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MCIMX6S6AVM10ADR NXP USA Inc. IMX6SDLIEC.pdf Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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FS32V232BMN1VUB NXP USA Inc. Description: ISP GPU NO CSE800MHZ
Produkt ist nicht verfügbar
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FS32V234BJN1VUB FS32V234BJN1VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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TEA1998TS/1X TEA1998TS/1X NXP USA Inc. TEA1998TS.pdf Description: FLYBACK SR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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TEA1993TS/1X TEA1993TS/1X NXP USA Inc. TEA1993TS.pdf Description: IC CTRLR SYNC RECT SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
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KITVR5510DA0EVM KITVR5510DA0EVM NXP USA Inc. VR5510.pdf Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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KITVR5510MA0EVM KITVR5510MA0EVM NXP USA Inc. VR5510.pdf Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
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KITVR5510BA0EVM NXP USA Inc. Description: EVAL BOARD VR5510 PMIC
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KITVR5510SKTEVM NXP USA Inc. Description: VR5510 OTP PROG BOARD - SOCKET
Packaging: Bulk
For Use With/Related Products: VR5510
Module/Board Type: Socket Module
Part Status: Active
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74LV164N,112 74LV164N,112 NXP USA Inc. 74LV164_Rev3.pdf Description: IC 8BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 14-DIP
Part Status: Obsolete
Number of Bits per Element: 8
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BZX84-B5V6/DG/B4215 BZX84-B5V6/DG/B4215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZX84-B5V6 - ZENER
Produkt ist nicht verfügbar
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MIMXRT1062CVL5B MIMXRT1062CVL5B NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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25+13.75 EUR
240+12.13 EUR
480+11.8 EUR
720+11.64 EUR
1200+11.46 EUR
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MIMXRT1062CVJ5BR MIMXRT1062CVJ5BR NXP USA Inc. IMXRT1060CEC.pdf Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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MIMXRT1062CVJ5AR NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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PIMXRT1062DVL6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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PIMXRT1062CVL5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVJ6B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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PIMXRT1062CVJ5B NXP USA Inc. Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FET180557 NXP USA Inc. PHGL-S-A0002884601-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLSH 180TFBGA
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LPC4088FET180 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
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LPC4088FBD208K LPC4088FBD208K NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
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10+22.12 EUR
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OM13050UL NXP USA Inc. Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 NXP USA Inc. PHGLS24309-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
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74LVT162245BDL,112 74LVT162245BDL,112 NXP USA Inc. 74LVT162245B.pdf Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
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494+1.07 EUR
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LPC1817JBD144551 LPC1817JBD144551 NXP USA Inc. PHGLS25743-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816CX4/16P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6816CX4/C14P,315 LD6816CX4/C14P,315 NXP USA Inc. PHGLS25656-1.pdf?t.download=true&u=5oefqw Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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LD6816CX4/18P,315 LD6816CX4/18P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6816CX4/25P,315 LD6816CX4/25P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
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BLF6G20S-45112 NXP USA Inc. Description: RF POWER TRANSISTORS
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC MCIMX6X1EVK10AC NXP USA Inc. IMX6SXAEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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XC540203CZT75A NXP USA Inc. Description: PROCESSOR
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XC540203CZT75AR2 NXP USA Inc. Description: INTEGRATED CIRCUIT
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MCIMX6S1AVM10AD MCIMX6S1AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6S6AVM10AD MCIMX6S6AVM10AD NXP USA Inc. Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PBSM5240PFH115 NXP USA Inc. PBSM5240PFH.pdf Description: NOW NEXPERIA PBSM5240PFH SMALL S
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 6-HUSON (2x2)
Applications: General Purpose
Transistor Type: PNP, N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 1.8A
Package / Case: 6-UDFN Exposed Pad
Voltage - Rated: 40V
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74AHC157D112 74AHC157D112 NXP USA Inc. 74AHC_AHCT157.pdf Description: NOW NEXPERIA 74AHC157D - MULTIPL
