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MF1SPLUS1031DA8/0J NXP USA Inc. Description: MF1SPLUS1031DA8/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DUD/0V NXP USA Inc. Description: MF1SPLUS1031DUD/0V
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G132GF132 74AUP1G132GF132 NXP USA Inc. 74AUP1G132.pdf Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 139950 Stücke:
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2533+0.25 EUR
Mindestbestellmenge: 2533 Stücke
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TDA8350Q/N6,112 TDA8350Q/N6,112 NXP USA Inc. TDA8350Q.pdf Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G35D35T2 AFSC5G35D35T2 NXP USA Inc. AFSC5G35D35.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
auf Bestellung 1451 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.73 EUR
10+65.01 EUR
25+61.32 EUR
100+57.29 EUR
250+55.36 EUR
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NTS0302JKZ NTS0302JKZ NXP USA Inc. NTS0302.pdf Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
auf Bestellung 37103 Stücke:
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11+1.96 EUR
15+1.4 EUR
25+1.27 EUR
100+1.12 EUR
250+1.05 EUR
500+1.01 EUR
1000+0.98 EUR
2500+0.96 EUR
Mindestbestellmenge: 11 Stücke
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BC517,112 BC517,112 NXP USA Inc. DS_568_BC517.pdf Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Produkt ist nicht verfügbar
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TDA1308TT/N2,118 TDA1308TT/N2,118 NXP USA Inc. TDA1308.pdf Description: IC AUDIO AMP AB 8-TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308AUK,027 TDA1308AUK,027 NXP USA Inc. TDA1308.pdf Description: IC AUDIO AMP AB 8-WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
 Mindestbestellmenge: 7000 Stücke
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TDA1308T/N2,115 TDA1308T/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308T/N2,112 TDA1308T/N2,112 NXP USA Inc. TDA1308.pdf Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308AT/N2,115 TDA1308AT/N2,115 NXP USA Inc. TDA1308_A.pdf Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308T/N1,112 TDA1308T/N1,112 NXP USA Inc. TDA1308_A.pdf Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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TDA1308AT/N2,112 TDA1308AT/N2,112 NXP USA Inc. TDA1308_A.pdf Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308/N2,112 TDA1308/N2,112 NXP USA Inc. TDA1308.pdf Description: IC AUDIO AMP AB 8-DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MIMXRT106FDVL6B MIMXRT106FDVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+27 EUR
10+19.5 EUR
25+17.59 EUR
80+17.41 EUR
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MIMXRT1061CVL5B MIMXRT1061CVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+24.74 EUR
10+19.49 EUR
25+18.18 EUR
240+16.09 EUR
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MIMXRT1061CVJ5B MIMXRT1061CVJ5B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+29.74 EUR
10+23.5 EUR
25+21.96 EUR
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MIMXRT106SDVL6B MIMXRT106SDVL6B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
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1+27.17 EUR
10+19.35 EUR
25+17.34 EUR
80+15.39 EUR
240+14.04 EUR
480+13.36 EUR
960+13.04 EUR
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MIMXRT106FCVL5B MIMXRT106FCVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
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1+26.89 EUR
10+21.36 EUR
25+19.98 EUR
240+19.58 EUR
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MIMXRT1064CVJ5B MIMXRT1064CVJ5B NXP USA Inc. IMXRT1064IEC.pdf Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
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1+36.3 EUR
10+28.91 EUR
25+27.06 EUR
189+24.35 EUR
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MIMXRT1061DVL6B MIMXRT1061DVL6B NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
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1+25.18 EUR
10+19.8 EUR
25+18.44 EUR
80+17.17 EUR
240+16.29 EUR
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PCA9665APW118 PCA9665APW118 NXP USA Inc. PCA9665_PCA9665A.pdf Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9665APW PCA9665APW NXP USA Inc. PCA9665_PCA9665A.pdf Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9665PW PCA9665PW NXP USA Inc. PHGLS23319-1.pdf?t.download=true&u=5oefqw Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMA8225KEGR2 NXP USA Inc. Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MMA8205KEG MMA8205KEG NXP USA Inc. Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA8205KEGR2 MMA8205KEGR2 NXP USA Inc. Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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A7001CMHN1/T1AGB39 NXP USA Inc. NXP_a700x_fam_sds.pdf?t.download=true&u=ovmfp3 Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
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A7002CMHN1/T1AGB39 NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
auf Bestellung 1098 Stücke:
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BZX84-B22/DG/B3215 BZX84-B22/DG/B3215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
Packaging: Bulk
auf Bestellung 114000 Stücke:
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15000+0.039 EUR
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BFS540,115 BFS540,115 NXP USA Inc. BFS540_Rev_Oct2010.pdf Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Produkt ist nicht verfügbar
