
2035643017 Molex

Description: CONN HEADER SMD 30POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1100+ | 3.25 EUR |
2200+ | 3.09 EUR |
3300+ | 3 EUR |
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Technische Details 2035643017 Molex
Description: CONN HEADER SMD 30POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Voltage Rating: 50V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Contact Shape: Rectangular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Row Spacing - Mating: 0.105" (2.66mm).
Weitere Produktangebote 2035643017 nach Preis ab 3.46 EUR bis 5.76 EUR
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2035643017 | Hersteller : Molex |
![]() Packaging: Cut Tape (CT) Features: Pick and Place, Solder Retention Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Contact Shape: Rectangular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon Row Spacing - Mating: 0.105" (2.66mm) |
auf Bestellung 3569 Stücke: Lieferzeit 10-14 Tag (e) |
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203564-3017 | Hersteller : Molex | Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38 |
auf Bestellung 1356 Stücke: Lieferzeit 10-14 Tag (e) |
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203564-3017 | Hersteller : MOLEX |
![]() tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Pico-Clasp 203564 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 3503 Stücke: Lieferzeit 14-21 Tag (e) |
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2035643017 | Hersteller : Molex |
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Produkt ist nicht verfügbar |