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Data Selector/Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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CBT3245ADS,112 CBT3245ADS,112 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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CBT3245ADS,118 CBT3245ADS,118 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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CBT3245APW-Q100118 CBT3245APW-Q100118 NXP USA Inc. CBT3245A_Q100.pdf Description: BUS DRIVER, CBT SERIES
Packaging: Bulk
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TEA1723DT/N1118 TEA1723DT/N1118 NXP USA Inc. TEA1723DT.pdf Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B2V7/DG/B3215 BZX84-B2V7/DG/B3215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
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BZX84-B2V7 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 350 mW
Part Status: Active
Supplier Device Package: SOT-23
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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BZX84-B4V7/DG/B3215 BZX84-B4V7/DG/B3215 NXP USA Inc. BZX84_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
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BZX84-B4V7/LF1R BZX84-B4V7/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC9S08PT32AVLH MC9S08PT32AVLH NXP USA Inc. MC9S08PT60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462BT/0Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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LPC55S06-EVK LPC55S06-EVK NXP USA Inc. LPC55S06-EVK-QSG.pdf Description: EVAL KIT LPC55
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S06
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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LPC55S04JBD64E LPC55S04JBD64E NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
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LPC5502JHI48QL LPC5502JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC5504JHI48QL LPC5504JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S04JHI48QL LPC55S04JHI48QL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S06JHI48QL LPC55S06JHI48QL NXP USA Inc. LPC55S0x_LPC550x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07GM/S500115 NXP USA Inc. 74LVC1G07.pdf Description: BUFFER, LVC/LCX/Z SERIES
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: -, 32mA
Number of Bits per Element: 1
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Part Status: Active
Packaging: Bulk
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74LVC1G07GF/S500132 74LVC1G07GF/S500132 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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74LVC1G07GF/S505125 74LVC1G07GF/S505125 NXP USA Inc. PHGLS24896-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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LPC1763FBD100Y LPC1763FBD100Y NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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10+9.42 EUR
25+9.21 EUR
100+9.15 EUR
250+8.92 EUR
500+8.89 EUR
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LPC1765FET100K LPC1765FET100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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BZV85-C7V5133 BZV85-C7V5133 NXP USA Inc. NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.3 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 3 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Part Status: Active
Packaging: Bulk
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TJA1081GTS/0Z TJA1081GTS/0Z NXP USA Inc. TJA1081G.pdf Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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MCIMX6S6AVM10ADR IMX6SDLIEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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FS32V232BMN1VUB
Hersteller: NXP USA Inc.
Description: ISP GPU NO CSE800MHZ
Produkt ist nicht verfügbar
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FS32V234BJN1VUB S32V234.pdf
FS32V234BJN1VUB
Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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TEA1998TS/1X TEA1998TS.pdf
TEA1998TS/1X
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Part Status: Obsolete
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
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420+1.05 EUR
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TEA1993TS/1X TEA1993TS.pdf
TEA1993TS/1X
Hersteller: NXP USA Inc.
Description: IC CTRLR SYNC RECT SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
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561+0.87 EUR
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KITVR5510DA0EVM VR5510.pdf
KITVR5510DA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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KITVR5510MA0EVM VR5510.pdf
KITVR5510MA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR VR5510
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: VR5510
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2.7V ~ 60V Supply
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
Part Status: Active
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KITVR5510BA0EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD VR5510 PMIC
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1+637.89 EUR
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KITVR5510SKTEVM
Hersteller: NXP USA Inc.
Description: VR5510 OTP PROG BOARD - SOCKET
Packaging: Bulk
For Use With/Related Products: VR5510
Module/Board Type: Socket Module
Part Status: Active
auf Bestellung 2 Stücke:
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AnzahlPreis
1+1129.39 EUR
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74LV164N,112 74LV164_Rev3.pdf
74LV164N,112
Hersteller: NXP USA Inc.
