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LPC1114JHN33/333551 LPC1114JHN33/333551 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/302K LPC1114FHN33/302K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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10+5.19 EUR
25+4.77 EUR
100+4.31 EUR
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LPC1114FHI33/303K LPC1114FHI33/303K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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100+4.43 EUR
490+4.07 EUR
980+3.95 EUR
1470+3.89 EUR
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LPC1114FHN33/301K LPC1114FHN33/301K NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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10+5.68 EUR
25+5.21 EUR
100+4.71 EUR
260+4.46 EUR
520+4.32 EUR
1040+4.2 EUR
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LPC1114FBD48/303EL LPC1114FBD48/303EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1114FBD48/302EL LPC1114FBD48/302EL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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3+7.52 EUR
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100+4.71 EUR
250+4.47 EUR
500+4.33 EUR
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BC846AW135 BC846AW135 NXP USA Inc. BC846XW_SER.pdf Description: NOW NEXPERIA BC846AW - SMALL SIG
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 65 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1042AT/3/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR S9S08SG4E2CTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR S9S08SG4E2CTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S9S08SG4E2MTGR S9S08SG4E2MTGR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2470 Stücke:
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3+8.6 EUR
10+6.53 EUR
25+6.01 EUR
100+5.45 EUR
250+5.18 EUR
500+5.13 EUR
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LPC18S50FET180551 NXP USA Inc. PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 180TFBGA
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LPC1822JBD144551 LPC1822JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 512KB FLASH 144LQFP
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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LPC18S37JBD144551 LPC18S37JBD144551 NXP USA Inc. PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S57JBD208551 LPC18S57JBD208551 NXP USA Inc. PHGL-S-A0000312259-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 208LQFP
Produkt ist nicht verfügbar
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BCV61B235 BCV61B235 NXP USA Inc. BCV61.pdf Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8885TS/Q900/1118 NXP USA Inc. PCA8885.pdf Description: 8-CHANNEL TOUCH SENSOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1020AXN7MQB LS1020AXN7MQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1020AXE7MQB LS1020AXE7MQB NXP USA Inc. LS1020ALS1022AFS.pdf Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
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BUK9640-100A118 NXP USA Inc. PHGLS20786-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK9640-100A - POWE
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PN5331B3HN/C270518 PN5331B3HN/C270518 NXP USA Inc. PHGL-S-A0001051647-1.pdf?t.download=true&u=5oefqw Description: USB NFC INTEGRATED SOLUTION
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1815JBD144551 LPC1815JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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P1025NSN5DFB557 NXP USA Inc. Description: QORIQ, POWER ARCH 32-BIT SOC, 2
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC22XSD200BEK-NXP MC22XSD200BEK-NXP NXP USA Inc. PHGL-S-A0002426518-1.pdf?t.download=true&u=5oefqw Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
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PTN36221AHX128 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN36221AHX147 PTN36221AHX147 NXP USA Inc. PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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74AUP2G126GS/S500115 74AUP2G126GS/S500115 NXP USA Inc. PHGLS26014-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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PCF2100CT/F1118 NXP USA Inc. PCF21XXC_FAM.pdf Description: IC LCD DRIVER 40SEG 28SOIC
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BC847CW/ZL115 BC847CW/ZL115 NXP USA Inc. BC847XW_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81668VLH NXP USA Inc. MC56F81XXXL.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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10+12.23 EUR
25+11.35 EUR
160+10.13 EUR
320+9.81 EUR
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MC56F81768VLH MC56F81768VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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2+17.89 EUR
10+13.93 EUR
25+12.95 EUR
160+11.58 EUR
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MC56F81648VLH MC56F81648VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81748VLH MC56F81748VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81868VLH MC56F81868VLH NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT74D/L112 NXP USA Inc. PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11C14FBD48/30EL LPC11C14FBD48/30EL NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11C24FBD48/30EL LPC11C24FBD48/30EL NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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74LVTH125D,112 74LVTH125D,112 NXP USA Inc. 74LVT_LVTH125.pdf Description: IC BUFF TRI-ST QD N-INV 14SOIC
Packaging: Bulk
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74CBTLVD3861DK,118 74CBTLVD3861DK,118 NXP USA Inc. 74CBTLVD3861_Rev_Feb2017.pdf Description: IC BUS SWITCH 10 X 1:1 24SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 24-SSOP
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LPC2131FBD64/01151 LPC2131FBD64/01151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01118 LPC2131FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 64-LQFP