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PMXB120EPE147 NXP USA Inc. PMXB120EPE.pdf Description: SMALL SIGNAL FET
auf Bestellung 648598 Stücke:
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PMXB75UPE147 PMXB75UPE147 NXP USA Inc. PMXB75UPE.pdf Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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4729+0.12 EUR
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PMXB75UPE/M5147 PMXB75UPE/M5147 NXP USA Inc. PMXB75UPE.pdf Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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PMZB200UNE315 PMZB200UNE315 NXP USA Inc. PMZB200UNE.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Supplier Device Package: DFN1006B-3
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
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PMXB56EN147 NXP USA Inc. PMXB56EN.pdf Description: SMALL SIGNAL FET
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BF904215 NXP USA Inc. Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MKS20FN256VFT12 MKS20FN256VFT12 NXP USA Inc. KS22PB.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
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MKL81Z128CBH7R MKL81Z128CBH7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL81Z128CBH7R MKL81Z128CBH7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32BIT 128KB FLASH 64WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 64-WLCSP (3.48x3.38)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-XFBGA, WLCSP
Packaging: Cut Tape (CT)
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MKL81Z128VMC7557 MKL81Z128VMC7557 NXP USA Inc. KL82P121M72SF0.pdf Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
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MIMXRT1166DVM6A MIMXRT1166DVM6A NXP USA Inc. IMXRT1160ACEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1166XVM5A MIMXRT1166XVM5A NXP USA Inc. IMXRT1160XEC-3442886.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1160-EVK MIMXRT1160-EVK NXP USA Inc. IMXRT1160EVKQSG.pdf Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
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MIMXRT1165DVM6A MIMXRT1165DVM6A NXP USA Inc. IMXRT1160ACEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1165CVM5A MIMXRT1165CVM5A NXP USA Inc. IMXRT1160IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 2x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4/M7
Program Memory Type: External Program Memory
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 240MHz, 500MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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MIMXRT1166CVM5A MIMXRT1166CVM5A NXP USA Inc. IMXRT1160AIEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1165XVM5A MIMXRT1165XVM5A NXP USA Inc. IMXRT1160AIEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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UBA2213AP/N1112 UBA2213AP/N1112 NXP USA Inc. PHGLS24154-1.pdf?t.download=true&u=5oefqw Description: IC DVR HALF BRIDGE CFL 8DIP
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UBA20270T/1518 UBA20270T/1518 NXP USA Inc. PHGLS23582-1.pdf?t.download=true&u=5oefqw Description: IC CFL LAMP DVR 600V 16-SOIC
Packaging: Bulk
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PDTC114EMB315 NXP USA Inc. PDTC114EMB.pdf Description: NOW NEXPERIA PDTC114EMB - SMALL
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BAS21LD315 NXP USA Inc. BAS21J.pdf Description: BAS21LD - HIGH-VOLTAGE SWITCHING
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MIMX8QX1AVLFZAC MIMX8QX1AVLFZAC NXP USA Inc. Download?colCode=IMX8DXAEC&amp;location=null Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
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LPC1111FHN33/203 LPC1111FHN33/203 NXP USA Inc. LPC112X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
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LPC1111FHN33/102K LPC1111FHN33/102K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
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6+3.5 EUR
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LPC1111FHN33/103K LPC1111FHN33/103K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
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LPC1111FHN33/2025 LPC1111FHN33/2025 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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A2I20D040GNR1 A2I20D040GNR1 NXP USA Inc. A2I20D040N.pdf Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Supplier Device Package: TO-270WBG-17
Test Frequency: 1.8GHz ~ 2.2GHz
P1dB: 36.3W
Current - Supply: 220mA
Gain: 32.7dB
Voltage - Supply: 28V
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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MCIMX515DJM8CR2 MCIMX515DJM8CR2 NXP USA Inc. FSCLS07403-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
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MF1SPLUS1031DA8/0J
Hersteller: NXP USA Inc.
Description: MF1SPLUS1031DA8/0J
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1SPLUS1031DUD/0V
Hersteller: NXP USA Inc.
Description: MF1SPLUS1031DUD/0V
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G132GF132 74AUP1G132.pdf
74AUP1G132GF132
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 2IN 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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TDA8350Q/N6,112 TDA8350Q.pdf
TDA8350Q/N6,112
Hersteller: NXP USA Inc.
Description: IC DC COUPLED V-DEFL 13PDBS
Packaging: Tube
Package / Case: 13-SIP Formed Leads
Mounting Type: Through Hole
Supplier Device Package: 13-PDBS
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFSC5G35D35T2 AFSC5G35D35.pdf
AFSC5G35D35T2
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 26.1dB
Supplier Device Package: 26-HLQFN (10x6)
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1+79.73 EUR
10+65.01 EUR
25+61.32 EUR
100+57.29 EUR
250+55.36 EUR
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NTS0302JKZ NTS0302.pdf
NTS0302JKZ
Hersteller: NXP USA Inc.
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
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11+1.96 EUR
15+1.4 EUR
25+1.27 EUR
100+1.12 EUR
250+1.05 EUR
500+1.01 EUR
1000+0.98 EUR
2500+0.96 EUR
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BC517,112 DS_568_BC517.pdf
BC517,112
Hersteller: NXP USA Inc.
Description: TRANS NPN DARL 30V 0.5A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 30000 @ 20mA, 2V
Frequency - Transition: 220MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 625 mW
Produkt ist nicht verfügbar
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TDA1308TT/N2,118 TDA1308.pdf
TDA1308TT/N2,118
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-TSSOP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308AUK,027 TDA1308.pdf
TDA1308AUK,027
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-WLCSP
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-XFBGA, WLCSP
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-WLCSP (0.61x0.84)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308T/N2,115 TDA1308_A.pdf
TDA1308T/N2,115
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308T/N2,112 TDA1308.pdf
TDA1308T/N2,112
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA1308AT/N2,115 TDA1308_A.pdf
TDA1308AT/N2,115
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308T/N1,112 TDA1308_A.pdf
TDA1308T/N1,112
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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TDA1308AT/N2,112 TDA1308_A.pdf
TDA1308AT/N2,112
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-SO
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 7V, ±1.2V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDA1308/N2,112 TDA1308.pdf
TDA1308/N2,112
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 8-DIP
Features: Depop, Short-Circuit Protection
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Headphones, 2-Channel (Stereo)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 7V, ±1.5V ~ 3.5V
Max Output Power x Channels @ Load: 80mW x 2 @ 32Ohm
Supplier Device Package: 8-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MIMXRT106FDVL6B IMXRT1060CEC.pdf
MIMXRT106FDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+27 EUR
10+19.5 EUR
25+17.59 EUR
80+17.41 EUR
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MIMXRT1061CVL5B IMXRT1060IEC.pdf
MIMXRT1061CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
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1+24.74 EUR
10+19.49 EUR
25+18.18 EUR
240+16.09 EUR
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MIMXRT1061CVJ5B IMXRT1060CEC.pdf
MIMXRT1061CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
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AnzahlPrivatkunde
1+29.74 EUR
10+23.5 EUR
25+21.96 EUR
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MIMXRT106SDVL6B IMXRT1060IEC.pdf
MIMXRT106SDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
1+27.17 EUR
10+19.35 EUR
25+17.34 EUR
80+15.39 EUR
240+14.04 EUR
480+13.36 EUR
960+13.04 EUR
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MIMXRT106FCVL5B IMXRT1060IEC.pdf
MIMXRT106FCVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)
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1+26.89 EUR
10+21.36 EUR
25+19.98 EUR
240+19.58 EUR
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MIMXRT1064CVJ5B IMXRT1064IEC.pdf
MIMXRT1064CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.3 EUR
10+28.91 EUR
25+27.06 EUR
189+24.35 EUR
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MIMXRT1061DVL6B IMXRT1060CEC.pdf
MIMXRT1061DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 364 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+25.18 EUR
10+19.8 EUR
25+18.44 EUR
80+17.17 EUR
240+16.29 EUR
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PCA9665APW118 PCA9665_PCA9665A.pdf
PCA9665APW118
Hersteller: NXP USA Inc.
Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9665APW PCA9665_PCA9665A.pdf
PCA9665APW
Hersteller: NXP USA Inc.
Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9665PW PHGLS23319-1.pdf?t.download=true&u=5oefqw
PCA9665PW
Hersteller: NXP USA Inc.