Description: IC 8BIT SHIFT REGISTER 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 14-DIP
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 1941 Stücke:
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AnzahlPreis
437+1.12 EUR
Mindestbestellmenge: 437 Stücke
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BZX84-B5V6/DG/B4215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B5V6/DG/B4215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B5V6 - ZENER
Produkt ist nicht verfügbar
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MIMXRT1062CVL5B IMXRT1060IEC.pdf
MIMXRT1062CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18.81 EUR
10+14.76 EUR
25+13.75 EUR
240+12.13 EUR
480+11.8 EUR
720+11.64 EUR
1200+11.46 EUR
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MIMXRT1062CVJ5BR IMXRT1060CEC.pdf
MIMXRT1062CVJ5BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
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AnzahlPreis
1000+12.65 EUR
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MIMXRT1062CVJ5AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVL5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062DVJ6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIMXRT1062CVJ5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC4076FET180557 PHGL-S-A0002884601-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 37 Stücke
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LPC4088FET180 LPC408X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Produkt ist nicht verfügbar
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LPC4088FBD208K LPC408X_7X.pdf
LPC4088FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+27.79 EUR
10+22.12 EUR
36+17.33 EUR
108+16.59 EUR
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OM13050UL
Hersteller: NXP USA Inc.
Description: LPC4088 EVAL BRD
Produkt ist nicht verfügbar
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74LVT16245BBX,518 PHGLS24309-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HXQFN
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4475 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
833+0.59 EUR
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74LVT162245BDL,112 74LVT162245B.pdf
74LVT162245BDL,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 16BIT 48SSOP
Packaging: Tube
Part Status: Active
auf Bestellung 1414 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
494+1.07 EUR
Mindestbestellmenge: 494 Stücke
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LPC1817JBD144551 PHGLS25743-1.pdf?t.download=true&u=5oefqw
LPC1817JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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LD6816CX4/16P,315 LD6816.pdf
LD6816CX4/16P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 150MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.6V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3328+0.15 EUR
Mindestbestellmenge: 3328 Stücke
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LD6816CX4/C14P,315 PHGLS25656-1.pdf?t.download=true&u=5oefqw
LD6816CX4/C14P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Active
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3328+0.15 EUR
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LD6816CX4/18P,315 LD6816.pdf
LD6816CX4/18P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 36000 Stücke:
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AnzahlPreis
3328+0.15 EUR
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LD6816CX4/25P,315 LD6816.pdf
LD6816CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 150MA 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3328+0.15 EUR
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BLF6G20S-45112
Hersteller: NXP USA Inc.
Description: RF POWER TRANSISTORS
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6X1EVK10AC IMX6SXAEC.pdf
MCIMX6X1EVK10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Part Status: Active
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC540203CZT75A
Hersteller: NXP USA Inc.
Description: PROCESSOR
auf Bestellung 7091 Stücke:
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Mindestbestellmenge: 24 Stücke
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XC540203CZT75AR2
Hersteller: NXP USA Inc.
Description: INTEGRATED CIRCUIT
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MCIMX6S1AVM10AD
MCIMX6S1AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6S6AVM10AD
MCIMX6S6AVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PBSM5240PFH115 PBSM5240PFH.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSM5240PFH SMALL S
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 6-HUSON (2x2)
Applications: General Purpose
Transistor Type: PNP, N-Channel
Mounting Type: Surface Mount
Current Rating (Amps): 1.8A
Package / Case: 6-UDFN Exposed Pad
Voltage - Rated: 40V
auf Bestellung 63000 Stücke:
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AnzahlPreis
2544+0.19 EUR
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74AHC157D112 74AHC_AHCT157.pdf
74AHC157D112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC157D - MULTIPL
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Data Selector/Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 2000 Stücke:
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AnzahlPreis
2000+0.24 EUR
Mindestbestellmenge: 2000 Stücke
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CBT3245ADS,112 CBT3245A.pdf
CBT3245ADS,112
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 14604 Stücke:
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AnzahlPreis
1776+0.28 EUR
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CBT3245ADS,118 CBT3245A.pdf
CBT3245ADS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1776+0.28 EUR
