Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36617) > Seite 385 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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74HC2G125DP-Q100125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 8TSSOP |
auf Bestellung 2900 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS21/DG/B3215 | NXP USA Inc. |
Description: RECTIFIER DIODE, 0.2A, 250V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 7548 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CAK3MME3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CAK3MME3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CK3MME3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGACore Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CSK3MME3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CDK3MME3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CSK3MME3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGAOperating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CRK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 516-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 516-BGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CAK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGAProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 516-BGA Packaging: Tray DigiKey Programmable: Not Verified Supplier Device Package: 516-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CAK3MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CCK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CLK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CSK3MMO3 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CCK3MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CDK3MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGAOscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 516-BGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Supplier Device Package: 516-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CLK3MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CSK3MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CDK3MME4R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 416MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 416-MAPBGA (27x27) Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CDK3MMO4R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 516-MAPBGA (27x27) Peripherals: DMA, LVD, POR, Zipwire Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16b Sigma-Delta, eQADC Core Processor: e200z7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 8MB (8M x 8) Speed: 264MHz Mounting Type: Surface Mount Package / Case: 516-BGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5777CK2MMO3R | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC32PF8121A0EP | NXP USA Inc. |
Description: IC POWER MANAGEMENTSupplier Device Package: 56-HVQFN (8x8) Applications: Industrial, IoT Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 258 Stücke: Lieferzeit 10-14 Tag (e) |
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KITPF8121FRDMEVM | NXP USA Inc. |
Description: FRDM EXPANSION BOARD PF8121 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC32PF8121F2EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8M MINISupplier Device Package: 56-HVQFN (8x8) Applications: Industrial, IoT Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC32PF8121EUEPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PRSupplier Device Package: 56-HVQFN (8x8) Applications: Industrial, IoT Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC32PF8121A0EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 NON-PR |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC32PF8121F2EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PRSupplier Device Package: 56-HVQFN (8x8) Applications: Industrial, IoT Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BC869-16115 | NXP USA Inc. |
Description: NOW NEXPERIA BC869-16 - SMALL SIPackaging: Bulk Supplier Device Package: SOT-89 Mounting Type: Surface Mount Package / Case: TO-243AA |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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BC869135 | NXP USA Inc. |
Description: NOW NEXPERIA BC869 - SMALL SIGNADigiKey Programmable: Not Verified Packaging: Bulk Supplier Device Package: SOT-89 Mounting Type: Surface Mount Package / Case: TO-243AA |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604BF2VLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5604BF2VLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1075ATW/5V0WD,1 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOPPackaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BC54PAS115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
auf Bestellung 20400 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 5635 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/FD/3V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1132HW/FD/3V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 3004 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1131HW/FD/3V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1131HW/FD/3V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1131HW/FD/5V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1131HW/FD/5V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 1471 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1132HW/FD/5V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/FD/5V/0Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1400 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1135HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1135HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1135HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVER |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1135HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVER |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1131HW/FD/5V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2959 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1136HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1136HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1136HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1136HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1131HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1131HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/FD/5V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/FD/5V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTEPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 1453 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1132HW/FD/3V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/FD/3V/4Y | NXP USA Inc. |
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/3V3Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1470 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1132HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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UJA1132HW/5V0Y | NXP USA Inc. |
Description: IC TRANSCEIVERPackaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1175 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC2G125DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8TSSOP
Description: IC BUFFER NON-INVERT 6V 8TSSOP
auf Bestellung 2900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2900+ | 0.27 EUR |
| BAS21/DG/B3215 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 0.2A, 250V
Description: RECTIFIER DIODE, 0.2A, 250V
Produkt ist nicht verfügbar
Mindestbestellmenge: 7548 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CAK3MME3 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CAK3MME3R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CK3MME3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CSK3MME3 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CDK3MME3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CSK3MME3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CRK3MMO3 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CAK3MMO3 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CAK3MMO3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CCK3MMO3 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CLK3MMO3 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CSK3MMO3 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CCK3MMO3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CDK3MMO3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CLK3MMO3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CSK3MMO3R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CDK3MME4R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 416-MAPBGA (27x27)
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CDK3MMO4R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LVD, POR, Zipwire
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Processor: e200z7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 264MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5777CK2MMO3R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF8121A0EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: IC POWER MANAGEMENT
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.11 EUR |
| 10+ | 10.13 EUR |
| 25+ | 9.38 EUR |
| 100+ | 8.56 EUR |
| KITPF8121FRDMEVM |
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Hersteller: NXP USA Inc.
