520-AG11D-ES

520-AG11D-ES TE Connectivity / AMP


NG_CD_1437532-2_A-1237899.pdf Hersteller: TE Connectivity / AMP
IC & Component Sockets SOLID FRAME PC 20P
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Lieferzeit 14-28 Tag (e)
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Technische Details 520-AG11D-ES TE Connectivity / AMP

Description: DIP SOCKET T/H 20POS, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy, Part Status: Obsolete.

Weitere Produktangebote 520-AG11D-ES

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520-AG11D-ES 520-AG11D-ES Hersteller : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1437532-2&DocType=Customer+Drawing&DocLang=English Description: DIP SOCKET T/H 20POS
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Part Status: Obsolete
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