2035643017 Molex
Hersteller: Molex
Description: CONN HEADER SMD 30POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
| Anzahl | Privatkunde |
|---|---|
| 1100+ | 4.22 EUR |
| 2200+ | 4.03 EUR |
| 3300+ | 3.92 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 2035643017 Molex
Description: CONN HEADER SMD 30POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Voltage Rating: 50V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Contact Shape: Rectangular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Row Spacing - Mating: 0.105" (2.66mm).
Weitere Produktangebote 2035643017 nach Preis ab 4.14 EUR bis 9.97 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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2035643017 | Molex |
Description: CONN HEADER SMD 30POS 1MM Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Contact Shape: Rectangular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon Row Spacing - Mating: 0.105" (2.66mm) |
auf Bestellung 4417 Stücke: Lieferzeit 10-14 Tag (e) |
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203564-3017 | Molex | Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38 |
auf Bestellung 3767 Stücke: Lieferzeit 10-14 Tag (e) |
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203564-3017 | MOLEX |
Description: MOLEX - 203564-3017 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Pico-Clasp 203564 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 1790 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 2035643017 |
|
Hersteller: Molex
Description: CONN HEADER SMD 30POS 1MM
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
Description: CONN HEADER SMD 30POS 1MM
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
auf Bestellung 4417 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.64 EUR |
| 10+ | 5.64 EUR |
| 100+ | 4.8 EUR |
| 500+ | 4.34 EUR |
| 203564-3017 |
Hersteller: Molex
Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38
Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38
auf Bestellung 3767 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.76 EUR |
| 10+ | 5.74 EUR |
| 100+ | 4.88 EUR |
| 500+ | 4.44 EUR |
| 1100+ | 4.14 EUR |
| 203564-3017 |
Hersteller: MOLEX
Description: MOLEX - 203564-3017 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 30Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Pico-Clasp 203564 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (25-Jun-2025)
Description: MOLEX - 203564-3017 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 30Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Pico-Clasp 203564 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 1790 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 26+ | 9.97 EUR |
| 33+ | 7.1 EUR |
| 82+ | 6.06 EUR |
| 220+ | 5.57 EUR |
| 550+ | 5.06 EUR |