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MC9S08PT32AVLH MC9S08PT32AVLH NXP USA Inc. MC9S08PT60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462BT/0Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.06 EUR
12+1.49 EUR
25+1.35 EUR
100+1.2 EUR
250+1.12 EUR
500+1.08 EUR
1000+1.04 EUR
Mindestbestellmenge: 9
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LPC55S06-EVK LPC55S06-EVK NXP USA Inc. LPC55S06-EVK-QSG.pdf Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 8 Stücke:
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1+71.56 EUR
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LPC55S04JBD64E LPC55S04JBD64E NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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3+6.64 EUR
10+4.85 EUR
25+4.7 EUR
160+4.39 EUR
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LPC5502JHI48QL LPC5502JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 209 Stücke:
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10+4.37 EUR
25+4.01 EUR
100+3.62 EUR
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LPC5504JHI48QL LPC5504JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
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4+5.79 EUR
10+4.39 EUR
25+4.04 EUR
80+3.71 EUR
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LPC55S04JHI48QL LPC55S04JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S06JHI48QL LPC55S06JHI48QL NXP USA Inc. LPC55S0x_LPC550x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07GM/S500115 NXP USA Inc. 74LVC1G07.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
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74LVC1G07GF/S500132 74LVC1G07GF/S500132 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
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74LVC1G07GF/S505125 74LVC1G07GF/S505125 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 155597 Stücke:
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1210+0.4 EUR
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LPC1763FBD100Y LPC1763FBD100Y NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 883 Stücke:
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2+13.6 EUR
10+9.42 EUR
25+9.21 EUR
100+9.15 EUR
250+8.92 EUR
500+8.89 EUR
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LPC1765FET100K LPC1765FET100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1062 Stücke:
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2+16.56 EUR
10+10.41 EUR
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BZV85-C7V5133 BZV85-C7V5133 NXP USA Inc. NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
auf Bestellung 55000 Stücke:
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
auf Bestellung 1699 Stücke:
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3+7.96 EUR
10+7.14 EUR
25+6.75 EUR
100+5.85 EUR
250+5.55 EUR
500+4.98 EUR
1000+4.2 EUR
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TJA1081TS TJA1081TS NXP USA Inc. PHGLS25769-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
auf Bestellung 813 Stücke:
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135+3.98 EUR
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MCF5213CAF66R MCF5213CAF66R NXP USA Inc. MCF5213EC.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC1837JBD144551 LPC1837JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AESFC315 NXP USA Inc. PMEG4005AEA.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 162000 Stücke:
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6662+0.083 EUR
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PMEG4002ESFC315 PMEG4002ESFC315 NXP USA Inc. PMEG4002ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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7212+0.07 EUR
Mindestbestellmenge: 7212
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PMEG2005ESFC315 PMEG2005ESFC315 NXP USA Inc. PMEG2005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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7212+0.07 EUR
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PMEG4005ESFC315 PMEG4005ESFC315 NXP USA Inc. PMEG4005ESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 63000 Stücke:
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6662+0.083 EUR
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PMEG4002AESFC315 PMEG4002AESFC315 NXP USA Inc. PMEG4002AESF.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 45000 Stücke:
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7212+0.07 EUR
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PMEG1201AESFC315 PMEG1201AESFC315 NXP USA Inc. Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
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7212+0.07 EUR
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74CBTLV3245DS,118 74CBTLV3245DS,118 NXP USA Inc. 74CBTLV3245_Rev_Feb2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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IP4281CZ10/2115 NXP USA Inc. IP4281CZ10.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
auf Bestellung 20000 Stücke:
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4121+0.12 EUR
