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PTN36221AHX128 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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PTN36221AHX147 PTN36221AHX147 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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74AUP2G126GS/S500115 74AUP2G126GS/S500115 NXP USA Inc. PHGLS26014-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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PCF2100CT/F1118 NXP USA Inc. PCF21XXC_FAM.pdf Description: IC LCD DRIVER 40SEG 28SOIC
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BC847CW/ZL115 BC847CW/ZL115 NXP USA Inc. BC847XW_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81668VLH NXP USA Inc. MC56F81XXXL.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MC56F81768VLH MC56F81768VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MC56F81648VLH MC56F81648VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81748VLH MC56F81748VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81868VLH MC56F81868VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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74ABT74D/L112 NXP USA Inc. PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11C14FBD48/30EL LPC11C14FBD48/30EL NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11C24FBD48/30EL LPC11C24FBD48/30EL NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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1000+7.29 EUR
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74LVTH125D,112 74LVTH125D,112 NXP USA Inc. 74LVT_LVTH125.pdf Description: IC BUFF TRI-ST QD N-INV 14SOIC
Packaging: Bulk
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74CBTLVD3861DK,118 74CBTLVD3861DK,118 NXP USA Inc. 74CBTLVD3861_Rev_Feb2017.pdf Description: IC BUS SWITCH 10 X 1:1 24SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 24-SSOP
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LPC2131FBD64/01151 LPC2131FBD64/01151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
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LPC2131FBD64/01118 LPC2131FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 64-LQFP
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LPC2132FBD64/01118 LPC2132FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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LPC2114FBD64/01151 LPC2114FBD64/01151 NXP USA Inc. PHGLS22995-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2114FBD6401151 LPC2114FBD6401151 NXP USA Inc. PHGLS22995-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2119FBD64/01151 LPC2119FBD64/01151 NXP USA Inc. PHGLS22994-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2138FBD64/01151 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2138FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2131FBD64/01 LPC2131FBD64/01 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2131FBD640115 LPC2131FBD640115 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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LPC2132FBD64/01EL LPC2132FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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50+21 EUR
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LPC2134FBD64/01EL LPC2134FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2119FBD64/01EL LPC2119FBD64/01EL NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b SAR
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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P332G004A4/T0BC243 NXP USA Inc. Description: IC SMART E-ID PLMC SOT500-2
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BZV49-C33115 BZV49-C33115 NXP USA Inc. BZV49_SERIES.pdf Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
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NPS3001DVT1 NXP USA Inc. Description: DIFFP 0 - 1KPA
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PNPS3000VVT1 NXP USA Inc. Description: DIFF P +/- 0.5KPA
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PNPS3001DVT1 NXP USA Inc. Description: DIFFP 0 - 1KPA
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PNPS3002VVT1 NXP USA Inc. Description: DIFFP +/- 2KPA
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8MNANOLPD4-EVK 8MNANOLPD4-EVK NXP USA Inc. IMX8MNANOFS.pdf Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126D,118 NXP USA Inc. CBT3126.pdf Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
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PCA9646D118 PCA9646D118 NXP USA Inc. PHGLS22490-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 4CH 2WIRE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-SO
Part Status: Active
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74LVT244APW-Q100118 74LVT244APW-Q100118 NXP USA Inc. 74LVT_LVTH244A_Q100.pdf Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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74LVT244APW/AU118 74LVT244APW/AU118 NXP USA Inc. PHGLS15753-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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74LVT244BPW/AU118 74LVT244BPW/AU118 NXP USA Inc. PHGLS28507-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
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74LVT244AD NXP USA Inc. PHGLS15753-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVT SERIES, 2-FUNC,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT244BD118 74LVT244BD118 NXP USA Inc. 74LVT_LVTH244B.pdf Description: NOW NEXPERIA 74LVT244BD BUS DRIV
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MMRF5300NR5 NXP USA Inc. Description: 2700-3500 MHZ 60 W PEAK 50V WI
