Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35543) > Seite 385 nach 593
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| LPC1837JET100551 | NXP USA Inc. |
 Description: IC MCU 32BIT 1MB FLASH 100TFBGA |
Produkt ist nicht verfügbar |
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| LPC18S37JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA |
Produkt ist nicht verfügbar |
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| LPC4333JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA |
Produkt ist nicht verfügbar |
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LPC4325JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLSH 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 768KB (768K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 |
Produkt ist nicht verfügbar |
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| LPC4327JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA |
Produkt ist nicht verfügbar |
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LPC4337JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S37JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 |
Produkt ist nicht verfügbar |
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| LPC43S67JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 154K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54606J512ET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC4367JET100551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA |
Produkt ist nicht verfügbar |
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| BAW56SRA147 | NXP USA Inc. |
Description: BAW56 - QUAD HIGH-SPEED SWITCHIN Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74ABT00N,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 15mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 Current - Quiescent (Max): 50 µA |
auf Bestellung 3940 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT00DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74ABT00DB - NAND GA Packaging: Bulk Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 15mA, 20mA Number of Inputs: 2 Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF Part Status: Active Number of Circuits: 4 Current - Quiescent (Max): 50 µA |
auf Bestellung 1990 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDTC114YT235 | NXP USA Inc. |
Description: PDTA114Y SERIES - PNP RESISTOR-E Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PDTC114YM315 | NXP USA Inc. |
Description: NOW NEXPERIA PDTC114YM - SMALL S Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Supplier Device Package: DFN1006-3 Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 47 kOhms |
Produkt ist nicht verfügbar |
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| PDTC124XMB315 | NXP USA Inc. |
Description: NOW NEXPERIA PDTC124XMB - SMALL |
Produkt ist nicht verfügbar |
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PDTC124TMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 22 kOhms Qualification: AEC-Q101 |
auf Bestellung 190000 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS21AVD/DG/B2135 | NXP USA Inc. |
Description: BAS21AVD - RECTIFIER DIODE |
Produkt ist nicht verfügbar |
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| BAS21AVD135 | NXP USA Inc. | Description: NOW NEXPERIA BAS21AVD - RECTIFIE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC912D60AVFUE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 8x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 48 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| S912D60AH2VPVE | NXP USA Inc. | Description: IC MCU 16BIT SGF 112LQFP |
Produkt ist nicht verfügbar |
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| S912D60AH2VPVER | NXP USA Inc. | Description: IC MCU 16BIT SGF 112LQFP |
Produkt ist nicht verfügbar |
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N74F00N,602 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14DIP Packaging: Bulk Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 22524 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV241DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SSOP |
auf Bestellung 1348 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV241N,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-DIP |
auf Bestellung 2823 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68HC908QT2CPE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-PDIP Part Status: Active Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2148FBD64,157 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 14x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
auf Bestellung 610 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC161DB118 | NXP USA Inc. |
Description: BINARY COUNTER, LVC/LCX/Z SERIES |
Produkt ist nicht verfügbar |
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BFG480W,115 | NXP USA Inc. |
 Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4Packaging: Cut Tape (CT) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 16dB Power - Max: 360mW Current - Collector (Ic) (Max): 250mA Voltage - Collector Emitter Breakdown (Max): 4.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz Supplier Device Package: CMPAK-4 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3566HV/V1100557 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U12FHN33/201K | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1353 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCF2961EHN3/0200CY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| NCF29A7XHN3/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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PCA2129T/Q900/2 | NXP USA Inc. |
Description: AUTOMOTIVE ACCURATE RTC WITH INT |
Produkt ist nicht verfügbar |
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74ALVC14D,112 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SOIC Packaging: Tube |
auf Bestellung 3780 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT138DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT138DB - DECODE Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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NTS0304EPWJ | NXP USA Inc. |
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
Produkt ist nicht verfügbar |
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NTS0304EPWJ | NXP USA Inc. |
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
auf Bestellung 898 Stücke: Lieferzeit 10-14 Tag (e) |
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OM13543 | NXP USA Inc. |
Description: EVAL BOARD FOR NTS0304E Packaging: Bulk Function: Logic-Level Translator Type: Interface Contents: Board(s) Utilized IC / Part: NTS0304E Supplied Contents: Board(s) Primary Attributes: Level Shifter Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMA1250KEG | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 50Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 400 Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33812EKR2518 | NXP USA Inc. |
Description: MULTIFUNCTIONAL IGNITION AND INJ Packaging: Bulk |
auf Bestellung 5690 Stücke: Lieferzeit 10-14 Tag (e) |
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| A7101CGUK/T0B0407, | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BGA7350,115 | NXP USA Inc. |
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 50MHz ~ 250MHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 19.5dB Current - Supply: 245mA Noise Figure: 6dB P1dB: 17dBm Test Frequency: 50MHz Supplier Device Package: 32-HVQFN (5x5) |
auf Bestellung 1468 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA7351,115 | NXP USA Inc. |
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 50MHz ~ 500MHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 21.5dB Current - Supply: 280mA Noise Figure: 6dB P1dB: 15.8dBm Test Frequency: 250MHz Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
auf Bestellung 2777 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5746BSK1MKU2R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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74AHC573PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 5463 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC573BQ-Q100115 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| SL3S5050N0FUD/00BZ | NXP USA Inc. |
Description: IC RFID TRANSP UCODE DNA WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Type: RFID Transponder Standards: EPC, ISO 29167 Supplier Device Package: Wafer Part Status: Active |
Produkt ist nicht verfügbar |
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MC9S08QG4CFKE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 24QFN Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN-EP (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 4186 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG6010AESBC315 | NXP USA Inc. |
Description: DIODE SCHOTTKY 60V 1A DSN10062 Packaging: Bulk Package / Case: 2-XDFN Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 2.4 ns Technology: Schottky Capacitance @ Vr, F: 20pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: DSN1006-2 Operating Temperature - Junction: 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 60 V Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A Current - Reverse Leakage @ Vr: 650 µA @ 60 V |
Produkt ist nicht verfügbar |
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PMEG6010ELR/B115 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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IP4054CX15/LF135 | NXP USA Inc. |
Description: CONSUMER CIRCUIT Packaging: Bulk Part Status: Active |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4054CX15/LF | NXP USA Inc. |
Description: CONSUMER CIRCUIT Packaging: Bulk Part Status: Active |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX31LCVMN4DR2518 | NXP USA Inc. |
Description: I.MX31 32-BIT MPU, ARM1136JF-S C Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC33FS8430G1ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8430 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 133 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT540D-Q100118 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5601DF1VLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 33x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5601DF1VLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 33x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5602CF2MLH4R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5604BK0MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LPC1837JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC18S37JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4333JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4325JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4327JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4337JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S37JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S67JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54606J512ET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4367JET100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAW56SRA147 |
|
Hersteller: NXP USA Inc.
Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
Description: BAW56 - QUAD HIGH-SPEED SWITCHIN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT00N,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
auf Bestellung 3940 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 444+ | 1.10 EUR |
| 74ABT00DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT00DB - NAND GA
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
Description: NOW NEXPERIA 74ABT00DB - NAND GA
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 645+ | 0.78 EUR |
| PDTC114YT235 |
|
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC114YM315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC114YM - SMALL S
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: DFN1006-3
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Description: NOW NEXPERIA PDTC114YM - SMALL S
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: DFN1006-3
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC124XMB315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC124XMB - SMALL
Description: NOW NEXPERIA PDTC124XMB - SMALL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTC124TMB315 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 22 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 22 kOhms
Qualification: AEC-Q101
auf Bestellung 190000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11225+ | 0.05 EUR |
| BAS21AVD/DG/B2135 |
|
Hersteller: NXP USA Inc.
Description: BAS21AVD - RECTIFIER DIODE
Description: BAS21AVD - RECTIFIER DIODE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAS21AVD135 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAS21AVD - RECTIFIE
Description: NOW NEXPERIA BAS21AVD - RECTIFIE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC912D60AVFUE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912D60AH2VPVE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
Description: IC MCU 16BIT SGF 112LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912D60AH2VPVER |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
Description: IC MCU 16BIT SGF 112LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F00N,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 22524 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 784+ | 0.60 EUR |
| 74LV241DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
auf Bestellung 1348 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 888+ | 0.57 EUR |
| 74LV241N,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DIP
Description: IC BUFFER NON-INVERT 3.6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DIP
auf Bestellung 2823 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 346+ | 1.47 EUR |
| MC68HC908QT2CPE-NXP |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2148FBD64,157 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 610 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.21 EUR |
| 10+ | 24.74 EUR |
| 25+ | 24.19 EUR |
| 160+ | 23.02 EUR |
| 320+ | 22.74 EUR |
| 74LVC161DB118 |
|
Hersteller: NXP USA Inc.
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFG480W,115 | |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF3566HV/V1100557 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 34+ | 16.00 EUR |
| LPC11U12FHN33/201K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1353 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 4.19 EUR |
| 10+ | 3.16 EUR |
| 25+ | 2.96 EUR |
| PCA2129T/Q900/2 |
|
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE ACCURATE RTC WITH INT
Description: AUTOMOTIVE ACCURATE RTC WITH INT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ALVC14D,112 |
|
auf Bestellung 3780 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2420+ | 0.20 EUR |
| 74HCT138DB118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 0.24 EUR |
| NTS0304EPWJ |
|
Hersteller: NXP USA Inc.
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTS0304EPWJ |
|
Hersteller: NXP USA Inc.
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: 4-BIT VOLTAGE TRANSLATOR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
auf Bestellung 898 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 1.76 EUR |
| 14+ | 1.26 EUR |
| 25+ | 1.14 EUR |
| 100+ | 1.00 EUR |
| 250+ | 0.94 EUR |
| 500+ | 0.90 EUR |
| OM13543 |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NTS0304E
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Contents: Board(s)
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
Description: EVAL BOARD FOR NTS0304E
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Contents: Board(s)
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 159.63 EUR |
| MMA1250KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.70 EUR |
| 10+ | 17.19 EUR |
| MC33812EKR2518 |
|
auf Bestellung 5690 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 127+ | 3.95 EUR |
| A7101CGUK/T0B0407, |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGA7350,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 1468 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 86+ | 5.76 EUR |
| BGA7351,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
auf Bestellung 2777 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 145+ | 3.51 EUR |
| SPC5746BSK1MKU2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHC573PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 5463 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1823+ | 0.26 EUR |
| 74AHC573BQ-Q100115 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SL3S5050N0FUD/00BZ |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08QG4CFKE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 4186 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 135+ | 3.94 EUR |
| PMEG6010AESBC315 |
|
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN10062
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Description: DIODE SCHOTTKY 60V 1A DSN10062
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4054CX15/LF135 |
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1255+ | 0.42 EUR |
| IP4054CX15/LF |
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 919+ | 0.54 EUR |
| MCIMX31LCVMN4DR2518 |
|
Hersteller: NXP USA Inc.
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| MC33FS8430G1ES |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 133 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 17.62 EUR |
| 10+ | 15.91 EUR |
| 25+ | 15.17 EUR |
| 80+ | 13.17 EUR |
| 74HCT540D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
Produkt ist nicht verfügbar
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| SPC5601DF1VLL4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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| SPC5601DF1VLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SPC5602CF2MLH4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
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| SPC5604BK0MLH4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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