5055680371 Molex
Hersteller: Molex1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black
auf Bestellung 9600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 9600+ | 0.11 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 5055680371 Molex
Description: CONN HEADER SMD 3POS 1.25MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.165" (4.20mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Glass Filled.
Weitere Produktangebote 5055680371 nach Preis ab 0.11 EUR bis 1.24 EUR
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 9600 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 18000 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 7810 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 9600 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
Description: CONN HEADER SMD 3POS 1.25MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.165" (4.20mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
auf Bestellung 16800 Stücke: Lieferzeit 10-14 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 7810 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
auf Bestellung 10000 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
Description: CONN HEADER SMD 3POS 1.25MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.165" (4.20mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon, Glass Filled |
auf Bestellung 16863 Stücke: Lieferzeit 10-14 Tag (e) |
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505568-0371 | Hersteller : Molex | Headers & Wire Housings MicroLockPlus 1.25MM VERT HDR SR 3CKT BLK |
auf Bestellung 13622 Stücke: Lieferzeit 10-14 Tag (e) |
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5055680371 | Hersteller : Molex |
Conn Shrouded Header (4 Sides) HDR 3 POS 1.25mm Solder ST Top Entry SMD Micro-Lock Plus T/R |
auf Bestellung 8400 Stücke: Lieferzeit 14-21 Tag (e) |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
Produkt ist nicht verfügbar |
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5055680371 | Hersteller : Molex |
1.25mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, Tin-Bismuth Plating, Positive Lock, 3 Circuits, Black |
Produkt ist nicht verfügbar |