1981813-1 TE Connectivity
auf Bestellung 236000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 0.7 EUR |
| 28000+ | 0.56 EUR |
| 52000+ | 0.52 EUR |
| 100000+ | 0.47 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 1981813-1 TE Connectivity
Description: CONN RCPT 2POS 0.031 GOLD SMD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 30V, Current Rating (Amps): 0.5A, Mounting Type: Surface Mount, Number of Positions: 2, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Outer Shroud Contact, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Finish - Post: Gold, Part Status: Active, Insulation Height: 0.055" (1.40mm), Number of Rows: 1.
Weitere Produktangebote 1981813-1 nach Preis ab 0.77 EUR bis 2.37 EUR
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1981813-1 | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN RCPT 2POS 0.031 GOLD SMDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 30V Current Rating (Amps): 0.5A Mounting Type: Surface Mount Number of Positions: 2 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Outer Shroud Contact Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.055" (1.40mm) Number of Rows: 1 |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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1981813-1 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN RCPT 2POS 0.031 GOLD SMD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 30V Current Rating (Amps): 0.5A Mounting Type: Surface Mount Number of Positions: 2 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Outer Shroud Contact Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.055" (1.40mm) Number of Rows: 1 |
auf Bestellung 23625 Stücke: Lieferzeit 10-14 Tag (e) |
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1981813-1 | Hersteller : TE Connectivity / AMP |
Headers & Wire Housings .8mm Micro SLP RECPT |
auf Bestellung 4385 Stücke: Lieferzeit 14-28 Tag (e) |
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1981813-1 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 1981813-1 - Printbuchse, Wire-to-Board, 0.8 mm, 1 Reihe(n), 2 Kontakt(e), Oberflächenmontage, Micro SLP tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Ausführung: Buchse Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 2Contacts euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: Micro SLP productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 1Rows Rastermaß: 0.8mm SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 192000 Stücke: Lieferzeit 14-21 Tag (e) |
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1981813-1 | Hersteller : TE Connectivity |
Board to Board Connector Assembly |
Produkt ist nicht verfügbar |
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1981813-1 | Hersteller : TE Connectivity |
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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1981813-1 | Hersteller : TE Connectivity |
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |