3-1658462-1 TE Connectivity

Description: CONN DIFF ARRAY RCP 28P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 28, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 22mm, 25mm, 30mm, Number of Rows: 2.