1-1658462-3 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP ConnectorsDescription: CONN DIFF ARRAY RCP 84P SMD GOLD
Packaging: Box
Features: Board Guide, Ground Bus (Plane)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 84
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm
Part Status: Active
Number of Rows: 2
auf Bestellung 210 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 44 EUR |
| 25+ | 43.17 EUR |
| 45+ | 42.37 EUR |
| 85+ | 41.54 EUR |
| 210+ | 40.76 EUR |
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Technische Details 1-1658462-3 TE Connectivity AMP Connectors
Description: CONN DIFF ARRAY RCP 84P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 84, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote 1-1658462-3
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1-1658462-3 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN DIFF ARRAY RCP 84P SMD GOLD Packaging: Tray Features: Board Guide, Ground Bus (Plane) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 84 Pitch: 0.031" (0.80mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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1-1658462-3 | Hersteller : TE Connectivity / AMP |
Board to Board & Mezzanine Connectors MSB0.80RC-ASY84DP, -,30,VCTY |
Produkt ist nicht verfügbar |