822064-4 TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 14+ | 12.77 EUR |
| 50+ | 12.36 EUR |
| 95+ | 11.88 EUR |
| 200+ | 11.38 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 822064-4 TE Connectivity
Description: CONN SOCKET PQFP 100POS TIN-LEAD, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.025" (0.64mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.025" (0.64mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 100 (4 x 25), Type: QFP.
Weitere Produktangebote 822064-4
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
822064-4 | TE Connectivity AMP Connectors |
Description: CONN SOCKET PQFP 100POS TIN-LEADMounting Type: Through Hole Features: Closed Frame Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.025" (0.64mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.025" (0.64mm) Housing Material: Liquid Crystal Polymer (LCP) Termination: Solder Number of Positions or Pins (Grid): 100 (4 x 25) Type: QFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
822064-4 | TE Connectivity / AMP |
IC & Component Sockets 100P MICRO-PITCH ASSY |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 822064-4 |
![]() |
Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET PQFP 100POS TIN-LEAD
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.025" (0.64mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.025" (0.64mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 100 (4 x 25)
Type: QFP
Description: CONN SOCKET PQFP 100POS TIN-LEAD
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.025" (0.64mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.025" (0.64mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 100 (4 x 25)
Type: QFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 822064-4 |
![]() |
Hersteller: TE Connectivity / AMP
IC & Component Sockets 100P MICRO-PITCH ASSY
IC & Component Sockets 100P MICRO-PITCH ASSY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH




