808-AG11D TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 8POS GOLD, Part Status: Obsolete, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Operating Temperature: -55°C ~ 105°C.