822064-4 TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 14+ | 12.92 EUR |
| 50+ | 12.51 EUR |
| 95+ | 12.01 EUR |
| 200+ | 11.51 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
14 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 822064-4 TE Connectivity
Description: CONN SOCKET PQFP 100POS TIN-LEAD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: QFP, Number of Positions or Pins (Grid): 100 (4 x 25), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.025" (0.64mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.025" (0.64mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze.
Weitere Produktangebote 822064-4
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
822064-4 | TE Connectivity AMP Connectors |
 Description: CONN SOCKET PQFP 100POS TIN-LEADFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: QFP Number of Positions or Pins (Grid): 100 (4 x 25) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.025" (0.64mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
822064-4 | TE Connectivity / AMP |
IC & Component Sockets 100P MICRO-PITCH ASSY |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 822064-4 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET PQFP 100POS TIN-LEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: QFP
Number of Positions or Pins (Grid): 100 (4 x 25)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.025" (0.64mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PQFP 100POS TIN-LEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: QFP
Number of Positions or Pins (Grid): 100 (4 x 25)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.025" (0.64mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 822064-4 |
|
Hersteller: TE Connectivity / AMP
IC & Component Sockets 100P MICRO-PITCH ASSY
IC & Component Sockets 100P MICRO-PITCH ASSY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH