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CBT3384DB,112 CBT3384DB,112 NXP USA Inc. PHGLS19466-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Part Status: Active
Supplier Device Package: 24-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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NT2H1511G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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PDZ6.8B135 PDZ6.8B135 NXP USA Inc. PDZ-B_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9745BTW/Q900J PCA9745BTW/Q900J NXP USA Inc. PCA9745B.pdf Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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OM13524UL NXP USA Inc. PCA9745B.pdf Description: EVAL BOARD FOR PCA9745
Contents: Board(s)
Supplied Contents: Board(s)
Utilized IC / Part: PCA9745
Features: Dimmable
Packaging: Bulk
Part Status: Active
Outputs and Type: 16 Non-Isolated Outputs
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S9S12G48F1CLCR528 S9S12G48F1CLCR528 NXP USA Inc. MC9S12GRMV1.pdf Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G48F1VLCR528 S9S12G48F1VLCR528 NXP USA Inc. MC9S12GRMV1.pdf Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DZ32F2VLCR528 S9S08DZ32F2VLCR528 NXP USA Inc. MC9S08DZ60.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA18215HN/C1518 NXP USA Inc. Description: TDA18215H - SILICON TUNER ONBOAR
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LPC1751FBD80K LPC1751FBD80K NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
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LX2160XE72232B LX2160XE72232B NXP USA Inc. LX2160A.pdf Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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LX2080SE72232B LX2080SE72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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LX2120SE72232B LX2120SE72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
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LX2120XE72232B NXP USA Inc. Description: SSL MATRIX CONTROLLER
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MCIMX7U5DVP08SC NXP USA Inc. Description: I.MX7ULP1 14X14
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74LVC1G157GV-Q100,125 74LVC1G157GV-Q100,125 NXP USA Inc. 74LVC1G157_Q100.pdf Description: NOW NEXPERIA 74LVC1G157GV-Q100 -
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G157GM 74LVC1G157GM NXP USA Inc. NEXP-S-A0003544679-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXER, LVC/LCX/Z SERIES, 1
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114JHN33/303551 LPC1114JHN33/303551 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114LVFHI33/303551 LPC1114LVFHI33/303551 NXP USA Inc. PHGLS25606-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
DigiKey Programmable: Not Verified
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LPC1114JHI33/303551 LPC1114JHI33/303551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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LPC1114FBD48/302151 LPC1114FBD48/302151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 48LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
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LPC1114FHN33/301551 LPC1114FHN33/301551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FBD48/303151 LPC1114FBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
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LPC1114FHN33/333551 LPC1114FHN33/333551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114JHN33/333551 LPC1114JHN33/333551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/302K LPC1114FHN33/302K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1114FHI33/303K LPC1114FHI33/303K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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10+4.49 EUR
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100+3.72 EUR
490+3.42 EUR
980+3.32 EUR
1470+3.27 EUR
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LPC1114FHN33/301K LPC1114FHN33/301K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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25+4.38 EUR
100+3.96 EUR
260+3.75 EUR
520+3.63 EUR
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LPC1114FBD48/303EL LPC1114FBD48/303EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1114FBD48/302EL LPC1114FBD48/302EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+6.32 EUR
10+4.77 EUR
25+4.38 EUR
100+3.96 EUR
250+3.76 EUR
500+3.64 EUR
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BC846AW135 BC846AW135 NXP USA Inc. BC846XW_SER.pdf Description: NOW NEXPERIA BC846AW - SMALL SIG
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 65 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1042AT/3/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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S9S08SG4E2CTGR S9S08SG4E2CTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR S9S08SG4E2CTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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S9S08SG4E2MTGR S9S08SG4E2MTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2490 Stücke:
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10+4.01 EUR
25+3.68 EUR
100+3.32 EUR
250+3.15 EUR
500+3.04 EUR
1000+2.96 EUR
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LPC18S50FET180551 NXP USA Inc. PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 180TFBGA
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LPC1822JBD144551 LPC1822JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 144LQFP
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC18S37JBD144551 LPC18S37JBD144551 NXP USA Inc. PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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LPC18S57JBD208551 LPC18S57JBD208551 NXP USA Inc. PHGL-S-A0000312259-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 208LQFP
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BCV61B235 BCV61B235 NXP USA Inc. BCV61.pdf Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8885TS/Q900/1118 NXP USA Inc. PCA8885.pdf Description: 8-CHANNEL TOUCH SENSOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1020AXN7MQB LS1020AXN7MQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
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LS1020AXE7MQB LS1020AXE7MQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
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BUK9640-100A118 NXP USA Inc. PHGLS20786-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK9640-100A - POWE