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.5GHz
Power - Output: 60W
Gain: 17dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 70 mA
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74AHC04PW-Q100118 74AHC04PW-Q100118 NXP USA Inc. 74AHC_AHCT04_Q100.pdf Description: INVERTER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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UJA1131HW/FD/5V/4Y UJA1131HW/FD/5V/4Y NXP USA Inc. UJA113X_SER.pdf Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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1500+8.08 EUR
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TJA1086HNJ TJA1086HNJ NXP USA Inc. TJA1086.pdf Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1085GHN/0Z TJA1085GHN/0Z NXP USA Inc. TJA1085G.pdf Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
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TJA1085GHN/0Z TJA1085GHN/0Z NXP USA Inc. TJA1085G.pdf Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
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10+22.76 EUR
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PMPB12UN,115 PMPB12UN,115 NXP USA Inc. Description: MOSFET N-CH 20V 7.9A 6DFN
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: 6-DFN2020MD (2x2)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
Packaging: Bulk
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TDF8544ASD/N2,112 NXP USA Inc. Description: IC AMP AUDIO BTL CLASS AB 36HSOP
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TDF8544AJ/N2,112 NXP USA Inc. Description: IC AMP AUDIO BTL CLASS AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC00D-Q100118 74AHC00D-Q100118 NXP USA Inc. 74AHC_AHCT00_Q100.pdf Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
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74AHC00D/C118 74AHC00D/C118 NXP USA Inc. PHGLS15482-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
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74AHC00BQ-Q100115 74AHC00BQ-Q100115 NXP USA Inc. 74AHC_AHCT00_Q100.pdf Description: NAND GATE
Packaging: Bulk
Part Status: Active
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74AHC00PW/C4118 74AHC00PW/C4118 NXP USA Inc. PHGLS15482-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC00PW-Q100118 74AHC00PW-Q100118 NXP USA Inc. 74AHC_AHCT00_Q100.pdf Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC00D/C4118 74AHC00D/C4118 NXP USA Inc. PHGLS15482-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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BZV55-C2V4135 BZV55-C2V4135 NXP USA Inc. BZV55_SER.pdf Description: NOW NEXPERIA BZV55-C2V4 - ZENER
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 500 mW
Supplier Device Package: LLDS; MiniMelf
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.4 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Surface Mount
Package / Case: DO-213AC, MINI-MELF, SOD-80
Tolerance: ±5%
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NZX15B133 NZX15B133 NXP USA Inc. NZX_SER.pdf Description: NOW NEXPERIA NZX15B - ZENER DIOD
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SSL2129AT/1118 SSL2129AT/1118 NXP USA Inc. PHGLS26284-1.pdf?t.download=true&u=5oefqw Description: DIMMABLE LED CONTROLLER IC
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PTN36221AHX128 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN36221AHX147 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
PTN36221AHX147
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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74AUP2G126GS/S500115 PHGLS26014-1.pdf?t.download=true&u=5oefqw
74AUP2G126GS/S500115
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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PCF2100CT/F1118 PCF21XXC_FAM.pdf
Hersteller: NXP USA Inc.
Description: IC LCD DRIVER 40SEG 28SOIC
Produkt ist nicht verfügbar
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BC847CW/ZL115 BC847XW_SER.pdf
BC847CW/ZL115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81XXXL.pdf
MC56F81668VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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2+15.77 EUR
10+12.23 EUR
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MC56F81768VLH MC56F81XXX.pdf
MC56F81768VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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2+17.89 EUR
10+13.93 EUR
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MC56F81648VLH MC56F81XXX.pdf
MC56F81648VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81748VLH MC56F81XXX.pdf
MC56F81748VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81868VLH MC56F81XXX.pdf
MC56F81868VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT74D/L112 PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11C14FBD48/30EL LPC11CX2_CX4.pdf
LPC11C14FBD48/30EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 4863 Stücke:
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3+10.25 EUR
10+7.83 EUR
25+7.22 EUR
100+6.56 EUR
250+6.24 EUR
500+6.05 EUR
1000+5.89 EUR
2500+5.72 EUR
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LPC11C24FBD48/30EL LPC11CX2_CX4.pdf
LPC11C24FBD48/30EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 3988 Stücke:
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2+12.46 EUR
10+9.6 EUR
25+8.88 EUR
100+8.09 EUR
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500+7.49 EUR
1000+7.29 EUR
2500+7.1 EUR
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74LVTH125D,112 74LVT_LVTH125.pdf
74LVTH125D,112
Hersteller: NXP USA Inc.
