818-AG11D TE Connectivity
auf Bestellung 364 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 34+ | 4.45 EUR |
| 156+ | 4.19 EUR |
| 260+ | 3.97 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 818-AG11D TE Connectivity
Description: CONN IC DIP SOCKET 18POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy.
Weitere Produktangebote 818-AG11D
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
818-AG11D | Hersteller : TE Connectivity / AMP |
 IC & Component Sockets 18 PIN DIP |
auf Bestellung 1040 Stücke: Lieferzeit 10-14 Tag (e) |
|
 |
818-AG11D | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |