MC32PF1550A9EPR2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details MC32PF1550A9EPR2 NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 4.1V ~ 6V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5).
Weitere Produktangebote MC32PF1550A9EPR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
MC32PF1550A9EPR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, 3 Buck Regs, 3 LDO Regs, Charger, 40 QFN 5x5 |
Produkt ist nicht verfügbar |