Description: IC BUFF TRI-ST QD N-INV 14SOIC
Packaging: Bulk
auf Bestellung 9559 Stücke:
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1839+0.32 EUR
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74CBTLVD3861DK,118 74CBTLVD3861_Rev_Feb2017.pdf
74CBTLVD3861DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 24-SSOP
auf Bestellung 45000 Stücke:
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987+0.58 EUR
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LPC2131FBD64/01151 LPC2131_32_34_36_38.pdf
LPC2131FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
LPC2131FBD64/01118
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 64-LQFP
Produkt ist nicht verfügbar
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LPC2132FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
LPC2132FBD64/01118
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2114FBD64/01151 PHGLS22995-1.pdf?t.download=true&u=5oefqw
LPC2114FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2114FBD6401151 PHGLS22995-1.pdf?t.download=true&u=5oefqw
LPC2114FBD6401151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2119FBD64/01151 PHGLS22994-1.pdf?t.download=true&u=5oefqw
LPC2119FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2138FBD64/01151 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2138FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01 LPC2131_32_34_36_38.pdf
LPC2131FBD64/01
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD640115 LPC2131_32_34_36_38.pdf
LPC2131FBD640115
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2132FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2132FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1706 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+29.68 EUR
10+23.48 EUR
50+21 EUR
100+20.23 EUR
160+19.79 EUR
640+18.78 EUR
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LPC2134FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2134FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 457 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.92 EUR
10+25.37 EUR
25+23.73 EUR
160+21.46 EUR
320+20.86 EUR
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LPC2119FBD64/01EL LPC2109_2119_2129.pdf
LPC2119FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b SAR
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 499 Stücke:
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AnzahlPrivatkunde
1+30.73 EUR
10+24.53 EUR
25+22.98 EUR
160+21.34 EUR
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P332G004A4/T0BC243
Hersteller: NXP USA Inc.
Description: IC SMART E-ID PLMC SOT500-2
Produkt ist nicht verfügbar
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BZV49-C33115 BZV49_SERIES.pdf
BZV49-C33115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
auf Bestellung 1760 Stücke:
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1760+0.35 EUR
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NPS3001DVT1
Hersteller: NXP USA Inc.
Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3000VVT1
Hersteller: NXP USA Inc.
Description: DIFF P +/- 0.5KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3001DVT1
Hersteller: NXP USA Inc.
Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3002VVT1
Hersteller: NXP USA Inc.
Description: DIFFP +/- 2KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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8MNANOLPD4-EVK IMX8MNANOFS.pdf
8MNANOLPD4-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126.pdf
CBT3126D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
auf Bestellung 4740 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1776+0.33 EUR
Mindestbestellmenge: 1776 Stücke
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PCA9646D118 PHGLS22490-1.pdf?t.download=true&u=5oefqw
PCA9646D118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 4CH 2WIRE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Delay Time: 100ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C
Current - Supply: 1µA
Data Rate (Max): 1MHz
Supplier Device Package: 16-SO
Part Status: Active
auf Bestellung 2447 Stücke:
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AnzahlPrivatkunde
74+8.54 EUR
Mindestbestellmenge: 74 Stücke
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74LVT244APW-Q100118 74LVT_LVTH244A_Q100.pdf
74LVT244APW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5589 Stücke:
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AnzahlPrivatkunde
1205+0.48 EUR
Mindestbestellmenge: 1205 Stücke
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74LVT244APW/AU118 PHGLS15753-1.pdf?t.download=true&u=5oefqw
74LVT244APW/AU118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
auf Bestellung 7415 Stücke:
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AnzahlPrivatkunde
1210+0.48 EUR
Mindestbestellmenge: 1210 Stücke
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74LVT244BPW/AU118 PHGLS28507-1.pdf?t.download=true&u=5oefqw
74LVT244BPW/AU118
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-TSSOP
auf Bestellung 2799 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1210+0.48 EUR
Mindestbestellmenge: 1210 Stücke
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74LVT244AD PHGLS15753-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 2-FUNC,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT244BD118 74LVT_LVTH244B.pdf
74LVT244BD118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVT244BD BUS DRIV
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MMRF5300NR5
Hersteller: NXP USA Inc.
