| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
116-83-650-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 50 (2 x 25) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-83-652-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLDHousing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-210-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDPitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDTermination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-304-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 4POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLDContact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Finish Thickness - Mating: FLASH Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-306-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 6POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDPitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-308-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
116-87-310-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 116-83-650-41-018101 |
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Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-001101 |
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Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-002101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-003101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-004101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-006101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-007101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-008101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-009101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-011101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-012101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-013101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-83-652-41-018101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-001101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-002101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-003101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-004101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-007101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-008101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-009101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 10POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-011101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-012101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-013101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-210-41-018101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-001101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Description: CONN IC DIP SOCKET 4POS GOLD
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-002101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Description: CONN IC DIP SOCKET 4POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-003101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-004101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-006101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-007101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-008101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-009101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-011101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-012101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-013101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-304-41-018101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-001101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-002101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-003101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-004101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-006101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-007101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-008101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-009101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-011101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-012101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-013101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Finish Thickness - Mating: FLASH
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Finish Thickness - Mating: FLASH
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-306-41-018101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-001101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-002101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-003101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-004101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-007101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-008101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-009101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-011101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-012101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Description: CONN IC DIP SOCKET 8POS GOLD
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-013101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-308-41-018101 |
![]() |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 116-87-310-41-002101 |
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Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH




























































