5767094-2 TE Connectivity / AMP
Hersteller: TE Connectivity / AMP
Board to Board & Mezzanine Connectors MICT,RECPT,076,ASY PDNI,EXTD
| Anzahl | Preis |
|---|---|
| 1+ | 82.4 EUR |
| 10+ | 66.28 EUR |
| 28+ | 63.1 EUR |
| 56+ | 60.09 EUR |
| 112+ | 57.24 EUR |
| 252+ | 56.92 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 5767094-2 TE Connectivity / AMP
Description: CONN RCPT 76P SMD PALLAD-NICKEL, Features: Board Guide, Ground Bus (Plane), Packaging: Tube, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Palladium-Nickel, Mounting Type: Surface Mount, Number of Positions: 76, Pitch: 0.025" (0.64mm), Height Above Board: 0.587" (14.91mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 15.62mm, 18mm, 20mm, 21.6mm, 27mm, 27.8mm, 29mm, 31.9mm, Number of Rows: 2.
Weitere Produktangebote 5767094-2 nach Preis ab 73.82 EUR bis 93.4 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
5767094-2 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN RCPT 76P SMD PALLAD-NICKELFeatures: Board Guide, Ground Bus (Plane) Packaging: Tube Connector Type: Receptacle, Center Strip Contacts Contact Finish: Palladium-Nickel Mounting Type: Surface Mount Number of Positions: 76 Pitch: 0.025" (0.64mm) Height Above Board: 0.587" (14.91mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 15.62mm, 18mm, 20mm, 21.6mm, 27mm, 27.8mm, 29mm, 31.9mm Number of Rows: 2 |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
|