Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35705) > Seite 398 nach 596
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| PIMXRT1062CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC4076FET180557 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA |
Produkt ist nicht verfügbar |
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| LPC4088FET180 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA |
Produkt ist nicht verfügbar |
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LPC4088FBD208K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 135 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13050UL | NXP USA Inc. | Description: LPC4088 EVAL BRD |
Produkt ist nicht verfügbar |
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| 74LVT16245BBX,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 60HXQFNPackaging: Bulk Package / Case: 60-XFQFN Dual Rows, Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 60-HXQFN (4x6) |
auf Bestellung 4475 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT162245BDL,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 16BIT 48SSOPPackaging: Tube Part Status: Active |
auf Bestellung 1414 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1817JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
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LD6816CX4/16P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.6V 150MA 4-WLCSPPackaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.6V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6816CX4/C14P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 150MA 4-WLCSPPackaging: Bulk Part Status: Active Package / Case: 4-UFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.4V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6816CX4/18P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 150MA 4WLCSPPackaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6816CX4/25P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2.5V 150MA 4WLCSPPackaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2.5V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF6G20S-45112 | NXP USA Inc. |
Description: RF POWER TRANSISTORS Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX6X1EVK10AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Part Status: Active Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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| XC540203CZT75A | NXP USA Inc. | Description: PROCESSOR |
auf Bestellung 7091 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| XC540203CZT75AR2 | NXP USA Inc. | Description: INTEGRATED CIRCUIT |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCIMX6S1AVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6S6AVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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| PBSM5240PFH115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSM5240PFH SMALL SPackaging: Bulk Voltage - Rated: 40V Package / Case: 6-UDFN Exposed Pad Current Rating (Amps): 1.8A Mounting Type: Surface Mount Transistor Type: PNP, N-Channel Applications: General Purpose Supplier Device Package: 6-HUSON (2x2) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 63000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC157D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHC157D - MULTIPLPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Data Selector/Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 8mA, 8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3245ADS,112 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPPackaging: Tube Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP |
auf Bestellung 14604 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3245ADS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPPackaging: Bulk Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3245APW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIESPackaging: Bulk |
auf Bestellung 36196 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1723DT/N1118 | NXP USA Inc. |
Description: GREENCHIP SMPS LOW POWER CONTROLPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BZX84-B2V7/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Supplier Device Package: SOT23-3 (TO-236) |
auf Bestellung 69000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX84-B2V7 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-B2V7 - ZENERPackaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 Part Status: Active Power - Max: 350 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V |
Produkt ist nicht verfügbar |
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BZX84-B4V7/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B4V7/LF1R | NXP USA Inc. |
Description: DIODE ZENER 4.7V 250MW TO236ABPackaging: Tape & Reel (TR) Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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MC9S08PT32AVLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TJA1462BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 100 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2506 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S06-EVK | NXP USA Inc. |
Description: EVAL KIT LPC55Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-M33 Board Type: Evaluation Platform Utilized IC / Part: LPC55S06 Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S04JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 9x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5502JHI48QL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 209 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5504JHI48QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S04JHI48QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC55S06JHI48QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC1G07GM/S500115 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-XSON (1.45x1) |
auf Bestellung 3785730 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G07GF/S500132 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-XSON (1x1) |
auf Bestellung 540000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G07GF/S505125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-XSON (1x1) |
auf Bestellung 155597 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1763FBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 883 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1765FET100K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100TFBGAPackaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 1062 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV85-C7V5133 | NXP USA Inc. |
Description: NOW NEXPERIA BZV85-C7V5 - ZENERPackaging: Bulk Part Status: Active Tolerance: ±5% Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 3 Ohms Supplier Device Package: DO-41 Power - Max: 1.3 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V |
auf Bestellung 55000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1081GTS/0Z | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED FLEXRAYPackaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: FlexRay Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 16-SSOP Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1081GTS/0Z | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED FLEXRAYPackaging: Cut Tape (CT) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: FlexRay Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 16-SSOP Grade: Automotive |
