Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35723) > Seite 385 nach 596
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BC52-16PAS115 | NXP USA Inc. |
 Description: NOW NEXPERIA BC52-16PAS - SMALLPackaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12P128J0MFTR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48QFN Packaging: Cut Tape (CT) Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12P128J0CFTR | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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S9S12P128J0VLH | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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S9S12P128J0VLHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12P128J0MLHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| NCF295AXHN4/0300ZY | NXP USA Inc. | Description: ACTIC-SRX |
Produkt ist nicht verfügbar |
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| NCF295AMHN4/0300ZY | NXP USA Inc. | Description: ACTIC-SRX |
Produkt ist nicht verfügbar |
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| NCF29AAXHN4/0300ZY | NXP USA Inc. | Description: TOKEN |
Produkt ist nicht verfügbar |
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| NCF29AAVHN4/0300ZY | NXP USA Inc. | Description: TOKEN |
Produkt ist nicht verfügbar |
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| NCF29AAMHN4/0300ZY | NXP USA Inc. | Description: TOKEN |
Produkt ist nicht verfügbar |
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NX3L1G53GT,115 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 750MOHM 8XSON Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 24ns, 8ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Active Number of Circuits: 1 |
auf Bestellung 857 Stücke: Lieferzeit 10-14 Tag (e) |
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| PSMN1R5-30BLE118 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk |
Produkt ist nicht verfügbar |
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MCIMX6L2EVN10ABR | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tape & Reel (TR) Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Produkt ist nicht verfügbar |
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TDA18254AHN/C1518 | NXP USA Inc. |
Description: IC CABLE TUNER DGTL 48HVQFN Packaging: Bulk |
auf Bestellung 7950 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA143XMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 4.7 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
auf Bestellung 180000 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA143ZMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 4.7 kOhms Resistor - Emitter Base (R2): 47 kOhms Qualification: AEC-Q101 |
auf Bestellung 179950 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA143EMB | NXP USA Inc. |
Description: NOW NEXPERIA PDTA143EMB - SMALL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| TDF8541JS/N3512 | NXP USA Inc. |
Description: I2C-BUS CONTROLLED 4 X 45 W POWE Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| P87C51X2FA, 512 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC |
Produkt ist nicht verfügbar |
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PMST5088,115 | NXP USA Inc. |
Description: NOW NEXPERIA PMST5088 - SMALL SI Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 200 mW |
auf Bestellung 581293 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE14F512VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 622 Stücke: Lieferzeit 10-14 Tag (e) |
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HEF4030BT-Q100J | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 15.5V Current - Output High, Low: 2.4mA, 2.4mA Number of Inputs: 2 Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF Part Status: Active Number of Circuits: 4 |
auf Bestellung 2930 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS21SW115 | NXP USA Inc. |
Description: NOW NEXPERIA BAS21SW - RECTIFIER Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW165 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW/C2125 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74AHC1G08GW132 | NXP USA Inc. |
Description: AND GATE, HC/UH SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MIMXRT1064DVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1064CVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 2895 Stücke: Lieferzeit 10-14 Tag (e) |
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T1042NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L/4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54113J256UK49012 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 49WLCSP Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.44x3.44) Part Status: Active Number of I/O: 39 |
Produkt ist nicht verfügbar |
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MK20DX256VLH7557 | NXP USA Inc. |
Description: KINETIS K20: 72MHZ CORTEX-M4 PER |
Produkt ist nicht verfügbar |
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74HC4538PW-Q100118 | NXP USA Inc. |
Description: IC MULTIVIBRATOR Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 25 ns Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Schmitt Trigger Input: No Supplier Device Package: 16-TSSOP Part Status: Active Voltage - Supply: 2 V ~ 6 V |
Produkt ist nicht verfügbar |
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FRWY-LS1046A-TP | NXP USA Inc. |
Description: LS1046A EVAL BOARD CORAL TPU Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A72 Board Type: Evaluation Platform Utilized IC / Part: LS1046A Platform: Layerscape LS1046A Freeway Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68HCP11E1CFNE3,574 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC11 CPU |
auf Bestellung 1355 Stücke: Lieferzeit 10-14 Tag (e) |
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PMF87EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 1.7A SOT323-3 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta) Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V Power Dissipation (Max): 275mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-70 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V |
auf Bestellung 103313 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5747CBK0ACKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 |
Produkt ist nicht verfügbar |