Produkt ist nicht verfügbar
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LPC2132FBD64/01118 LPC2132FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2114FBD64/01151 LPC2114FBD64/01151 NXP USA Inc. PHGLS22995-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2114FBD6401151 LPC2114FBD6401151 NXP USA Inc. PHGLS22995-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2119FBD64/01151 LPC2119FBD64/01151 NXP USA Inc. PHGLS22994-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2138FBD64/01151 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2138FBD64/01118 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01 LPC2131FBD64/01 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD640115 LPC2131FBD640115 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2132FBD64/01EL LPC2132FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1141 Stücke:
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10+23.54 EUR
25+21.98 EUR
160+19.84 EUR
320+19.28 EUR
640+18.83 EUR
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LPC2134FBD64/01EL LPC2134FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 457 Stücke:
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LPC2119FBD64/01EL LPC2119FBD64/01EL NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b SAR
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 499 Stücke:
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10+24.53 EUR
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P332G004A4/T0BC243 NXP USA Inc. Description: IC SMART E-ID PLMC SOT500-2
Produkt ist nicht verfügbar
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BZV49-C33115 BZV49-C33115 NXP USA Inc. BZV49_SERIES.pdf Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
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1760+0.35 EUR
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NPS3001DVT1 NXP USA Inc. Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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PNPS3000VVT1 NXP USA Inc. Description: DIFF P +/- 0.5KPA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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PNPS3001DVT1 NXP USA Inc. Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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PNPS3002VVT1 NXP USA Inc. Description: DIFFP +/- 2KPA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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8MNANOLPD4-EVK 8MNANOLPD4-EVK NXP USA Inc. IMX8MNANOFS.pdf Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126D,118 NXP USA Inc. CBT3126.pdf Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
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1776+0.33 EUR
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LPC1114JHN33/333551 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1114JHN33/333551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 56KB (56K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1114FHN33/302K LPC1102_1104.pdf
LPC1114FHN33/302K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 129 Stücke:
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AnzahlPrivatkunde
4+6.89 EUR
10+5.19 EUR
25+4.77 EUR
100+4.31 EUR
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LPC1114FHI33/303K LPC1102_1104.pdf
LPC1114FHI33/303K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2420 Stücke:
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3+7.08 EUR
10+5.34 EUR
25+4.9 EUR
100+4.43 EUR
490+4.07 EUR
980+3.95 EUR
1470+3.89 EUR
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LPC1114FHN33/301K LPC1102_1104.pdf
LPC1114FHN33/301K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1911 Stücke:
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AnzahlPrivatkunde
3+7.52 EUR
10+5.68 EUR
25+5.21 EUR
100+4.71 EUR
260+4.46 EUR
520+4.32 EUR
1040+4.2 EUR
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LPC1114FBD48/303EL LPC1102_1104.pdf
LPC1114FBD48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
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3+7.52 EUR
10+5.68 EUR
25+5.21 EUR
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LPC1114FBD48/302EL LPC1102_1104.pdf
LPC1114FBD48/302EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
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3+7.52 EUR
10+5.68 EUR
25+5.21 EUR
100+4.71 EUR
250+4.47 EUR
500+4.33 EUR
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BC846AW135 BC846XW_SER.pdf
BC846AW135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC846AW - SMALL SIG
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 65 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT-323
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1042AT/3/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR MC9S08SG8.pdf
S9S08SG4E2CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08SG4E2CTGR MC9S08SG8.pdf
S9S08SG4E2CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S9S08SG4E2MTGR MC9S08AC60.pdf
S9S08SG4E2MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2470 Stücke:
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AnzahlPrivatkunde
3+8.6 EUR
10+6.53 EUR
25+6.01 EUR
100+5.45 EUR
250+5.18 EUR
500+5.13 EUR
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LPC18S50FET180551 PHGL-S-A0001584179-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
auf Bestellung 378 Stücke:
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LPC1822JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1822JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
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LPC18S37JBD144551 PHGL-S-A0001611798-1.pdf?t.download=true&u=5oefqw
LPC18S37JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC18S57JBD208551 PHGL-S-A0000312259-1.pdf?t.download=true&u=5oefqw
LPC18S57JBD208551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Produkt ist nicht verfügbar
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BCV61B235 BCV61.pdf
BCV61B235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCV61B - SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8885TS/Q900/1118 PCA8885.pdf
Hersteller: NXP USA Inc.
