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LS1026ASN8Q1A LS1026ASN8Q1A NXP USA Inc. LS1046AFS.pdf Description: QORIQ LAYERSCAPE 2XA72 64BIT ARM
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74AHCT245BQ-Q100115 NXP USA Inc. 74AHC_AHCT245_Q100.pdf Description: BUS TRANSCVR
Part Status: Active
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Bulk
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74AHCT245PW-Q100118 74AHCT245PW-Q100118 NXP USA Inc. 74AHC_AHCT245_Q100.pdf Description: BUS TRANSCVR
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74AHCT245D-Q100118 74AHCT245D-Q100118 NXP USA Inc. 74AHC_AHCT245_Q100.pdf Description: BUS TRANSCVR
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MFR4310E1MAE40,557 MFR4310E1MAE40,557 NXP USA Inc. MFR4310RM.pdf Description: COMMUNICATION CONTROLLER, 40MHZ
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BAT54A/6235 BAT54A/6235 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 30V 200MA SOT23
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Qualification: AEC-Q101
Grade: Automotive
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BAT54A/6215 BAT54A/6215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 30V 200MA SOT23
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
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74LV377DB,112 74LV377DB,112 NXP USA Inc. 74LV377.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LV377PW,112 74LV377PW,112 NXP USA Inc. 74LV377.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LV377N,112 74LV377N,112 NXP USA Inc. 74LV377.pdf Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LV377DB,118 74LV377DB,118 NXP USA Inc. 74LV377.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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BAT54S/6215 BAT54S/6215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54S/6235 BAT54S/6235 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOT 30V 200MA SOT233
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA
Supplier Device Package: SOT23-3 (TO-236)
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
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MKV10Z64VLF7R MKV10Z64VLF7R NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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FS32K116BRT0VLFT FS32K116BRT0VLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
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FS32K118LFT0VLHT FS32K118LFT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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SPC5745BBK1ACKU6 SPC5745BBK1ACKU6 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 176LQFP
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MIMXRT595-EVK MIMXRT595-EVK NXP USA Inc. IMXRT500RT600FS.pdf Description: I.MXRT500 EVAL KIT
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Utilized IC / Part: i.MX RT500
Core Processor: ARM® Cortex®-M33
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MIMXRT1052DVL6A557 MIMXRT1052DVL6A557 NXP USA Inc. PHGL-S-A0006456247-1.pdf?t.download=true&u=5oefqw Description: I.MX RT1050 CORTEX A7 RISC MICRO
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Bulk
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MIMXRT1052CVL5A557 MIMXRT1052CVL5A557 NXP USA Inc. PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw Description: I.MX RT1050 CORTEX A7 RISC MICRO
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Bulk
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MIMXRT1051DVL6BR MIMXRT1051DVL6BR NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1052DVL6BR MIMXRT1052DVL6BR NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1052CVL5BR MIMXRT1052CVL5BR NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1051CVJ5B MIMXRT1051CVJ5B NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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BGU7063,518 BGU7063,518 NXP USA Inc. BGU7063.pdf Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Supplier Device Package: 16-HLQFN (8x8)
Test Frequency: 1.95GHz
P1dB: -12.5dBm
Noise Figure: 0.9dB
Current - Supply: 230mA
Gain: 37.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: Cellular
Frequency: 1.92GHz ~ 1.98GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Bulk
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UBA2036TS/N1,118 UBA2036TS/N1,118 NXP USA Inc. UBA2036TS.pdf Description: IC HID LAMP CNTRL 100KHZ 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Frequency: 100kHz
Type: HID Lamp Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 10.5V ~ 13.5V
Supplier Device Package: 28-SSOP
Dimming: No
Current - Supply: 500 µA
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TDA8542TS/N1 NXP USA Inc. tda8542ts_2.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO PWR 1.2W AB 20SSOP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8547TS/N1,118 TDA8547TS/N1,118 NXP USA Inc. TDA8547TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
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TDA8547TS/N1,112 TDA8547TS/N1,112 NXP USA Inc. TDA8547TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Part Status: Obsolete
