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IP4281CZ10/2115 NXP USA Inc. IP4281CZ10.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
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4121+0.14 EUR
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MCR908JK3ECPE MCR908JK3ECPE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
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MCR908JL3ECDWER MCR908JL3ECDWER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MCR908JK1ECDWER NXP USA Inc. MC68HC908Jx%281%2C3%29.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387FBD100K NXP USA Inc. LPC2387.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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1+43.27 EUR
10+34.69 EUR
25+32.55 EUR
100+30.19 EUR
450+28.48 EUR
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OM11013598 OM11013598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC68HC705C9ACFNE MC68HC705C9ACFNE NXP USA Inc. MC68HC705C9A.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC14PW/C1118 74HC14PW/C1118 NXP USA Inc. PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB MIMX8ML8DVNLZAB NXP USA Inc. IMX8MPCEC.pdf Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 263 Stücke:
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1+100.83 EUR
10+82.88 EUR
25+78.4 EUR
126+72.83 EUR
252+71.11 EUR
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MIMX8ML8CVNKZAB MIMX8ML8CVNKZAB NXP USA Inc. i.MX%208M%20Plus.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
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1+108.91 EUR
10+89.73 EUR
25+84.94 EUR
126+78.98 EUR
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MIMX8ML6DVNLZAB MIMX8ML6DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+93.75 EUR
10+76.95 EUR
25+72.74 EUR
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MIMX8ML3DVNLZAB MIMX8ML3DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
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1+97.83 EUR
10+80.35 EUR
25+75.98 EUR
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MIMX8ML4CVNKZAB MIMX8ML4CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 831 Stücke:
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1+96.76 EUR
10+79.44 EUR
25+75.12 EUR
126+69.75 EUR
252+68.09 EUR
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MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+90.73 EUR
10+74.4 EUR
25+70.33 EUR
126+65.25 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB NXP USA Inc. MIMX8ML3CVNKZAB_Rev1_8-2021.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+103.4 EUR
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FRDMCD1020EVM FRDMCD1020EVM NXP USA Inc. CD1020.pdf Description: EVAL BOARD FOR CD1020
Contents: Board(s)
Part Status: Active
Primary Attributes: 22-Channel
Supplied Contents: Board(s)
Utilized IC / Part: CD1020
Type: Interface
Function: Switch Detection
Packaging: Bulk
auf Bestellung 23 Stücke:
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1+190.64 EUR
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LS1028AXE7PQA LS1028AXE7PQA NXP USA Inc. Description: IC MPU QORIQ 1.5GHZ 448FBGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASN7HNA LS1028ASN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASN7KQA LS1028ASN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028ASE7HNA NXP USA Inc. Description: LS1028A-800 ST SEC
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASN7NQA LS1028ASN7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028ASE7KQA NXP USA Inc. Description: LS1028A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXN7HNA LS1028AXN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 90 Stücke
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LS1028AXN7KQA LS1028AXN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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LS1028ASE7NQA NXP USA Inc. Description: LS1028A-1300 ST SEC
Produkt ist nicht verfügbar
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LS1028AXE7HNA LS1028AXE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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LS1028AXE7KQA LS1028AXE7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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LS1028AXE7NQA LS1028AXE7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028AYE7HNA NXP USA Inc. Description: LS1028A-800 XT SEC
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LS1028ACN7NQA NXP USA Inc. Description: LS1028A-1300 A3 NO SEC
Produkt ist nicht verfügbar
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74HCT4060DB-Q100118 74HCT4060DB-Q100118 NXP USA Inc. 74HC_HCT4060_Q100.pdf Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
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816+0.74 EUR
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PESD24VS2UT/ZL215 PESD24VS2UT/ZL215 NXP USA Inc. NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 NXP USA Inc. PESD24VF1BSF.pdf Description: TVS DIODE
Packaging: Bulk
Part Status: Active
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BAV170M315 BAV170M315 NXP USA Inc. BAV170M.pdf Description: DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1006-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
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BAV170QA147 BAV170QA147 NXP USA Inc. BAV170QA.pdf Description: DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