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PCA9536D118 | NXP USA Inc. |
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908QT2ACDWER-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, FLASH, H Packaging: Bulk Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Part Status: Active Number of I/O: 5 DigiKey Programmable: Not Verified |
auf Bestellung 326 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908QB4CDWE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 1645 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z64VFP4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 519 Stücke: Lieferzeit 10-14 Tag (e) |
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TJF1051T/CM118 | NXP USA Inc. |
Description: GALVANICALLY ISOLATED HIGH-SPEED Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX384-B6V8/ZLX | NXP USA Inc. |
Description: DIODE ZENER 6.8V 300MW SOD323 Packaging: Tape & Reel (TR) Tolerance: ±2% Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 6.8 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOD-323 Part Status: Obsolete Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 4 V |
Produkt ist nicht verfügbar |
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PMEG045V150EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
auf Bestellung 1005000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMEG045T150EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
Produkt ist nicht verfügbar |
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| PMEG060V100EPD139 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
Produkt ist nicht verfügbar |
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SLN-VIZNAS-IOT | NXP USA Inc. |
Description: DEV I.MXRT106F FACE RECOGNITION Packaging: Box Function: Face Recognition Utilized IC / Part: i.MX RT1060 Supplied Contents: Board(s) Embedded: Yes |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMXRT1061DVJ6A | NXP USA Inc. |
Description: I.MXRT1060 |
Produkt ist nicht verfügbar |
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S9S12P96J0CFT | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48QFN Packaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVCH8T245PW | NXP USA Inc. |
Description: IC TRANSLATION TXRX 5.5V 24TSSOP |
Produkt ist nicht verfügbar |
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BUK9E1R9-40E,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V I2PAK Packaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tj) Supplier Device Package: I2PAK Part Status: Obsolete Drain to Source Voltage (Vdss): 40 V |
auf Bestellung 4974 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK762R9-40E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK762R9-40E 100A, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PDTA114YU/L115 | NXP USA Inc. |
Description: PDTA114Y SERIES - PNP RESISTOR-E Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PN5180A0ET/C4QL | NXP USA Inc. |
Description: PN5180 TFBGA64 TRAY Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 5.5V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC Supplier Device Package: 64-TFBGA (5.5x5.5) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| TEF8101EN/N1E | NXP USA Inc. |
Description: RADAR |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TEF8101EN/N1Y | NXP USA Inc. |
Description: RADAR |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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NVT2001GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Bulk Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
auf Bestellung 460205 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT2001GMZ | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Grade: Automotive Number of Circuits: 1 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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NVT2001GM,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PCA9306GF,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT1089 Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-XSON, SOT1089 (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Last Time Buy Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BC52-16PAS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC52-16PAS - SMALL
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA BC52-16PAS - SMALL
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P128J0MFTR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P128J0CFTR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Description: IC MCU 16BIT 128KB FLASH 48QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P128J0VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P128J0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P128J0MLHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF295AXHN4/0300ZY |
Hersteller: NXP USA Inc.
Description: ACTIC-SRX
Description: ACTIC-SRX
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF295AMHN4/0300ZY |
Hersteller: NXP USA Inc.
Description: ACTIC-SRX
Description: ACTIC-SRX
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF29AAXHN4/0300ZY |
Hersteller: NXP USA Inc.
Description: TOKEN
Description: TOKEN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF29AAVHN4/0300ZY |
Hersteller: NXP USA Inc.
Description: TOKEN
Description: TOKEN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF29AAMHN4/0300ZY |
Hersteller: NXP USA Inc.
Description: TOKEN
Description: TOKEN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NX3L1G53GT,115 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 857 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 14+ | 1.28 EUR |
| 20+ | 0.92 EUR |
| 25+ | 0.83 EUR |
| 100+ | 0.73 EUR |
| 250+ | 0.68 EUR |
| 500+ | 0.65 EUR |
| MCIMX6L2EVN10ABR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA18254AHN/C1518 |
|
auf Bestellung 7950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 146+ | 3.43 EUR |
| PDTA143XMB315 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11225+ | 0.048 EUR |
| PDTA143ZMB315 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Qualification: AEC-Q101
auf Bestellung 179950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11225+ | 0.048 EUR |
| PDTA143EMB |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTA143EMB - SMALL
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PDTA143EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8541JS/N3512 |
Hersteller: NXP USA Inc.