Power Line Protection: No
Power - Peak Pulse: 6W
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Bulk
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MCZ33800EK MCZ33800EK NXP USA Inc. MC33800.pdf Description: IC ENGINE CTRL SW/DVR 54-SOIC
Grade: Automotive
Part Status: Active
Supplier Device Package: 54-SOIC-EP
Current - Supply: 10mA
Voltage - Supply: 5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MPF7100BMMA0ES NXP USA Inc. Description: PF7100 PMIC OTP
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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100+12.76 EUR
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KITPF8200FRDMPGM KITPF8200FRDMPGM NXP USA Inc. PF8100_PF8200.pdf Description: EVAL BOARD FOR PF8200
Contents: Board(s)
Part Status: Active
Primary Attributes: 12-Channel
Supplied Contents: Board(s)
Utilized IC / Part: PF8200
Type: Power Management
Packaging: Bulk
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FRDM-K32L3A6 FRDM-K32L3A6 NXP USA Inc. K32MCUSFS.pdf Description: FREEDOM DEV K32L3A6
Platform: Freedom
Utilized IC / Part: K32 L3
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+, Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
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FRDM-KW38 FRDM-KW38 NXP USA Inc. FRDM-KW38-QSG.pdf Description: KW38 FREEDOM DEV BOARD
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
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LPC5506JHI48QL LPC5506JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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TDA3681TH/N2S/S435 NXP USA Inc. Description: IC REG MULTIPLE VOLTAGE 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Current - Supply: 110µA
Supplier Device Package: 20-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ALVC373PW,118 74ALVC373PW,118 NXP USA Inc. PHGLS15080-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74ALVC373PW - BUS D
Part Status: Active
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 2.2ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 1
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74AHCT74PW-Q100118 74AHCT74PW-Q100118 NXP USA Inc. 74AHC_AHCT74_Q100.pdf Description: D FLIP-FLOP, AHCT/VHCT SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Grade: Automotive
Part Status: Active
Number of Bits per Element: 1
Qualification: AEC-Q100
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PDTB114EQA147 PDTB114EQA147 NXP USA Inc. PDTB113_123_143_114EQA_SER.pdf Description: NOW NEXPERIA PDTB114EQA SMALL SI
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TDF8544J/N3112 NXP USA Inc. PHGLS23309-1.pdf?t.download=true&u=5oefqw Description: IC AMP AUDIO BTL DBS27P
Packaging: Bulk
Package / Case: 27-SSIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA9981BHL/15/C1551 TDA9981BHL/15/C1551 NXP USA Inc. _TDA9981AHL_Web.pdf?t.download=true&u=ovmfp3 Description: HDMI TRANSMITTER
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TDA9981BHL/15/C1557 NXP USA Inc. PHGLS15861-1.pdf?t.download=true&u=5oefqw Description: HDMI TRANSMITTER
Packaging: Bulk
Part Status: Active
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TDA9981AHL/15C183557 TDA9981AHL/15C183557 NXP USA Inc. _TDA9981AHL_Web.pdf?t.download=true&u=ovmfp3 Description: HDMI TRANSMITTER
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LPC11A12FHN33/101551 LPC11A12FHN33/101551 NXP USA Inc. _LPC11AXX.pdf?t.download=true&u=ovmfp3 Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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NTM88H075T1 NTM88H075T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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NTM88H075T1 NTM88H075T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
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TDA9955HL/17/C155 TDA9955HL/17/C155 NXP USA Inc. PHGLS15808-1.pdf?t.download=true&u=5oefqw Description: CONSUMER CIRCUIT,
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TDA9955HL/17/C1557 NXP USA Inc. PHGLS15808-1.pdf?t.download=true&u=5oefqw Description: A/D CONVERTER 8-BIT 3 CHANNEL
Packaging: Bulk
Part Status: Active
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TDA9955HL/17/C1551 TDA9955HL/17/C1551 NXP USA Inc. PHGLS15808-1.pdf?t.download=true&u=5oefqw Description: A/D CONVERTER 8-BIT 3 CHANNEL
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MC56F8135VFGE MC56F8135VFGE NXP USA Inc. MC56F833xDSAD.pdf Description: IC MCU 16BIT 64KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
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10+45.07 EUR
50+40.76 EUR
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MC9S08PB8VTJ MC9S08PB8VTJ NXP USA Inc. MC9S08PB16.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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150+2.83 EUR
450+2.68 EUR
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SW574XG-OS401V NXP USA Inc. Description: AUTOSAR SOFTWARE MPC574XG OS4.0
Produkt ist nicht verfügbar
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SW574XG-MCAL401V NXP USA Inc. Description: AUTOSAR SOFTWARE MPC574XG MCAL4.
Produkt ist nicht verfügbar
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SWS12Z-OS401V NXP USA Inc. Description: AUTOSAR SOFTWARE S12ZV AR4.0 OS
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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SW5746M-SMCL401V NXP USA Inc. Description: AUTOSAR SOFTWARE MPC5746M SAFETY
Produkt ist nicht verfügbar
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SW5746R-SMCL401V NXP USA Inc. Description: AUTOSAR SOFTWARE MPC5746R SAFETY
Produkt ist nicht verfügbar
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SW574XG-OS401P NXP USA Inc. Description: AUTOSAR SOFTWARE MPC574XG OS4.0
Produkt ist nicht verfügbar
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SW574XG-SMCL401V NXP USA Inc. Description: AUTOSAR SOFTWARE MPC574XG SAFETY
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SWAC58R-MCAL401V NXP USA Inc. Description: AUTOSAR SOFTWARE SAC58R M4 MCAL4
Produkt ist nicht verfügbar
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LS1026ASN8Q1A LS1046AFS.pdf
LS1026ASN8Q1A
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE 2XA72 64BIT ARM
Produkt ist nicht verfügbar
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74AHCT245BQ-Q100115 74AHC_AHCT245_Q100.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR
Part Status: Active
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT245PW-Q100118 74AHC_AHCT245_Q100.pdf
74AHCT245PW-Q100118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT245D-Q100118 74AHC_AHCT245_Q100.pdf
74AHCT245D-Q100118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MFR4310E1MAE40,557 MFR4310RM.pdf
MFR4310E1MAE40,557
Hersteller: NXP USA Inc.
Description: COMMUNICATION CONTROLLER, 40MHZ
Produkt ist nicht verfügbar
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BAT54A/6235 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54A/6235
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
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BAT54A/6215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54A/6215
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
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74LV377DB,112 74LV377.pdf
74LV377DB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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74LV377PW,112 74LV377.pdf
74LV377PW,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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720+0.81 EUR
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74LV377N,112 74LV377.pdf
74LV377N,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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AnzahlPrivatkunde
370+1.55 EUR
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74LV377DB,118 74LV377.pdf
74LV377DB,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Current - Quiescent (Iq): 160 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 70 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+0.75 EUR
Mindestbestellmenge: 1000 Stücke
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BAT54S/6215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54S/6215
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54S/6235 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54S/6235
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOT 30V 200MA SOT233
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA
Supplier Device Package: SOT23-3 (TO-236)
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Produkt ist nicht verfügbar
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MKV10Z64VLF7R KV11P64M75.pdf
MKV10Z64VLF7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K116BRT0VLFT S32K1xx.pdf
FS32K116BRT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LFT0VLHT S32K1xx.pdf
FS32K118LFT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BBK1ACKU6
SPC5745BBK1ACKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
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MIMXRT595-EVK IMXRT500RT600FS.pdf
MIMXRT595-EVK
Hersteller: NXP USA Inc.
Description: I.MXRT500 EVAL KIT
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
Utilized IC / Part: i.MX RT500
Core Processor: ARM® Cortex®-M33
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MIMXRT1052DVL6A557 PHGL-S-A0006456247-1.pdf?t.download=true&u=5oefqw
MIMXRT1052DVL6A557
Hersteller: NXP USA Inc.