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BAV170235 BAV170235 NXP USA Inc. BAV170.pdf Description: RECTIFIER DIODE, 2 ELEMENT, 0.21
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Produkt ist nicht verfügbar
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BAV170/DG/B3215 NXP USA Inc. BAV170.pdf Description: BAV170 - LOW-LEAKAGE DOUBLE DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54C/DG,215 BAT54C/DG,215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Cathode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Produkt ist nicht verfügbar
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NMBT3904215 NMBT3904215 NXP USA Inc. Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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NMBT3904235 NMBT3904235 NXP USA Inc. Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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BUK9875-100A/CU115 NXP USA Inc. BUK9875-100A.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK9875-100A,115 BUK9875-100A,115 NXP USA Inc. BUK9875-100A.pdf Description: MOSFET N-CH 100V 7A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 8A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PCA2003U/10AC/1Z NXP USA Inc. PCA2003.pdf Description: IC WATCH CIRCUIT DIE
DigiKey Programmable: Not Verified
Supplier Device Package: Die
Type: Watch Circuit
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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PMEG2005ESF315 NXP USA Inc. PMEG2005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
auf Bestellung 459000 Stücke:
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BAT54W135 BAT54W135 NXP USA Inc. PHGLS25811-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY 30V 200MA SOT323
Produkt ist nicht verfügbar
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74LVC2G86GT/S500115 74LVC2G86GT/S500115 NXP USA Inc. 74LVC2G86.pdf Description: XOR GATE, LVC/LCX/Z SERIES
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PCA9955TW,118 PCA9955TW,118 NXP USA Inc. PCA9952_PCA9955.pdf Description: IC LED DRIVER LIN DIM 28HTSSOP
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OM13483UL NXP USA Inc. PCA9952_PCA9955.pdf Description: PCA9955 I2C LED DEMOBOARD
Features: Dimmable
Packaging: Bulk
Utilized IC / Part: PCA9955
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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PCA9626B,118 PCA9626B,118 NXP USA Inc. PCA9626.pdf Description: IC LED DRVR LIN PWM 100MA 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 24
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 48-LQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9626BS,518 PCA9626BS,518 NXP USA Inc. PCA9626.pdf Description: IC LED DRIVER LINEAR DIM 48HVQFN
Produkt ist nicht verfügbar
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PCA9450BHNY PCA9450BHNY NXP USA Inc. PCA9450.pdf Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
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PCA9450BHNY PCA9450BHNY NXP USA Inc. PCA9450.pdf Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
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MCIMX6G0DVM05AB MCIMX6G0DVM05AB NXP USA Inc. IMX6ULAEC.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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P87C51SBAA512 P87C51SBAA512 NXP USA Inc. RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 32
Produkt ist nicht verfügbar
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P87C51RD+4A512 P87C51RD+4A512 NXP USA Inc. RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw Description: MCU 8-BIT OTPROM, 16MHZ
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2 Stücke
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BAT54C/6235 BAT54C/6235 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
auf Bestellung 30000 Stücke:
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8876+0.057 EUR
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BAT54C/6215 BAT54C/6215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
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LPC2388FBD144K LPC2388FBD144K NXP USA Inc. LPC2388.pdf Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
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BUK9E04-30B,127 BUK9E04-30B,127 NXP USA Inc. Description: PFET, 75A I(D), 30V, 0.0044OHM,
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BUK9E1R9-40E NXP USA Inc. Description: BUK9E1R9-40E - I2PAK
Produkt ist nicht verfügbar
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IP4281CZ10/2115 IP4281CZ10.pdf
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
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MCR908JK3ECPE MC68HC908Jx(1,3).pdf
MCR908JK3ECPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
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MCR908JL3ECDWER
MCR908JL3ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MC68HC908Jx%281%2C3%29.pdf
MCR908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387.pdf
LPC2387FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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1+43.27 EUR
10+34.69 EUR
25+32.55 EUR
100+30.19 EUR
450+28.48 EUR
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OM11013598
OM11013598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
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MC68HC705C9ACFNE MC68HC705C9A.pdf
MC68HC705C9ACFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC14PW/C1118 PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw
74HC14PW/C1118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 6
Part Status: Active
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB IMX8MPCEC.pdf
MIMX8ML8DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Part Status: Active
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 263 Stücke:
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1+100.83 EUR
10+82.88 EUR
25+78.4 EUR
126+72.83 EUR
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MIMX8ML8CVNKZAB i.MX%208M%20Plus.pdf
MIMX8ML8CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 366 Stücke:
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AnzahlPrivatkunde
1+108.91 EUR
10+89.73 EUR
25+84.94 EUR
126+78.98 EUR
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MIMX8ML6DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+93.75 EUR
10+76.95 EUR
25+72.74 EUR
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MIMX8ML3DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML3DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Tray
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
auf Bestellung 116 Stücke:
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1+97.83 EUR
10+80.35 EUR
25+75.98 EUR
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MIMX8ML4CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML4CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 831 Stücke:
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AnzahlPrivatkunde
1+96.76 EUR
10+79.44 EUR
25+75.12 EUR
126+69.75 EUR
252+68.09 EUR
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MIMX8ML6CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 182 Stücke:
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AnzahlPrivatkunde
1+90.73 EUR
10+74.4 EUR
25+70.33 EUR
126+65.25 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB_Rev1_8-2021.pdf
MIMX8ML3CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 64 Stücke:
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AnzahlPrivatkunde
1+103.4 EUR
10+85.12 EUR
25+80.56 EUR
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FRDMCD1020EVM CD1020.pdf
FRDMCD1020EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR CD1020
Contents: Board(s)
Part Status: Active
Primary Attributes: 22-Channel
Supplied Contents: Board(s)
Utilized IC / Part: CD1020
Type: Interface
Function: Switch Detection
Packaging: Bulk
auf Bestellung 23 Stücke:
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AnzahlPrivatkunde
1+190.64 EUR
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LS1028AXE7PQA
LS1028AXE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.5GHZ 448FBGA
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Produkt ist nicht verfügbar
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LS1028ASN7HNA Download?colCode=LS1027A&amp;location=null
LS1028ASN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028ASN7KQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028ASE7HNA
Hersteller: NXP USA Inc.
Description: LS1028A-800 ST SEC
Produkt ist nicht verfügbar
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LS1028ASN7NQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1028ASE7KQA
Hersteller: NXP USA Inc.
Description: LS1028A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXN7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXN7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ASE7NQA
Hersteller: NXP USA Inc.
Description: LS1028A-1300 ST SEC
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AXE7NQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028AYE7HNA
Hersteller: NXP USA Inc.
Description: LS1028A-800 XT SEC
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LS1028ACN7NQA
Hersteller: NXP USA Inc.
Description: LS1028A-1300 A3 NO SEC
Produkt ist nicht verfügbar
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74HCT4060DB-Q100118 74HC_HCT4060_Q100.pdf
74HCT4060DB-Q100118
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
816+0.74 EUR
Mindestbestellmenge: 816 Stücke
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PESD24VS2UT/ZL215 NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw
PESD24VS2UT/ZL215
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 PESD24VF1BSF.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4133+0.14 EUR
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BAV170M315 BAV170M.pdf
BAV170M315
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1006-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
auf Bestellung 480000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
11632+0.06 EUR
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BAV170QA147 BAV170QA.pdf
BAV170QA147
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 320mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
auf Bestellung 164300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9746+0.06 EUR
Mindestbestellmenge: 9746 Stücke
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BAV170235 BAV170.pdf
BAV170235
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 2 ELEMENT, 0.21
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: TO-236AB
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 5 nA @ 75 V
Produkt ist nicht verfügbar
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BAV170/DG/B3215 BAV170.pdf
Hersteller: NXP USA Inc.
