1981813-1 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN RCPT 2POS 0.031 GOLD SMD
Number of Rows: 1
Insulation Height: 0.055" (1.40mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.031" (0.80mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Detent Lock
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Positions: 2
Mounting Type: Surface Mount
Current Rating (Amps): 0.5A
Voltage Rating: 30V
Connector Type: Receptacle
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details 1981813-1 TE Connectivity AMP Connectors
Description: CONN RCPT 2POS 0.031 GOLD SMD, Number of Rows: 1, Insulation Height: 0.055" (1.40mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 12.0µin (0.30µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.031" (0.80mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Detent Lock, Contact Type: Outer Shroud Contact, Operating Temperature: -25°C ~ 85°C, Style: Board to Cable/Wire, Number of Positions: 2, Mounting Type: Surface Mount, Current Rating (Amps): 0.5A, Voltage Rating: 30V, Connector Type: Receptacle, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote 1981813-1 nach Preis ab 0.56 EUR bis 1.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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1981813-1 | TE Connectivity |
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R |
auf Bestellung 100000 Stücke: Lieferzeit 14-21 Tag (e) |
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1981813-1 | TE Connectivity / AMP |
Headers & Wire Housings .8mm Micro SLP RECPT |
auf Bestellung 4123 Stücke: Lieferzeit 10-14 Tag (e) |
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1981813-1 | TE Connectivity |
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R |
auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) |
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1981813-1 | TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 1981813-1 - Printbuchse, Wire-to-Board, 0.8 mm, 1 Reihe(n), 2 Kontakt(e), Oberflächenmontage, Micro SLP tariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Ausführung: Buchse Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 2Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: Micro SLP productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 1Reihe(n) Rastermaß: 0.8mm SVHC: To Be Advised |
auf Bestellung 84000 Stücke: Lieferzeit 14-21 Tag (e) |
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1981813-1 | TE Connectivity AMP Connectors |
Description: CONN RCPT 2POS 0.031 GOLD SMD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 30V Current Rating (Amps): 0.5A Mounting Type: Surface Mount Number of Positions: 2 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Outer Shroud Contact Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12.0µin (0.30µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.055" (1.40mm) Number of Rows: 1 |
auf Bestellung 7776 Stücke: Lieferzeit 10-14 Tag (e) |
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| 1981813-1 |
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Hersteller: TE Connectivity
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R
auf Bestellung 100000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 0.86 EUR |
| 16000+ | 0.79 EUR |
| 28000+ | 0.63 EUR |
| 52000+ | 0.6 EUR |
| 100000+ | 0.56 EUR |
| 1981813-1 |
|
Hersteller: TE Connectivity / AMP
Headers & Wire Housings .8mm Micro SLP RECPT
Headers & Wire Housings .8mm Micro SLP RECPT
auf Bestellung 4123 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 0.95 EUR |
| 4000+ | 0.79 EUR |
| 1981813-1 |
|
Hersteller: TE Connectivity
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R
Conn Wire to Board RCP 2 POS 0.8mm Solder ST SMD T/R
auf Bestellung 4000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 0.95 EUR |
| 1981813-1 |
|
Hersteller: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 1981813-1 - Printbuchse, Wire-to-Board, 0.8 mm, 1 Reihe(n), 2 Kontakt(e), Oberflächenmontage, Micro SLP
tariffCode: 85366990
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Ausführung: Buchse
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 2Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Produktpalette: Micro SLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 0.8mm
SVHC: To Be Advised
Description: TE CONNECTIVITY / PARTNER STOCK - 1981813-1 - Printbuchse, Wire-to-Board, 0.8 mm, 1 Reihe(n), 2 Kontakt(e), Oberflächenmontage, Micro SLP
tariffCode: 85366990
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Ausführung: Buchse
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 2Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Produktpalette: Micro SLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 0.8mm
SVHC: To Be Advised
auf Bestellung 84000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 1.05 EUR |
| 12000+ | 0.95 EUR |
| 1981813-1 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN RCPT 2POS 0.031 GOLD SMD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 30V
Current Rating (Amps): 0.5A
Mounting Type: Surface Mount
Number of Positions: 2
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Outer Shroud Contact
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.055" (1.40mm)
Number of Rows: 1
Description: CONN RCPT 2POS 0.031 GOLD SMD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 30V
Current Rating (Amps): 0.5A
Mounting Type: Surface Mount
Number of Positions: 2
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Outer Shroud Contact
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 12.0µin (0.30µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.055" (1.40mm)
Number of Rows: 1
auf Bestellung 7776 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.62 EUR |
| 16+ | 1.38 EUR |
| 25+ | 1.29 EUR |
| 50+ | 1.23 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.09 EUR |
| 500+ | 1.05 EUR |
| 1000+ | 0.99 EUR |