2200970871 Molex
Hersteller: Molex1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive
auf Bestellung 1820 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 209+ | 0.70 EUR |
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Technische Details 2200970871 Molex
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B, Features: Board Guide, Packaging: Tray, Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Contact Shape: Rectangular, Contact Length - Post: 0.091" (2.30mm), Insulation Height: 0.193" (4.90mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.
Weitere Produktangebote 2200970871 nach Preis ab 0.65 EUR bis 1.37 EUR
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2200970871 | Hersteller : Molex |
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive |
auf Bestellung 1820 Stücke: Lieferzeit 14-21 Tag (e) |
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2200970871 | Hersteller : Molex |
Description: 1.25WB MLP SGL VT TH ASSY 8CKT B Features: Board Guide Packaging: Tray Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Contact Shape: Rectangular Contact Length - Post: 0.091" (2.30mm) Insulation Height: 0.193" (4.90mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
auf Bestellung 2479 Stücke: Lieferzeit 10-14 Tag (e) |
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220097-0871 | Hersteller : Molex | Headers & Wire Housings 1.25MM HDR 01X08P VT W/LCK |
auf Bestellung 7154 Stücke: Lieferzeit 10-14 Tag (e) |
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220097-0871 | Hersteller : MOLEX |
Description: MOLEX - 220097-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Durchsteckmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Micro-Lock Plus 220097 Series productTraceability: No Kontaktanschluss: Durchsteckmontage, gerade Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 1754 Stücke: Lieferzeit 14-21 Tag (e) |
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2200970871 | Hersteller : Molex |
1.25mm Pitch, Micro Lock Plus PCB Header, Single Row, Vertical, Through Hole, Tin-Bismuth Plating, Positive |
Produkt ist nicht verfügbar |