2-821949-4 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET PQFP 100POS TIN-LEAD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.050" (1.27mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.050" (1.27mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 100 (4 x 25)
Type: QFP
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Produktrezensionen
Produktbewertung abgeben
Technische Details 2-821949-4 TE Connectivity AMP Connectors
Description: CONN SOCKET PQFP 100POS TIN-LEAD, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.050" (1.27mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.050" (1.27mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 100 (4 x 25), Type: QFP, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube.
Weitere Produktangebote 2-821949-4
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
| 2-821949-4 | TE Connectivity / AMP |
IC & Component Sockets 100P ASSY HSG MICRO-PITCH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 2-821949-4 |
|
Hersteller: TE Connectivity / AMP
IC & Component Sockets 100P ASSY HSG MICRO-PITCH
IC & Component Sockets 100P ASSY HSG MICRO-PITCH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH