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MCF52230CAF60557 MCF52230CAF60557 NXP USA Inc. MCF52235DS.pdf Description: MCF5223X 32 BIT MCU, COLDFIRE V2
Produkt ist nicht verfügbar
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BF1100WR,115 BF1100WR,115 NXP USA Inc. BF1100WR.pdf Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
auf Bestellung 66000 Stücke:
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1567+0.32 EUR
Mindestbestellmenge: 1567
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BF1109WR,115 BF1109WR,115 NXP USA Inc. BF1109%28R%2CWR%29.pdf Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.5dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 11 V
Voltage - Test: 9 V
auf Bestellung 3000 Stücke:
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1567+0.31 EUR
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N74F541N,602 N74F541N,602 NXP USA Inc. N74F540%2C541.pdf Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 2088 Stücke:
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270+1.79 EUR
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BLF6G20-180PN112 NXP USA Inc. PHGLS18506-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG2010EA115 NXP USA Inc. PMEG2010EA.pdf Description: DIODE SCHOTTKY 20V 1A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: SOD-323
Operating Temperature - Junction: 125°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
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FS32K116LIT0VLFT FS32K116LIT0VLFT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6G2AVM07AA MCIMX6G2AVM07AA NXP USA Inc. MCIMX6GxAzzzzzA.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD5V0S1UA/ZL115 PESD5V0S1UA/ZL115 NXP USA Inc. PESD5V0S1UA_PESD12VS1UA.pdf Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S912XDT256F1VALR S912XDT256F1VALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT256F1VAL S912XDT256F1VAL NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1113JBD48/303151 LPC1113JBD48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
Produkt ist nicht verfügbar
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MIMXRT1172CVM8A MIMXRT1172CVM8A NXP USA Inc. i.MX-RT1170-FS.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+35.71 EUR
10+28.59 EUR
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S912XEP100W1MAL S912XEP100W1MAL NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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10+46.28 EUR
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BGA3131J BGA3131J NXP USA Inc. BGA3131.pdf Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
auf Bestellung 6000 Stücke:
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4+5.16 EUR
10+4.45 EUR
25+4.21 EUR
100+3.87 EUR
250+3.67 EUR
500+3.53 EUR
1000+3.39 EUR
Mindestbestellmenge: 4
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74HC688DB118 74HC688DB118 NXP USA Inc. 74HC688.pdf Description: IC COMPARATOR IDENTITY 8B 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
Produkt ist nicht verfügbar
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74HCT574PW/C1118 NXP USA Inc. PHGL-S-A0000283113-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 76 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT574PW-Q100118 NXP USA Inc. 74HC_HCT574_Q100.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 76 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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MIMXRT1062DVL6B MIMXRT1062DVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 636 Stücke:
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2+16.93 EUR
10+13.25 EUR
25+12.33 EUR
240+10.85 EUR
480+10.56 EUR
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74AHCT1G14GW/C125 74AHCT1G14GW/C125 NXP USA Inc. PHGLS19320-1.pdf?t.download=true&u=5oefqw Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G14GW-Q100125 74AHCT1G14GW-Q100125 NXP USA Inc. 74AHC_AHCT1G14_Q100.pdf Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT16373ADGG653 74LVT16373ADGG653 NXP USA Inc. PHGLS16242-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
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74LVT16374ADGG653 74LVT16374ADGG653 NXP USA Inc. PHGLS24369-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
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BZX585-C2V4135 BZX585-C2V4135 NXP USA Inc. BZX585_SERIES.pdf Description: NOW NEXPERIA BZX585-C2V4 - ZENER
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MCIMX6G2DVM05AA-NXP MCIMX6G2DVM05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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25+19.22 EUR
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MCIMX6G2DVK05AA-NXP MCIMX6G2DVK05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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27+17.72 EUR
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MCIMX6G3DVM05AA-NXP MCIMX6G3DVM05AA-NXP NXP USA Inc. FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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24+19.95 EUR
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74LV00N,112 74LV00N,112 NXP USA Inc. 74LV00_Rev3.pdf Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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620+0.81 EUR
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74LVTN16244BBX,518 74LVTN16244BBX,518 NXP USA Inc. PHGLS24361-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFNU (4x6)
auf Bestellung 4800 Stücke:
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833+0.58 EUR
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74LVTN16244BDGG112 74LVTN16244BDGG112 NXP USA Inc. 74LVTN16244B.pdf Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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815+0.6 EUR
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74LVTN16245BDGG112 74LVTN16245BDGG112 NXP USA Inc. 74LVTN16245B.pdf Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
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PCAL6416AER118 PCAL6416AER118 NXP USA Inc. PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
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PCAL6416AER115 NXP USA Inc. PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
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74HCT02DB118 74HCT02DB118 NXP USA Inc. 74HC_HCT02.pdf Description: IC GATE NOR 4CH 2-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74AUP1G158GF,132 74AUP1G158GF,132 NXP USA Inc. 74AUP1G158.pdf Description: IC MUX LP 2-INPUT 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
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MC908GP32CFBER528 MC908GP32CFBER528 NXP USA Inc. MC68HC908GP32.pdf Description: I/C HC908 FLASH
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PCA9511AD,112 PCA9511AD,112 NXP USA Inc. PCA9511A.pdf Description: BUFFER, ACCELERATOR 1 CHANNEL 40
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 5 pF
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8MNANOD4-EVK 8MNANOD4-EVK NXP USA Inc. IMX-8M-Nano-QSG.pdf Description: 8MNANOD4-EVK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Part Status: Active
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OM12001/000557 NXP USA Inc. Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Produkt ist nicht verfügbar
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OM12000/0000000557 NXP USA Inc. Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PZT2222A135 NXP USA Inc. PZT2222A.pdf Description: NOW NEXPERIA PZT2222A SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA85176H/Q900/1518 PCA85176H/Q900/1518 NXP USA Inc. PCA85176.pdf Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA85176H/Q900/155 PCA85176H/Q900/155 NXP USA Inc. PCA85176.pdf Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
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PCF85176/1518 NXP USA Inc. PHGL-S-A0000283129-1.pdf?t.download=true&u=5oefqw Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
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PEMI2STD/RM,115 PEMI2STD/RM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
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TJA1055T/1118 TJA1055T/1118 NXP USA Inc. TJA1055.pdf Description: IC ENHANCED FAULT TOLERANT
Packaging: Bulk
Part Status: Active
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TJA1055T/3/1118 TJA1055T/3/1118 NXP USA Inc. TJA1055.pdf Description: IC ENHANCED FAULT TOLERANT
Packaging: Bulk
Part Status: Active
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TJA1055T/3/C,512 TJA1055T/3/C,512 NXP USA Inc. PHGL-S-Z0000001197-1.pdf?t.download=true&u=5oefqw Description: IC PDSO14
Packaging: Bulk
Part Status: Active
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TJA1055TC512 NXP USA Inc. PHGL-S-Z0000001197-1.pdf?t.download=true&u=5oefqw Description: IC CAN TXRX FAULT-TOL 14-SOIC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC1G00GF/S505125 74LVC1G00GF/S505125 NXP USA Inc. PHGLS25109-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 10000 Stücke:
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74LVC1G00GF/S500132 74LVC1G00GF/S500132 NXP USA Inc. PHGLS25109-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
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74AHC138PW112 NXP USA Inc. 74AHC_AHCT138.pdf Description: NOW NEXPERIA 74AHC138PW - DECODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6G1AVM05ABR MCIMX6G1AVM05ABR NXP USA Inc. IMX6ULAEC.pdf Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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BAS16/LF1215 BAS16/LF1215 NXP USA Inc. PHGL-S-A0000133609-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, 0.215A, 100V
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: TO-236AB
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 215mA
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
auf Bestellung 96000 Stücke:
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15000+0.032 EUR
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UJA1131HW/FD/3V/4Y UJA1131HW/FD/3V/4Y NXP USA Inc. UJA113X_SER.pdf Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
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CBTL06DP211EE,118 CBTL06DP211EE,118 NXP USA Inc. CBTL06DP211.pdf Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: DVI, HDMI
Packaging: Cut Tape (CT)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, Video
-3db Bandwidth: 2GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
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2PC4081R/ZL115 2PC4081R/ZL115 NXP USA Inc. PHGLS20110-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
auf Bestellung 1950000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.033 EUR
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BUK754R3-75C,127 BUK754R3-75C,127 NXP USA Inc. BUK754R3-75C.pdf Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
auf Bestellung 3929 Stücke:
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BUK7E4R3-75C,127 BUK7E4R3-75C,127 NXP USA Inc. Description: MOSFET N-CH 75V 100A I2PAK
auf Bestellung 542 Stücke:
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74LVC1G66GV-Q100125 NXP USA Inc. 74LVC1G66_Q100.pdf Description: 74LVC1G66GV-Q100 - SPST
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCF52230CAF60557 MCF52235DS.pdf
MCF52230CAF60557
Hersteller: NXP USA Inc.