Description: BAV170 - LOW-LEAKAGE DOUBLE DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54C/DG,215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54C/DG,215
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Voltage - DC Reverse (Vr) (Max): 30 V
Part Status: Active
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SOT-23-3
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Diode Configuration: 1 Pair Common Cathode
Technology: Schottky
Reverse Recovery Time (trr): 5 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Produkt ist nicht verfügbar
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NMBT3904215
NMBT3904215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
auf Bestellung 2652500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15000+0.038 EUR
Mindestbestellmenge: 15000 Stücke
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NMBT3904235
NMBT3904235
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 1232000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15000+0.038 EUR
Mindestbestellmenge: 15000 Stücke
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BUK9875-100A/CU115 BUK9875-100A.pdf
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BUK9875-100A,115 BUK9875-100A.pdf
BUK9875-100A,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 7A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 72mOhm @ 8A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PCA2003U/10AC/1Z PCA2003.pdf
Hersteller: NXP USA Inc.
Description: IC WATCH CIRCUIT DIE
DigiKey Programmable: Not Verified
Supplier Device Package: Die
Type: Watch Circuit
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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PMEG2005ESF315 PMEG2005ESF.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
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BAT54W135 PHGLS25811-1.pdf?t.download=true&u=5oefqw
BAT54W135
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA SOT323
Produkt ist nicht verfügbar
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74LVC2G86GT/S500115 74LVC2G86.pdf
74LVC2G86GT/S500115
Hersteller: NXP USA Inc.
Description: XOR GATE, LVC/LCX/Z SERIES
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3150+0.21 EUR
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PCA9955TW,118 PCA9952_PCA9955.pdf
PCA9955TW,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 28HTSSOP
Produkt ist nicht verfügbar
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OM13483UL PCA9952_PCA9955.pdf
Hersteller: NXP USA Inc.
Description: PCA9955 I2C LED DEMOBOARD
Features: Dimmable
Packaging: Bulk
Utilized IC / Part: PCA9955
Supplied Contents: Board(s)
Outputs and Type: 16, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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PCA9626B,118 PCA9626.pdf
PCA9626B,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 100MA 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 24
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 48-LQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9626BS,518 PCA9626.pdf
PCA9626BS,518
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR DIM 48HVQFN
Produkt ist nicht verfügbar
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PCA9450BHNY PCA9450.pdf
PCA9450BHNY
Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
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2000+5.91 EUR
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PCA9450BHNY PCA9450.pdf
PCA9450BHNY
Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
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2+10.47 EUR
10+8.02 EUR
25+7.4 EUR
100+6.72 EUR
250+6.4 EUR
500+6.33 EUR
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MCIMX6G0DVM05AB IMX6ULAEC.pdf
MCIMX6G0DVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
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30+18.22 EUR
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P87C51SBAA512 RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw
P87C51SBAA512
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 32
Produkt ist nicht verfügbar
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P87C51RD+4A512 RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw
P87C51RD+4A512
Hersteller: NXP USA Inc.
Description: MCU 8-BIT OTPROM, 16MHZ
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BAT54C/6235 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54C/6235
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
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BAT54C/6215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54C/6215
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Qualification: AEC-Q101
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8876+0.057 EUR
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LPC2388FBD144K LPC2388.pdf
LPC2388FBD144K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
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1+49.87 EUR
10+40.13 EUR
60+35.89 EUR
120+34.74 EUR
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BUK9E04-30B,127
BUK9E04-30B,127
Hersteller: NXP USA Inc.
Description: PFET, 75A I(D), 30V, 0.0044OHM,
auf Bestellung 811 Stücke:
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AnzahlPrivatkunde
258+2.38 EUR
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BUK9E1R9-40E
Hersteller: NXP USA Inc.
Description: BUK9E1R9-40E - I2PAK
Produkt ist nicht verfügbar
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