2200970871 Molex
Hersteller: Molex
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
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Technische Details 2200970871 Molex
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B, Features: Board Guide, Packaging: Tray, Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Contact Shape: Rectangular, Contact Length - Post: 0.091" (2.30mm), Insulation Height: 0.193" (4.90mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.
Weitere Produktangebote 2200970871 nach Preis ab 0.65 EUR bis 1.44 EUR
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2200970871 | Molex |
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive |
auf Bestellung 1740 Stücke: Lieferzeit 14-21 Tag (e) |
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2200970871 | Molex |
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive |
auf Bestellung 1620 Stücke: Lieferzeit 14-21 Tag (e) |
|
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2200970871 | Molex |
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Contact Shape: Rectangular Contact Length - Post: 0.091" (2.30mm) Insulation Height: 0.193" (4.90mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
auf Bestellung 2479 Stücke: Lieferzeit 10-14 Tag (e) |
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220097-0871 | Molex | Headers & Wire Housings 1.25MM HDR 01X08P VT W/LCK |
auf Bestellung 6275 Stücke: Lieferzeit 10-14 Tag (e) |
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220097-0871 | MOLEX |
Description: MOLEX - 220097-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Durchsteckmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Micro-Lock Plus 220097 Series productTraceability: No Kontaktanschluss: Durchsteckmontage, gerade Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (04-Feb-2026) |
auf Bestellung 565 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 2200970871 |
|
Hersteller: Molex
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
auf Bestellung 1740 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 211+ | 0.69 EUR |
| 2200970871 |
|
Hersteller: Molex
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
auf Bestellung 1620 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 250+ | 0.95 EUR |
| 600+ | 0.81 EUR |
| 1200+ | 0.72 EUR |
| 2200970871 |
|
Hersteller: Molex
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B
Features: Board Guide
Packaging: Tray
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 8
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Contact Shape: Rectangular
Contact Length - Post: 0.091" (2.30mm)
Insulation Height: 0.193" (4.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B
Features: Board Guide
Packaging: Tray
Connector Type: Header
Voltage Rating: 50VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 8
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Contact Shape: Rectangular
Contact Length - Post: 0.091" (2.30mm)
Insulation Height: 0.193" (4.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon, Glass Filled
auf Bestellung 2479 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 16+ | 1.11 EUR |
| 19+ | 0.94 EUR |
| 80+ | 0.81 EUR |
| 440+ | 0.72 EUR |
| 1920+ | 0.65 EUR |
| 220097-0871 |
Hersteller: Molex
Headers & Wire Housings 1.25MM HDR 01X08P VT W/LCK
Headers & Wire Housings 1.25MM HDR 01X08P VT W/LCK
auf Bestellung 6275 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.44 EUR |
| 10+ | 1.22 EUR |
| 100+ | 1.04 EUR |
| 500+ | 0.98 EUR |
| 1000+ | 0.9 EUR |
| 1920+ | 0.88 EUR |
| 220097-0871 |
Hersteller: MOLEX
Description: MOLEX - 220097-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Durchsteckmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Lock Plus 220097 Series
productTraceability: No
Kontaktanschluss: Durchsteckmontage, gerade
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (04-Feb-2026)
Description: MOLEX - 220097-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Durchsteckmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Lock Plus 220097 Series
productTraceability: No
Kontaktanschluss: Durchsteckmontage, gerade
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (04-Feb-2026)
auf Bestellung 565 Stücke:
Lieferzeit 14-21 Tag (e)