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SC16C554BIB80,557 SC16C554BIB80,557 NXP USA Inc. SC16C554B_554DB.pdf Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCR908JK3ECPE MCR908JK3ECPE NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
auf Bestellung 6513 Stücke:
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MCR908JL3ECDWER MCR908JL3ECDWER NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MCR908JK1ECDWER NXP USA Inc. MC68HC908Jx%281%2C3%29.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387FBD100K NXP USA Inc. LPC2387.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 622 Stücke:
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1+31.86 EUR
10+25.47 EUR
25+23.87 EUR
100+22.11 EUR
450+20.84 EUR
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OM11013598 OM11013598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC68HC705C9ACFNE MC68HC705C9ACFNE NXP USA Inc. MC68HC705C9A.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC14PW/C1118 74HC14PW/C1118 NXP USA Inc. PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB MIMX8ML8DVNLZAB NXP USA Inc. IMX8MPCEC.pdf Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 126 Stücke:
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1+69.87 EUR
10+57.22 EUR
25+54.06 EUR
126+50.13 EUR
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MIMX8ML8CVNKZAB MIMX8ML8CVNKZAB NXP USA Inc. i.MX%208M%20Plus.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
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1+75.47 EUR
10+61.95 EUR
25+58.57 EUR
126+54.37 EUR
252+53.08 EUR
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MIMX8ML6DVNLZAB MIMX8ML6DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+64.64 EUR
10+53.06 EUR
25+51.64 EUR
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MIMX8ML3DVNLZAB MIMX8ML3DVNLZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+82.21 EUR
10+67.52 EUR
25+63.85 EUR
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MIMX8ML4CVNKZAB MIMX8ML4CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+68.27 EUR
10+55.84 EUR
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MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB NXP USA Inc. Download?colCode=IMX8MPCEC&amp;location=null Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
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1+73.23 EUR
10+60.06 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB NXP USA Inc. MIMX8ML3CVNKZAB_Rev1_8-2021.pdf Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
1+89.14 EUR
10+73.38 EUR
25+69.45 EUR
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FRDMCD1020EVM FRDMCD1020EVM NXP USA Inc. CD1020.pdf Description: EVAL BOARD FOR CD1020
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: CD1020
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Contents: Board(s)
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+160.2 EUR
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LS1028AXE7PQA LS1028AXE7PQA NXP USA Inc. Description: IC MPU QORIQ 1.5GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASN7HNA LS1028ASN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASN7KQA LS1028ASN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASE7HNA NXP USA Inc. Description: LS1028A-800 ST SEC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1028ASN7NQA LS1028ASN7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASE7KQA NXP USA Inc. Description: LS1028A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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LS1028AXN7HNA LS1028AXN7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXN7KQA LS1028AXN7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASE7NQA NXP USA Inc. Description: LS1028A-1300 ST SEC
Produkt ist nicht verfügbar
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LS1028AXE7HNA LS1028AXE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXE7KQA LS1028AXE7KQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXE7NQA LS1028AXE7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AYE7HNA NXP USA Inc. Description: LS1028A-800 XT SEC
Produkt ist nicht verfügbar
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LS1028ACN7NQA NXP USA Inc. Description: LS1028A-1300 A3 NO SEC
Produkt ist nicht verfügbar
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74HCT4060DB-Q100118 74HCT4060DB-Q100118 NXP USA Inc. 74HC_HCT4060_Q100.pdf Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
816+0.62 EUR
Mindestbestellmenge: 816
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PESD24VS2UT/ZL215 PESD24VS2UT/ZL215 NXP USA Inc. NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 NXP USA Inc. PESD24VF1BSF.pdf Description: TVS DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)
4133+0.12 EUR
Mindestbestellmenge: 4133
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MC9S08PT32AVLH MC9S08PT60.pdf
MC9S08PT32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462.pdf
TJA1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.06 EUR
12+1.49 EUR
25+1.35 EUR
100+1.2 EUR
250+1.12 EUR
500+1.08 EUR
1000+1.04 EUR
Mindestbestellmenge: 9
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LPC55S06-EVK LPC55S06-EVK-QSG.pdf
LPC55S06-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+71.56 EUR
