42 EUR
25+9.94 EUR
80+8.63 EUR
230+8.23 EUR
490+7.51 EUR
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MPF5024AVNA0ES MPF5024AVNA0ES NXP USA Inc. Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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3+9.12 EUR
10+6.99 EUR
25+6.46 EUR
100+5.87 EUR
490+5.59 EUR
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JN5188THN/001Z JN5188THN/001Z NXP USA Inc. JN5189.pdf Description: WIRELESS MICROCONTROLLER
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.36mA ~ 20.28mA
Current - Receiving: 4.3mA
Protocol: Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P89LPC952FAB512 P89LPC952FAB512 NXP USA Inc. PHGLS15789-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8595J/N2S/S422112 NXP USA Inc. PHGLS28244-1.pdf?t.download=true&u=5oefqw Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33FS5502Y3ES MC33FS5502Y3ES NXP USA Inc. Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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10+9.88 EUR
25+9.16 EUR
100+8.59 EUR
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MC33FS5502Y0ESR2 MC33FS5502Y0ESR2 NXP USA Inc. Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS5502Y3ESR2 MC33FS5502Y3ESR2 NXP USA Inc. Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BUK7509-75A,127 NXP USA Inc. 2156_BUK7509-75A.pdf Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
auf Bestellung 7296 Stücke:
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SA56004HD112 SA56004HD112 NXP USA Inc. PHGLS26228-1.pdf?t.download=true&u=5oefqw Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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PBSS2515M315 PBSS2515M315 NXP USA Inc. PBSS2515M.pdf Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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RDVCU5775EVM RDVCU5775EVM NXP USA Inc. RDVCU5775EVM.pdf Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
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BUK652R6-40C,127 BUK652R6-40C,127 NXP USA Inc. BUK652R6-40C.pdf Description: MOSFET N-CH 40V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 199 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11334 pF @ 25 V
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74AUP2G157GF,115 74AUP2G157GF,115 NXP USA Inc. PHGLS25967-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (1.35x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
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PDTB113EQA147 PDTB113EQA147 NXP USA Inc. PDTB113_123_143_114EQA_SER.pdf Description: NOW NEXPERIA PDTB113EQA SMALL SI
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PDTB113EU,115 PDTB113EU,115 NXP USA Inc. NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 33 @ 50mA, 5V
Supplier Device Package: SC-70
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Qualification: AEC-Q101
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P5CC081XS/S1AP52AJ NXP USA Inc. SmartMX_Leaflet.pdf Description: P5CC081XS/S1AP52AJ
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TDA5051AT/CI512 TDA5051AT/CI512 NXP USA Inc. PHGLS22188-1.pdf?t.download=true&u=5oefqw Description: HOME AUTOMATION MODEM
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G53GS115 NXP USA Inc. 74LVC2G53.pdf Description: NOW NEXPERIA 74LVC2G53GS SINGLE-
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM11039598 NXP USA Inc. Description: LPC1343 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1343
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT74BQ-Q100115 NXP USA Inc. 74HC_HCT74_Q100.pdf Description: IC FF D-TYPE DUAL 1BIT 14DHVQFN
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Capacitance: 3.5 pF
Clock Frequency: 59 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9674AD,518 PCA9674AD,518 NXP USA Inc. PCA9674_PCA9674A.pdf Description: PARALLEL I/O PORT, 8-BIT, 8 I/O,
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PBSS5240ZX PBSS5240ZX NXP USA Inc. NEXP-S-A0003107811-1.pdf?t.download=true&u=5oefqw Description: TRANS PNP 40V 2A SOT-223
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 2 A
Part Status: Active
Supplier Device Package: SOT-223
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
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HEF4020BT-Q100118 HEF4020BT-Q100118 NXP USA Inc. HEF4020B_Q100.pdf Description: BINARY COUNTER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NXH2261UK/A1BSCZ NXP USA Inc. Description: NXH2261UK - NFMI RADIO FOR WIREL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC139DB,112 74LVC139DB,112 NXP USA Inc. 74LVC139.pdf Description: IC DUAL 2-4 DECODER/DEMUX 16SSOP
Packaging: Tube
auf Bestellung 13104 Stücke:
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CBT3384DB,112 CBT3384DB,112 NXP USA Inc. PHGLS19466-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Part Status: Active
Supplier Device Package: 24-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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NT2H1511G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
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PDZ6.8B135 PDZ6.8B135 NXP USA Inc. PDZ-B_SER.pdf Description: DIODE ZENER
Packaging: Bulk
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PCA9745BTW/Q900J PCA9745BTW/Q900J NXP USA Inc. PCA9745B.pdf Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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OM13524UL NXP USA Inc. PCA9745B.pdf Description: EVAL BOARD FOR PCA9745
Contents: Board(s)
Supplied Contents: Board(s)
Utilized IC / Part: PCA9745
Features: Dimmable
Packaging: Bulk
Part Status: Active
Outputs and Type: 16 Non-Isolated Outputs