Description: I.MX RT1050 CORTEX A7 RISC MICRO
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 512K x 8
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1052CVL5A557 PHGL-S-A0006456212-1.pdf?t.download=true&u=5oefqw
MIMXRT1052CVL5A557
Hersteller: NXP USA Inc.
Description: I.MX RT1050 CORTEX A7 RISC MICRO
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 512K x 8
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMXRT1051DVL6BR IMXRT1050CEC.pdf
MIMXRT1051DVL6BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1500+12.8 EUR
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MIMXRT1052DVL6BR IMXRT1050CEC.pdf
MIMXRT1052DVL6BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1052CVL5BR IMXRT1050IEC.pdf
MIMXRT1052CVL5BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1500+12.53 EUR
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MIMXRT1051CVJ5B IMXRT1050IEC.pdf
MIMXRT1051CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+22.41 EUR
10+17.58 EUR
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BGU7063,518 BGU7063.pdf
BGU7063,518
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Supplier Device Package: 16-HLQFN (8x8)
Test Frequency: 1.95GHz
P1dB: -12.5dBm
Noise Figure: 0.9dB
Current - Supply: 230mA
Gain: 37.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: Cellular
Frequency: 1.92GHz ~ 1.98GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Bulk
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41+15.05 EUR
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UBA2036TS/N1,118 UBA2036TS.pdf
UBA2036TS/N1,118
Hersteller: NXP USA Inc.
Description: IC HID LAMP CNTRL 100KHZ 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Frequency: 100kHz
Type: HID Lamp Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 10.5V ~ 13.5V
Supplier Device Package: 28-SSOP
Dimming: No
Current - Supply: 500 µA
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140+4.28 EUR
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TDA8542TS/N1 tda8542ts_2.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO PWR 1.2W AB 20SSOP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8547TS/N1,118 TDA8547TS.pdf
TDA8547TS/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TDA8547TS/N1,112 TDA8547TS.pdf
TDA8547TS/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Part Status: Obsolete
Power Line Protection: No
Power - Peak Pulse: 6W
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Bulk
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3806+0.15 EUR
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MCZ33800EK MC33800.pdf
MCZ33800EK
Hersteller: NXP USA Inc.
Description: IC ENGINE CTRL SW/DVR 54-SOIC
Grade: Automotive
Part Status: Active
Supplier Device Package: 54-SOIC-EP
Current - Supply: 10mA
Voltage - Supply: 5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MPF7100BMMA0ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC OTP
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 254 Stücke:
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2+19.16 EUR
10+14.96 EUR
25+13.91 EUR
100+12.76 EUR
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KITPF8200FRDMPGM PF8100_PF8200.pdf
KITPF8200FRDMPGM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF8200
Contents: Board(s)
Part Status: Active
Primary Attributes: 12-Channel
Supplied Contents: Board(s)
Utilized IC / Part: PF8200
Type: Power Management
Packaging: Bulk
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1+632.03 EUR
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FRDM-K32L3A6 K32MCUSFS.pdf
FRDM-K32L3A6
Hersteller: NXP USA Inc.
Description: FREEDOM DEV K32L3A6
Platform: Freedom
Utilized IC / Part: K32 L3
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+, Cortex®-M4
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Part Status: Active
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1+79.09 EUR
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FRDM-KW38 FRDM-KW38-QSG.pdf
FRDM-KW38
Hersteller: NXP USA Inc.
Description: KW38 FREEDOM DEV BOARD
Packaging: Bulk
For Use With/Related Products: KW38
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
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LPC5506JHI48QL LPC55S0x_LPC550x.pdf
LPC5506JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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3+8.54 EUR
10+6.5 EUR
25+5.99 EUR
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TDA3681TH/N2S/S435
Hersteller: NXP USA Inc.