Description: MCF5223X 32 BIT MCU, COLDFIRE V2
Produkt ist nicht verfügbar
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BF1100WR,115 BF1100WR.pdf
BF1100WR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
auf Bestellung 66000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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BF1109WR,115 BF1109%28R%2CWR%29.pdf
BF1109WR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.5dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 11 V
Voltage - Test: 9 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.31 EUR
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N74F541N,602 N74F540%2C541.pdf
N74F541N,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 2088 Stücke:
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Anzahl Preis
270+1.79 EUR
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BLF6G20-180PN112 PHGLS18506-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMEG2010EA115 PMEG2010EA.pdf
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1A SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: SOD-323
Operating Temperature - Junction: 125°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 550 mV @ 1 A
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Produkt ist nicht verfügbar
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FS32K116LIT0VLFT S32K-DS.pdf
FS32K116LIT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6G2AVM07AA MCIMX6GxAzzzzzA.pdf
MCIMX6G2AVM07AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD5V0S1UA/ZL115 PESD5V0S1UA_PESD12VS1UA.pdf
PESD5V0S1UA/ZL115
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S912XDT256F1VALR
S912XDT256F1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT256F1VAL
S912XDT256F1VAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1113JBD48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113JBD48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
Produkt ist nicht verfügbar
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MIMXRT1172CVM8A i.MX-RT1170-FS.pdf
MIMXRT1172CVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.71 EUR
10+28.59 EUR
25+26.8 EUR
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S912XEP100W1MAL
S912XEP100W1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 37 Stücke:
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Anzahl Preis
1+57.71 EUR
10+46.28 EUR
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BGA3131J BGA3131.pdf
BGA3131J
Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-205MHZ 20HVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5MHz ~ 205MHz
RF Type: CATV
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37dB
Current - Supply: 660mA
Noise Figure: 6.5dB ~ 15dB
Supplier Device Package: 20-HVQFN (5x5)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.16 EUR
10+4.45 EUR
25+4.21 EUR
100+3.87 EUR
250+3.67 EUR
500+3.53 EUR
1000+3.39 EUR
Mindestbestellmenge: 4
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74HC688DB118 74HC688.pdf
74HC688DB118
Hersteller: NXP USA Inc.
Description: IC COMPARATOR IDENTITY 8B 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active Low
Type: Identity Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 29ns @ 6V, 50pF
Output Function: A=B
Number of Bits: 8
Produkt ist nicht verfügbar
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74HCT574PW/C1118 PHGL-S-A0000283113-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 76 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT574PW-Q100118 74HC_HCT574_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 6mA, 6mA
Trigger Type: Positive Edge
Clock Frequency: 76 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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MIMXRT1062DVL6B IMXRT1060CEC.pdf
MIMXRT1062DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 636 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.93 EUR
10+13.25 EUR
25+12.33 EUR
240+10.85 EUR
480+10.56 EUR
Mindestbestellmenge: 2
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74AHCT1G14GW/C125 PHGLS19320-1.pdf?t.download=true&u=5oefqw
74AHCT1G14GW/C125
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT1G14GW-Q100125 74AHC_AHCT1G14_Q100.pdf
74AHCT1G14GW-Q100125
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT16373ADGG653 PHGLS16242-1.pdf?t.download=true&u=5oefqw
74LVT16373ADGG653
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
auf Bestellung 26800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1025+0.47 EUR
Mindestbestellmenge: 1025
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74LVT16374ADGG653 PHGLS24369-1.pdf?t.download=true&u=5oefqw
74LVT16374ADGG653
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1025+0.47 EUR
Mindestbestellmenge: 1025
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BZX585-C2V4135 BZX585_SERIES.pdf
BZX585-C2V4135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C2V4 - ZENER
auf Bestellung 174425 Stücke:
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MCIMX6G2DVM05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVM05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 147 Stücke:
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Anzahl Preis
25+19.22 EUR
Mindestbestellmenge: 25
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MCIMX6G2DVK05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G2DVK05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Bulk
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 517 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
27+17.72 EUR
Mindestbestellmenge: 27
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MCIMX6G3DVM05AA-NXP FSCL-S-A0001284907-1.pdf?t.download=true&u=5oefqw
MCIMX6G3DVM05AA-NXP
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 3184 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+19.95 EUR
Mindestbestellmenge: 24
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74LV00N,112 74LV00_Rev3.pdf
74LV00N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 6421 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
620+0.81 EUR
Mindestbestellmenge: 620
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74LVTN16244BBX,518 PHGLS24361-1.pdf?t.download=true&u=5oefqw
74LVTN16244BBX,518
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HXQFNU
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFNU (4x6)
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
833+0.58 EUR
Mindestbestellmenge: 833
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74LVTN16244BDGG112 74LVTN16244B.pdf
74LVTN16244BDGG112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 10125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
815+0.6 EUR
Mindestbestellmenge: 815
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74LVTN16245BDGG112 74LVTN16245B.pdf
74LVTN16245BDGG112
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 48-TSSOP
auf Bestellung 8770 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
784+0.61 EUR
Mindestbestellmenge: 784
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PCAL6416AER118 PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw
PCAL6416AER118
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCAL6416AER115 PHGL-S-A0002523635-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LOW VOLTAGE TRANSLATING, 8 BIT I
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT02DB118 74HC_HCT02.pdf
74HCT02DB118
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74AUP1G158GF,132 74AUP1G158.pdf
74AUP1G158GF,132
Hersteller: NXP USA Inc.