Description: FRDM EXPANSION BOARD PF8121
Description: FRDM EXPANSION BOARD PF8121
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| MC32PF8121F2EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8M MINI
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: IC POWER MANAGEMENT I.MX8M MINI
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF8121EUEPR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF8121A0EPR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF8121F2EPR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Supplier Device Package: 56-HVQFN (8x8)
Applications: Industrial, IoT
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BC869-16115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC869-16 - SMALL SI
Packaging: Bulk
Supplier Device Package: SOT-89
Mounting Type: Surface Mount
Package / Case: TO-243AA
Description: NOW NEXPERIA BC869-16 - SMALL SI
Packaging: Bulk
Supplier Device Package: SOT-89
Mounting Type: Surface Mount
Package / Case: TO-243AA
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2681+ | 0.21 EUR |
| BC869135 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC869 - SMALL SIGNA
DigiKey Programmable: Not Verified
Packaging: Bulk
Supplier Device Package: SOT-89
Mounting Type: Surface Mount
Package / Case: TO-243AA
Description: NOW NEXPERIA BC869 - SMALL SIGNA
DigiKey Programmable: Not Verified
Packaging: Bulk
Supplier Device Package: SOT-89
Mounting Type: Surface Mount
Package / Case: TO-243AA
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2681+ | 0.21 EUR |
| SPC5604BF2VLL4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BF2VLL4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1075ATW/5V0WD,1 |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BC54PAS115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
auf Bestellung 20400 Stücke:
Lieferzeit 10-14 Tag (e)
| UJA1132HW/FD/3V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 7.6 EUR |
| UJA1132HW/FD/3V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3004 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.11 EUR |
| 10+ | 10.1 EUR |
| 25+ | 9.35 EUR |
| 100+ | 8.53 EUR |
| 250+ | 8.13 EUR |
| 500+ | 8.12 EUR |
| UJA1131HW/FD/3V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1131HW/FD/3V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1131HW/FD/5V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1131HW/FD/5V/0Y |
![]() |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1471 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.46 EUR |
| 10+ | 9.58 EUR |
| 25+ | 8.87 EUR |
| 100+ | 8.08 EUR |
| 250+ | 7.7 EUR |
| 500+ | 7.66 EUR |
| UJA1132HW/FD/5V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/FD/5V/0Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.16 EUR |
| 10+ | 8.54 EUR |
| 25+ | 7.89 EUR |
| 100+ | 7.18 EUR |
| 250+ | 6.83 EUR |
| 500+ | 6.62 EUR |
| UJA1135HW/3V3Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 8.03 EUR |
| UJA1135HW/3V3Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.16 EUR |
| 10+ | 12.78 EUR |
| 25+ | 12.19 EUR |
| 100+ | 10.58 EUR |
| 250+ | 10.1 EUR |
| 500+ | 9.21 EUR |
| UJA1135HW/5V0Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Description: IC TRANSCEIVER
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 11.03 EUR |
| UJA1135HW/5V0Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Description: IC TRANSCEIVER
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.61 EUR |
| 10+ | 15.01 EUR |
| 25+ | 14.3 EUR |
| 100+ | 12.42 EUR |
| 250+ | 11.86 EUR |
| 500+ | 11.03 EUR |
| UJA1131HW/FD/5V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2959 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.48 EUR |
| 10+ | 10.41 EUR |
| 25+ | 9.64 EUR |
| 100+ | 8.79 EUR |
| 250+ | 8.39 EUR |
| 500+ | 8.38 EUR |
| UJA1136HW/5V0Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1136HW/5V0Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.72 EUR |
| 10+ | 13.29 EUR |
| 25+ | 12.67 EUR |
| 100+ | 11.01 EUR |
| 250+ | 10.51 EUR |
| 500+ | 9.58 EUR |
| UJA1136HW/3V3Y |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 8.46 EUR |
| UJA1136HW/3V3Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.93 EUR |
| 10+ | 13.48 EUR |
| 25+ | 12.85 EUR |
| 100+ | 11.16 EUR |
| 250+ | 10.66 EUR |
| 500+ | 9.71 EUR |
| UJA1131HW/3V3Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 8.76 EUR |
| UJA1131HW/3V3Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| UJA1132HW/FD/5V/4Y |
![]() |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/FD/5V/4Y |
![]() |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1453 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.16 EUR |
| 10+ | 10.92 EUR |
| 25+ | 10.13 EUR |
| 100+ | 9.25 EUR |
| 250+ | 8.83 EUR |
| UJA1132HW/FD/3V/4Y |
![]() |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/FD/3V/4Y |
![]() |
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/3V3Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/3V3Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.43 EUR |
| 10+ | 11.95 EUR |
| 25+ | 11.07 EUR |
| 100+ | 10.1 EUR |
| 250+ | 9.65 EUR |
| 500+ | 9.37 EUR |
| UJA1132HW/5V0Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1132HW/5V0Y |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1175 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.43 EUR |
| 10+ | 11.95 EUR |
| 25+ | 11.07 EUR |
| 100+ | 10.1 EUR |
| 250+ | 9.65 EUR |
| 500+ | 9.37 EUR |




