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LPC55S04JBD64E LPC55S0x_LPC550x.pdf
LPC55S04JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.64 EUR
10+4.85 EUR
25+4.7 EUR
160+4.39 EUR
Mindestbestellmenge: 3
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LPC5502JHI48QL LPC55S0x_LPC550x.pdf
LPC5502JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+4.37 EUR
25+4.01 EUR
100+3.62 EUR
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LPC5504JHI48QL LPC55S0x_LPC550x.pdf
LPC5504JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+4.39 EUR
25+4.04 EUR
80+3.71 EUR
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LPC55S04JHI48QL LPC55S0x_LPC550x.pdf
LPC55S04JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S06JHI48QL LPC55S0x_LPC550x_DS.pdf
LPC55S06JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07.pdf
74LVC1G07GM/S500115
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
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Anzahl Preis
3883+0.13 EUR
Mindestbestellmenge: 3883
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74LVC1G07GF/S500132 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S500132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 540000 Stücke:
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Anzahl Preis
3129+0.16 EUR
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74LVC1G07GF/S505125 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S505125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 155597 Stücke:
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Anzahl Preis
1210+0.4 EUR
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LPC1763FBD100Y LPC1769_68_67_66_65_64_63.pdf
LPC1763FBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 883 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.6 EUR
10+9.42 EUR
25+9.21 EUR
100+9.15 EUR
250+8.92 EUR
500+8.89 EUR
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LPC1765FET100K LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1062 Stücke:
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Anzahl Preis
2+16.56 EUR
10+10.41 EUR
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BZV85-C7V5133 NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw
BZV85-C7V5133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
auf Bestellung 55000 Stücke:
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Anzahl Preis
9043+0.048 EUR
Mindestbestellmenge: 9043
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
auf Bestellung 1699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.96 EUR
10+7.14 EUR
25+6.75 EUR
100+5.85 EUR
250+5.55 EUR
500+4.98 EUR
1000+4.2 EUR
Mindestbestellmenge: 3
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TJA1081TS PHGLS25769-1.pdf?t.download=true&u=5oefqw
TJA1081TS
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
auf Bestellung 813 Stücke:
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Anzahl Preis
135+3.98 EUR
Mindestbestellmenge: 135
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MCF5213CAF66R MCF5213EC.pdf
MCF5213CAF66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC1837JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1837JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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PMEG4005AESFC315 PMEG4005AEA.pdf
PMEG4005AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6662+0.083 EUR
Mindestbestellmenge: 6662
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PMEG4002ESFC315 PMEG4002ESF.pdf
PMEG4002ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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Anzahl Preis
7212+0.07 EUR
Mindestbestellmenge: 7212
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PMEG2005ESFC315 PMEG2005ESF.pdf
PMEG2005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 135000 Stücke:
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Anzahl Preis
7212+0.07 EUR
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PMEG4005ESFC315 PMEG4005ESF.pdf
PMEG4005ESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 63000 Stücke:
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Anzahl Preis
6662+0.083 EUR
Mindestbestellmenge: 6662
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PMEG4002AESFC315 PMEG4002AESF.pdf
PMEG4002AESFC315
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7212+0.07 EUR
Mindestbestellmenge: 7212
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PMEG1201AESFC315
PMEG1201AESFC315
Hersteller: NXP USA Inc.
Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7212+0.07 EUR
Mindestbestellmenge: 7212
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74CBTLV3245DS,118 74CBTLV3245_Rev_Feb2017.pdf
74CBTLV3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 43707 Stücke:
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Anzahl Preis
1332+0.37 EUR
Mindestbestellmenge: 1332
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IP4281CZ10/2115 IP4281CZ10.pdf
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
auf Bestellung 20000 Stücke:
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Anzahl Preis
4121+0.12 EUR
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SC16C554BIB80,557 SC16C554B_554DB.pdf
SC16C554BIB80,557
Hersteller: NXP USA Inc.
Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCR908JK3ECPE MC68HC908Jx(1,3).pdf
MCR908JK3ECPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
auf Bestellung 6513 Stücke:
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MCR908JL3ECDWER
MCR908JL3ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MC68HC908Jx%281%2C3%29.pdf
MCR908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2387FBD100K LPC2387.pdf
LPC2387FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 622 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.86 EUR
10+25.47 EUR
25+23.87 EUR
100+22.11 EUR
450+20.84 EUR
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OM11013598
OM11013598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC68HC705C9ACFNE MC68HC705C9A.pdf
MC68HC705C9ACFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC14PW/C1118 PHGL-S-A0001365518-1.pdf?t.download=true&u=5oefqw
74HC14PW/C1118
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZAB IMX8MPCEC.pdf
MIMX8ML8DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+69.87 EUR
10+57.22 EUR
25+54.06 EUR
126+50.13 EUR
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MIMX8ML8CVNKZAB i.MX%208M%20Plus.pdf
MIMX8ML8CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, PCIe, SDHC, SPI, UART
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+75.47 EUR
10+61.95 EUR
25+58.57 EUR
126+54.37 EUR
252+53.08 EUR
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MIMX8ML6DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+64.64 EUR
10+53.06 EUR
25+51.64 EUR
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MIMX8ML3DVNLZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML3DVNLZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+82.21 EUR
10+67.52 EUR
25+63.85 EUR
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MIMX8ML4CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML4CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+68.27 EUR
10+55.84 EUR
25+52.74 EUR
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MIMX8ML6CVNKZAB Download?colCode=IMX8MPCEC&amp;location=null
MIMX8ML6CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.23 EUR
10+60.06 EUR
25+56.77 EUR
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MIMX8ML3CVNKZAB MIMX8ML3CVNKZAB_Rev1_8-2021.pdf
MIMX8ML3CVNKZAB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.6GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+89.14 EUR
10+73.38 EUR
25+69.45 EUR
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FRDMCD1020EVM CD1020.pdf
FRDMCD1020EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR CD1020
Packaging: Bulk
Function: Switch Detection
Type: Interface
Utilized IC / Part: CD1020
Supplied Contents: Board(s)
Primary Attributes: 22-Channel
Part Status: Active
Contents: Board(s)
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+160.2 EUR
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LS1028AXE7PQA
LS1028AXE7PQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.5GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASN7HNA Download?colCode=LS1027A&amp;location=null
LS1028ASN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASN7KQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASE7HNA
Hersteller: NXP USA Inc.
Description: LS1028A-800 ST SEC
Produkt ist nicht verfügbar
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LS1028ASN7NQA Download?colCode=LS1027A&amp;location=null
LS1028ASN7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1028ASE7KQA
Hersteller: NXP USA Inc.
Description: LS1028A-1000 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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LS1028AXN7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXN7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028ASE7NQA
Hersteller: NXP USA Inc.
Description: LS1028A-1300 ST SEC
Produkt ist nicht verfügbar
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LS1028AXE7HNA Download?colCode=LS1027A&amp;location=null
LS1028AXE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXE7KQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AXE7NQA Download?colCode=LS1027A&amp;location=null
LS1028AXE7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LS1028AYE7HNA
Hersteller: NXP USA Inc.
Description: LS1028A-800 XT SEC
Produkt ist nicht verfügbar
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LS1028ACN7NQA
Hersteller: NXP USA Inc.
Description: LS1028A-1300 A3 NO SEC
Produkt ist nicht verfügbar
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74HCT4060DB-Q100118 74HC_HCT4060_Q100.pdf
74HCT4060DB-Q100118
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 12-BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 88 MHz
Number of Bits per Element: 14
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
816+0.62 EUR
Mindestbestellmenge: 816
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PESD24VS2UT/ZL215 NEXP-S-A0003059590-1.pdf?t.download=true&u=5oefqw
PESD24VS2UT/ZL215
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PESD24VF1BSF315 PESD24VF1BSF.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 300000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4133+0.12 EUR
Mindestbestellmenge: 4133
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