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S9S12G48F1CLCR528 S9S12G48F1CLCR528 NXP USA Inc. MC9S12GRMV1.pdf Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G48F1VLCR528 S9S12G48F1VLCR528 NXP USA Inc. MC9S12GRMV1.pdf Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DZ32F2VLCR528 S9S08DZ32F2VLCR528 NXP USA Inc. MC9S08DZ60.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA18215HN/C1518 NXP USA Inc. Description: TDA18215H - SILICON TUNER ONBOAR
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LPC1751FBD80K LPC1751FBD80K NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
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LX2160XE72232B LX2160XE72232B NXP USA Inc. LX2160A.pdf Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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LX2080SE72232B LX2080SE72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72232B LX2120SE72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
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LX2120XE72232B NXP USA Inc. Description: SSL MATRIX CONTROLLER
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MCIMX7U5DVP08SC NXP USA Inc. Description: I.MX7ULP1 14X14
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74LVC1G157GV-Q100,125 74LVC1G157GV-Q100,125 NXP USA Inc. 74LVC1G157_Q100.pdf Description: NOW NEXPERIA 74LVC1G157GV-Q100 -
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G157GM 74LVC1G157GM NXP USA Inc. NEXP-S-A0003544679-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXER, LVC/LCX/Z SERIES, 1
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114JHN33/303551 LPC1114JHN33/303551 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114LVFHI33/303551 LPC1114LVFHI33/303551 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JHI33/303551 LPC1114JHI33/303551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC1114FBD48/302151 LPC1114FBD48/302151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 48LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Produkt ist nicht verfügbar
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LPC1114FHN33/301551 LPC1114FHN33/301551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FBD48/303151 LPC1114FBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
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LPC1114FHN33/333551 LPC1114FHN33/333551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX31LCVMN4DR2518 MCIMX31_5.pdf
Hersteller: NXP USA Inc.
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS8430G1ES PB_FS84_FS85C.pdf
MC33FS8430G1ES
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 133 Stücke:
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AnzahlPrivatkunde
1+20.97 EUR
10+18.93 EUR
25+18.05 EUR
80+15.67 EUR
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74HCT540D-Q100118 74HC_HCT540_Q100.pdf
74HCT540D-Q100118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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SPC5601DF1VLL4R MPC5604BC.pdf
SPC5601DF1VLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 33x12b
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SPC5601DF1VLL4 MPC5604BC.pdf
SPC5601DF1VLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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SPC5602CF2MLH4R
SPC5602CF2MLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
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SPC5604BK0MLH4
SPC5604BK0MLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5604PEF1VLL6R MPC5602P.pdf
SPC5604PEF1VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5603BF2VLQ4R MPC5602D.pdf
SPC5603BF2VLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5604PEF1VLL6 MPC5602P.pdf
SPC5604PEF1VLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPF5023AVNA0ES PF5023.pdf
MPF5023AVNA0ES
Hersteller: NXP USA Inc.
Description: PF5023
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.54 EUR
10+10.42 EUR
25+9.94 EUR
80+8.63 EUR
230+8.23 EUR
490+7.51 EUR
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MPF5024AVNA0ES
MPF5024AVNA0ES
Hersteller: NXP USA Inc.
Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 2865 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.12 EUR
10+6.99 EUR
25+6.46 EUR
100+5.87 EUR
490+5.59 EUR
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JN5188THN/001Z JN5189.pdf
JN5188THN/001Z
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.36mA ~ 20.28mA
Current - Receiving: 4.3mA
Protocol: Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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P89LPC952FAB512 PHGLS15789-1.pdf?t.download=true&u=5oefqw
P89LPC952FAB512
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Bulk
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TDA8595J/N2S/S422112 PHGLS28244-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33FS5502Y3ES
MC33FS5502Y3ES
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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2+12.76 EUR
10+9.88 EUR
25+9.16 EUR
100+8.59 EUR
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MC33FS5502Y0ESR2
MC33FS5502Y0ESR2
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS5502Y3ESR2
MC33FS5502Y3ESR2
Hersteller: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BUK7509-75A,127 2156_BUK7509-75A.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
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365+1.64 EUR
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SA56004HD112 PHGLS26228-1.pdf?t.download=true&u=5oefqw
SA56004HD112
Hersteller: NXP USA Inc.
Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1565 Stücke:
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634+0.9 EUR
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PBSS2515M315 PBSS2515M.pdf
PBSS2515M315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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RDVCU5775EVM RDVCU5775EVM.pdf
RDVCU5775EVM
Hersteller: NXP USA Inc.
Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
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1+915.31 EUR
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BUK652R6-40C,127 BUK652R6-40C.pdf
BUK652R6-40C,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 199 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11334 pF @ 25 V
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74AUP2G157GF,115 PHGLS25967-1.pdf?t.download=true&u=5oefqw
74AUP2G157GF,115
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (1.35x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
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1528+0.4 EUR
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PDTB113EQA147 PDTB113_123_143_114EQA_SER.pdf
PDTB113EQA147
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTB113EQA SMALL SI
auf Bestellung 40000 Stücke:
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PDTB113EU,115 NEXP-S-A0003101095-1.pdf?t.download=true&u=5oefqw
PDTB113EU,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 33 @ 50mA, 5V
Supplier Device Package: SC-70
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 300 mW
Frequency - Transition: 140 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Qualification: AEC-Q101
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8036+0.08 EUR
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P5CC081XS/S1AP52AJ SmartMX_Leaflet.pdf
Hersteller: NXP USA Inc.
Description: P5CC081XS/S1AP52AJ
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TDA5051AT/CI512 PHGLS22188-1.pdf?t.download=true&u=5oefqw
TDA5051AT/CI512
Hersteller: NXP USA Inc.
Description: HOME AUTOMATION MODEM
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G53GS115 74LVC2G53.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G53GS SINGLE-
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM11039598
Hersteller: NXP USA Inc.
Description: LPC1343 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1343
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT74BQ-Q100115 74HC_HCT74_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14DHVQFN
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Capacitance: 3.5 pF
Clock Frequency: 59 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9674AD,518 PCA9674_PCA9674A.pdf
PCA9674AD,518
Hersteller: NXP USA Inc.
Description: PARALLEL I/O PORT, 8-BIT, 8 I/O,
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PBSS5240ZX NEXP-S-A0003107811-1.pdf?t.download=true&u=5oefqw
PBSS5240ZX
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 2A SOT-223
Power - Max: 650 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 2 A
Part Status: Active
Supplier Device Package: SOT-223
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
auf Bestellung 199795 Stücke:
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AnzahlPrivatkunde
2737+0.21 EUR
Mindestbestellmenge: 2737 Stücke
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HEF4020BT-Q100118 HEF4020B_Q100.pdf
HEF4020BT-Q100118
Hersteller: NXP USA Inc.
Description: BINARY COUNTER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NXH2261UK/A1BSCZ
Hersteller: NXP USA Inc.
Description: NXH2261UK - NFMI RADIO FOR WIREL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC139DB,112 74LVC139.pdf
74LVC139DB,112
Hersteller: NXP USA Inc.
Description: IC DUAL 2-4 DECODER/DEMUX 16SSOP
Packaging: Tube
auf Bestellung 13104 Stücke:
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AnzahlPrivatkunde
1902+0.32 EUR
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CBT3384DB,112 PHGLS19466-1.pdf?t.download=true&u=5oefqw
CBT3384DB,112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Part Status: Active
Supplier Device Package: 24-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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1402+0.42 EUR
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NT2H1511G0DUFV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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PDZ6.8B135 PDZ-B_SER.pdf
PDZ6.8B135
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9745BTW/Q900J PCA9745B.pdf
PCA9745BTW/Q900J
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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OM13524UL PCA9745B.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9745
Contents: Board(s)
Supplied Contents: Board(s)
Utilized IC / Part: PCA9745
Features: Dimmable
Packaging: Bulk
Part Status: Active
Outputs and Type: 16 Non-Isolated Outputs
Produkt ist nicht verfügbar
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S9S12G48F1CLCR528 MC9S12GRMV1.pdf
S9S12G48F1CLCR528
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G48F1VLCR528 MC9S12GRMV1.pdf
S9S12G48F1VLCR528
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DZ32F2VLCR528 MC9S08DZ60.pdf
S9S08DZ32F2VLCR528
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA18215HN/C1518
Hersteller: NXP USA Inc.
Description: TDA18215H - SILICON TUNER ONBOAR
Produkt ist nicht verfügbar
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LPC1751FBD80K LPC1759_58_56_54_52_51.pdf
LPC1751FBD80K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.4 EUR
10+11.35 EUR
25+9.85 EUR
119+8.29 EUR
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LX2160XE72232B LX2160A.pdf
LX2160XE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
auf Bestellung 21 Stücke:
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AnzahlPrivatkunde
1+1692.57 EUR
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LX2080SE72232B
LX2080SE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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LX2120SE72232B
LX2120SE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Produkt ist nicht verfügbar
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LX2120XE72232B
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Produkt ist nicht verfügbar
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MCIMX7U5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX7ULP1 14X14
Produkt ist nicht verfügbar
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74LVC1G157GV-Q100,125 74LVC1G157_Q100.pdf
74LVC1G157GV-Q100,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G157GV-Q100 -
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G157GM NEXP-S-A0003544679-1.pdf?t.download=true&u=5oefqw
74LVC1G157GM
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, LVC/LCX/Z SERIES, 1
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114JHN33/303551 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1114JHN33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114LVFHI33/303551 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHI33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JHI33/303551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JHI33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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LPC1114FBD48/302151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FBD48/302151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Produkt ist nicht verfügbar
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LPC1114FHN33/301551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/301551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1114FBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
Produkt ist nicht verfügbar
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LPC1114FHN33/333551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/333551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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