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P87C51X2FA, 512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Description: IC MCU 8BIT 4KB OTP 44PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMST5088,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMST5088 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Description: NOW NEXPERIA PMST5088 - SMALL SI
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100µA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
auf Bestellung 581293 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.033 EUR |
| MKE14F512VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 622 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.5 EUR |
| 10+ | 7.63 EUR |
| HEF4030BT-Q100J |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Current - Output High, Low: 2.4mA, 2.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
auf Bestellung 2930 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1269+ | 0.37 EUR |
| BAS21SW115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BAS21SW - RECTIFIER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1064DVL6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.67 EUR |
| 10+ | 17.92 EUR |
| 25+ | 16.73 EUR |
| 240+ | 14.83 EUR |
| MIMXRT1064CVL5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 2895 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 23 EUR |
| 10+ | 18.19 EUR |
| 25+ | 16.99 EUR |
| 240+ | 15.07 EUR |
| 480+ | 14.68 EUR |
| 720+ | 14.49 EUR |
| T1042NSE7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 255.18 EUR |
| 10+ | 216.68 EUR |
| 60+ | 199.94 EUR |
| LPC54113J256UK49012 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.44x3.44)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MK20DX256VLH7557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Description: KINETIS K20: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC4538PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Description: IC MULTIVIBRATOR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRWY-LS1046A-TP |
|
Hersteller: NXP USA Inc.
Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
Description: LS1046A EVAL BOARD CORAL TPU
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1757.34 EUR |
| MC68HCP11E1CFNE3,574 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC11 CPU
Description: MICROCONTROLLER, 8 BIT, HC11 CPU
auf Bestellung 1355 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 19+ | 27.33 EUR |
| PMF87EN,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
auf Bestellung 103313 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| SPC5747CBK0ACKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9536D118 |
|
Hersteller: NXP USA Inc.
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 4-BIT I2C-BUS AND SMBUS I/O PORT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908QT2ACDWER-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, FLASH, H
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
auf Bestellung 326 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 114+ | 4.3 EUR |
| MC908QB4CDWE-NXP |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 1645 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 72+ | 6.37 EUR |
| MKE15Z64VFP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 519 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.53 EUR |
| 10+ | 2.91 EUR |
| 25+ | 2.87 EUR |
| 100+ | 2.86 EUR |
| TJF1051T/CM118 |
|
Hersteller: NXP USA Inc.
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Description: GALVANICALLY ISOLATED HIGH-SPEED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX384-B6V8/ZLX |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.8V 300MW SOD323
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Description: DIODE ZENER 6.8V 300MW SOD323
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOD-323
Part Status: Obsolete
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 4 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMEG045V150EPD139 |
|
auf Bestellung 1005000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 838+ | 0.63 EUR |
| PMEG045T150EPD139 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMEG060V100EPD139 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SLN-VIZNAS-IOT |
|
Hersteller: NXP USA Inc.
Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
Description: DEV I.MXRT106F FACE RECOGNITION
Packaging: Box
Function: Face Recognition
Utilized IC / Part: i.MX RT1060
Supplied Contents: Board(s)
Embedded: Yes
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 399.06 EUR |
| MIMXRT1061DVJ6A |
|
Hersteller: NXP USA Inc.
Description: I.MXRT1060
Description: I.MXRT1060
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P96J0CFT |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH8T245PW |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Description: IC TRANSLATION TXRX 5.5V 24TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK9E1R9-40E,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
auf Bestellung 4974 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 317+ | 1.59 EUR |
| BUK762R9-40E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK762R9-40E 100A,
Description: NOW NEXPERIA BUK762R9-40E 100A,
Produkt ist nicht verfügbar
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| PDTA114YU/L115 |
|
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| PN5180A0ET/C4QL |
|
Hersteller: NXP USA Inc.
Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
Description: PN5180 TFBGA64 TRAY
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
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| TEF8101EN/N1E |
|
Hersteller: NXP USA Inc.
Description: RADAR
Description: RADAR
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| TEF8101EN/N1Y |
|
Hersteller: NXP USA Inc.
Description: RADAR
Description: RADAR
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| NVT2001GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 460205 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 792+ | 0.64 EUR |
| NVT2001GMZ |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| NVT2001GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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| PCA9306GF,115 |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
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