Description: IC MUX LP 2-INPUT 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
auf Bestellung 19800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1972+0.24 EUR
Mindestbestellmenge: 1972
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MC908GP32CFBER528 MC68HC908GP32.pdf
MC908GP32CFBER528
Hersteller: NXP USA Inc.
Description: I/C HC908 FLASH
Produkt ist nicht verfügbar
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PCA9511AD,112 PCA9511A.pdf
PCA9511AD,112
Hersteller: NXP USA Inc.
Description: BUFFER, ACCELERATOR 1 CHANNEL 40
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Capacitance - Input: 5 pF
auf Bestellung 33929 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
582+1.51 EUR
Mindestbestellmenge: 582
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8MNANOD4-EVK IMX-8M-Nano-QSG.pdf
8MNANOD4-EVK
Hersteller: NXP USA Inc.
Description: 8MNANOD4-EVK
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M Nano
Part Status: Active
Produkt ist nicht verfügbar
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OM12001/000557
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Produkt ist nicht verfügbar
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OM12000/0000000557
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PZT2222A135 PZT2222A.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZT2222A SMALL SIGN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA85176H/Q900/1518 PCA85176.pdf
PCA85176H/Q900/1518
Hersteller: NXP USA Inc.
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA85176H/Q900/155 PCA85176.pdf
PCA85176H/Q900/155
Hersteller: NXP USA Inc.
Description: 40 X 4 AUTOMOTIVE LCD DRIVER FOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCF85176/1518 PHGL-S-A0000283129-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Produkt ist nicht verfügbar
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PEMI2STD/RM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/RM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
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TJA1055T/1118 TJA1055.pdf
TJA1055T/1118
Hersteller: NXP USA Inc.
Description: IC ENHANCED FAULT TOLERANT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1055T/3/1118 TJA1055.pdf
TJA1055T/3/1118
Hersteller: NXP USA Inc.
Description: IC ENHANCED FAULT TOLERANT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1055T/3/C,512 PHGL-S-Z0000001197-1.pdf?t.download=true&u=5oefqw
TJA1055T/3/C,512
Hersteller: NXP USA Inc.
Description: IC PDSO14
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TJA1055TC512 PHGL-S-Z0000001197-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC CAN TXRX FAULT-TOL 14-SOIC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC1G00GF/S505125 PHGLS25109-1.pdf?t.download=true&u=5oefqw
74LVC1G00GF/S505125
Hersteller: NXP USA Inc.
Description: NAND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
720+0.7 EUR
Mindestbestellmenge: 720
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74LVC1G00GF/S500132 PHGLS25109-1.pdf?t.download=true&u=5oefqw
74LVC1G00GF/S500132
Hersteller: NXP USA Inc.
Description: NAND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2221+0.23 EUR
Mindestbestellmenge: 2221
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74AHC138PW112 74AHC_AHCT138.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC138PW - DECODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6G1AVM05ABR IMX6ULAEC.pdf
MCIMX6G1AVM05ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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BAS16/LF1215 PHGL-S-A0000133609-1.pdf?t.download=true&u=5oefqw
BAS16/LF1215
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 0.215A, 100V
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: TO-236AB
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 215mA
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
auf Bestellung 96000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.032 EUR
Mindestbestellmenge: 15000
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UJA1131HW/FD/3V/4Y UJA113X_SER.pdf
UJA1131HW/FD/3V/4Y
Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
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CBTL06DP211EE,118 CBTL06DP211.pdf
CBTL06DP211EE,118
Hersteller: NXP USA Inc.
Description: IC MUX 6CH DISPLAY PORT 48TFBGA
Features: DVI, HDMI
Packaging: Cut Tape (CT)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, Video
-3db Bandwidth: 2GHz
Supplier Device Package: 48-TFBGA (5x5)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1, 4:1
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
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2PC4081R/ZL115 PHGLS20110-1.pdf?t.download=true&u=5oefqw
2PC4081R/ZL115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
auf Bestellung 1950000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.033 EUR
Mindestbestellmenge: 15000
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BUK754R3-75C,127 BUK754R3-75C.pdf
BUK754R3-75C,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
auf Bestellung 3929 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
226+2.34 EUR
Mindestbestellmenge: 226
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BUK7E4R3-75C,127
BUK7E4R3-75C,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 100A I2PAK
auf Bestellung 542 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
188+2.72 EUR
Mindestbestellmenge: 188
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74LVC1G66GV-Q100125 74LVC1G66_Q100.pdf
Hersteller: NXP USA Inc.
Description: 74LVC1G66GV-Q100 - SPST
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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