Description: I2C BUS CONTROLLER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMA8225KEGR2
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±250g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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MMA8205KEG
MMA8205KEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA8205KEGR2
MMA8205KEGR2
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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A7001CMHN1/T1AGB39 NXP_a700x_fam_sds.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
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A7002CMHN1/T1AGB39
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
auf Bestellung 1098 Stücke:
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Mindestbestellmenge: 103 Stücke
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BZX84-B22/DG/B3215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B22/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15000+0.039 EUR
Mindestbestellmenge: 15000 Stücke
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BFS540,115 BFS540_Rev_Oct2010.pdf
BFS540,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Produkt ist nicht verfügbar
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PMXB120EPE147 PMXB120EPE.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
auf Bestellung 648598 Stücke:
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Mindestbestellmenge: 4411 Stücke
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PMXB75UPE147 PMXB75UPE.pdf
PMXB75UPE147
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
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4729+0.12 EUR
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PMXB75UPE/M5147 PMXB75UPE.pdf
PMXB75UPE/M5147
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Supplier Device Package: DFN1010D-3
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
auf Bestellung 45000 Stücke:
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AnzahlPrivatkunde
3328+0.17 EUR
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PMZB200UNE315 PMZB200UNE.pdf
PMZB200UNE315
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Supplier Device Package: DFN1006B-3
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
auf Bestellung 156850 Stücke:
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AnzahlPrivatkunde
4522+0.14 EUR
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PMXB56EN147 PMXB56EN.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
auf Bestellung 10000 Stücke:
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Mindestbestellmenge: 4014 Stücke
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BF904215
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MKS20FN256VFT12 KS22PB.pdf
MKS20FN256VFT12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
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MKL81Z128CBH7R KNTSKL8XFS.pdf
MKL81Z128CBH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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MKL81Z128CBH7R KNTSKL8XFS.pdf
MKL81Z128CBH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 64-WLCSP (3.48x3.38)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-XFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 4990 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+23.06 EUR
10+18.11 EUR
25+16.86 EUR
100+15.51 EUR
250+15.26 EUR
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MKL81Z128VMC7557 KL82P121M72SF0.pdf
MKL81Z128VMC7557
Hersteller: NXP USA Inc.
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
auf Bestellung 144344 Stücke:
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Mindestbestellmenge: 55 Stücke
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MIMXRT1166DVM6A IMXRT1160ACEC.pdf
MIMXRT1166DVM6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
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MIMXRT1166XVM5A IMXRT1160XEC-3442886.pdf
MIMXRT1166XVM5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1160-EVK IMXRT1160EVKQSG.pdf
MIMXRT1160-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
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MIMXRT1165DVM6A IMXRT1160ACEC.pdf
MIMXRT1165DVM6A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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MIMXRT1165CVM5A IMXRT1160IEC.pdf
MIMXRT1165CVM5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 2x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4/M7
Program Memory Type: External Program Memory
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Speed: 240MHz, 500MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
auf Bestellung 122 Stücke:
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MIMXRT1166CVM5A IMXRT1160AIEC.pdf
MIMXRT1166CVM5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 42 Stücke:
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1+41.32 EUR
10+33.07 EUR
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MIMXRT1165XVM5A IMXRT1160AIEC.pdf
MIMXRT1165XVM5A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 143 Stücke:
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1+42.1 EUR
10+33.68 EUR
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UBA2213AP/N1112 PHGLS24154-1.pdf?t.download=true&u=5oefqw
UBA2213AP/N1112
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
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UBA20270T/1518 PHGLS23582-1.pdf?t.download=true&u=5oefqw
UBA20270T/1518
Hersteller: NXP USA Inc.
Description: IC CFL LAMP DVR 600V 16-SOIC
Packaging: Bulk
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310+1.87 EUR
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PDTC114EMB315 PDTC114EMB.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC114EMB - SMALL
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BAS21LD315 BAS21J.pdf
Hersteller: NXP USA Inc.
Description: BAS21LD - HIGH-VOLTAGE SWITCHING
Produkt ist nicht verfügbar
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MIMX8QX1AVLFZAC Download?colCode=IMX8DXAEC&amp;location=null
MIMX8QX1AVLFZAC
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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LPC1111FHN33/203 LPC112X.pdf
LPC1111FHN33/203
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC1111FHN33/102K LPC111X.pdf
LPC1111FHN33/102K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
auf Bestellung 994 Stücke:
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6+3.5 EUR
10+2.38 EUR
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LPC1111FHN33/103K LPC111X.pdf
LPC1111FHN33/103K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1111FHN33/2025 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1111FHN33/2025
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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A2I20D040GNR1 A2I20D040N.pdf
A2I20D040GNR1
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Supplier Device Package: TO-270WBG-17
Test Frequency: 1.8GHz ~ 2.2GHz
P1dB: 36.3W
Current - Supply: 220mA
Gain: 32.7dB
Voltage - Supply: 28V
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX515DJM8CR2 FSCLS07403-1.pdf?t.download=true&u=5oefqw
MCIMX515DJM8CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Part Status: Active
auf Bestellung 11232 Stücke:
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AnzahlPrivatkunde
5+120.88 EUR
Mindestbestellmenge: 5 Stücke
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