Mindestbestellmenge: 1776 Stücke
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CBT3245APW-Q100118 CBT3245A_Q100.pdf
CBT3245APW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Packaging: Bulk
auf Bestellung 36196 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1528+0.35 EUR
Mindestbestellmenge: 1528 Stücke
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TEA1723DT/N1118 TEA1723DT.pdf
TEA1723DT/N1118
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS LOW POWER CONTROL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-B2V7/DG/B3215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B2V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
auf Bestellung 69000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
15000+0.033 EUR
Mindestbestellmenge: 15000 Stücke
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BZX84-B2V7 PHGLS29437-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B2V7 - ZENER
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 350 mW
Part Status: Active
Supplier Device Package: SOT-23
Impedance (Max) (Zzt): 100 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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BZX84-B4V7/DG/B3215 BZX84_SER.pdf
BZX84-B4V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
auf Bestellung 30000 Stücke:
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AnzahlPreis
15000+0.032 EUR
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BZX84-B4V7/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B4V7/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 250MW TO236AB
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC9S08PT32AVLH MC9S08PT60.pdf
MC9S08PT32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1462BT/0Z TJA1462.pdf
TJA1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2506 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
9+2.06 EUR
12+1.49 EUR
25+1.35 EUR
100+1.2 EUR
250+1.12 EUR
500+1.08 EUR
1000+1.04 EUR
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LPC55S06-EVK LPC55S06-EVK-QSG.pdf
LPC55S06-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT LPC55
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC55S06
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 8 Stücke:
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AnzahlPreis
1+71.56 EUR
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LPC55S04JBD64E LPC55S0x_LPC550x.pdf
LPC55S04JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 9x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 180 Stücke:
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AnzahlPreis
3+6.64 EUR
10+4.85 EUR
25+4.7 EUR
160+4.39 EUR
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LPC5502JHI48QL LPC55S0x_LPC550x.pdf
LPC5502JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 209 Stücke:
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AnzahlPreis
3+6.05 EUR
10+4.57 EUR
25+4.2 EUR
100+3.79 EUR
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LPC5504JHI48QL LPC55S0x_LPC550x.pdf
LPC5504JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
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AnzahlPreis
4+5.79 EUR
10+4.39 EUR
25+4.04 EUR
80+3.71 EUR
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LPC55S04JHI48QL LPC55S0x_LPC550x.pdf
LPC55S04JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC55S06JHI48QL LPC55S0x_LPC550x_DS.pdf
LPC55S06JHI48QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC1G07GM/S500115 74LVC1G07.pdf
74LVC1G07GM/S500115
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: -, 32mA
Number of Bits per Element: 1
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 6-XFDFN
Part Status: Active
Packaging: Bulk
auf Bestellung 3785730 Stücke:
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3883+0.13 EUR
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74LVC1G07GF/S500132 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S500132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
auf Bestellung 540000 Stücke:
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3129+0.16 EUR
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74LVC1G07GF/S505125 PHGLS24896-1.pdf?t.download=true&u=5oefqw
74LVC1G07GF/S505125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
auf Bestellung 155597 Stücke:
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AnzahlPreis
1210+0.4 EUR
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LPC1763FBD100Y LPC1769_68_67_66_65_64_63.pdf
LPC1763FBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 883 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.6 EUR
10+9.42 EUR
25+9.21 EUR
100+9.15 EUR
250+8.92 EUR
500+8.89 EUR
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LPC1765FET100K LPC1769_68_67_66_65_64_63.pdf
LPC1765FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
auf Bestellung 1062 Stücke:
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AnzahlPreis
2+16.56 EUR
10+10.41 EUR
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BZV85-C7V5133 NEXP-S-A0002883904-1.pdf?t.download=true&u=5oefqw
BZV85-C7V5133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV85-C7V5 - ZENER
Current - Reverse Leakage @ Vr: 1 µA @ 4.5 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.3 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 3 Ohms
Voltage - Zener (Nom) (Vz): 7.5 V
Operating Temperature: -65°C ~ 200°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Part Status: Active
Packaging: Bulk
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
9043+0.048 EUR
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TJA1081GTS/0Z TJA1081G.pdf
TJA1081GTS/0Z
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED FLEXRAY
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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