Description: 8-CHANNEL TOUCH SENSOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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LS1020AXN7MQB LS1020ALS1022AFS.pdf
LS1020AXN7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
SATA: SATA 3Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 (1), USB 3.0 + PHY
Ethernet: GbE (3)
Supplier Device Package: 525-FCPBGA (19x19)
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1020AXE7MQB LS1020ALS1022AFS.pdf
LS1020AXE7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
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BUK9640-100A118 PHGLS20786-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9640-100A - POWE
Produkt ist nicht verfügbar
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PN5331B3HN/C270518 PHGL-S-A0001051647-1.pdf?t.download=true&u=5oefqw
PN5331B3HN/C270518
Hersteller: NXP USA Inc.
Description: USB NFC INTEGRATED SOLUTION
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1815JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1815JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P1025NSN5DFB557
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 2
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC22XSD200BEK-NXP PHGL-S-A0002426518-1.pdf?t.download=true&u=5oefqw
MC22XSD200BEK-NXP
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 36V, DUAL 22MO
Packaging: Bulk
Part Status: Active
auf Bestellung 42 Stücke:
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42+13.48 EUR
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PTN36221AHX128 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PTN36221AHX147 PHGL-S-A0001171933-1.pdf?t.download=true&u=5oefqw
PTN36221AHX147
Hersteller: NXP USA Inc.
Description: SINGLE-CHANNEL SUPERSPEED USB 3.
Part Status: Active
Packaging: Bulk
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411+1.44 EUR
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74AUP2G126GS/S500115 PHGLS26014-1.pdf?t.download=true&u=5oefqw
74AUP2G126GS/S500115
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (1.35x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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2623+0.23 EUR
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PCF2100CT/F1118 PCF21XXC_FAM.pdf
Hersteller: NXP USA Inc.