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PN5331B3HN/C270518 PN5331B3HN/C270518 NXP USA Inc. PHGL-S-A0001051647-1.pdf?t.download=true&u=5oefqw Description: USB NFC INTEGRATED SOLUTION
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1815JBD144551 LPC1815JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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P1025NSN5DFB557 NXP USA Inc. Description: QORIQ, POWER ARCH 32-BIT SOC, 2
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC22XSD200BEK-NXP MC22XSD200BEK-NXP NXP USA Inc. PHGL-S-A0002426518-1.pdf?t.download=true&u=5oefqw Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
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PTN36221AHX128 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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PTN36221AHX147 PTN36221AHX147 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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74AUP2G126GS/S500115 74AUP2G126GS/S500115 NXP USA Inc. PHGLS26014-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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PCF2100CT/F1118 NXP USA Inc. PCF21XXC_FAM.pdf Description: IC LCD DRIVER 40SEG 28SOIC
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BC847CW/ZL115 BC847CW/ZL115 NXP USA Inc. BC847XW_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81668VLH NXP USA Inc. MC56F81XXXL.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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2+13.25 EUR
10+10.28 EUR
25+9.54 EUR
160+8.51 EUR
320+8.24 EUR
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MC56F81768VLH MC56F81768VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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2+15.03 EUR
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MC56F81648VLH MC56F81648VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81748VLH MC56F81748VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81868VLH MC56F81868VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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74ABT74D/L112 NXP USA Inc. PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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LPC11C14FBD48/30EL LPC11C14FBD48/30EL NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2994 Stücke:
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3+7.73 EUR
10+5.88 EUR
25+5.42 EUR
100+4.91 EUR
250+4.67 EUR
500+4.53 EUR
1000+4.41 EUR
2500+4.28 EUR
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CBT3384DB,112 PHGLS19466-1.pdf?t.download=true&u=5oefqw
CBT3384DB,112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT/FST/QS/5C/B SERI
Part Status: Active
Supplier Device Package: 24-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 5 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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1402+0.35 EUR
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NT2H1511G0DUFV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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PDZ6.8B135 PDZ-B_SER.pdf
PDZ6.8B135
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9745BTW/Q900J PCA9745B.pdf
PCA9745BTW/Q900J
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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OM13524UL PCA9745B.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9745
Contents: Board(s)
Supplied Contents: Board(s)
Utilized IC / Part: PCA9745
Features: Dimmable
Packaging: Bulk
Part Status: Active
Outputs and Type: 16 Non-Isolated Outputs
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S9S12G48F1CLCR528 MC9S12GRMV1.pdf
S9S12G48F1CLCR528
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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S9S12G48F1VLCR528 MC9S12GRMV1.pdf
S9S12G48F1VLCR528
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 48KB FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DZ32F2VLCR528 MC9S08DZ60.pdf
S9S08DZ32F2VLCR528
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA18215HN/C1518
Hersteller: NXP USA Inc.
Description: TDA18215H - SILICON TUNER ONBOAR
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LPC1751FBD80K LPC1759_58_56_54_52_51.pdf
LPC1751FBD80K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
auf Bestellung 480 Stücke:
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AnzahlPreis
2+10.42 EUR
10+9.54 EUR
25+8.28 EUR
119+6.97 EUR
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LX2160XE72232B LX2160A.pdf
LX2160XE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
auf Bestellung 21 Stücke:
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LX2080SE72232B
LX2080SE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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LX2120SE72232B
LX2120SE72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Produkt ist nicht verfügbar
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LX2120XE72232B
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Produkt ist nicht verfügbar
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MCIMX7U5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX7ULP1 14X14
Produkt ist nicht verfügbar
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74LVC1G157GV-Q100,125 74LVC1G157_Q100.pdf
74LVC1G157GV-Q100,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G157GV-Q100 -
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G157GM NEXP-S-A0003544679-1.pdf?t.download=true&u=5oefqw
74LVC1G157GM
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, LVC/LCX/Z SERIES, 1
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC1114JHN33/303551 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1114JHN33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114LVFHI33/303551 PHGLS25606-1.pdf?t.download=true&u=5oefqw
LPC1114LVFHI33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JHI33/303551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JHI33/303551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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LPC1114FBD48/302151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FBD48/302151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Produkt ist nicht verfügbar
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LPC1114FHN33/301551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/301551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.8V
Produkt ist nicht verfügbar