Description: IC REG MULTIPLE VOLTAGE 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Current - Supply: 110µA
Supplier Device Package: 20-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ALVC373PW,118 PHGLS15080-1.pdf?t.download=true&u=5oefqw
74ALVC373PW,118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVC373PW - BUS D
Part Status: Active
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 2.2ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 1
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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1778+0.33 EUR
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74AHCT74PW-Q100118 74AHC_AHCT74_Q100.pdf
74AHCT74PW-Q100118
Hersteller: NXP USA Inc.
Description: D FLIP-FLOP, AHCT/VHCT SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 140 MHz
Input Capacitance: 3 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Grade: Automotive
Part Status: Active
Number of Bits per Element: 1
Qualification: AEC-Q100
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2684+0.21 EUR
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PDTB114EQA147 PDTB113_123_143_114EQA_SER.pdf
PDTB114EQA147
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTB114EQA SMALL SI
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9427+0.064 EUR
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TDF8544J/N3112 PHGLS23309-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP AUDIO BTL DBS27P
Packaging: Bulk
Package / Case: 27-SSIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA9981BHL/15/C1551 _TDA9981AHL_Web.pdf?t.download=true&u=ovmfp3
TDA9981BHL/15/C1551
Hersteller: NXP USA Inc.
Description: HDMI TRANSMITTER
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138+4.31 EUR
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TDA9981BHL/15/C1557 PHGLS15861-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: HDMI TRANSMITTER
Packaging: Bulk
Part Status: Active
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120+5.28 EUR
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TDA9981AHL/15C183557 _TDA9981AHL_Web.pdf?t.download=true&u=ovmfp3
TDA9981AHL/15C183557
Hersteller: NXP USA Inc.
Description: HDMI TRANSMITTER
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100+5.96 EUR
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LPC11A12FHN33/101551 _LPC11AXX.pdf?t.download=true&u=ovmfp3
LPC11A12FHN33/101551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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NTM88H075T1
NTM88H075T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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NTM88H075T1
NTM88H075T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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TDA9955HL/17/C155 PHGLS15808-1.pdf?t.download=true&u=5oefqw
TDA9955HL/17/C155
Hersteller: NXP USA Inc.
Description: CONSUMER CIRCUIT,
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94+6.71 EUR
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TDA9955HL/17/C1557 PHGLS15808-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: A/D CONVERTER 8-BIT 3 CHANNEL
Packaging: Bulk
Part Status: Active
auf Bestellung 5737 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
59+10.75 EUR
Mindestbestellmenge: 59 Stücke
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TDA9955HL/17/C1551 PHGLS15808-1.pdf?t.download=true&u=5oefqw
TDA9955HL/17/C1551
Hersteller: NXP USA Inc.
Description: A/D CONVERTER 8-BIT 3 CHANNEL
auf Bestellung 4093 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
64+9.89 EUR
Mindestbestellmenge: 64 Stücke
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MC56F8135VFGE MC56F833xDSAD.pdf
MC56F8135VFGE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+55.8 EUR
10+45.07 EUR
50+40.76 EUR
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MC9S08PB8VTJ MC9S08PB16.pdf
MC9S08PB8VTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.5 EUR
10+3.52 EUR
150+2.83 EUR
450+2.68 EUR
Mindestbestellmenge: 5 Stücke
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SW574XG-OS401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC574XG OS4.0
Produkt ist nicht verfügbar
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SW574XG-MCAL401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC574XG MCAL4.
Produkt ist nicht verfügbar
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SWS12Z-OS401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S12ZV AR4.0 OS
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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SW5746M-SMCL401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC5746M SAFETY
Produkt ist nicht verfügbar
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SW5746R-SMCL401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC5746R SAFETY
Produkt ist nicht verfügbar
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SW574XG-OS401P
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC574XG OS4.0
Produkt ist nicht verfügbar
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SW574XG-SMCL401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE MPC574XG SAFETY
Produkt ist nicht verfügbar
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SWAC58R-MCAL401V
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE SAC58R M4 MCAL4
Produkt ist nicht verfügbar
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