Description: IC LCD DRIVER 40SEG 28SOIC
Produkt ist nicht verfügbar
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BC847CW/ZL115 BC847XW_SER.pdf
BC847CW/ZL115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
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MC56F81668VLH MC56F81XXXL.pdf
MC56F81668VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 479 Stücke:
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AnzahlPrivatkunde
2+15.77 EUR
10+12.23 EUR
25+11.35 EUR
160+10.13 EUR
320+9.81 EUR
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MC56F81768VLH MC56F81XXX.pdf
MC56F81768VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 160 Stücke:
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AnzahlPrivatkunde
2+17.89 EUR
10+13.93 EUR
25+12.95 EUR
160+11.58 EUR
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MC56F81648VLH MC56F81XXX.pdf
MC56F81648VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I2C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MC56F81748VLH MC56F81XXX.pdf
MC56F81748VLH
Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81868VLH MC56F81XXX.pdf
MC56F81868VLH
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQFP64
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: I²C, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT74D/L112 PHGL-S-A0002323551-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, ABT SERIES
Number of Bits per Element: 1
Max Propagation Delay @ V, Max CL: 4.2ns @ 5V, 50pF
Supplier Device Package: 14-SO
Input Capacitance: 3 pF
Clock Frequency: 250 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 15mA, 20mA
Current - Quiescent (Iq): 50 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Set(Preset) and Reset
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11C14FBD48/30EL LPC11CX2_CX4.pdf
LPC11C14FBD48/30EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 4863 Stücke:
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10+7.83 EUR
25+7.22 EUR
100+6.56 EUR
250+6.24 EUR
500+6.05 EUR
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LPC11C24FBD48/30EL LPC11CX2_CX4.pdf
LPC11C24FBD48/30EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 3988 Stücke:
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2+12.46 EUR
10+9.6 EUR
25+8.88 EUR
100+8.09 EUR
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500+7.49 EUR
1000+7.29 EUR
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74LVTH125D,112 74LVT_LVTH125.pdf
74LVTH125D,112
Hersteller: NXP USA Inc.
Description: IC BUFF TRI-ST QD N-INV 14SOIC
Packaging: Bulk
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74CBTLVD3861DK,118 74CBTLVD3861_Rev_Feb2017.pdf
74CBTLVD3861DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 24-SSOP
auf Bestellung 45000 Stücke:
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987+0.58 EUR
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LPC2131FBD64/01151 LPC2131_32_34_36_38.pdf
LPC2131FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
LPC2131FBD64/01118
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 64-LQFP
Produkt ist nicht verfügbar
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LPC2132FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
LPC2132FBD64/01118
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2114FBD64/01151 PHGLS22995-1.pdf?t.download=true&u=5oefqw
LPC2114FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2114FBD6401151 PHGLS22995-1.pdf?t.download=true&u=5oefqw
LPC2114FBD6401151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2119FBD64/01151 PHGLS22994-1.pdf?t.download=true&u=5oefqw
LPC2119FBD64/01151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC2138FBD64/01151 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2138FBD64/01118 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01 LPC2131_32_34_36_38.pdf
LPC2131FBD64/01
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD640115 LPC2131_32_34_36_38.pdf
LPC2131FBD640115
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2132FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2132FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1141 Stücke:
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1+29.74 EUR
10+23.54 EUR
25+21.98 EUR
160+19.84 EUR
320+19.28 EUR
640+18.83 EUR
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LPC2134FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2134FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 457 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.92 EUR
10+25.37 EUR
25+23.73 EUR
160+21.46 EUR
320+20.86 EUR
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LPC2119FBD64/01EL LPC2109_2119_2129.pdf
LPC2119FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b SAR
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 499 Stücke:
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AnzahlPrivatkunde
1+30.73 EUR
10+24.53 EUR
25+22.98 EUR
160+21.34 EUR
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P332G004A4/T0BC243
Hersteller: NXP USA Inc.
Description: IC SMART E-ID PLMC SOT500-2
Produkt ist nicht verfügbar
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BZV49-C33115 BZV49_SERIES.pdf
BZV49-C33115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-89
Grade: Automotive
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q100
auf Bestellung 1760 Stücke:
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AnzahlPrivatkunde
1760+0.35 EUR
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NPS3001DVT1
Hersteller: NXP USA Inc.
Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3000VVT1
Hersteller: NXP USA Inc.
Description: DIFF P +/- 0.5KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3001DVT1
Hersteller: NXP USA Inc.
Description: DIFFP 0 - 1KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PNPS3002VVT1
Hersteller: NXP USA Inc.
Description: DIFFP +/- 2KPA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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8MNANOLPD4-EVK IMX8MNANOFS.pdf
8MNANOLPD4-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX8M NANO
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126.pdf
CBT3126D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
auf Bestellung 4740 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1776+0.33 EUR
Mindestbestellmenge: 1776 Stücke
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