Description: 2700-3500 MHZ 60 W PEAK 50V WI
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.5GHz
Power - Output: 60W
Gain: 17dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 70 mA
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74AHC04PW-Q100118 74AHC_AHCT04_Q100.pdf
74AHC04PW-Q100118
Hersteller: NXP USA Inc.
Description: INVERTER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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UJA1131HW/FD/5V/4Y UJA113X_SER.pdf
UJA1131HW/FD/5V/4Y
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1500+8.08 EUR
Mindestbestellmenge: 1500 Stücke
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TJA1086HNJ TJA1086.pdf
TJA1086HNJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Cut Tape (CT)
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TJA1085GHN/0Z TJA1085G.pdf
TJA1085GHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+18.31 EUR
Mindestbestellmenge: 1000 Stücke
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TJA1085GHN/0Z TJA1085G.pdf
TJA1085GHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 4/4 44HVQFN
Packaging: Cut Tape (CT)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75 ~ 5.25V
Number of Drivers/Receivers: 4/4
Protocol: FlexRay
Supplier Device Package: 44-HVQFN (9x9)
Part Status: Active
auf Bestellung 1848 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+28.8 EUR
10+22.76 EUR
25+21.27 EUR
100+19.67 EUR
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PMPB12UN,115
PMPB12UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 7.9A 6DFN
Input Capacitance (Ciss) (Max) @ Vds: 886 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: 6-DFN2020MD (2x2)
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 7.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 7.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
Packaging: Bulk
auf Bestellung 65963 Stücke:
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AnzahlPrivatkunde
1268+0.46 EUR
Mindestbestellmenge: 1268 Stücke
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TDF8544ASD/N2,112
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO BTL CLASS AB 36HSOP
Produkt ist nicht verfügbar
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TDF8544AJ/N2,112
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO BTL CLASS AB DBS27P
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC00D-Q100118 74AHC_AHCT00_Q100.pdf
74AHC00D-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
auf Bestellung 5326 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2578+0.24 EUR
Mindestbestellmenge: 2578 Stücke
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74AHC00D/C118 PHGLS15482-1.pdf?t.download=true&u=5oefqw
74AHC00D/C118
Hersteller: NXP USA Inc.
Description: IC GATE NAND
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
3806+0.15 EUR
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74AHC00BQ-Q100115 74AHC_AHCT00_Q100.pdf
74AHC00BQ-Q100115
Hersteller: NXP USA Inc.
Description: NAND GATE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC00PW/C4118 PHGLS15482-1.pdf?t.download=true&u=5oefqw
74AHC00PW/C4118
Hersteller: NXP USA Inc.
Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC00PW-Q100118 74AHC_AHCT00_Q100.pdf
74AHC00PW-Q100118
Hersteller: NXP USA Inc.
Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC00D/C4118 PHGLS15482-1.pdf?t.download=true&u=5oefqw
74AHC00D/C4118
Hersteller: NXP USA Inc.
Description: NAND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZV55-C2V4135 BZV55_SER.pdf
BZV55-C2V4135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV55-C2V4 - ZENER
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 500 mW
Supplier Device Package: LLDS; MiniMelf
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.4 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Surface Mount
Package / Case: DO-213AC, MINI-MELF, SOD-80
Tolerance: ±5%
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NZX15B133 NZX_SER.pdf
NZX15B133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA NZX15B - ZENER DIOD
auf Bestellung 157600 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15000+0.038 EUR
Mindestbestellmenge: 15000 Stücke
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SSL2129AT/1118 PHGLS26284-1.pdf?t.download=true&u=5oefqw
SSL2129AT/1118
Hersteller: NXP USA Inc.
Description: DIMMABLE LED CONTROLLER IC
auf Bestellung 149591 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 545 Stücke
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