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LPC1114FHN33/333551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114FHN33/333551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114JHN33/333551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JHN33/333551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/302K LPC1102_1104.pdf
LPC1114FHN33/302K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.79 EUR
10+4.36 EUR
25+4.01 EUR
100+3.62 EUR
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LPC1114FHI33/303K LPC1102_1104.pdf
LPC1114FHI33/303K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2420 Stücke:
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AnzahlPreis
3+5.95 EUR
10+4.49 EUR
25+4.12 EUR
100+3.72 EUR
490+3.42 EUR
980+3.32 EUR
1470+3.27 EUR
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LPC1114FHN33/301K LPC1102_1104.pdf
LPC1114FHN33/301K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1911 Stücke:
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AnzahlPreis
3+6.32 EUR
10+4.77 EUR
25+4.38 EUR
100+3.96 EUR
260+3.75 EUR
520+3.63 EUR
1040+3.53 EUR
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LPC1114FBD48/303EL LPC1102_1104.pdf
LPC1114FBD48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
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AnzahlPreis
3+6.32 EUR
10+4.77 EUR
25+4.38 EUR
100+3.96 EUR
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LPC1114FBD48/302EL LPC1102_1104.pdf
LPC1114FBD48/302EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
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AnzahlPreis
3+6.32 EUR
10+4.77 EUR
25+4.38 EUR
100+3.96 EUR
250+3.76 EUR
500+3.64 EUR
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BC846AW135 BC846XW_SER.pdf
BC846AW135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC846AW - SMALL SIG
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 65 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1042AT/3/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR MC9S08SG8.pdf
S9S08SG4E2CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR MC9S08SG8.pdf
S9S08SG4E2CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S9S08SG4E2MTGR MC9S08SG8.pdf
S9S08SG4E2MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.33 EUR
10+4.01 EUR
25+3.68 EUR
100+3.32 EUR
250+3.15 EUR
500+3.04 EUR
1000+2.96 EUR
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LPC18S50FET180551 PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
auf Bestellung 378 Stücke:
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LPC1822JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1822JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
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LPC18S37JBD144551 PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw
LPC18S37JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S57JBD208551 PHGL-S-A0000312259-1.pdf?t.download=true&u=5oefqw
LPC18S57JBD208551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Produkt ist nicht verfügbar
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BCV61B235 BCV61.pdf
BCV61B235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8885TS/Q900/1118 PCA8885.pdf
Hersteller: NXP USA Inc.
Description: 8-CHANNEL TOUCH SENSOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1020AXN7MQB LS1020ALS1022AFS.pdf
LS1020AXN7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1020AXE7MQB LS1020ALS1022AFS.pdf
LS1020AXE7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
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BUK9640-100A118 PHGLS20786-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9640-100A - POWE
Produkt ist nicht verfügbar
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PN5331B3HN/C270518 PHGL-S-A0001051647-1.pdf?t.download=true&u=5oefqw
PN5331B3HN/C270518
Hersteller: NXP USA Inc.
Description: USB NFC INTEGRATED SOLUTION
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1815JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1815JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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P1025NSN5DFB557
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 2
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC22XSD200BEK-NXP PHGL-S-A0002426518-1.pdf?t.download=true&u=5oefqw
MC22XSD200BEK-NXP
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
auf Bestellung 42 Stücke:
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AnzahlPreis
42+11.33 EUR
Mindestbestellmenge: 42 Stücke
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PTN36221AHX128 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN36221AHX147 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
PTN36221AHX147
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
auf Bestellung 10000 Stücke:
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AnzahlPreis
411+1.21 EUR
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74AUP2G126GS/S500115 PHGLS26014-1.pdf?t.download=true&u=5oefqw
74AUP2G126GS/S500115
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 35000 Stücke:
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2623+0.19 EUR
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PCF2100CT/F1118 PCF21XXC_FAM.pdf
Hersteller: NXP USA Inc.
Description: IC LCD DRIVER 40SEG 28SOIC
Produkt ist nicht verfügbar
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BC847CW/ZL115 BC847XW_SER.pdf
BC847CW/ZL115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81XXXL.pdf
MC56F81668VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 479 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.25 EUR
10+10.28 EUR
25+9.54 EUR
160+8.51 EUR
320+8.24 EUR
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MC56F81768VLH MC56F81XXX.pdf
MC56F81768VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 160 Stücke:
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AnzahlPreis
2+15.03 EUR
10+11.71 EUR
25+10.88 EUR
160+9.73 EUR
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MC56F81648VLH MC56F81XXX.pdf
MC56F81648VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81748VLH MC56F81XXX.pdf
MC56F81748VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81868VLH MC56F81XXX.pdf
MC56F81868VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT74D/L112 PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11C14FBD48/30EL LPC11CX2_CX4.pdf
LPC11C14FBD48/30EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2994 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.73 EUR
10+5.88 EUR
25+5.42 EUR
100+4.91 EUR
250+4.67 EUR
500+4.53 EUR
1000+4.41 EUR
2500+4.28 EUR
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