auf Bestellung 1699 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1081TS | NXP USA Inc. |
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS |
auf Bestellung 813 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF5213CAF66R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1837JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFPPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PMEG4005AESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
auf Bestellung 162000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG4002ESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
auf Bestellung 135000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG2005ESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
auf Bestellung 135000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG4005ESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 1.28 ns Technology: Schottky Capacitance @ Vr, F: 17pF @ 1V, 1MHz Current - Average Rectified (Io): 500mA Supplier Device Package: DSN0603-2 Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V |
auf Bestellung 63000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG4002AESFC315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG1201AESFC315 | NXP USA Inc. |
Description: PMEG1201AESF - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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74CBTLV3245DS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPPackaging: Bulk Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP |
auf Bestellung 43707 Stücke: Lieferzeit 10-14 Tag (e) |
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| IP4281CZ10/2115 | NXP USA Inc. |
Description: TRANS VOLTAGE SUPPRESSOR DIODE |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16C554BIB80,557 | NXP USA Inc. |
Description: UART INTERFACE IC 16CB 2.5V-5V 4Packaging: Bulk Package / Case: 80-LQFP Number of Channels: 4, QUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 5Mbps Supplier Device Package: 80-LQFP (12x12) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCR908JK3ECPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20DIP |
auf Bestellung 6513 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCR908JL3ECDWER | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 28SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCR908JK1ECDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 20SOICPackaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Part Status: Not For New Designs Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC2387FBD100K | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 98K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
auf Bestellung 622 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIMXRT1062CVJ5B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4076FET180557 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4088FET180 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4088FBD208K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 27.79 EUR |
| 10+ | 22.12 EUR |
| 36+ | 17.33 EUR |
| 108+ | 16.59 EUR |
| OM13050UL |
Hersteller: NXP USA Inc.
Description: LPC4088 EVAL BRD
Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT16245BBX,518 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Packaging: Bulk
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
auf Bestellung 4475 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 833+ | 0.59 EUR |
| 74LVT162245BDL,112 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
auf Bestellung 1414 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 494+ | 1.07 EUR |
| LPC1817JBD144551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LD6816CX4/16P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.15 EUR |
| LD6816CX4/C14P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Part Status: Active
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Part Status: Active
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.15 EUR |
| LD6816CX4/18P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.15 EUR |
| LD6816CX4/25P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.15 EUR |
| MCIMX6X1EVK10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC540203CZT75A |
Hersteller: NXP USA Inc.
Description: PROCESSOR
Description: PROCESSOR
auf Bestellung 7091 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| XC540203CZT75AR2 |
Hersteller: NXP USA Inc.
Description: INTEGRATED CIRCUIT
Description: INTEGRATED CIRCUIT
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MCIMX6S1AVM10AD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6S6AVM10AD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PBSM5240PFH115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSM5240PFH SMALL S
Packaging: Bulk
Voltage - Rated: 40V
Package / Case: 6-UDFN Exposed Pad
Current Rating (Amps): 1.8A
Mounting Type: Surface Mount
Transistor Type: PNP, N-Channel
Applications: General Purpose
Supplier Device Package: 6-HUSON (2x2)
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA PBSM5240PFH SMALL S
Packaging: Bulk
Voltage - Rated: 40V
Package / Case: 6-UDFN Exposed Pad
Current Rating (Amps): 1.8A
Mounting Type: Surface Mount
Transistor Type: PNP, N-Channel
Applications: General Purpose
Supplier Device Package: 6-HUSON (2x2)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 63000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2544+ | 0.19 EUR |
| 74AHC157D112 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC157D - MULTIPL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: NOW NEXPERIA 74AHC157D - MULTIPL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 0.24 EUR |
| CBT3245ADS,112 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 14604 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1776+ | 0.28 EUR |
| CBT3245ADS,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1776+ | 0.28 EUR |
| CBT3245APW-Q100118 |
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auf Bestellung 36196 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1528+ | 0.35 EUR |
| TEA1723DT/N1118 |
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Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B2V7/DG/B3215 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
auf Bestellung 69000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.033 EUR |
| BZX84-B2V7 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Part Status: Active
Power - Max: 350 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B4V7/DG/B3215 |
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auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.032 EUR |
| BZX84-B4V7/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 4.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S08PT32AVLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1462BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 2.06 EUR |
| 12+ | 1.49 EUR |
| 25+ | 1.35 EUR |
| 100+ | 1.2 EUR |
| 250+ | 1.12 EUR |
| 500+ | 1.08 EUR |
| 1000+ | 1.04 EUR |
| LPC55S06-EVK |
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Hersteller: NXP USA Inc.
Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
Description: EVAL KIT LPC55
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: LPC55S06
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 71.56 EUR |
| LPC55S04JBD64E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.64 EUR |
| 10+ | 4.85 EUR |
| 25+ | 4.7 EUR |
| 160+ | 4.39 EUR |
| LPC5502JHI48QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.79 EUR |
| 10+ | 4.37 EUR |
| 25+ | 4.01 EUR |
| 100+ | 3.62 EUR |
| LPC5504JHI48QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.79 EUR |
| 10+ | 4.39 EUR |
| 25+ | 4.04 EUR |
| 80+ | 3.71 EUR |
| LPC55S04JHI48QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC55S06JHI48QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 74LVC1G07GM/S500115 |
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Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
auf Bestellung 3785730 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3883+ | 0.13 EUR |
| 74LVC1G07GF/S500132 |
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Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 540000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3129+ | 0.16 EUR |
| 74LVC1G07GF/S505125 |
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Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
auf Bestellung 155597 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1210+ | 0.4 EUR |
| LPC1763FBD100Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 883 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.6 EUR |
| 10+ | 9.42 EUR |
| 25+ | 9.21 EUR |
| 100+ | 9.15 EUR |
| 250+ | 8.92 EUR |
| 500+ | 8.89 EUR |
| LPC1765FET100K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1062 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.74 EUR |
| 10+ | 10.41 EUR |
| BZV85-C7V5133 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Packaging: Bulk
Part Status: Active
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: DO-41
Power - Max: 1.3 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9043+ | 0.048 EUR |
| TJA1081GTS/0Z |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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| TJA1081GTS/0Z |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
auf Bestellung 1699 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.96 EUR |
| 10+ | 7.14 EUR |
| 25+ | 6.75 EUR |
| 100+ | 5.85 EUR |
| 250+ | 5.55 EUR |
| 500+ | 4.98 EUR |
| 1000+ | 4.2 EUR |
| TJA1081TS |
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Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
Description: INTERFACE CIRCUIT, 1-TRNSVR, PDS
auf Bestellung 813 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 135+ | 3.98 EUR |
| MCF5213CAF66R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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| LPC1837JBD144551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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| PMEG4005AESFC315 |
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auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6662+ | 0.083 EUR |
| PMEG4002ESFC315 |
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auf Bestellung 135000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.07 EUR |
| PMEG2005ESFC315 |
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auf Bestellung 135000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.07 EUR |
| PMEG4005ESFC315 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 500mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 500 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
auf Bestellung 63000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6662+ | 0.083 EUR |
| PMEG4002AESFC315 |
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auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.07 EUR |
| PMEG1201AESFC315 |
Hersteller: NXP USA Inc.
Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
Description: PMEG1201AESF - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.07 EUR |
| 74CBTLV3245DS,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 43707 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1332+ | 0.37 EUR |
| IP4281CZ10/2115 |
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Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Description: TRANS VOLTAGE SUPPRESSOR DIODE
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4121+ | 0.12 EUR |
| SC16C554BIB80,557 |
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Hersteller: NXP USA Inc.
Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Description: UART INTERFACE IC 16CB 2.5V-5V 4
Packaging: Bulk
Package / Case: 80-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 80-LQFP (12x12)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MCR908JK3ECPE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Description: IC MCU 8BIT 4KB FLASH 20DIP
auf Bestellung 6513 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MCR908JL3ECDWER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCR908JK1ECDWER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC2387FBD100K |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 622 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 31.86 EUR |
| 10+ | 25.47 EUR |
| 25+ | 23.87 EUR |
| 100+ | 22.11 EUR |
| 450+ | 20.84 EUR |


































